CN211284519U - Evaporation system and evaporation production line - Google Patents
Evaporation system and evaporation production line Download PDFInfo
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- CN211284519U CN211284519U CN201922353856.8U CN201922353856U CN211284519U CN 211284519 U CN211284519 U CN 211284519U CN 201922353856 U CN201922353856 U CN 201922353856U CN 211284519 U CN211284519 U CN 211284519U
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Abstract
The utility model provides a line is produced in coating by vaporization system and coating by vaporization, including metal coating by vaporization mechanism, organic coating by vaporization mechanism and a plurality of transport mechanism, through the first and the last intercommunication in proper order of a plurality of organic coating by vaporization cavitys that will organic coating by vaporization mechanism includes, set up each transport mechanism respectively in each organic coating by vaporization cavity, the substrate that the organic coating by vaporization is being carried out in the conveying, with metal coating by vaporization mechanism and organic coating by vaporization mechanism intercommunication to substrate after the organic coating by vaporization carries out the metal coating by vaporization, so, simplified the structure of coating by vaporization system, reduced the cost of system.
Description
Technical Field
The utility model relates to an evaporation equipment technical field particularly, relates to an evaporation system and line are produced in evaporation plating.
Background
Organic Light-Emitting Diode (OLED) is a new technology for Organic semiconductor materials to emit Light under the action of electric field, and has been rapidly developed in recent years. The OLED lighting product has the advantages of low energy consumption, environmental protection, ultrathin property, high color saturation, surface light source and the like, so that the OLED lighting product becomes one of the mainstream trends of the development of future lighting products.
At present, the OLED lighting device is mainly prepared by an evaporation coating method, and in actual production, because the OLED lighting device is produced under a high vacuum condition and has a plurality of evaporation processes, a traditional production line scheme adopts a Cluster type (Cluster) structure, and the structure is complex and the manufacturing cost is high.
SUMMERY OF THE UTILITY MODEL
Based on the research, the utility model provides a line is produced with the coating by vaporization to evaporation system to improve above-mentioned problem.
The utility model provides a technical scheme:
in a first aspect, an embodiment provides an evaporation system for evaporation of a substrate, the evaporation system including a metal evaporation mechanism, an organic evaporation mechanism, and a plurality of transport mechanisms;
the organic evaporation mechanism comprises a plurality of organic evaporation cavities which are sequentially communicated end to end and used for carrying out organic evaporation on the substrate;
the conveying mechanisms are respectively arranged in the organic evaporation cavities and are used for conveying the substrate undergoing organic evaporation in the organic evaporation cavities;
the metal evaporation mechanism is communicated with the organic evaporation mechanism and is used for carrying out metal evaporation on the substrate subjected to organic evaporation.
In an alternative embodiment, the transfer mechanism comprises a plurality of drive shafts and a plurality of drive wheels;
each transmission shaft is connected with the side wall of the organic evaporation cavity, at least one group of transmission wheels is arranged on each transmission shaft, and the transmission wheels rotate to drive the substrate to move so as to transmit the substrate undergoing organic evaporation in each organic evaporation cavity.
In an optional embodiment, the organic evaporation chamber is provided with a transfer window in a transfer direction of the conveying mechanism, the organic evaporation chambers are communicated through the transfer window, and a support wheel assembly for supporting the substrate transfer transition is arranged below the transfer window in the organic evaporation chamber.
In an alternative embodiment, the organic evaporation mechanism further comprises at least one turning cavity for changing the conveying direction of the substrate, so that the organic evaporation mechanism forms an L-shaped structure, a T-shaped structure or a mouth-shaped structure.
In an optional embodiment, the organic evaporation mechanism further comprises a mask alignment cavity and a mask unloading cavity;
the mask alignment cavity is used for aligning and attaching the substrate and the mask;
the mask unloading cavity is used for separating the substrate from the mask.
In an optional embodiment, the organic evaporation mechanism further comprises a conveying cavity, and the conveying cavity is arranged between the mask alignment cavity and the mask unloading cavity, and/or between the two organic evaporation cavities;
in an alternative embodiment, the evaporation system further comprises a cleaning mechanism for cleaning the substrate, and the cleaning mechanism is detachably communicated with the mask alignment cavity.
In an alternative embodiment, the cleaning mechanism comprises a first multi-station cavity and at least one cleaning cavity;
each cleaning cavity is detachably communicated with the first multi-station cavity, and the first multi-station cavity is detachably communicated with the mask alignment cavity.
In an optional embodiment, the metal evaporation mechanism comprises a second multi-station cavity and at least one metal evaporation cavity;
each metal evaporation cavity is detachably communicated with the second multi-station cavity respectively;
the second multi-station cavity is communicated with the mask unloading cavity.
In an alternative embodiment, the evaporation system further comprises a mask loading chamber and a mask buffer chamber;
the mask loading cavity and the mask buffer cavity are respectively communicated with an organic evaporation mechanism;
the mask loading cavity is used for loading the mask, and the mask buffer cavity is used for loading the unloaded mask.
In an optional embodiment, the evaporation system further comprises a plurality of mask replacement cavities, and each mask replacement cavity is alternately communicated with each organic evaporation cavity.
In an optional embodiment, the evaporation system further includes a vacuum mechanism, and the vacuum mechanism is detachably communicated with each organic evaporation cavity.
In a second aspect, an embodiment provides an evaporation line, comprising a control unit and the evaporation system of any one of the above embodiments, wherein the control unit is electrically connected to the evaporation system.
The embodiment of the utility model provides a line is produced in coating by vaporization system and coating by vaporization, including metal coating by vaporization mechanism, organic coating by vaporization mechanism and a plurality of transport mechanism, through a plurality of organic coating by vaporization cavitys that will organic coating by vaporization mechanism include head and the tail intercommunication in proper order, set up each transport mechanism respectively in each organic coating by vaporization cavity, the substrate that the organic coating by vaporization is being carried out in the conveying, with metal coating by vaporization mechanism and organic coating by vaporization mechanism intercommunication to substrate after the organic coating by vaporization carries out the metal coating by vaporization, so, simplified the structure of coating by vaporization system, reduced the cost of system.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a conventional vapor deposition apparatus.
Fig. 2 is a schematic structural diagram of an evaporation system according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a conveying mechanism according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a substrate transfer mechanism according to an embodiment of the present invention.
Fig. 5 is a schematic view of a substrate transfer mechanism according to an embodiment of the present invention.
Fig. 6(a) is a schematic structural diagram of an organic evaporation mechanism according to an embodiment of the present invention.
Fig. 6(b) is another schematic structural diagram of an organic evaporation mechanism according to an embodiment of the present invention.
Fig. 6(c) is a schematic structural diagram of an organic evaporation mechanism according to an embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a steering cavity according to an embodiment of the present invention.
Fig. 8 is another schematic structural diagram of a steering cavity according to an embodiment of the present invention.
Fig. 9 is a schematic structural diagram of a steering cavity according to an embodiment of the present invention.
Fig. 10 is another schematic structural diagram of an evaporation system according to an embodiment of the present invention.
Fig. 11 is a schematic structural diagram of a cleaning mechanism according to an embodiment of the present invention.
Fig. 12 is a schematic structural diagram of a metal evaporation mechanism according to an embodiment of the present invention.
Fig. 13 is a schematic structural diagram of an evaporation system according to an embodiment of the present invention.
Fig. 14 is a schematic structural diagram of a mask clip according to an embodiment of the present invention.
Fig. 15 is a schematic structural diagram of an evaporation system according to an embodiment of the present invention.
Fig. 16 is a schematic structural diagram of an evaporation system according to an embodiment of the present invention.
Icon: 1-vapor deposition system; 10-metal vapor deposition mechanism; 11-a second multi-station cavity; 12-metal evaporation chamber; 20-organic evaporation mechanism; 21-organic evaporation chamber; 211 — a first sidewall; 212-a second side wall; 213-a third sidewall; 214-a pass window; 215-a support wheel assembly; 22-a steering chamber; 221-a carrier support; 222-a shaft; 223-a motor; 23-mask alignment cavity; 24-mask unload chamber; 25-a transfer chamber; 30-a transport mechanism; 31-a drive shaft; 32-a transmission wheel; 40-a cleaning mechanism; 41-a first multi-station cavity; 42-cleaning the cavity; 43-robot configuration; 50-a mask loading chamber; 51-a mask clip; 52-a mask; 53-fixing plate; 54-a locating pin; 60-mask cache cavity; 70-mask replacement chamber; 80-a vacuum mechanism; 2-substrate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or orientations or positional relationships that are conventionally placed when the products of the present invention are used, or orientations or positional relationships that are conventionally understood by those skilled in the art, and are merely for convenience of description of the present invention and for simplicity of description, and do not indicate or imply that the equipment or components that are referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
At present, OLED lighting devices are mainly prepared by an evaporation coating method, and in actual production, because the OLED lighting devices are produced under a high vacuum condition and have a plurality of evaporation processes, a traditional production line scheme adopts a Cluster type (Cluster) structure as shown in figure 1, namely, a plurality of octagonal cavities are connected, evaporation cavities with different functions are installed on each edge of each octagonal cavity, the octagonal cavity in the middle is used for transmission, the structure is complex, and the equipment cost is low.
When the cluster type structure is utilized to carry out evaporation on products, the evaporated products (glass substrates) sequentially pass through each octagonal cavity, and evaporation of different functional layer materials is carried out in the peripheral cavity of each octagonal cavity in sequence. Every coating by vaporization cavity must accomplish at last piece substrate coating by vaporization and take out the back to send into next coating by vaporization room coating by vaporization back through the octagon cavity in the middle of, just can carry out the coating by vaporization of next piece substrate, efficiency is lower, and is lower by the utilization ratio of coating by vaporization material, thereby leads to the production beat lower, and product cost is high.
In addition, when a plurality of substrates are subjected to evaporation plating, the cluster structure needs to accurately control the transmission structure in each octagonal cavity, so that the cluster structure is matched with each station (cavity) of the substrate for evaporation plating, and the control logic of the device is complex.
Based on the above research, the present embodiment provides an evaporation system to improve the above problem.
Referring to fig. 2 and fig. 3, the vapor deposition system 1 of the present embodiment is used for vapor deposition of a substrate, and the vapor deposition system 1 includes a metal vapor deposition mechanism 10, an organic vapor deposition mechanism 20, and a plurality of transport mechanisms 30.
The organic evaporation mechanism 20 comprises a plurality of organic evaporation cavities 21, and the organic evaporation cavities 21 are sequentially communicated end to end and used for carrying out organic evaporation on the substrate.
The conveying mechanisms 30 are respectively disposed in the organic evaporation chambers 21, and the conveying mechanisms 30 are used for conveying the substrate undergoing organic evaporation in each organic evaporation chamber 21.
The metal vapor deposition mechanism 10 is communicated with the organic vapor deposition mechanism 20, and is used for performing metal vapor deposition on the substrate after organic vapor deposition.
Wherein, in this embodiment, can dismantle the intercommunication between each organic evaporation coating cavity 21, and then, can set up the quantity of organic evaporation coating cavity 21 according to the evaporation coating demand.
As an alternative embodiment, in this embodiment, the metal evaporation mechanism 10 and the organic evaporation mechanism 20 are also detachably connected, wherein the metal evaporation mechanism 10 is used as a rear end portion of substrate evaporation, and can be selectively detachably connected to one organic evaporation cavity 21 in the organic evaporation mechanism 20 according to evaporation requirements (for example, selection of the amount of organic materials to be evaporated, evaporation time, and the like). Optionally, in this embodiment, the detachable communication may be realized by means of screws.
In the present embodiment, each organic evaporation chamber 21 is provided with a linear organic evaporation source for evaporating organic materials on the substrate. Optionally, the linear organic evaporation sources in each organic evaporation cavity 21 may be the same or different, and specifically, may be set according to evaporation requirements, and are not specifically limited herein.
Because each organic evaporation coating cavity 21 is end to end intercommunication in proper order, consequently, the mode that the evaporation coating system 1 that this embodiment provided can flow the piece carries out the coating by vaporization to a plurality of substrates simultaneously, and every substrate passes through each organic evaporation coating cavity 21 in proper order promptly to accomplish organic evaporation coating, improved the utilization ratio of coating by vaporization material, also need not to take out the substrate from former organic evaporation coating cavity 21 simultaneously and send into to next organic evaporation coating cavity 21 in, simplified operation flow.
For example, the substrate a is evaporated in the organic evaporation chamber a, and after evaporation, the substrate a is conveyed to the organic evaporation chamber B communicated with the organic evaporation chamber a for evaporation, and at this time, the substrate B is conveyed to the organic evaporation chamber a for evaporation, and after evaporation in the organic evaporation chamber B, the substrate a is conveyed to the next organic evaporation chamber B for evaporation, and the substrate B is conveyed to the organic evaporation chamber B for evaporation, so that a plurality of substrates are evaporated simultaneously in a flow sheet manner.
In the process of performing organic evaporation on the substrate, the linear organic evaporation sources in the organic evaporation cavities 21 are static, and the substrates move at a constant speed in the organic evaporation cavities 21 through the conveying mechanism 30 and sequentially pass through the linear organic evaporation sources in the organic evaporation cavities 21 to complete evaporation. Because each substrate moves at a constant speed in each organic evaporation cavity 21 through the conveying mechanism 30, the evaporation thickness can be controlled by controlling the evaporation rate, thereby simplifying the control logic of the substrate movement and improving the utilization rate of evaporation materials.
Optionally, in this embodiment, in order to improve the convenience of conveying the substrate in each organic evaporation chamber 21, please refer to fig. 3, the conveying mechanism 30 includes a plurality of transmission shafts 31 and a plurality of transmission wheels 32.
Each transmission shaft 31 is connected with the side wall of the organic evaporation cavity 21, at least one group of transmission wheels 32 is arranged on each transmission shaft 31, and the transmission wheels 32 rotate to drive the substrate to move so as to transmit the substrate undergoing organic evaporation in each organic evaporation cavity 21.
Each organic evaporation cavity 21 includes a first sidewall 211 and a second sidewall 212, wherein the first sidewall 211 and the second sidewall 212 are disposed opposite to each other, one end of each transmission shaft 31 is connected to the first sidewall 211, and the other end is connected to the second sidewall 212.
Optionally, in this embodiment, the transmission shafts 31 may be arranged in parallel, and each transmission shaft 31 is provided with at least one set of transmission wheels 32, and each set includes two transmission wheels 32. When a plurality of sets are provided on each of the transmission shafts 31, the transmission wheels 32 of each set are provided at intervals on the transmission shaft 31.
In an embodiment, the substrate may be placed on the driving wheel 32, and the substrate is driven by the rotation of the driving wheel 32, so as to transport the substrate undergoing organic evaporation in the organic evaporation chamber 21. Optionally, in this embodiment, the rotation of the driving wheel 32 may be controlled by a motor, and an output shaft of the motor is connected to the driving wheel 32, so that the rotation of the motor drives the rotation of the driving wheel 32.
In an alternative embodiment, the present embodiment may also place the substrate on the substrate holder or the mask plate holder according to different manufacturing requirements, and then place the substrate holder or the mask plate holder on the driving wheel 32, and the substrate holder or the mask plate holder is moved by the rotation of the driving wheel 32 to transport the substrate undergoing organic evaporation in the organic evaporation chamber 21, as shown in fig. 4.
In order to avoid the falling of the substrate during the process of transferring the substrate from one organic evaporation chamber to the next organic evaporation chamber, please refer to fig. 5, a transfer window 214 is opened in the transfer direction of the conveying mechanism 30 in the organic evaporation chamber 21, each organic evaporation chamber 21 is communicated through the transfer window 214, and a support wheel assembly 215 for supporting the substrate transfer transition is disposed below the transfer window 214 in the organic evaporation chamber 21.
As shown in fig. 5, the organic evaporation cavity 21 further includes a third sidewall 213 connecting the first sidewall 211 and the second sidewall 212, and a fourth sidewall (not shown) opposite to the third sidewall 213, and the first sidewall 211, the second sidewall 212, the third sidewall 213 and the fourth sidewall surround to form a cavity. The third and fourth side walls 213 and 213 are located in the transfer direction of the transfer mechanism 30, and therefore, transfer windows 214 are opened in the third and fourth side walls 213 and 214. The organic evaporation cavities 21 are communicated end to end through the transmission windows 214.
When a substrate enters the next organic evaporation cavity 21 from one organic evaporation cavity 21 through the transfer window 214, the substrate is easy to fall off because the transfer mechanism 30 is at a certain distance from the transfer window 214, and the substrate has no stress point in the process from the transfer mechanism 30 to the transfer window 214 or in the process from the transfer window 214 to the transfer mechanism 30. In order to avoid the substrate from falling down in the transmission process, the supporting wheel assembly 215 is arranged below the transmission window 214, and the substrate is supported by the supporting wheel assembly 215 for transmission transition, so that the phenomenon that the gravity center of the substrate is unstable and falls down is avoided.
Optionally, in this embodiment, the height of each support wheel assembly 215 is the same as the height of the conveying mechanism 30 and is higher than or equal to the height of the lower edge of the transmission window 214, so that the smoothness of the substrate transition between the cavities can be improved.
As an alternative embodiment, in the present embodiment, there may be a plurality of supporting wheel assemblies 215, and a plurality of supporting wheel assemblies 215 are spaced below the transmission window 214.
In order to improve the utilization of space, in an alternative embodiment, the organic evaporation mechanism 20 further comprises at least one turning cavity 22 for changing the conveying direction of the substrate, so that the organic evaporation mechanism 20 forms an L-shaped structure, a T-shaped structure or a mouth-shaped structure.
When the organic evaporation mechanism 20 includes one turning cavity 22, the turning cavity 22 is communicated with the organic evaporation cavity 21, so that the organic evaporation mechanism 20 forms an L-shaped structure. As shown in fig. 6(a), the turning cavity 22 is communicated with the organic evaporation cavity 21 in the first direction, is communicated with the organic evaporation cavity 21 in the second direction, and the organic evaporation cavities 21 in the first direction and the second direction are sequentially communicated end to end, so that an L-shaped structure is formed.
When organic coating by vaporization mechanism 20 includes two and turns to chamber 22, as shown in fig. 6(b), one turns to chamber 22 and organic coating by vaporization cavity 21 intercommunication in the first direction, and with organic coating by vaporization cavity 21 intercommunication in the second direction, simultaneously, the other end and another of the ascending organic coating by vaporization cavity 21 of second direction turn to chamber 22 intercommunication, and another turns to chamber 22 and organic coating by vaporization cavity 21 intercommunication in the first direction, organic coating by vaporization cavity 21 in first direction and the second direction communicates end to end in proper order, so, form T type structure.
When the organic evaporation mechanism 20 includes four turning cavities 22, as shown in fig. 6(c), the turning cavities 22 are communicated with the organic evaporation cavity 21, and two T-shaped structures can be spliced to form a one-mouth structure, and similarly, the organic evaporation cavities 21 in the first direction and the second direction are sequentially communicated end to end.
It is understood that the structure of the organic evaporation mechanism 20 is not limited to the above structure, the structure of the organic evaporation mechanism 20 is related to the number of the turning chambers 22, and when the number of the turning chambers 22 is different, the structure of the organic evaporation mechanism 20 is also different. Optionally, in this embodiment, the organic evaporation mechanism 20 is in a mouth-shaped structure by providing the turning cavity 22, so as to improve the space utilization rate.
In this embodiment, as shown in fig. 7, 8 and 9, in each turning cavity 22, the conveying mechanism 30 is disposed on a bearing support 221, and a rotating component is disposed below the cavity of the turning cavity 22, the rotating component includes a rotating shaft 222 and a motor 223, wherein one end of the rotating shaft 222 is connected to an output shaft of the motor 223, and the other end of the rotating shaft passes through a bottom cavity wall of the turning cavity 22 to be connected to the bearing support 221, and the motor 223 rotates to drive the rotating shaft 222 to rotate, and the rotation of the rotating shaft 222 can drive the bearing support 221 to rotate, so as to drive the conveying mechanism 30 to rotate integrally, so as to adjust the conveying direction of the conveying mechanism 30.
It is understood that, in the present embodiment, the turning cavity 22 may be opened with a transmission window on the side wall according to the conveying direction, and is communicated with the organic evaporation cavity 21.
In the embodiment, the turning cavity 22 is arranged, the turning cavity 22 is communicated with the organic evaporation cavity 21, and the conveying direction of the substrate is changed, so that the utilization rate of the space is improved.
In an alternative embodiment, referring to fig. 10, the organic evaporation mechanism 20 further includes a mask alignment chamber 23 and a mask unloading chamber 24.
The mask aligning cavity 23 is used for aligning and attaching the substrate and the mask.
The mask unloading chamber 24 is used to separate the substrate from the mask.
The organic evaporation mechanism 20 further includes a transfer chamber 25, and the transfer chamber 25 is disposed between the mask alignment chamber 23 and the mask unloading chamber 24, and/or between the two organic evaporation chambers 21.
In order to ensure stability of the substrate during transfer, the substrate needs to be transferred together with the mask after being aligned and attached to the mask in the mask alignment chamber 23, and after completion of organic vapor deposition, the substrate needs to be separated from the mask in the mask unloading chamber 24.
In this embodiment, when the transfer chamber 25 is provided between the mask alignment chamber 23 and the mask unloading chamber 24, the transfer chamber 25 is used for transferring the unloaded mask, and when the transfer chamber 25 is provided between at least two organic evaporation chambers 21, the transfer chamber 25 is used for transferring the aligned substrate and the mask. In this embodiment, the transfer mechanism 30 is provided in each of the transfer chamber 25, the mask alignment chamber 23, and the mask unloading chamber 24 for transferring.
In an alternative embodiment, with continued reference to fig. 10, the evaporation system 1 further includes a cleaning mechanism 40 for cleaning the substrate, wherein the cleaning mechanism 40 is detachably connected to the mask alignment chamber 23.
The cleaning mechanism 40 includes a first multi-station chamber 41 and at least one cleaning chamber 42.
Each cleaning cavity 42 is detachably communicated with the first multi-station cavity 41, and the first multi-station cavity 41 is detachably communicated with the mask alignment cavity 23.
As shown in fig. 11, a manipulator structure 43 is disposed in the first multi-station cavity 41, and the manipulator structure 43 is used for clamping a substrate and is communicated with the mask alignment cavity 23 and the cleaning cavity 42 through the first multi-station cavity 41, so that the substrate can be taken and placed between different cavities (i.e., between the mask alignment cavity 23 and the cleaning cavity 42).
In one embodiment, the robot structure 43 may be connected to a power control unit (e.g., PLC controller, server), and under the control of the power control unit, the robot structure 43 may adjust the rotation angle in the first multi-station chamber 41 to achieve the substrate clamping. For example, after the substrate is completely cleaned in the cleaning chamber 42, the robot mechanism 43 is controlled to take out the substrate from the cleaning chamber 42, and then the cleaned substrate is held in the mask alignment chamber 23 and aligned with the mask.
In the present embodiment, the detachable communication between the cleaning mechanism 40 and the organic evaporation mechanism 20 is realized by the detachable communication between the first multi-station chamber 41 and the mask alignment chamber 23.
Optionally, in this embodiment, the mask alignment chamber 23 is used as a starting point of substrate organic evaporation and is communicated with the cleaning mechanism 40 to perform organic evaporation on the cleaned substrate, and the mask unloading chamber 24 is used as an end point of substrate organic evaporation and is communicated with the metal evaporation mechanism 10 to perform metal evaporation on the substrate after organic evaporation.
In an alternative embodiment, referring to fig. 12, the metal evaporation mechanism 10 includes a second multi-station cavity 11 and at least one metal evaporation cavity 12.
Each metal evaporation cavity 12 is detachably communicated with the second multi-station cavity 11.
The second multi-station chamber 11 communicates with the mask unloading chamber 24.
The second multi-station cavity 11 is also provided with a manipulator structure for clamping the substrate, and is communicated with the mask unloading cavity 24 and the metal evaporation cavity 12 through the second multi-station cavity 11, so that the substrate can be taken and placed between different cavities (namely between the mask unloading cavity 24 and the metal evaporation cavity 12).
In the embodiment, after the substrate is separated from the mask in the mask unloading cavity 24, the robot structure takes the substrate out of the mask unloading cavity 24 and clamps the substrate to a metal evaporation cavity 12 for metal evaporation, and the separated mask is transferred to the mask aligning cavity 23 through the transfer cavity 25 to be aligned and attached to the next substrate.
In this embodiment, the linear metal evaporation sources in each metal evaporation cavity 12 may be the same or different, and specifically, may be set according to the evaporation requirement.
In practical applications, since many organic materials may remain on the mask after the mask is used for many times, in order to prevent the mask after being used for many times from contaminating the substrate, referring to fig. 13, the evaporation system 1 of the present embodiment further includes a mask loading chamber 50 and a mask buffer chamber 60.
The mask loading chamber 50 and the mask buffer chamber 60 are respectively communicated with the organic evaporation mechanism 20.
The mask loading chamber 50 is used for loading the mask, and the mask buffer chamber 60 is used for loading the unloaded mask.
In order to improve the work efficiency and reduce the transmission path, the mask loading chamber 50 and the mask buffer chamber 60 are respectively communicated with the transfer chamber 25 disposed between the mask aligning chamber 23 and the mask unloading chamber 24. After the mask is separated from the substrate, the mask is transferred to the mask aligning cavity 23 through the transfer cavity 25 and aligned and bonded with the next substrate, but if the mask has been used many times and a plurality of organic materials remain, the mask is transferred to the mask buffer cavity 60 through the transfer cavity 25, and meanwhile, the unused mask is placed again in the transfer cavity 25 in the mask loading cavity 50 and transferred to the mask aligning cavity 23 through the transfer cavity 25 and aligned and bonded.
In order to facilitate the alignment and attachment of the substrate and the mask, in this embodiment, the mask loading chamber 50 is further provided with a mask clamp 51 for fixing the substrate and the mask. As shown in fig. 14, each mask clip 51 is provided with a mask 52 and a fixing plate 53, the mask 52 is provided with a plurality of positioning pins 54 on the periphery, the substrate 2 is placed on the mask 52 according to the positions of the positioning pins 54 to align and attach the mask 52, after the substrate 2 is aligned and attached to the mask 52, the fixing plate 53 is placed on the substrate 2 to fix the substrate 2, and the substrate 2 is prevented from being shifted from the mask 52 during transportation.
In a specific embodiment, in the vapor deposition system 1 provided in this embodiment, when the mask clip 51 is removed from the mask loading chamber 50 and transferred to the mask alignment chamber 23 through the transfer chamber 25, the substrate 2 after cleaning is aligned and attached to the mask 52 on the mask clip 51, the fixing plate 53 is placed on the substrate 2, the mask 52 and the substrate 2 are fixed to the mask clip 51, and the substrate 2 is moved forward by the transfer mechanism 30 in the chamber to sequentially pass through the organic vapor deposition chambers 21 communicating with each other, thereby completing organic vapor deposition. After the organic vapor deposition is completed, the mask clips provided with the substrate 2 are conveyed to the mask unloading cavity 24 to separate the substrate from the mask, the separated substrate is placed into the metal vapor deposition mechanism 10 to perform metal electrode vapor deposition, the mask clips 51 provided with the mask 52 are continuously conveyed to the mask aligning cavity 23 to receive the next substrate, and then the process is repeated to perform vapor deposition, so that the utilization rate of the mask 52 is improved, the conveying path of the mask 52 is reduced, and the cost is reduced.
It is understood that in the present embodiment, the alignment and attachment of the substrate 2 and the mask 52 can be realized by disposing a robot structure in the mask alignment chamber 23, and the separation of the substrate 2 and the mask 52 can be realized by disposing a robot structure in the mask unloading chamber 24.
Since the evaporation sources in each organic evaporation chamber 21 may be different during the organic evaporation process, in order to further prevent the substrate from being contaminated during the organic evaporation process, as shown in fig. 15, the evaporation system 1 further includes a plurality of mask replacement chambers 70, and each mask replacement chamber 70 is alternately communicated with each organic evaporation chamber 21.
Wherein, each mask replacing chamber 70 is provided therein with a robot structure and a plurality of masks, and the replacement of the masks is achieved by the robot structure. When replacing the mask, the robot structure unloads the substrate and the old mask from the mask chuck 51, places a new mask thereon, places the substrate on the new mask 52, and performs alignment bonding.
In this embodiment, the organic evaporation chamber 21 and the mask replacement chamber 70 are alternately communicated, so that the mask replacement chamber 70 can unload the mask subjected to organic evaporation, replace a new mask, align the new mask with the substrate, and transfer the new mask to the next organic evaporation chamber 21, thereby effectively preventing the substrate from being contaminated.
Since the substrate is always in a vacuum environment during the evaporation process, as shown in fig. 16, the evaporation system 1 further includes a vacuum mechanism 80, and the vacuum mechanism 80 is detachably connected to each organic evaporation chamber 21.
Optionally, the number of the vacuum mechanisms 80 provided in this embodiment may be multiple, and the vacuum mechanisms 80 are detachably connected to the organic evaporation cavities 21, respectively, so as to evacuate the organic evaporation cavities 21.
As an alternative embodiment, the vacuum mechanism 80 provided in the present embodiment may be a vacuum pump.
The coating by vaporization system 1 that this embodiment provided, through with a plurality of organic coating by vaporization cavitys 21 that organic coating by vaporization mechanism 20 of middle-end includes head and tail intercommunication in proper order, set up each transport mechanism 30 respectively in each organic coating by vaporization cavity, simplified the structure of coating by vaporization system and the flow of coating by vaporization, adopt the mode of flow piece formula to carry out the coating by vaporization to the substrate, simplified control logic, improved production efficiency, reduce cost.
In addition, the present embodiment further provides a vapor deposition line including a control unit and the vapor deposition system 1 according to any one of the above embodiments, wherein the control unit is electrically connected to the vapor deposition system 1.
The deposition line provided in this embodiment is electrically connected to the deposition system 1 through the power control unit, so as to realize the power control of the deposition system 1, for example, the deposition of the substrate, the operation of the robot, the conveying of the conveying mechanism 30, and the like, and specifically, the power control method can refer to the prior art, and this embodiment is not limited.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working process of the evaporation production line described above may refer to the evaporation system 1, and will not be described in detail herein.
To sum up, the line is produced in evaporation plating system and evaporation plating that this embodiment provided, including metal evaporation plating mechanism, organic evaporation plating mechanism and a plurality of transport mechanism, through a plurality of organic evaporation plating cavitys that include organic evaporation plating mechanism head and the tail intercommunication in proper order, set up each transport mechanism respectively in each organic evaporation plating cavity, the substrate that the organic evaporation plating is being carried out in the conveying, with metal evaporation plating mechanism and organic evaporation plating mechanism intercommunication to carry out metal evaporation plating to the substrate after the organic evaporation plating, so, the structure of evaporation plating system has been simplified, the cost of system has been reduced.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (13)
1. An evaporation system is characterized by being used for evaporation of a substrate and comprising a metal evaporation mechanism, an organic evaporation mechanism and a plurality of conveying mechanisms;
the organic evaporation mechanism comprises a plurality of organic evaporation cavities which are sequentially communicated end to end and used for carrying out organic evaporation on the substrate;
the conveying mechanisms are respectively arranged in the organic evaporation cavities and are used for conveying the substrate undergoing organic evaporation in the organic evaporation cavities;
the metal evaporation mechanism is communicated with the organic evaporation mechanism and is used for carrying out metal evaporation on the substrate subjected to organic evaporation.
2. The vapor deposition system according to claim 1, wherein the transport mechanism comprises a plurality of transmission shafts and a plurality of transmission wheels;
each transmission shaft is connected with the side wall of the organic evaporation cavity, at least one group of transmission wheels is arranged on each transmission shaft, and the transmission wheels rotate to drive the substrate to move so as to transmit the substrate undergoing organic evaporation in each organic evaporation cavity.
3. The evaporation system according to claim 2, wherein the organic evaporation chambers have transfer windows formed in a transfer direction of the transport mechanism, and the organic evaporation chambers are communicated through the transfer windows, and a support wheel assembly for supporting the substrate transfer transition is disposed below the transfer windows.
4. An evaporation system according to claim 1, wherein the organic evaporation mechanism further comprises at least one turning chamber for changing the conveying direction of the substrate, so that the organic evaporation mechanism forms an L-shaped structure, a T-shaped structure or a mouth-shaped structure.
5. The evaporation system according to claim 1, wherein the organic evaporation mechanism further comprises a mask alignment chamber, a mask unloading chamber;
the mask alignment cavity is used for aligning and attaching the substrate and the mask;
the mask unloading cavity is used for separating the substrate from the mask.
6. The evaporation system according to claim 5, wherein the organic evaporation mechanism further comprises a transfer chamber disposed between the mask alignment chamber and the mask unloading chamber, and/or between two organic evaporation chambers.
7. The evaporation system according to claim 6, further comprising a cleaning mechanism for cleaning the substrate, the cleaning mechanism being in detachable communication with the mask alignment chamber.
8. The evaporation system according to claim 7, wherein the cleaning mechanism comprises a first multi-station cavity and at least one cleaning cavity;
each cleaning cavity is detachably communicated with the first multi-station cavity, and the first multi-station cavity is detachably communicated with the mask alignment cavity.
9. The evaporation system according to claim 5, wherein the metal evaporation mechanism comprises a second multi-station cavity and at least one metal evaporation cavity;
each metal evaporation cavity is detachably communicated with the second multi-station cavity respectively;
the second multi-station cavity is communicated with the mask unloading cavity.
10. The evaporation system according to claim 1, further comprising a mask loading chamber and a mask buffer chamber;
the mask loading cavity and the mask buffer cavity are respectively communicated with an organic evaporation mechanism;
the mask loading cavity is used for loading the mask, and the mask buffer cavity is used for loading the unloaded mask.
11. The evaporation system according to claim 1, further comprising a plurality of mask replacement chambers, each of the mask replacement chambers being alternately communicated with each of the organic evaporation chambers.
12. The evaporation system according to claim 1, further comprising a vacuum mechanism in detachable communication with each organic evaporation chamber.
13. An evaporation line comprising a control unit and the evaporation system according to any one of claims 1 to 12, wherein the control unit is electrically connected to the evaporation system.
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| CN201922353856.8U CN211284519U (en) | 2019-12-24 | 2019-12-24 | Evaporation system and evaporation production line |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114377631A (en) * | 2021-12-28 | 2022-04-22 | 福州物联网开放实验室有限公司 | NFC cavity, NFC cavity system and method for controlling NFC interaction cavity |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114377631A (en) * | 2021-12-28 | 2022-04-22 | 福州物联网开放实验室有限公司 | NFC cavity, NFC cavity system and method for controlling NFC interaction cavity |
| CN114377631B (en) * | 2021-12-28 | 2023-10-13 | 福州物联网开放实验室有限公司 | NFC cavity, NFC cavity system and method for controlling NFC interaction cavity |
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