CN216571205U - Electrode plate and tumor electric field treatment system - Google Patents

Abstract

The utility model provides an electrode plate and tumor electric field treatment system, which comprises a flexible circuit board, at least one high dielectric sheet arranged on the flexible circuit board and a lead electrically connected with the flexible circuit board, wherein the flexible circuit board is provided with a wiring part welded with the lead and a reinforcing plate arranged on the wiring part, the wiring part is provided with a plurality of golden fingers welded with the lead and conductive traces electrically connected with the corresponding golden fingers respectively, and the reinforcing plate is arranged at the position of the wiring part, which is opposite to the connecting part of the golden fingers and the conductive traces. The flexible circuit board of the electrode plate is provided with the reinforcing plate arranged on the wiring part, so that the strength of the wiring part can be improved, the pulling force of the lead on the wiring part can be greatly dispersed in the process of moving or overturning the flexible circuit board after the lead is welded with the flexible circuit board, the connecting part of the golden finger and the conductive trace can be prevented from being broken when the wiring part is pulled by the lead, the product yield is improved, and the production cost is reduced.

Description

Electrode plate and tumor electric field treatment system

Technical Field

The utility model relates to an electrode plate and an electric field tumor treatment system, and belongs to the technical field of medical instruments.

Background

At present, the treatment modes of tumors mainly comprise operations, radiotherapy, chemotherapy and the like, but the methods have corresponding defects, for example, radiotherapy and chemotherapy can generate side effects and kill normal cells. The electric field for treating tumor is one of the current development fronts, and the tumor treating electric field (tumor treating fields) emits wave with high change rate to corresponding tissues through a special electric field generating device, and then conducts energy to corresponding parts of human body through an insulating material in a radiation or induction mode, so that the mitosis process of destroying cells can be interfered, and the tumor treating electric field has a good effect on tumor treatment. Research shows that the electric field treatment has obvious effect in treating diseases such as glioblastoma, non-small cell lung cancer, malignant pleural mesothelioma and the like, and the electric field applied by the method can influence the aggregation of tubulin, prevent the formation of spindles, inhibit the mitosis process and induce the apoptosis of cancer cells.

The existing tumor electric field treatment system comprises an electric field generator and an electrode plate electrically connected with the electric field generator. The electrode plate comprises a lead, a flexible circuit board welded with the lead and a high dielectric plate welded on one side of the flexible circuit board facing the body surface of the patient. The flexible circuit board of the electrode plate is flexible, so that the electrode plate can be attached to the body surface corresponding to the tumor part of the patient. The flexible circuit board mainly comprises an insulating substrate, a plurality of paths of conductive traces embedded in the insulating substrate and a plurality of golden fingers which are exposed out of the insulating substrate and electrically connected with the conductive traces. One end of the lead is welded with the golden finger of the flexible circuit board, and the other end of the lead is electrically connected with the electric field generator. When the tumor electric field treatment is carried out on a patient, the alternating voltage of the electric field generator is transmitted to the flexible circuit board through the conducting wire, and then the alternating electric field is coupled to the tumor part of the patient through the high dielectric piece so as to carry out the tumor electric field treatment.

In the manufacturing process of the electrode plate, for example, in the process of moving the flexible circuit board or turning over the flexible circuit board after the lead is welded with the flexible circuit board, the lead can pull the corresponding part of the flexible circuit board welded with the lead, so that the corresponding part of the flexible circuit board is easy to bend, and further the joint of the gold finger and the conductive trace is broken, so that the whole electrode plate is scrapped, and the yield of the electrode plate is affected.

Therefore, there is a need to provide an improved electrode plate and a tumor electric field treatment system, so as to solve the problems of the electrode plate of the tumor electric field treatment system.

SUMMERY OF THE UTILITY MODEL

The utility model provides an electrode plate and a tumor electric field treatment system, which can prevent a connecting part of a golden finger of a flexible circuit board and a conductive trace from being broken.

The electrode plate is realized by the following technical scheme: an electrode plate is used for tumor electric field treatment and comprises a flexible circuit board, at least one high dielectric sheet arranged on the flexible circuit board and a lead electrically connected with the flexible circuit board, wherein the flexible circuit board is provided with a wiring part welded with the lead and a reinforcing plate arranged on the wiring part, the wiring part is provided with a plurality of golden fingers welded with the lead and conductive traces electrically connected with the corresponding golden fingers respectively, and the reinforcing plate is arranged at the position, opposite to the connecting part of the golden fingers and the conductive traces, of the wiring part.

Further, the reinforcing plate and the high dielectric sheet are located on opposite sides of the flexible circuit board.

Further, the plurality of gold fingers are arranged on the side face of the wire connecting part, which is on the same side as the high dielectric sheet.

Furthermore, the plurality of golden fingers are arranged on two opposite side surfaces of the wiring part in a staggered manner.

Furthermore, the reinforcing plates are multiple and are respectively arranged on two opposite sides of the wiring part.

Furthermore, the reinforcing plate is arranged at the relative position of the corresponding golden finger of the wiring part and the conductive trace electrically connected with the golden finger, and the reinforcing plate and the corresponding golden finger are respectively arranged at the two opposite sides of the wiring part.

Further, a plurality of golden fingers are including being the first golden finger that staggers row form setting, the relative both sides of wiring portion are located respectively to the first golden finger that is stagger row form setting.

Furthermore, the stiffening plate includes first stiffening plate and the second stiffening plate of locating the relative both sides of wiring portion respectively.

Furthermore, the first reinforcing plate and the high dielectric sheet are located on the same side, and the first golden fingers which are arranged on the wiring portion and located on different sides of the high dielectric sheet are located on two opposite sides of the wiring portion respectively.

Furthermore, the first reinforcing plate is arranged at a position where the wire connection portion and the first gold finger of the high dielectric sheet are located at different sides and the conductive trace electrically connected with the first gold finger are opposite.

Further, the second reinforcing plate is provided on a side surface of the wire connection portion on a different side from the high dielectric sheet.

Further, the second reinforcing plate is located on a different side from the high dielectric sheet.

Furthermore, the second reinforcing plate and the first golden finger which is arranged on the wiring part and is positioned on the same side with the high dielectric sheet are respectively positioned on two opposite sides of the wiring part.

Furthermore, the second reinforcing plate is arranged at a position where the first golden finger of the wiring portion and the high dielectric sheet are located at the same side and the conductive trace electrically connected with the first golden finger are opposite.

Further, the golden finger further comprises a second golden finger which is arranged on the wiring portion and located on the same side with the high dielectric sheet.

Furthermore, the second golden finger and the first golden finger which is positioned on the same side of the second golden finger are arranged at intervals.

Furthermore, the first golden finger on the same side with the high dielectric sheet is arranged close to the tail end of the wire connection part, and the first golden finger on a different side with the high dielectric sheet is arranged far away from the tail end of the wire connection part.

Further, the distance from the first gold finger located on the same side as the high dielectric sheet to the end of the wire portion is smaller than the distance from the first gold finger located on a different side from the high dielectric sheet to the end of the wire portion.

Further, the first gold finger located on the same side as the high dielectric sheet is disposed at a position between the first gold finger and the second gold finger of the wire portion located on different sides from the high dielectric sheet as viewed in a thickness direction of the wire portion.

Furthermore, the second reinforcing plate and the second golden finger are located on two opposite sides of the wiring portion, and the second reinforcing plate is located at a position where the wiring portion and the high dielectric sheet are located on the same side of the first golden finger and the second golden finger, and the position is opposite to the conductive trace electrically connected with the first golden finger and the second golden finger respectively.

Further, the second golden finger is arranged at a position close to the tail end of the wire connection part.

Furthermore, the first golden finger on the same side with the high dielectric sheet is arranged far away from the tail end of the wire connection part, and the first golden finger on a different side with the high dielectric sheet is arranged close to the tail end of the wire connection part.

Further, the distance from the first gold finger located on the same side as the high dielectric sheet to the end of the wire portion is larger than the distance from the first gold finger located on a different side from the high dielectric sheet to the end of the wire portion.

Further, the first gold finger located on the different side from the high dielectric sheet is disposed at a position between the first gold finger and the second gold finger of the wire connection portion located on the same side as the high dielectric sheet as viewed in the thickness direction of the wire connection portion.

Furthermore, the reinforcing plate is made of polyimide materials, and the thickness of the reinforcing plate is 0.6mm-1 mm.

Furthermore, the reinforcing plate is made of epoxy glass fiber materials, and the thickness of the reinforcing plate is 0.2mm-0.5 mm.

Furthermore, the flexible printed circuit board further comprises a heat-shrinkable sleeve which is coated at the connecting position of the wiring part of the flexible printed circuit board and the lead.

The tumor electric field treatment system is realized by the following technical scheme: an electric field tumor treating system comprises an electric field generator and the electrode plate electrically connected with the electric field generator.

Furthermore, the electrode plate assembly also comprises an adapter electrically connected with the electric field generator, and the electrode plate is detachably assembled on the adapter.

The flexible circuit board of the electrode plate is provided with the reinforcing plate which is arranged on the wiring part and is positioned at the position opposite to the connecting part of the golden finger of the wiring part and the conductive trace, so that the strength of the wiring part can be improved, the pulling force of the lead on the wiring part can be greatly dispersed in the process of moving or turning over the flexible circuit board after the lead is welded with the flexible circuit board, the connecting part of the golden finger and the conductive trace is prevented from being broken when the wiring part is pulled by the lead, the yield of products is improved, and the production cost is reduced. Meanwhile, the electrode plate can be ensured to be attached to the body surface corresponding to the tumor part of the patient in a fitting manner.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model, as claimed.

Drawings

Fig. 1 is a perspective view of an electrode sheet of a first embodiment of the electric field tumor treatment system of the present invention.

Fig. 2 is an exploded perspective view of the electrode sheet shown in fig. 1.

Fig. 3 is an exploded perspective view of the electrical functional assembly shown in fig. 2.

Fig. 4 is a plan view of the flexible circuit board of the electrical functional assembly shown in fig. 3.

Fig. 5 is another plan view of the flexible circuit board of the electrical functional assembly shown in fig. 4.

Figure 6 is a perspective view of a high dielectric sheet of the electrical functional assembly shown in figure 2.

Fig. 7 is a perspective view of an electrode sheet of a second embodiment of the electric field tumor treatment system of the present invention.

Fig. 8 is an exploded perspective view of the electrode sheet shown in fig. 7.

Fig. 9 is a plan view of the flexible circuit board and the temperature sensor of the electrical functional assembly shown in fig. 8.

Fig. 10 is another plan view of the flexible circuit board shown in fig. 9.

FIG. 11 is a plan view of the wiring portion and the reinforcing plate of the flexible circuit board of the electrode pad of the third embodiment of the system for electric field treatment of tumors of the present invention.

Fig. 12 is another plan view of the wiring portion and the reinforcing plate of the flexible circuit board shown in fig. 11.

Fig. 13 is a schematic block diagram of the tumor electric field treatment system of the present invention.

Description of reference numerals:

tumor electric field treatment system 1000, electrode patch 100, 100', backing 2, 2', electrical functional component 1, 1 ', flexible circuit board 11, 11', 11 ", insulating substrate 11A, 11A ', body portion 111, 111', peripheral body portion 111A ', central body portion 111B', spacer C, connecting portion 112 ', wiring portion 113, 113', 113", conductive pad 114, conductive core 115, gold finger 116, 116 ', 116 ", first gold finger 1161', 1161", second gold finger 1162 ', 1162 ", land 117, insulating plate 12, 12', high dielectric sheet 13, 13 ', metal layer 131, opening 132, reinforcing plate 15, 15', 15", first reinforcing plate 151 ', 151 ", second reinforcing plate 152', 152", support 3, 3 ', through hole 31, adhesive 4, 4', temperature sensor 14, 14 ', lead 6, 6', heat shrinkable sleeve 61, heat shrinkable sleeve 4, heat shrinkable sleeve 6, Plug 62, electric field generator 200, adaptor 300.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of devices, systems, apparatus, and methods consistent with certain aspects of the utility model.

Referring to fig. 1 to 13, an electric field therapy system 1000 for tumor of the present invention includes an electric field generator 200, an adaptor 300 electrically connected to the electric field generator 200, and electrode pads 100, 100' electrically connected to the electric field generator 200 through the adaptor 300. The electrode plates 100, 100' are attached to the body surface of a patient, and the therapeutic electric field generated by the electric field generator 200 acts on the human body. The electrode sheet 100, 100' according to the embodiment of the present invention may be applied to the trunk, such as the chest and abdomen, or the head. In other embodiments, the electrode pads 100, 100' of the electric field tumor therapy system can be directly electrically connected to the electric field generator 200.

First embodiment

Referring to fig. 1 to 6, an electrode sheet 100 according to a first embodiment of the present invention includes a backing 2, an electrical functional component 1 adhered to the backing 2, a support member 3 adhered to the backing 2, an adhesive member 4 covering a portion of the support member 3 corresponding to the electrical functional component 1, and a lead wire 6 welded to the electrical functional component 1. The electrode plate 100 of the utility model is attached to the corresponding body surface of the tumor part of the patient through the backing 2, and applies an alternating electric field to the tumor part of the patient through the electric functional component 1 to interfere or prevent the mitosis of the tumor cells of the patient, thereby realizing the purpose of treating the tumor. The electrode sheet 100 of the present embodiment is suitable for being applied to the trunk or head of a patient to perform electric field therapy, and a plurality of electrode sheets 100 can be freely combined for use.

The electrical functional assembly 1 includes a flexible circuit board 11, an insulating plate 12 and a high dielectric sheet 13 respectively disposed on two opposite sides of the flexible circuit board 11, a temperature sensor 14 disposed on the flexible circuit board 11 and located on the same side as the high dielectric sheet 13, and a reinforcing plate 15 disposed on one side of the flexible circuit board 11. The high dielectric sheet 13 and the temperature sensor 14 are disposed on one side of the flexible circuit board 11 close to the body surface of the patient, and the insulating plate 12 is disposed on one side of the flexible circuit board 11 far from the body surface of the patient. The electric functional assembly 1 is respectively adhered to the back lining 2 through the insulating plate 12 and the corresponding part of the flexible circuit board 11 and is closely attached to the back lining 2.

The flexible circuit board 11 includes a main body 111 and a wiring portion 113 extending outward from the main body 111 and electrically connected to the conductive wires 6. In the present embodiment, the wire connecting portion 113 is disposed in a strip shape or a belt shape. The wiring portion 113 of the flexible circuit board 11 is soldered to the lead 6 to electrically connect the lead 6 to the electrical functional assembly 1. The wire 6 with the welding department cladding of wiring portion 113 has heat shrinkage bush 61 for the junction of wiring portion 113 is sealed, insulation protection on wire 6 and the flexible circuit board 11, and the improvement intensity supports, avoids wire 6 and electric function component 1 junction to break off, can also dustproof and waterproof simultaneously. One end of the lead 6 is soldered to the wiring portion 113 of the electrical functional assembly 1, and the other end is provided with a plug 62 electrically connected to the adaptor 300. Alternatively, the plug 62 of the lead 6 is directly electrically connected to the electric field generator 200.

The main body 111 is provided in a circular sheet shape. The main body 111 is provided with a conductive pad 114 corresponding to the high dielectric sheet 13, and the high dielectric sheet 13 can be soldered (not shown) to the high dielectric sheet 13 to assemble the high dielectric sheet 13 on the main body 111 of the flexible circuit board 11. The center of the conductive pad 114 coincides with the center of the body portion 111. The conductive pad 114 has 4 conductive cores 115 protruding or exposed from the main body 111. The conductive core 115 is disposed in a central symmetrical manner, which can effectively prevent the high dielectric sheet 13 from being displaced due to stacking of solder (not shown) during the soldering process. The 4 conductive cores 115 are arranged at intervals, so that the using amount of copper foil for manufacturing the conductive cores 115 can be reduced, and the material cost is reduced; meanwhile, the amount of solder (not shown) used for welding the conductive core 115 and the high dielectric sheet 13 can be saved, thereby further reducing the material cost. In other embodiments, the main body 111 may be disposed in other polygonal sheet shapes.

The main body 111 further has two pads 117 protruding or exposed from the main body 111. The two pads 117 are located substantially at the center of the area enclosed by the conductive pads 114. The temperature sensor 14 has a signal terminal (not shown) and a ground terminal (not shown). One of the pads 117 on the main body 111 is soldered to a signal terminal (not shown) of the temperature sensor 14, and the other pad 117 is soldered to a ground terminal (not shown) of the temperature sensor 14, so as to electrically connect the main body 111 and the temperature sensor 14.

The main body 111 and the wire connecting portion 113 are each composed of an insulating substrate 11A and a plurality of conductive traces (not shown) embedded in the insulating substrate 11A. The plurality of conductive traces (not shown) in the insulating substrate 11A of the main body portion 111 are electrically connected to the plurality of conductive traces (not shown) in the insulating substrate 11A of the wire connecting portion 113 in a one-to-one correspondence. That is, the flexible circuit board 11 includes an insulating substrate 11A and a plurality of conductive traces (not shown) embedded in the insulating substrate 11A. In this embodiment, three paths of wiring traces (not shown) are provided for each of the main body portion 111 and the wire connection portion 113. That is, the wiring traces (not shown) of the flexible circuit board 11 are provided three ways. The three conductive traces (not shown) include a conductive trace (not shown) connecting all the conductive cores 115 of the conductive pads 114 of the main body 111 in series, a conductive trace (not shown) electrically connecting a pad 117, which is located on the main body 111 and soldered to a ground terminal (not shown) of the temperature sensor 14, and a conductive trace (not shown) electrically connecting a pad 117, which is located on the main body 111 and soldered to a signal terminal (not shown) of the temperature sensor 14.

A plurality of gold fingers 116 electrically connected to the three conductive traces (not shown) are disposed on one side of the wire connecting portion 113. The number of gold fingers 116 corresponds to the number of conductive traces (not shown). In this embodiment, the number of the gold fingers is 3. The three gold fingers 116 are soldered to the conductive wires 6 to electrically connect the conductive wires 6 to three conductive traces (not shown) of the flexible circuit board 11, and then electrically connect the high dielectric sheet 13 soldered to the conductive pads 114 and the temperature sensor 14 soldered to the bonding pads 117 via the three conductive traces (not shown). Specifically, the conductive wire 6 has three signal wires (not shown), and three wires (not shown) of the conductive wire 6 are respectively soldered to the corresponding gold fingers 116.

Referring to fig. 5, the reinforcing plate 15 is disposed in a strip or a belt shape. The reinforcing plate 15 and the plurality of gold fingers 116 of the wire connecting portion 113 are respectively disposed on opposite sides of the wire connecting portion 113. What is needed isThe reinforcing plate 15 is located on a side surface of the wire connection portion 113 away from the gold finger 116 and is arranged opposite to the gold finger 116, so that in the process of moving or turning over the flexible circuit board 11 after the wire 6 is welded to the flexible circuit board 11, the pulling force of the wire 6 on the wire connection portion 113 is greatly dispersed, most of the pulling force is transferred to the reinforcing plate 15, and the fracture of the connection between the gold finger 116 and a conductive trace (not shown) can be avoided when the wire connection portion 113 is pulled by the wire 6. Preferably, the reinforcing plate 15 is disposed on a side of the wire connecting portion 113 away from the gold finger 116, and is disposed opposite to the 3 gold fingers and the corresponding portions of the 3 conductive traces (not shown). That is, the reinforcing plate 15 is disposed not only opposite to the gold finger 116 but also opposite to a part of the conductive trace (not shown) connected to the gold finger 116. The area of the reinforcing plate 15 is larger than that of the corresponding golden finger 116. In this embodiment, the area of the reinforcing plate 15 is larger than 10mm². The length of the reinforcing plate 15 is not greater than the length of the wire connecting portion 113. The area of the reinforcing plate 15 is not larger than that of the wire connecting portion 113. Preferably, the wire connecting portion 113 is provided to be as wide as the reinforcing plate 15. The length of the reinforcing plate 15 is 5mm-40 mm. The reinforcing plate 15 is made of a rigid reinforcing material with a thickness of 0.2-1 mm, such as epoxy glass fiber material, metal material, etc. Preferably, the reinforcing plate 15 is made of epoxy glass fiber material with the thickness of 0.2mm-0.5 mm. Optionally, the stiffening plate 15 is made of a polyimide material with a thickness of 0.6mm to 1 mm.

The insulating plate 12 is arranged in a circular sheet shape. The insulating plate 12 is made of an insulating material, and is adhered to a side surface of the main body 111 of the flexible circuit board 11 away from the body surface of the patient by a sealant (not shown), so that while the strength of the flexible circuit board 11 is enhanced, a flat welding plane can be provided for the welding operation between the conductive plate 114 and the high dielectric sheet 13, and the product yield is improved. The insulating plate 12 can prevent moisture in the air on the side of the electrical functional assembly 1 away from the body surface of the patient from entering the electrical functional assembly 1, so as to prevent the moisture from contacting with a solder (not shown) located between the high dielectric sheet 13 and the main body portion 111 to affect the electrical connection between the main body portion 111 and the high dielectric sheet 13.

The high dielectric sheet 13 is arranged in a circular sheet shape. The high dielectric sheet 13 is made of a high dielectric constant material, and has a characteristic of blocking direct current and alternating current, so that the safety of a human body can be ensured. The high dielectric sheet 13 has a dielectric constant of at least more than 1000. The high dielectric sheet 13 has a ring-shaped metal layer 131 attached to the side facing the main body 111, and is soldered to the conductive pad 114 on the main body 111 by solder (not shown). A gap (not shown) formed between the high dielectric sheet 13 and the main body 111 by welding is filled with a sealant (not shown) to protect a solder (not shown) between the high dielectric sheet 13 and the main body 111, so as to prevent the welding part from being broken due to the influence of an external force on the high dielectric sheet 13, and further prevent an alternating electric field from being applied to a tumor part of a patient through the high dielectric sheet 13; meanwhile, it is avoided that moisture in the air enters the gap (not shown) to erode solder (not shown) between the high dielectric sheet 13 and the main body 111, thereby affecting the electrical connection between the high dielectric sheet 13 and the main body 111. The outer ring of the metal layer 131 and the outer edge of the high dielectric sheet 13 are spaced from each other, so that solder (not shown) between the metal layer 131 of the high dielectric sheet 13 and the main body 111 is prevented from overflowing the main body 111 when being melted by heat, and direct current which is not blocked by the high dielectric sheet 13 is prevented from directly acting on the body surface of the patient when the electrode sheet 100 is applied to the body surface corresponding to the tumor part of the patient. The high dielectric sheet 13 has an opening 132 provided therethrough for receiving the temperature sensor 14. The edge of the opening 132 of the high dielectric sheet 13 is spaced from the inner ring of the metal layer 131 of the high dielectric sheet 13, so that it is possible to prevent the solder (not shown) between the metal layer 131 of the high dielectric sheet 13 and the main body 111 from diffusing in the direction of the opening 132 of the high dielectric sheet 13 when melted by heat and causing a short circuit of the temperature sensor 14. The main body 111, the insulating plate 12, and the high dielectric sheet 13 are disposed in one-to-one correspondence, and centers of the three are located on the same straight line.

A temperature sensor 14 is fixed at the center of the main body portion 111 for monitoring the temperature of the adhesive member 4, thereby monitoring the temperature of the skin of the human body applied with the adhesive member 4. When the temperature monitored by the temperature sensor 14 exceeds the upper limit of the human body safe temperature, the electric field therapeutic apparatus (not shown) can timely reduce or close the alternating current transmitted to the electrode plate 100, so as to avoid low-temperature scald of the human body. The temperature sensor 14 is soldered to the two pads 117 of the main body 111 and then sealed with a sealant (not shown) to prevent moisture from attacking the temperature sensor 14 and causing the temperature sensor 14 to fail. In the present embodiment, the temperature sensor 14 is provided as one. In other embodiments, a plurality of temperature sensors 14 may be disposed on the main body 111.

The support 3 is arranged in a sheet shape. The support 3 is arranged in the form of a surrounding high dielectric sheet 13 and glued to the backing 2. The support 3 has a through hole 31 disposed therethrough for receiving the high dielectric sheet 13. The surface of the support piece 3 close to one side of the body surface of the patient is flush with the surface of the high dielectric sheet 13 close to one side of the body surface of the patient, the pasting piece 4 can be flatly covered on the support piece 3 and the high dielectric sheet 13, and the comfort of pasting the electrode slice is improved. In the present embodiment, the number of the supporting members 3 is 1.

The supporting member 3 can be made of Polyethylene (PE) material, PET material, heat conductive silicone sheet, or soft, chemically stable, light, non-deformable and non-toxic insulating material compounded by polyurethane, polyethylene, dispersant, flame retardant, carbon fiber, etc. Preferably, the support 3 may be made of flexible foam.

The adhesive member 4 is arranged in a sheet shape, the adhesive member 4 has double-sided adhesiveness, one side of the adhesive member is attached to the support member 3 and the high dielectric sheet 13, and the other side of the adhesive member is attached to the body surface of the patient. Preferably, the adhesive member 4 is a conductive hydrogel to act as a conductive medium to conduct alternating current through the high dielectric sheet 13 to the tumor site of the patient. The number of adhesive members 4 is the same as the number of support members 3. In this embodiment, the number of the adhesive members is 1. The size of the adhesive part 4 is approximately the same as that of the support part 3, and the adhesive part 4 has better application performance with the skin of a human body under the supporting action of the support part 3.

The flexible circuit board 11 of the electrode plate 100 of the tumor electric field treatment system 1000 of the present invention has the reinforcement plate 15 disposed on the same side of the wire connection portion 113 and the insulation plate 12 and disposed opposite to the gold finger 116 of the wire connection portion 113, so as to reinforce the strength of the connection portion between the gold finger 116 of the wire connection portion 113 and the conductive trace (not shown) thereof, so as to greatly disperse the pulling force of the wire 6 on the wire connection portion 113 in the process of moving or turning over the flexible circuit board 11 through the wire 6, and prevent the electrode plate 100 from being unusable due to the breakage of the connection portion between the gold finger 116 of the wire connection portion 113 and the conductive trace (not shown) thereof when the wire 6 is pulled.

Second embodiment

Fig. 7 to 10 show an electrode sheet 100' according to a second embodiment of the present invention, which is also suitable for being applied to the trunk area of a patient for performing electric field therapy. The electrode sheet 100' also includes a backing 2 ', an electrical functional component 1 ' adhered to the backing 2 ', a support member 3 ' adhered to the backing 2 ', an adhesive member 4 ' covering a portion of the support member 3 ' corresponding to the electrical functional component 1 ', and a lead 6 ' electrically connected to the electrical functional component 1 '. The electrode sheet 100' differs from the electrode sheet assembly 100 of the first embodiment in that:

the electrical functional assembly 1 'includes a flexible circuit board 11', a plurality of high dielectric sheets 13 'and a plurality of insulating sheets 12' disposed on opposite sides of the flexible circuit board 11 ', and a plurality of temperature sensors 14' disposed on the same side of the flexible circuit board 11 'as the plurality of high dielectric sheets 13'. The flexible circuit board 11 ' of the electrical functional assembly 1 ' includes a plurality of main body portions 111 ' arranged at intervals, a connecting portion 112 ' located between two adjacent main body portions 111 ', and a wiring portion 113 ' connected to the connecting portion 112 '. The plurality of main body portions 111' are arranged in a substantially array. In this embodiment, the number of the main body parts 111' is 20, and the main body parts are distributed in an array area with four rows and six columns. The 20 main body parts 111 ' are distributed in an array area with four rows and six columns in a manner that the first row and the last row are respectively provided with four main body parts 111 ', and the middle two rows are respectively provided with six main body parts 111 '. From the column arrangement perspective, the first and sixth columns each have two main body portions 111 ', and the middle four columns each have four main body portions 111'. Specifically, the four main body portions 111 ' of the first row are respectively located in the respective second to fifth columns, the six main body portions 111 ' of each row of the middle two rows are respectively located in the respective first to sixth columns, and the four main body portions 111 ' of the last row are respectively located in the respective second to fifth columns. The plurality of main body portions 111 'of the electrical functional module 1' are provided in an axisymmetric manner. The plurality of main body portions 111 'of the electrical functional module 1' are disposed in a line-direction axisymmetric manner and a column-direction axisymmetric manner. The twenty main body parts 111' are arranged in an octagonal shape. In other embodiments, the number of the main body 111' is not limited to 20, and may be 9, 13, or the like.

The connecting portion 112 'connects all two adjacent main portions 111' located at the periphery of the array, and at least one adjacent two main portions 111 'of the two adjacent main portions 111' located at the inner layer of the array are arranged in a disconnected manner. Specifically, the connecting portion 112 'is provided between all adjacent two body portions 111' except between two body portions 111 'of the second row, the third column, and the fourth column, and between two body portions 111' of the third row, the third column, and the fourth column. The connecting portions 112 'are located between two adjacent main portions 111' arranged in a row, between two main portions 111 'arranged in a column, and around the array and located between two adjacent main portions 111' arranged in adjacent rows and adjacent columns in a diagonal manner.

The plurality of main body portions 111 ' may be divided into a plurality of peripheral main body portions 111A ' located at the periphery and a plurality of central main body portions 111B ' surrounded by the peripheral main body portions 111A ', as viewed from the distribution position of the main body portions 111 ' in the array. In this embodiment, the number of the peripheral main body portions 111A 'is 12, and the number of the central main body portions 111B' is 8. All the peripheral main body portions 111A 'are connected two by the connecting portions 112'. That is, the connecting portion 112 'is provided between all adjacent two peripheral body portions 111A'. At least two of the plurality of central main body portions 111B ' are disposed in a broken shape between the central main body portions 111B ' adjacent to each other in the same row or in the same column, and a space C is formed therebetween for the wire bonding portion 113 ' to pass through.

The space C is provided between two adjacent central body portions 111B 'of the second row, the third column and the fourth column, and between two adjacent central body portions 111B' of the third row, the third column and the fourth column. The wire connecting portion 113 ' is substantially T-shaped, passes through the space C, and bridges the connecting portion 112 ' between the two adjacent central body portions 111B ' in the middle of the third row and the connecting portion 112 ' between the two adjacent central body portions 111B ' in the middle of the fourth row. The wire connecting portion 113 'and two adjacent connecting portions 112' connected thereto are disposed in an axisymmetrical shape. Alternatively, the wire connecting portion 113 'is provided in a line shape and is extended laterally toward the space C from the connecting portion 112' corresponding to the space C.

The temperature sensor 14 'of the electrical functional assembly 1' is provided in plurality. In this embodiment, the number of the temperature sensors 14 'is 8, and the temperature sensors are respectively disposed on eight main body portions 111' located in the first row third column, the first row fourth column, the last row third column, the last row fourth column, the second row second column, the second row fifth column, the third row second column and the third row fifth column.

In this embodiment, 10 traces (not shown) of the flexible circuit board 11' are provided. The number of conductive traces (not shown) is two more than the number of temperature sensors 14'. The 10 conductive traces (not shown) include one conductive trace (not shown) connecting all the conductive cores 115 ' of the conductive pads 114 ' of the respective main body portions 111 ' in series, one conductive trace (not shown) connecting the ground terminals (not shown) of the plurality of temperature sensors 14 ' on the corresponding main body portions 111 ' in series, and eight conductive traces (not shown) connecting the signal terminals (not shown) of the 8 temperature sensors 14 ' on the corresponding main body portions 111 ' in parallel, respectively.

The connection portion 112 ' is composed of an insulating substrate 11A ' and a plurality of conductive traces (not shown) embedded in the insulating substrate 11A '. The conductive traces (not shown) in the insulating substrate 11A 'of the connecting portion 112' are electrically connected to the conductive traces (not shown) in the insulating substrate 11A 'of the main body portion 111' and the conductive traces (not shown) in the insulating substrate 11A 'of the wire connecting portion 113'. The plurality of connection portions 112 ' may have a plurality of conductive traces (not shown) embedded in the insulating substrate 11A ' only in a portion of the connection portions 112 ', and the conductive traces (not shown) are not embedded in the insulating substrate 11A ' of the portion of the connection portions 112 '.

A plurality of gold fingers 116 'are arranged on two opposite side surfaces of the wire connecting portion 113'. In this embodiment, the plurality of gold fingers 116 ' includes ten first gold fingers 1161 ' and one second gold finger 1162 '. The number of the first gold fingers 1161' is the same as the number of the conductive traces (not shown). The ten first gold fingers 1161 'include a first gold finger 1161' connected in series with the ground terminals (not shown) of the 8 temperature sensors 14 'through a corresponding one-way conductive trace (not shown), eight first gold fingers 1161' connected in parallel with the signal terminals (not shown) of the 8 temperature sensors 14 'through corresponding eight-way conductive traces (not shown), and a first gold finger 1161' electrically connected with the high dielectric sheet (not shown) through a corresponding one-way conductive trace (not shown). In this embodiment, the conductive wire 6' has 10 signal lines (not shown) and a shielding wire (not shown) wrapping the 10 signal lines (not shown). 10 signal lines (not shown) of the lead wire 6 'are soldered to the ten first gold fingers 1161' in a one-to-one correspondence. The shielding wires (not shown) of the wires 6 'are soldered to the second gold fingers 1162'.

In this embodiment, the 10 first gold fingers 1161 'are arranged in a row and staggered on two opposite side surfaces of the connection portion 113'. The 5 first gold fingers 1161 'are arranged in a row on the flexible circuit board 11' and located on the same side as the high-dielectric sheet 13 ', and the 5 first gold fingers 1161' are arranged in a row on the flexible circuit board 11 'and located on the same side as the insulating sheet 12'. The second gold finger 1162 ' and the high dielectric sheet 13 ' are disposed on the same side of the flexible circuit board 11 '. The second gold finger 1162 'is disposed at an end of the connection portion 113'. The 5 first gold fingers 1161 'and the second gold fingers 1162' located on the same side are arranged in two rows at intervals. The first golden finger 1161 ' on the same side as the second golden finger 1162 ' is arranged in a shape close to the second golden finger 1162 '. The first gold finger 1161 'on the side of the wiring portion 113' away from the high dielectric sheet 13 'is disposed away from the second gold finger 1162'. That is, the distance from the first golden finger 1161 'to the second golden finger 1162' on the same side as the second golden finger 1162 'is less than the distance from the first golden finger 1161' to the position opposite to the second golden finger 1162 'on a different side from the second golden finger 1162'. The first gold finger 1161 ' on the same side as the second gold finger 1162 ' is closer to the end of the connection portion 113 ' than the first gold finger 1161 ' on a different side from the second gold finger 1162 '. That is, the distance from the first gold finger 1161 'located on the same side as the second gold finger 1162' to the end of the wiring portion 113 'is smaller than the distance from the first gold finger 1161' located on a different side from the second gold finger 1162 'to the end of the wiring portion 113'. That is, when viewed from the thickness direction of the wiring portion 113 ', the first gold finger 1161' located on the same side as the second gold finger 1162 'is disposed between the first gold finger 1161' and the second gold finger 1162 'located on different sides from the second gold finger 1162'.

The number of the reinforcing plates 15' is 2. The 2 reinforcing plates 15 ' include a first reinforcing plate 151 ' adhered to the wire portions 113 ' and located on the same side as the high dielectric sheet 13 ' and a second reinforcing plate 152 ' adhered to the wire portions 113 ' and located on the same side as the insulating sheet 12 '. The first reinforcing plate 151 ' is disposed opposite to the 5 first gold fingers 1161 ' disposed on the same side as the insulating plate 12 ' of the wiring portion 113 ' and corresponding portions of the plurality of conductive traces (not shown) electrically connected to the 5 first gold fingers 1161 '. The second reinforcing plate 152 ' is disposed opposite to the 5 first gold fingers 1161 ' disposed on the same side of the wire connecting portion 113 ' as the high dielectric sheet 13 ', corresponding portions of the plurality of conductive traces (not shown) electrically connected to the 5 first gold fingers 1161 ', and the second gold fingers 1162. The areas of the first reinforcing plate 151 ' and the second reinforcing plate 152 ' are larger than the area of the gold finger 116 ' disposed opposite to the first reinforcing plate. In the present embodiment, the areas of the first reinforcing plate 151 'and the second reinforcing plate 152' are both greater than 20mm². The first reinforcing plate 151 'and the second reinforcing plate 152' are arranged in a substantially staggered manner.

Third embodiment

Fig. 11 and 12 show a third embodiment of the electric field tumor therapy system 1000 of the present invention, which only shows a plan view of the wiring portion 113 "of the flexible circuit board 11" and the reinforcing plate 15 ", and which is different from the second embodiment only in that: the first golden finger 1161 "of the wiring portion 113" and the second golden finger 1162 "located on the same side are arranged in a shape far away from the end of the wiring portion 113", and the first golden finger 1161 "of the wiring portion 113" and the second golden finger 1162 "located on different sides are arranged in a direction close to the second golden finger 1162". The first gold finger 1161 "located on a different side from the second gold finger 1162" is disposed in a shape close to the end of the connection portion 113 ". The distance from the first golden finger 1161 "located on the same side as the second golden finger 1162" to the end of the wiring portion 113 "is greater than the distance from the first golden finger 1161" located on a different side from the second golden finger 1162 "to the end of the wiring portion 113". The first gold finger 1161 "located on a different side from the second gold finger 1162" is disposed between the first gold finger 1161 "and the second gold finger 1162" located on the same side as the second gold finger 1162 "when viewed from the thickness direction of the wiring portion 113". One first reinforcing plate 151 ″ is disposed between the second gold finger 1162 ″ and the first gold finger 1161 ″ on the same side as the wiring portion 113', so as to enhance the strength of the connection between the first gold finger 1161 ″ and the corresponding conductive trace (not shown) on the different side from the second gold finger 1162 ″. The two second reinforcing plates 152 "are respectively arranged at the positions of the two opposite ends of the first golden finger 1161" of the wiring part 113 "and the second golden finger 1162" which are located at different sides, and one of the two second reinforcing plates 152 "is arranged at the position of the wiring part 113" opposite to the second golden finger 1162 "for improving the strength of the connection part of the second golden finger 1162" and the conductive trace (not shown) connected with the second golden finger 1162 "; and the other is arranged at a position of the wiring portion 113 "opposite to the first golden finger 1161" on the same side as the second golden finger 1162 "for improving the strength of the first golden finger 1161" on the same side as the second golden finger 1162 ". The reinforcing plate 15 "and the gold finger 116" on the same side of the wire connecting portion 113 "have a gap of 1mm or more, so as to prevent the reinforcing plate 15" from affecting the welding between the gold finger 116 "and the lead 6".

In the electrode sheet 100, 100' of the present invention, the reinforcing plates 15, 15 ', 15 ″ are disposed at the positions of the connecting portions of the gold fingers 116 ' of the wire connecting portions 113, 113 ', 113 ″ and the conductive traces (not shown) opposite to each other, so as to improve the strength of the wire connecting portions 113, 113 ', 113 ″ and to greatly disperse the pulling force of the wires 6, 6 ' to the wire connecting portions 113, 113 ', 113 ″ in the process of moving or turning over the flexible circuit boards 11, 11 ' after the wires 6, 6 ' are welded to the flexible circuit boards 11, 11 ', thereby preventing the connecting portions of the gold fingers 116, 116 ', 116 ″ of the wire connecting portions 113, 113 ', 113 ″ and the conductive traces (not shown) from being broken when the wire connecting portions 113, 113 ', 113 ″ are pulled by the wires 6, 6 ', so as to prevent the electrode sheet 100, 100' from being unusable, thereby improving the product yield and reducing the production cost. Meanwhile, the electrode plates 100 and 100' can be attached to the body surface corresponding to the tumor part of the patient in a fitting manner.

The present invention is not limited to the above preferred embodiments, but rather should be construed as broadly within the spirit and scope of the utility model as defined in the appended claims.

Claims (29)

1. An electrode plate for electric field therapy of tumor comprises a flexible circuit board, at least one high dielectric sheet arranged on the flexible circuit board and a lead electrically connected with the flexible circuit board, and is characterized in that the flexible circuit board is provided with a wiring part welded with the lead and a reinforcing plate arranged on the wiring part, the wiring part is provided with a plurality of golden fingers welded with the lead and conductive traces electrically connected with the corresponding golden fingers respectively, and the reinforcing plate is arranged at the position opposite to the connecting part of the golden fingers and the conductive traces of the wiring part.

2. The electrode sheet of claim 1, wherein the stiffener and high dielectric sheet are on opposite sides of a flexible circuit board.

3. The electrode sheet of claim 2, wherein the plurality of gold fingers are provided on a side of the wire portion on the same side as the high dielectric sheet.

4. The electrode sheet according to claim 1, wherein the plurality of gold fingers are provided on opposite side surfaces of the wire connecting portion in a staggered manner.

5. The electrode tab according to claim 4, wherein the reinforcing plate is plural and provided on opposite sides of the terminal portion, respectively.

6. The electrode tab of claim 5, wherein the stiffener is disposed at a position opposite to the conductive trace electrically connected to the corresponding gold finger of the wire connection portion and the stiffener and the corresponding gold finger are disposed at two opposite sides of the wire connection portion.

7. The electrode sheet according to claim 1, wherein the plurality of gold fingers include first gold fingers arranged in a staggered row, and the first gold fingers arranged in the staggered row are respectively arranged on two opposite sides of the wire connecting portion.

8. The electrode tab of claim 7, wherein the reinforcing plates comprise a first reinforcing plate and a second reinforcing plate respectively disposed on opposite sides of the wire connecting portion.

9. The electrode tab of claim 8, wherein the first reinforcing plate is located on the same side as the high dielectric sheet and on opposite sides of the wire connection portion from first gold fingers provided on the wire connection portion and located on different sides from the high dielectric sheet.

10. The electrode pad of claim 9, wherein the first reinforcing plate is provided at a position opposite to a first gold finger of the wire connecting portion and the high dielectric sheet at different sides and a conductive trace electrically connected to the first gold finger.

11. The electrode tab as claimed in claim 8, wherein the second reinforcing plate is provided on a side surface of the terminal portion on a different side from the high-dielectric tab.

12. The electrode sheet of claim 8, wherein the second reinforcing plate is located on a different side from the high dielectric sheet.

13. The electrode tab of claim 8, wherein the second reinforcing plate and the first gold finger disposed on the wire connecting portion and on the same side as the high-dielectric sheet are respectively located on opposite sides of the wire connecting portion.

14. The electrode pad of claim 13, wherein the second reinforcing plate is disposed at a position opposite to the first gold finger of the wire connection portion on the same side as the high dielectric sheet and the conductive trace electrically connected to the first gold finger.

15. The electrode sheet of claim 8, wherein the gold finger further comprises a second gold finger disposed on the wire connecting portion and on the same side as the high dielectric sheet.

16. The electrode sheet of claim 15, wherein the second gold finger and the first gold finger on the same side are spaced apart.

17. The electrode sheet of claim 15, wherein the first gold finger on the same side as the high dielectric sheet is disposed near the terminal end of the wire portion, and the first gold finger on a different side from the high dielectric sheet is disposed away from the terminal end of the wire portion.

18. The electrode tab of claim 15, wherein the first gold finger on the same side as the high dielectric sheet is located at a distance from the terminal end of the wire portion that is less than the distance from the first gold finger on a different side from the high dielectric sheet.

19. The electrode tab according to claim 15, wherein the first gold finger on the same side as the high dielectric sheet is disposed at a position between the first gold finger and the second gold finger of the wire portion on different sides from the high dielectric sheet as viewed in a thickness direction of the wire portion.

20. The electrode tab of claim 19, wherein the second stiffener is located on opposite sides of the wire connecting portion from the second gold finger, and the second stiffener is located on opposite sides of the wire connecting portion from the first gold finger and the second gold finger on the same side of the high dielectric sheet and from the conductive traces electrically connected to the first gold finger and the second gold finger, respectively.

21. The electrode pad of claim 15, wherein the second gold finger is disposed at a position near the terminal end of the wire connection portion.

22. The electrode sheet of claim 21, wherein the first gold finger on the same side as the high dielectric sheet is disposed distal from the terminal end of the wire portion, and the first gold finger on a different side from the high dielectric sheet is disposed proximal to the terminal end of the wire portion.

23. The electrode tab of claim 21, wherein the first gold finger on the same side as the high dielectric sheet is located at a greater distance from the terminal end of the wire portion than the first gold finger on a different side from the high dielectric sheet.

24. The electrode tab as claimed in claim 21, wherein the first gold finger on the different side from the high dielectric sheet is disposed at a position between the first gold finger and the second gold finger of the wire portion on the same side as the high dielectric sheet as viewed in a thickness direction of the wire portion.

25. An electrode sheet as defined in any one of claims 1 to 24, wherein the reinforcing plate is made of a polyimide material and has a thickness of 0.6mm to 1 mm.

26. An electrode sheet as claimed in any one of claims 1 to 24, wherein the reinforcing plate is made of epoxy glass fibre material and has a thickness of 0.2mm-0.5 mm.

27. The electrode sheet of claim 1, further comprising a heat-shrinkable sleeve covering the connection between the wiring portion of the flexible circuit board and the lead.

28. An electric field tumor treatment system, comprising an electric field generator and an electrode pad according to any one of claims 1 to 27 electrically connected to the electric field generator.

29. The electric field tumor therapy system according to claim 28, further comprising an adapter electrically connected to the electric field generator, wherein the electrode pads are detachably mounted on the adapter.

Images