CN216565702U - Printed circuit board with electric thick gold and electronic equipment - Google Patents
Printed circuit board with electric thick gold and electronic equipment Download PDFInfo
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- CN216565702U CN216565702U CN202122557474.4U CN202122557474U CN216565702U CN 216565702 U CN216565702 U CN 216565702U CN 202122557474 U CN202122557474 U CN 202122557474U CN 216565702 U CN216565702 U CN 216565702U
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Abstract
The utility model belongs to the technical field of printed circuit boards, and particularly relates to a printed circuit board with an electrical thick gold and an electronic device. The printed circuit board comprises an inner layer board, a copper foil layer and a thick gold layer, wherein the copper foil layer is arranged on the outer surface of the inner layer board; the thick gold layer is formed on a partial area of the copper foil layer, and the thickness of the copper foil layer in the partial area is 5-15 mu m. The electronic equipment comprises the printed circuit board. The printed circuit board provided by the utility model limits the thickness of the copper foil layer at the bottom of the thick gold layer through the interaction of the inner layer board, the copper foil layer and the thick gold layer, so that the printed circuit board avoids the phenomenon of copper suspension, and has the beneficial effects of high finished product quality, simple structure, easiness in production and the like.
Description
Technical Field
The utility model belongs to the technical field of printed circuit boards, and particularly relates to a printed circuit board with an electrical thick gold and an electronic device.
Background
The thick gold formed by the existing printed circuit board often has the phenomenon of copper suspension because the copper layer at the bottom of the thick gold is affected by etching of alkaline liquid medicine, thereby causing the quality problems of uneven electroplated copper, incapability of welding in the assembly process, abnormal high-speed signal transmission and the like.
How to reduce the influence of the copper-suspending phenomenon on the quality of the printed circuit board is becoming a problem to be solved urgently in the field of printed circuit board manufacturing.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solving at least one of the problems of the prior art described above. Therefore, the embodiment of the application provides a printed circuit board with an electrical thick gold and an electronic device, so as to improve the influence of the existing copper-suspending phenomenon on the quality of the printed circuit board.
A first aspect of embodiments of the present application provides a printed circuit board having an electrical thick gold, the printed circuit board including: the inner layer plate, the copper foil layer and the thick gold layer; the copper foil layer is arranged on the outer surface of the inner layer plate; the thick gold layer is formed on a local area of the copper foil layer; the thickness of the copper foil layer corresponding to the local area is 5-15 mu m.
According to some embodiments of the present application, the copper foil layer comprises a first copper foil layer and a second copper foil layer connected to each other; the first copper foil layer is lower in thickness than the second copper foil layer; the thick gold layer is formed on the outer surface of the first copper foil layer.
According to some embodiments of the present application, the copper foil layer further comprises an electroplated copper layer; the electroplated copper layer is formed on the outer surface of the second copper foil layer.
According to some embodiments of the present application, the second copper foil layer is formed with a first circuit pattern layer on a surface thereof; the first circuit pattern layer penetrates through the electroplated copper layer.
According to some embodiments of the present application, the thick gold layer comprises a first gold layer and a second gold layer; the first gold layer is connected with the first copper foil layer and the second gold layer respectively.
According to some embodiments of the present application, the thick gold layer is formed with a second line pattern layer penetrating the first gold layer and the second gold layer.
According to some embodiments of the present application, the first copper foil layer has a thickness of 5-15 μm; the thickness of the second copper foil layer is 30-40 μm; the thickness of the electroplated copper layer is 60-90 μm.
According to some embodiments of the present application, the printed circuit board further comprises a via hole and a copper immersion layer; the conducting hole is communicated with the copper foil layer and the inner layer plate; the copper-plated layer is formed on the wall of the via hole.
According to some embodiments of the present application, the thickness of the copper immersion layer is not less than 10 μm.
A second aspect of embodiments of the present application provides an electronic device including the printed circuit board described above.
According to some embodiments of the present application, the electronic device comprises: the inner layer plate, the copper foil layer and the thick gold layer; the copper foil layer is arranged on the outer surface of the inner layer plate; the thick gold layer is formed on a local area of the copper foil layer; the thickness of the copper foil layer corresponding to the local area is 5-15 mu m. According to some embodiments of the present application, the copper foil layer comprises a first copper foil layer and a second copper foil layer connected to each other; the first copper foil layer is lower in thickness than the second copper foil layer; the thick gold layer is formed on the outer surface of the first copper foil layer.
Therefore, the beneficial effects of the embodiment of the application include:
1. the printed circuit board limits the thickness of the copper foil layer at the bottom of the thick gold layer to be 5-15 mu m through the interaction of the inner layer plate, the copper foil layer and the thick gold layer, so that the phenomenon of copper suspension in the printed circuit board is avoided, and the printed circuit board has the advantage of high finished product quality;
2. the printed circuit board has simple structure and is easy to produce.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:
FIG. 1 illustrates a schematic diagram of a printed circuit board in some embodiments of the utility model;
the figures in the drawings are identified as:
100-inner layer plate; 210-a first copper foil layer; 220-a second copper foil layer; 300-electroplating a copper layer; 410-a first gold layer; 420-second gold layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
The technical scheme provided by the embodiment of the application is described in the following with the accompanying drawings of the specification.
The embodiment of the present application provides a printed circuit board with electrical thick gold, the structure of which is shown in fig. 1, including an inner board 100; copper foil layers (i.e., first copper foil layer 210, second copper foil layer 220, and electroplated copper layer 300); thick gold layers (i.e., first gold layer 410 and second gold layer 420). The first copper foil layer 210 and the second copper foil layer 220 are both arranged on the outer surface of the inner plate 100; the thick gold layer is formed on a local area of the copper foil layer (i.e., the first copper foil layer) having a copper foil layer thickness (i.e., the thickness of the first copper foil layer) of 5 to 15 μm. It will be appreciated that the thick gold layer is also the electrically thick gold on the printed circuit board.
The printed circuit board provided by the embodiment of the application adjusts the thickness of the copper foil layer at the bottom of the thick gold layer through the interaction of the inner plate 100, the copper foil layer and the thick gold layer, so that the printed circuit board can avoid the phenomenon of copper suspension, and has the beneficial effects of high finished product quality, simple structure, easiness in production and the like.
In some embodiments of the present application, the printed circuit board further comprises a via hole and a copper sinker layer; the via hole penetrates the copper foil layer and the inner layer board 100; the conducting hole penetrates through the copper foil layer and the inner layer plate; the copper-deposited layer is formed on the hole wall of the via hole and connected with the copper foil layers on the two sides of the inner layer board.
In some embodiments of the present application, the inner panel 100 is a single-layer substrate or a multi-layer circuit board.
In some embodiments of the present application, the inner layer board is formed with an inner layer wiring pattern. The inner layer circuit pattern is obtained by etching after exposure and development of the inner layer circuit are completed by 6-8 grids by adopting a 21-grid exposure ruler.
In some embodiments of the present application, the copper foil layers are formed on opposite surfaces of the inner sheet 100.
It should be noted that the copper foil layer may be formed on one surface or both opposite surfaces of the inner layer board 100.
In some embodiments, the copper deposition layer is formed on the via hole, and the via hole may be metalized by using a copper deposition process. The copper deposition layer can be electrically connected to the inner layer board 100 and the copper foil layer, respectively, to ensure the conduction of each circuit.
Note that the thickness of the copper deposit layer is not less than 10 μm.
In some embodiments of the present application, the copper foil layer includes a first copper foil layer 210 and a second copper foil layer 220 connected to each other; the first copper foil layer 210 has a lower thickness than the second copper foil layer 220; a thick gold layer is formed on the outer surface of the first copper foil layer 210; the second copper foil layer 220 has a thickness of 34.3 μm; the first copper foil layer 210 has a thickness of 10 μm.
It should be noted that the thickness of the second copper foil layer 220 may be any value of 30-40 μm, and the thickness of the first copper foil layer 210 may be any value of 5-15 μm.
In some embodiments of the present application, the copper foil layer comprises a third copper foil layer; the third copper foil layer is provided with an electric gold position and a non-electric gold position, and the first copper foil layer is obtained by thinning the third copper foil layer corresponding to the electric gold position; the second copper foil layer is a third copper foil layer corresponding to the non-electric gold position.
In some embodiments of the present application, the copper foil layer further comprises an electroplated copper layer, the electroplated copper layer 300 having a thickness of 60-90 μm; the electroplated copper layer 300 is formed on the outer surface of the second copper foil layer 220. It should be noted that the sum of the copper thicknesses of the electroplated copper layer 300 and the second copper foil layer 220 is any value within the range of 100-120 μm. The copper thickness of the electroplated copper layer 300 and the second copper foil layer 220 and the thickness between the inner surface of the electroplated copper layer 300 and the outer surface of the second copper foil layer 220
In some embodiments of the present application, the first copper foil layer is obtained by reducing the thickness of the area corresponding to the first copper foil layer after the formation of the electroplated copper foil layer.
In some embodiments of the present application, the outer surface of the second copper foil layer 220 is formed with a first circuit pattern layer; the first line pattern layer is formed on the copper electroplating layer 300 and penetrates the copper electroplating layer 300. The first circuit pattern layer is obtained by etching with an alkaline solution.
In some embodiments of the present application, the outer surface of the second copper foil layer 220 is formed with a first circuit pattern; the first circuit pattern layer is obtained by etching the area corresponding to the first circuit pattern layer through an alkaline solution.
In some embodiments of the present application, the thick au layer includes a first au layer 410 and a second au layer 420, the first au layer 410 is formed on an outer surface of the first copper foil layer 210; the second gold layer 420 is formed on the outer surface of the first gold layer 410.
In some embodiments of the present application, the outer surface of the first copper foil layer 210 is formed with a second circuit pattern layer; the second line pattern layer is formed on the first au layer 410 and the second au layer 420, and penetrates the first au layer 410 and the second au layer 420. The second line pattern layer is obtained by etching with an alkaline solution.
In some embodiments of the present application, the outer surface of the first copper foil layer 210 is formed with a second circuit pattern, and the area of the outer surface of the first gold layer 410 corresponding to the second circuit pattern is again formed with a second circuit pattern, and the second circuit pattern layer is obtained by etching an alkaline solution at the area corresponding to the second circuit pattern.
In order to achieve the above object, an embodiment of the present application further provides an electronic device, which includes the printed circuit board in any of the above embodiments.
According to some embodiments of the present application, the electronic device comprises: inner layer plate 100, copper foil layer, thick gold layer; the copper foil layer is arranged on the outer surface of the inner plate 100; the thick gold layer is formed on a local area of the copper foil layer, the local area having a thickness of 5-15 μm. The electronic equipment has the advantages that the copper suspension phenomenon is avoided in the electronic equipment through the interaction of the inner plate 100, the copper foil layer and the thick gold layer and limitation on the thickness of the copper foil layer at the bottom of the thick gold layer, and the electronic equipment has the advantages of high finished product quality, simple structure, easiness in production and the like.
Finally, it should be noted that the above embodiment modes are only used for illustrating the technical solutions of the present application and are not limited, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.
Claims (10)
1. A printed circuit board, comprising:
an inner layer board;
the copper foil layer is arranged on the outer surface of the inner layer plate;
the thick gold layer is formed in a local area of the copper foil layer; the thickness of the copper foil layer corresponding to the local area is 5-15 mu m.
2. The printed circuit board of claim 1,
the copper foil layer comprises a first copper foil layer and a second copper foil layer which are connected with each other;
the first copper foil layer is lower in thickness than the second copper foil layer;
the thick gold layer is formed on the outer surface of the first copper foil layer.
3. The printed circuit board of claim 2,
the copper foil layer further comprises an electroplated copper layer;
the electroplated copper layer is formed on the outer surface of the second copper foil layer.
4. The printed circuit board of claim 3,
the electroplated copper layer is provided with a first circuit pattern layer;
the first circuit pattern layer penetrates through the electroplated copper layer.
5. The printed circuit board of claim 2,
the thick gold layer comprises a first gold layer and a second gold layer;
the first gold layer is connected with the first copper foil layer and the second gold layer respectively.
6. The printed circuit board of claim 5,
the thick gold layer is formed with a second line pattern layer,
the second circuit pattern layer penetrates through the first gold layer and the second gold layer.
7. The printed circuit board of claim 3,
the thickness of the first copper foil layer is 5-15 μm;
the thickness of the second copper foil layer is 30-40 μm;
the thickness of the electroplated copper layer is 60-90 μm.
8. The printed circuit board of claim 1,
the printed circuit board also comprises a via hole and a copper-plated layer;
the conducting hole is communicated with the copper foil layer and the inner layer plate;
the copper-plated layer is formed on the wall of the via hole.
9. The printed circuit board of claim 8, wherein the thickness of the copper sinker layer is not less than 10 μm.
10. An electronic device, characterized in that it comprises a printed circuit board according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122557474.4U CN216565702U (en) | 2021-10-22 | 2021-10-22 | Printed circuit board with electric thick gold and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122557474.4U CN216565702U (en) | 2021-10-22 | 2021-10-22 | Printed circuit board with electric thick gold and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216565702U true CN216565702U (en) | 2022-05-17 |
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ID=81568509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122557474.4U Active CN216565702U (en) | 2021-10-22 | 2021-10-22 | Printed circuit board with electric thick gold and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216565702U (en) |
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2021
- 2021-10-22 CN CN202122557474.4U patent/CN216565702U/en active Active
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