CN216582960U - Wafer ring supply device - Google Patents

Abstract

The application provides a crystal ring feeding device, includes: the feeding mechanism is used for supporting the crystal ring box; the wafer ring carrying platform is used for supporting and driving the wafer ring to move and is provided with at least two accommodating grooves for storing the wafer ring; a material taking mechanism; and a pick-and-place mechanism. According to the crystal ring supply device, the fetching mechanism and the carrying platform are arranged, and the carrying platform is provided with at least two containing grooves to support the crystal rings, so that when the crystal ring supply device is used, the fetching mechanism can push full crystal rings in a crystal ring box to one containing groove and place empty crystal rings in the other containing groove back to the crystal ring box; the fetching and delivering mechanism can transfer the empty crystal ring of the crystal supply position to another accommodating groove, and transfer the full crystal ring in one accommodating groove to the crystal supply position, so that the empty crystal ring and the full crystal ring can be transferred simultaneously, waiting time is not needed, and efficiency is high.

Description

Wafer ring supply device

Technical Field

The application belongs to the technical field of solid crystal, and particularly relates to a crystal ring supply device.

Background

When die bonder is used for die bonding, the die on the wafer needs to be supplied to the bonding head so as to mount the die. The wafer is typically mounted in a wafer ring through which the wafer is supported. After the chip on the wafer is taken out, a blank wafer ring is formed. For convenience of description, the wafer ring storing the wafer is referred to as a full wafer ring. At present, the brilliant ring supplies, generally adopts three-axis moving platform drive clamping jaw to take out the empty brilliant ring that supplies the brilliant position, removes to place in the brilliant ring box, takes out full brilliant ring from brilliant ring box again, removes to place to supply the brilliant position. The structure needs waiting time and is low in efficiency no matter whether the crystal ring is taken from the crystal ring box or taken from the crystal supply position and the clamping jaws move in a reciprocating mode.

SUMMERY OF THE UTILITY MODEL

An object of the embodiments of the present application is to provide a wafer ring feeding device, so as to solve the problem of low efficiency in the wafer ring feeding device in the related art that the three-axis moving platform directly drives the clamping jaw to reciprocate the wafer ring box and the wafer position to pick and place the wafer ring.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions: provided is a wafer supply apparatus including:

the feeding mechanism is used for supporting the crystal ring box and driving the crystal ring box to move up and down;

the wafer ring carrying platform is used for supporting and driving the wafer ring to move and is provided with at least two accommodating grooves for storing the wafer ring;

the material taking mechanism is used for taking and placing full crystal rings in the crystal ring box to the carrying platform and transferring empty crystal rings in the carrying platform to the crystal ring box; and the number of the first and second groups,

the fetching and conveying mechanism is used for transferring an empty crystal ring of a crystal supply position to the carrying and moving platform and transferring a full crystal ring on the carrying and moving platform to the crystal supply position;

the feeding mechanism and the material taking mechanism are respectively arranged on two opposite sides of the carrying and moving platform, and the carrying and moving platform is arranged below the taking and delivering mechanism.

In an optional embodiment, the carrying platform includes a tray and a linear driving module for driving the tray to move to and from the material taking mechanism and the material taking mechanism, and each accommodating groove is formed in the tray.

In an optional embodiment, the linear driving module comprises a base plate, a guide rail mounted on the base plate, a sliding block mounted on the guide rail, a driving motor mounted at one end of the base plate, a driving wheel mounted on the driving motor, a driven wheel mounted at the other end of the base plate, a transmission belt connecting the driving wheel and the driven wheel, and a clamping block connecting the transmission belt and the tray, wherein the tray is mounted on the sliding block.

In an optional embodiment, the number of the guide rails is at least two, the slide blocks are respectively installed on the guide rails, and the slide blocks are connected with the tray.

In an optional embodiment, the material taking mechanism comprises a movable clamp for clamping a wafer ring, a driver for driving the movable clamp, a sliding plate for supporting the movable clamp, a sliding block for supporting the sliding plate, a linear pushing module for driving the sliding plate to move, a sliding rail for guiding the sliding block to move, and a support for supporting the sliding rail, wherein the linear pushing module is installed on the support, a driving end of the linear pushing module is connected with the sliding plate, the sliding block is installed on the sliding rail, and the driver is installed on the sliding plate.

In an alternative embodiment, the linear pushing module is an air cylinder, and the sliding plate is provided with a connecting plate connected with the driving end of the linear pushing module.

In an optional embodiment, the feeding mechanism includes a supporting plate for supporting the wafer cassette, a lifting plate fixedly connected to the supporting plate, a sliding block for supporting the lifting plate, a vertical rail for guiding the sliding block to move up and down, a linear propulsion module for driving the lifting plate to move up and down, and a fixing seat for supporting the linear propulsion module, wherein the sliding block is mounted on the vertical rail, and the vertical rail is mounted on the fixing seat.

In an optional embodiment, the picking and delivering mechanism comprises a grabbing component for grabbing a wafer ring, a support for supporting the grabbing component, a lifting seat for supporting the support, a lifting driving module for driving the lifting seat to move up and down, a mounting seat for supporting the lifting driving module, a linear advancing module for driving the mounting seat to move back and forth between the wafer supply position and the carrying platform, and a supporting seat for supporting the linear advancing module.

In an optional embodiment, the grabbing assembly comprises a plurality of suckers for cooperatively sucking the wafer ring and a supporting plate for supporting the suckers, and the supporting plate is connected with the bracket.

In an alternative embodiment, the pick-and-place mechanism further comprises an inductor for inducing a wafer ring to position the plurality of suction cups, the inductor being mounted on the support plate.

The beneficial effects of the crystal ring supply device that this application embodiment provided lie in: compared with the prior art, the crystal ring supply device provided by the embodiment of the application has the advantages that the taking and feeding mechanism, the taking mechanism and the carrying platform are arranged, and the carrying platform is provided with at least two containing grooves to support the crystal rings, so that when the device is used, the taking mechanism can push full crystal rings in a crystal ring box to one containing groove and place empty crystal rings in the other containing groove back to the crystal ring box; the fetching and delivering mechanism can transfer the empty crystal ring of the crystal supply position to another containing groove and transfer the full crystal ring in one containing groove to the crystal supply position, so that the empty crystal ring and the full crystal ring can be transferred simultaneously without waiting time and the efficiency is high.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a wafer ring supply apparatus according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a feeding mechanism supporting a wafer ring box according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a material taking mechanism according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of a stage according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a pick-and-place mechanism provided in the embodiment of the present application.

Wherein, in the drawings, the reference numerals are mainly as follows:

100-ring supply means;

10-a feeding mechanism; 11-a pallet; 12-a lifter plate; 13-a linear propulsion module; 14-a fixed seat; 15-a slide block; 16-a vertical rail;

20-a material taking mechanism; 21-a support; 22-a slide rail; 23-a slider; 24-a slide plate; 25-linear pushing module; 26-a movable clamp; 27-a driver; 28-a connecting plate;

30-a carrying platform; 31-a tray; 311-a receiving groove; 32-linear drive module; 321-a bottom plate; 322-a guide rail; 323-a slide block; 324-a clamping block; 325-transmission belt; 326-drive motor; 327-a driving wheel; 328-driven wheel;

40-a pick-and-place mechanism; 41-a grasping assembly; 411-suction cup; 412-support tray; 42-a scaffold; 43-a lifting seat; 44-a lift drive module; 45-mounting seat; 46-a linear travel module; 47-a support seat; 48-a sensor;

91-a wafer ring box; 92-crystal ring; 921-full crystal ring; 922-empty crystal ring.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present application, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Reference throughout this specification to "one embodiment," "some embodiments," or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

For convenience of description, three coordinate axes which are mutually vertical in space are defined as an X axis, a Y axis and a Z axis respectively, and meanwhile, the direction along the X axis is longitudinal, the direction along the Y axis is transverse, and the direction along the Z axis is vertical; the X axis and the Y axis are two coordinate axes which are vertical to each other on the same horizontal plane, and the Z axis is a coordinate axis in the vertical direction; the X axis, the Y axis and the Z axis are positioned in space and are mutually vertical, and three planes are respectively an XY plane, a YZ plane and an XZ plane, wherein the XY plane is a horizontal plane, the XZ plane and the YZ plane are vertical planes, and the XZ plane is vertical to the YZ plane. Three axes in space are an X axis, a Y axis and a Z axis, and the three-axis movement in space refers to the movement along three axes which are vertical to each other in space, in particular to the movement along the X axis, the Y axis and the Z axis in space; the planar motion is a motion in the XY plane.

Referring to fig. 1 and 4, a wafer ring supply apparatus 100 provided by the present application will now be described. The crystal ring supply device 100 comprises a feeding mechanism 10, a carrying platform 30, a material taking mechanism 20 and a taking and feeding mechanism 40, wherein the feeding mechanism 10 and the material taking mechanism 20 are respectively arranged at two opposite sides of the carrying platform 30, and the carrying platform 30 is arranged below the taking and feeding mechanism 40. Wherein:

the feeding mechanism 10 is used for supporting the wafer cassette 91 and driving the wafer cassette 91 to move up and down. That is, the ring cassette 91 storing the ring 92 is installed in the loading mechanism 10, and since the ring cassette 91 generally stores a plurality of wafer rings 92 therein, the loading mechanism 10 drives the ring cassette 91 to move up and down, so that the unloading mechanism 20 sequentially takes out each full ring 921 in the ring cassette 91 and puts the empty ring 922 into the empty space in the ring cassette 91 to recover the empty ring 922.

The loading platform 30 is used for driving at least two wafer rings 92 to move synchronously. The carrying platform 30 has at least two receiving grooves 311, and the receiving grooves 311 are used for storing the wafer ring 92. Such that stage 30 can simultaneously support at least one empty wafer ring 922 and at least one full wafer ring 921.

The material taking mechanism 20 is used for taking and placing the full wafer ring 921 in the wafer ring box 91 to the carrying platform 30, and transferring the empty wafer ring 922 in the carrying platform 30 to the wafer ring box 91. Because the carrying platform 30 is provided with at least two accommodating grooves 311 for accommodating the wafer ring 92; thus, at least one empty wafer ring 922 can be supported on the carrying platform 30, the material taking mechanism 20 can take out a full wafer ring 921 in the wafer ring box 91 and place the full wafer ring in an empty accommodating groove 311 of the carrying platform 30, and the material taking mechanism 20 can take out the empty wafer ring 922 on the carrying platform 30 and place the empty wafer ring 922 in the wafer ring box 91, so that when the wafer ring box 91 takes and places the wafer ring 92, waiting is not needed.

The pick-and-place mechanism 40 is used for transferring the empty wafer ring 922 at the wafer supply position to the carrying platform 30 and transferring the full wafer ring 921 on the carrying platform 30 to the wafer supply position. Because the carrying platform 30 is provided with at least two accommodating grooves 311 for accommodating the wafer ring 92; thus, at least one full-wafer ring 921 can be supported on the carrying platform 30, the picking and delivering mechanism 40 can pick out and place an empty wafer ring 922 of a wafer supply position into an empty accommodating groove 311 of the carrying platform 30, and the picking and delivering mechanism 40 can pick out and place the full-wafer ring 921 on the carrying platform 30 into the wafer supply position, so that when the wafer ring 92 is picked and placed at the wafer supply position, waiting is not needed.

The structure moves once between the picking mechanism 40 and the feeding mechanism 10 on the carrying platform 30, at least one crystal ring 92 can be conveyed, for example, at least one empty crystal ring 922 can be conveyed from the picking mechanism 40 to the feeding mechanism 10, and at least one full crystal ring 921 can be conveyed from the feeding mechanism 10 to the picking mechanism 40, so that the recovery of the empty crystal ring 922 and the supply of the full crystal ring 921 are convenient, the waiting time is short, and the efficiency is high.

In addition, after the picking mechanism 40 picks up the full crystal ring 921 on the carrying platform 30, the carrying platform 30 can drive the empty crystal ring 922 to the feeding mechanism 10, so that the picking mechanism 20 can place the empty crystal ring 922 on the crystal ring box 91, or the picking mechanism 20 can pick up the full crystal ring 921 on the carrying platform 30, and the picking mechanism 20 can place the full crystal ring 921 on the carrying platform 30, and after picking up the empty crystal ring 922 on the carrying platform 30, the carrying platform 30 can drive the full crystal ring 921 on the picking mechanism 40, so that the picking mechanism 40 can place the empty crystal ring 922 on the carrying platform 30, or the picking mechanism 40 can pick up the empty crystal ring 922 on the carrying platform 30, and the picking mechanism 30 does not need waiting time, and is efficient.

Compared with the prior art, the wafer ring supply device 100 provided by the embodiment of the present application is provided with the taking and feeding mechanism 40, the material taking mechanism 20 and the carrying platform 30, and the carrying platform 30 is provided with at least two accommodating grooves 311 to support the wafer rings 92, so that when in use, the material taking mechanism 20 can push full wafer rings 921 in a wafer ring box 91 to one accommodating groove 311, and place empty wafer rings 922 in the other accommodating groove 311 back to the wafer ring box 91; the pick-and-place mechanism 40 can transfer the empty wafer ring 922 of the wafer supply position to another containing groove 311, and transfer the full wafer ring 921 in one containing groove 311 to the wafer supply position, so as to simultaneously transfer the empty wafer ring 922 and the full wafer ring 921, and the wafer supply position and the wafer ring 92 in the wafer ring box 91 can be picked and placed without mutual interference, without waiting time, and the efficiency is high.

In one embodiment, when the loading platform 30 drives the empty wafer ring 922 to move to the feeding mechanism 10, the material taking mechanism 20 places the full wafer ring 921 on the loading platform 30, and takes out the empty wafer ring 922 on the loading platform 30; the loading and moving platform 30 can drive the full-wafer ring 921 to the picking and delivering mechanism 40, the picking and delivering mechanism 40 places the empty-wafer ring 922 for the wafer position on the loading and moving platform 30, the picking and delivering mechanism 40 picks the full-wafer ring 921 on the loading and moving platform 30, and then the loading and moving platform 30 drives the empty-wafer ring 922 to move to the feeding mechanism 10, and the cycle is repeated, so that the efficiency is high.

In one embodiment, referring to fig. 1 and 4, the carrying platform 30 includes a tray 31 and a linear driving module 32, and each accommodating groove 311 is disposed on the tray 31 to support the wafer ring 92 on the tray 31. The tray 31 is installed on the linear driving module 32, and the linear driving module 32 is used for driving the tray 31 to move to and fro between the material taking mechanism 20 and the taking and delivering mechanism 40, so as to drive the wafer rings 92 on the tray 31 to move.

In one embodiment, two receiving grooves 311 are formed on the tray 31 to reduce the volume of the tray 31, so as to flexibly drive the tray 31 to move.

In one embodiment, the two receiving slots 311 are spaced along the moving direction of the tray 31, so that the tray 31 can be driven to move more smoothly.

In one embodiment, the linear driving module 32 includes a base 321, a guide rail 322, a slider 323, a driving motor 326, a driving wheel 327, a driven wheel 328, a transmission belt 325, and a clamping block 324, and the tray 31 is mounted on the slider 323, and the tray 31 is supported by the slider 323. The guide rail 322 is installed on the base plate 321 to support the guide rail 322 by the base plate 321. The slider 323 is slidably attached to the guide rail 322, and the slider 323 is supported and guided by the guide rail 322 to move, and further, the tray 31 is supported and guided to move. The driving wheel 327 and the driven wheel 328 are respectively arranged at two ends of the bottom plate 321, the driving wheel 327 and the driven wheel 328 are used for tensioning the transmission belt 325, the driving wheel 327 is arranged on the driving motor 326, the driving motor 326 is arranged at one end of the bottom plate 321, so that the driving wheel 327 is supported at one end of the bottom plate 321, the clamping block 324 is connected with the tray 31, the clamping block 324 clamps the fixed transmission belt 325, the transmission belt 325 is connected with the tray 31, and the driving motor 326 drives the driving wheel 327 to rotate so as to drive the transmission belt 325 to move, so that the clamping block 324 is pulled to move linearly, and the tray 31 is driven to move. The transmission belt 325 is used, so that the structure is simple and the assembly is convenient. It is understood that the linear driving module 32 may also use a linear module such as a lead screw and nut mechanism, a rack and pinion mechanism, a linear motor, etc.

In one embodiment, the number of the guide rails 322 is at least two, and the plurality of guide rails 322 are arranged in parallel, and each guide rail 322 is provided with a slider 323, and each slider 323 is connected to the tray 31, so as to support the tray 31 more stably and guide the movement of the tray 31.

In one embodiment, referring to fig. 1 and 3, the material taking mechanism 20 includes a movable clamp 26, a driver 27, a sliding plate 24, a sliding block 23, a linear pushing module 25, a sliding rail 22 and a support 21. The linear pushing module 25 is mounted on the support 21, the slide rail 22 is mounted on the support 21, and the linear pushing module 25 and the slide rail 22 are supported by the support 21. The slide block 23 is mounted on the slide rail 22 to guide the slide block 23 to move by the slide rail 22. The driver 27 is mounted on the slide plate 24, and the driver 27 is supported by the slide plate 24. An actuator 27 is coupled to movable clamp 26 to actuate movable clamp 26 so that movable clamp 26 holds wafer ring 92. The driving end of the linear pushing module 25 is connected to the sliding plate 24, so that the driving end of the linear pushing module 25 drives the sliding plate 24 to move along the sliding rail 22, and further drives the movable clamp 26 to move, so as to take out the full wafer ring 921 from the wafer ring box 91 and place the empty wafer ring 922 on the wafer ring box 91. This feeding agencies 20, simple structure, simple to operate, it is with low costs.

In one embodiment, the linear pushing module 25 is a cylinder, and the cylinder is used, so that the linear pushing module is simple in structure, convenient to control and low in cost. It is understood that the linear pushing module 25 may also use a linear module such as a lead screw and nut mechanism, a rack and pinion mechanism, a linear motor, etc.

In one embodiment, a coupling plate 28 is mounted on the slide plate 24, and the coupling plate 28 is coupled to the drive end of the linear pushing module 25. A connection plate 28 is provided to facilitate connection of the drive end of the cylinder to the slide plate 24.

In one embodiment, the actuator 27 may be a pneumatic cylinder, which is convenient to control and small in size. It is understood that the driver 27 may also be a linear module such as a lead screw and nut mechanism, a rack and pinion mechanism, a linear motor, etc.

In one embodiment, referring to fig. 1 and 2, the feeding mechanism 10 includes a supporting plate 11, a lifting plate 12, a sliding block 15, a vertical rail 16, a linear propulsion module 13, and a fixing base 14, wherein the linear propulsion module 13 and the vertical rail 16 are mounted on the fixing base 14, and the linear propulsion module 13 and the vertical rail 16 are supported by the fixing base 14. The sliding block 15 is mounted on a vertical rail 16 to guide the sliding block 15 to be lifted by the vertical rail 16. The sliding block 15 is connected to the lifting plate 12 to support the lifting plate 12 by the sliding block 15. The elevation plate 12 is connected to the pallet 11 to support the pallet 11 by the elevation plate 12. The supporting plate 11 is used for supporting the wafer ring box 91, that is, the wafer ring box 91 is placed on the supporting plate 11, the lifting plate 12 is driven to move up and down by the linear propulsion module 13, and then the supporting plate 11 and the wafer ring box 91 are driven to move up and down, so as to supply the wafer rings 92.

In one embodiment, the linear propulsion module 13 is a screw-nut mechanism, and the screw-nut mechanism is used, so that the driving force is high, and the operation is stable. It is understood that the linear propulsion module 13 may also use a rack and pinion mechanism, a linear motor, or other linear modules.

In one embodiment, referring to fig. 1 and 5, the pick-and-place mechanism 40 includes a grabbing assembly 41, a bracket 42, a lifting seat 43, a lifting driving module 44, a mounting seat 45, a linear travel module 46, and a supporting seat 47. The grasping assembly 41 is used to grasp the wafer ring 92. The grasping assembly 41 is mounted on the bracket 42, and the grasping assembly 41 is supported by the bracket 42 and moves the grasping assembly 41. The holder 42 is mounted on the elevating base 43, and the holder 42 is supported by the elevating base 43. The lifting seat 43 is connected with the lifting driving module 44, and the lifting seat 43 is driven by the lifting driving module 44 to move up and down, so as to drive the grabbing component 41 to move up and down. The elevation driving module 44 is mounted on the mounting base 45, and the elevation driving module 44 is supported by the mounting base 45. The mounting base 45 is connected to the linear moving module 46, so that the linear moving module 46 drives the mounting base 45 to move to and from the wafer supply position and the carrying platform 30, so as to realize that the empty wafer ring 922 on the wafer supply position is grabbed and placed on the carrying platform 30, and the full wafer ring 921 on the carrying platform 30 is moved to the wafer supply position.

In one embodiment, the grasping assembly 41 includes a plurality of suction cups 411 and a support plate 412, the plurality of suction cups 411 being mounted on the support plate 412, the plurality of suction cups 411 being supported by the support plate 412 such that the plurality of suction cups 411 cooperate to grasp the wafer ring 92. A support plate 412 is coupled to the support frame 42 to connect each suction cup 411 to the support frame 42. It is understood that the grasping assembly 41 may also use a robot, a cylinder clamp, a suction plate, etc.

In one embodiment, linear travel module 46 is disposed across stage 30 to facilitate driving lift drive module 44, lift base 43, support 42, and gripper assembly 41 across stage 30 to grip wafer ring 92.

In one embodiment, the pick-and-place mechanism 40 further comprises a sensor 48, the sensor 48 is mounted on the support plate 412, and the sensor 48 senses the wafer ring 92 to position the plurality of suction cups 411 for sucking the wafer ring 92.

In one embodiment, the support plate 412 is sized to be equal to or similar to the size of the wafer ring 92 to position the plurality of suction cups 411 and also to facilitate the suction of the wafer ring 92 by the suction cups 411.

In one embodiment, the lifting driving module 44 is a screw-nut mechanism, which has a large driving force and operates stably. It is understood that the lift drive module 44 may also use a linear module such as a rack and pinion mechanism, a linear motor, etc.

In one embodiment, the linear travel module 46 is a lead screw and nut mechanism, which provides a high driving force and operates smoothly. It is to be understood that the linear travel module 46 may also use a rack and pinion mechanism, a linear motor, or the like.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A wafer supply apparatus, comprising:

the feeding mechanism is used for supporting the crystal ring box and driving the crystal ring box to move up and down;

the wafer ring carrying platform is used for supporting and driving the wafer ring to move and is provided with at least two accommodating grooves for storing the wafer ring;

the material taking mechanism is used for taking and placing full crystal rings in the crystal ring box to the carrying platform and transferring empty crystal rings in the carrying platform to the crystal ring box; and the number of the first and second groups,

the fetching and conveying mechanism is used for transferring an empty crystal ring of a crystal supply position to the carrying and moving platform and transferring a full crystal ring on the carrying and moving platform to the crystal supply position;

the feeding mechanism and the material taking mechanism are respectively arranged on two opposite sides of the carrying and moving platform, and the carrying and moving platform is arranged below the taking and delivering mechanism.

2. The wafer ring supply apparatus according to claim 1, wherein: the carrying platform comprises a tray and a linear driving module for driving the tray to move to and fro between the material taking mechanism and the material taking and delivering mechanism, and each accommodating groove is arranged on the tray.

3. The wafer ring supply apparatus according to claim 2, wherein: the linear driving module comprises a bottom plate, a guide rail arranged on the bottom plate, a sliding block arranged on the guide rail, a driving motor arranged at one end of the bottom plate, a driving wheel arranged on the driving motor, a driven wheel arranged at the other end of the bottom plate, a transmission belt connecting the driving wheel and the driven wheel, and a clamping block connecting the transmission belt and the tray, wherein the tray is arranged on the sliding block.

4. The wafer ring supply apparatus according to claim 3, wherein: the guide rails are at least two and are arranged in parallel, the sliding blocks are respectively arranged on the guide rails, and the sliding blocks are connected with the tray.

5. The wafer ring supply apparatus according to any one of claims 1 to 4, wherein: the material taking mechanism comprises a movable clamp used for clamping a crystal ring, a driver driving the movable clamp, a sliding plate supporting the movable clamp, a sliding block supporting the sliding plate, a linear pushing module driving the sliding plate to move, a sliding rail guiding the sliding block to move and a support supporting the sliding rail, wherein the linear pushing module is installed on the support, the driving end of the linear pushing module is connected with the sliding plate, the sliding block is installed on the sliding rail, and the driver is installed on the sliding plate.

6. The wafer ring supply apparatus according to claim 5, wherein: the linear pushing module is an air cylinder, a connecting plate is mounted on the sliding plate, and the connecting plate is connected with the driving end of the linear pushing module.

7. The wafer ring supply apparatus according to any one of claims 1 to 4, wherein: the feeding mechanism comprises a supporting plate for supporting the crystal ring box, a lifting plate fixedly connected with the supporting plate, a sliding block for supporting the lifting plate, a vertical rail for guiding the sliding block to lift, a linear propulsion module for driving the lifting plate to move up and down and a fixing seat for supporting the linear propulsion module, wherein the sliding block is arranged on the vertical rail, and the vertical rail is arranged on the fixing seat.

8. The wafer ring supply apparatus according to any one of claims 1 to 4, wherein: the fetching and delivering mechanism comprises a grabbing component for grabbing crystal rings, a support for supporting the grabbing component, a lifting seat for supporting the support, a lifting driving module for driving the lifting seat to move up and down, a mounting seat for supporting the lifting driving module, a linear advancing module for driving the mounting seat to move back and forth between the crystal supply position and the carrying platform, and a supporting seat for supporting the linear advancing module.

9. The wafer ring supply apparatus according to claim 8, wherein: the grabbing assembly comprises a plurality of suckers used for sucking crystal rings in a matched mode and a supporting plate used for supporting the suckers, and the supporting plate is connected with the support.

10. The wafer ring supply apparatus according to claim 9, wherein: the picking and delivering mechanism further comprises an inductor used for inducing the crystal ring to position the suckers, and the inductor is installed on the supporting plate.

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