CN216563181U

CN216563181U - LED packaging structure and display device

Info

Publication number: CN216563181U
Application number: CN202123248534.0U
Authority: CN
Inventors: 杨鸿麟; 晏东
Original assignee: Tuomi Chengdu Applied Technology Research Institute Co ltd
Current assignee: Tuomi Chengdu Applied Technology Research Institute Co ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2022-05-17
Anticipated expiration: 2031-12-22

Abstract

The utility model discloses an LED packaging structure and a display device, and belongs to the technical field of packaging. The LED packaging structure comprises a light-transmitting piece, a packaging support and an LED chip, wherein the light-transmitting piece comprises a first glass layer, a quantum dot coating and a second glass layer, the quantum dot coating is packaged in the first glass layer and between the second glass layers, the quantum dot coating is packaged into the light-transmitting piece of an integrated structure by the first glass layer and the second glass layer, the light-transmitting piece is sealed and arranged at the top of the packaging support to form a containing cavity, and the LED chip is arranged in a solid crystal area at the bottom of the containing cavity and used for emitting light. The light-transmitting piece is provided with the quantum dot coating, so that the color gamut range is enlarged, the color coordinate is stable, and the light-emitting efficiency is improved; the excellent water-blocking and oxygen-blocking functions of the glass are utilized, and the service life of the quantum dot coating is prolonged.

Description

LED packaging structure and display device

Technical Field

The utility model relates to the technical field of packaging, in particular to an LED packaging structure and a display device.

Background

The use of LEDs as backlight units for liquid crystal display devices such as televisions, monitors, notebook computers, and in-vehicle displays has been rapidly advancing. LEDs have become the mainstream of light sources for various purposes (for example, light sources of backlight units or light sources for general lighting or illumination).

In a traditional LED glass fluorescent sheet structure, two ways are included for encapsulating a fluorescent material, one of which is as shown in fig. 1, generally, phosphor is dispersed in epoxy resin and used in a dispensing manner, a blue LED chip is fixed above a die bonding layer, and then a mixture of the phosphor and the epoxy resin is filled in a gap in an encapsulation support; another scheme is that as shown in fig. 2, the fluorescent powder and the ceramic powder are mixed, and the fluorescent glass sheet is prepared by sintering, a blue light LED chip is fixed above a die bonding layer, then the sintered glass fluorescent sheet is placed above a packaging support, and gaps in the packaging support are filled with epoxy resin.

However, the packaging method using the fluorescent powder has obvious defects: the color gamut range is small, the color coordinates drift, and the luminous efficiency is reduced.

Therefore, it is desirable to provide an LED package structure and a display device to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an LED packaging structure and a display device, which have the advantages of expanded color gamut range, stable color coordinates and high luminous efficiency.

In order to realize the purpose, the following technical scheme is provided:

an LED package structure comprising:

the light-transmitting piece comprises a first glass layer, a quantum dot coating and a second glass layer, wherein the quantum dot coating is packaged between the first glass layer and the second glass layer;

the light-transmitting piece sealing cover is arranged at the top of the packaging support and surrounds the packaging support to form a containing cavity, and a crystal fixing area is convexly arranged at the bottom of the containing cavity;

and the LED chip is arranged in the die bonding area.

As an alternative of the LED package structure, the LED package structure further includes a die bonding layer disposed between the die bonding region and the LED chip.

As an alternative of the LED package structure, the LED package structure further includes a lead wire, the lead wire is inserted into the bottom of the package support, one end of the lead wire extends into the accommodating cavity and is electrically connected to the LED chip, and the other end of the lead wire extends out of the bottom of the package support for being connected to an external power supply.

As an alternative of the LED package structure, the lead includes a positive electrode copper deposition line and a negative electrode copper deposition line, the positive electrode copper deposition line is connected to the positive electrode of the LED chip through a gold wire, and the negative electrode copper deposition line is connected to the negative electrode of the LED chip through a gold wire.

As an alternative to the LED package structure, the LED package structure further includes an epoxy resin, and the accommodating cavity is filled with the epoxy resin.

As an alternative of the LED packaging structure, the LED packaging structure is provided with a plurality of groups of LED chips, and the LED chips are arranged at the bottom of the light-transmitting piece at intervals.

As an alternative to the LED package structure, the LED chip is a blue chip, a red chip, or a green chip.

As an alternative scheme of the LED packaging structure, the quantum dot coating is provided with multiple layers, the multiple layers are arranged in the light-transmitting piece at intervals, and the multiple layers are arranged in a one-to-one correspondence manner with the multiple groups of LED chips.

As an alternative to the LED packaging structure, the thickness of the first glass layer and the second glass layer is not more than 0.1 mm.

A display device comprising a power supply and the LED package structure as described in any one of the above, the power supply being electrically connected to leads of the LED package structure.

Compared with the prior art, the utility model has the beneficial effects that:

the LED packaging structure provided by the utility model adopts the first glass layer and the second glass layer to package the quantum dot coating into the light-transmitting piece with an integrated structure, the light-transmitting piece is hermetically arranged at the top of the packaging support to form a containing cavity, and the solid crystal area at the bottom of the containing cavity is provided with the LED chip for emitting light. The light-transmitting piece is provided with the quantum dot coating, so that the color gamut range is enlarged, the color coordinate is stable, and the light-emitting efficiency is improved; the excellent water and oxygen blocking functions of the glass are utilized, and the service life of the quantum dot coating is prolonged.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.

FIG. 1 is a schematic diagram of a first package structure of an LED chip in the prior art;

FIG. 2 is a diagram illustrating a second package structure of an LED chip in the prior art;

FIG. 3 is a schematic structural diagram of an LED package structure according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a multilayer quantum dot coating provided in an embodiment of the present invention.

Reference numerals:

100. fluorescent powder; 200. a fluorescent glass sheet;

1. a light transmissive member; 2. packaging the bracket; 3. an accommodating chamber; 4. an LED chip; 5. solidifying a crystal layer; 6. a lead wire; 7. gold thread; 8. an epoxy resin;

11. a first glass layer; 12. a quantum dot coating; 13. a second glass layer;

31. a die bonding area;

61. a positive electrode copper deposition circuit; 62. and a negative electrode copper deposition circuit.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the description refers must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In a traditional LED glass fluorescent sheet structure, the encapsulation of fluorescent material includes two ways, one of which is: as shown in fig. 1, the phosphor 100 is generally dispersed in the epoxy resin 8 and used by dispensing, a blue LED chip is fixed above the die attach layer, and then the gap in the package support 2 is filled with the mixture of the phosphor 100 and the epoxy resin 8; the other scheme is as follows: as shown in fig. 2, the phosphor 100 and the ceramic powder are mixed and sintered to prepare a phosphor glass sheet 200, and the blue LED chip is fixed on the die bonding layer, and then the sintered phosphor glass sheet 200 is placed on the package support 2, and the gap in the package support 2 is filled with the epoxy resin 8.

Compared with organic materials of LEDs, quantum dots are mainly made of inorganic materials, have better light stability than organic materials, and are introduced into LEDs to solve the problem of color purity of the traditional LEDs and expand the color gamut. The advantages of the quantum dot display technology can be summarized into three major aspects of high, pure and long time. "high" means high color gamut; the pure color is pure color, the color purity is improved by about 58.3 percent compared with that of the common LED, and the natural color is accurately presented; the long-term color is the long-term color, the stable quantum dots of the inorganic nano material can ensure that the color is not faded for a long time, and the lasting and stable color can reach 60000 hours.

In order to expand the color gamut, ensure stable color coordinates, and have high light emitting efficiency, the embodiment provides an LED package structure, and details of the embodiment are described in detail below with reference to fig. 3 to 4.

As shown in fig. 3, the LED package structure includes a light-transmitting member 1, a package support 2, and an LED chip 4. The light-transmitting piece 1 comprises a first glass layer 11, a quantum dot coating 12 and a second glass layer 13, wherein the quantum dot coating 12 is packaged between the first glass layer 11 and the second glass layer 13 to form a sandwich structure. Encapsulation support 2 sealed cowling is located the top of encapsulation support 2 and encloses with encapsulation support 2 and establish and form and hold chamber 3, holds the protruding solid crystalline region 31 that is equipped with in bottom in chamber 3. The LED chip 4 is disposed in the die attach region 31.

In short, the LED package structure provided by the present invention adopts the first glass layer 11 and the second glass layer 13 to package the quantum dot coating 12 into the light-transmitting member 1 of an integrated structure, the light-transmitting member 1 is hermetically disposed on the top of the package support 2 and forms the accommodating cavity 3, and the die bonding region 31 at the bottom of the accommodating cavity 3 is disposed with the LED chip 4 for emitting light. The light-transmitting piece 1 is provided with the quantum dot coating 12, so that the color gamut range is enlarged, the color coordinate is stable, and the light-emitting efficiency is improved; the excellent water and oxygen blocking functions of the glass are utilized, and the service life of the quantum dot coating 12 is prolonged. The die bonding area 31 protrudes from the bottom of the accommodating cavity 3, so that the distance between the LED chip 4 and the light-transmitting piece 1 is shortened, the energy loss is reduced, and the light emitting quantity is increased.

Specifically, UTG Glass (Ultra-Thin Glass) is used as each of the first Glass layer 11 and the second Glass layer 13. The "thinness" of the ultra-thin glass also leads to better optical quality, such as higher transmittance, for the ultra-thin glass product, which may lead to overwhelming performance gaps in the application scenario of precision optics. In the smart phone industry, the application of the ultrathin glass can also improve the speed and accuracy of fingerprint identification under the screen.

Further, the first glass layer 11 and the second glass layer 13 are made of ultra-thin glass with the thickness not exceeding 0.1 mm. Preferably, the thickness of the ultrathin glass used for the first glass layer 11 is 0.03mm-0.07 mm; the thickness of the ultrathin glass used for the second glass layer 13 is 0.03mm-0.07 mm.

Further, the LED package structure further includes a die bond layer 5, and the die bond layer 5 is disposed between the die bond region 31 and the LED chip 4. The die bond layer 5 is formed by an insulating adhesive, so that the LED chip 4 is firmly bonded to the die bond region 31.

Further, as shown in fig. 3, the LED package structure further includes a lead 6, the lead 6 is inserted into the bottom of the package support 2, one end of the lead 6 extends into the accommodating cavity 3 and is electrically connected to the LED chip 4, and the other end of the lead 6 extends out of the bottom of the package support 2 for being connected to an external power supply. Specifically, the lead 6 includes a positive electrode copper deposition line 61 and a negative electrode copper deposition line 62, the positive electrode copper deposition line 61 is connected to the positive electrode of the LED chip 4 by a gold wire 7, and the negative electrode copper deposition line 62 is connected to the negative electrode of the LED chip 4 by a gold wire 7.

Further, the LED package structure further includes an epoxy resin 8, and the accommodating cavity 3 is filled with the epoxy resin 8.

Further, the longitudinal section of the accommodating cavity 3 is in an inverted trapezoid shape with a wide upper part and a narrow lower part, which is beneficial to enlarging the light emitting angle and improving the light emitting quantity. The inner surface of the accommodating cavity 3 is polished and smoothed, so that the reflection effect is improved, and the light emission quantity is further improved.

Further, as shown in fig. 3 and fig. 4, the LED package structure is provided with a plurality of sets of LED chips 4, and the plurality of sets of LED chips 4 are disposed at the bottom of the light-transmitting member 1 at intervals. The LED chip 4 may be a blue chip, a red chip, or a green chip, and mixes light with three primary colors (red, green, and blue) to form white light, so as to uniformly emit light from the light-transmitting member 1.

Furthermore, as shown in fig. 4, the quantum dot coating 12 is provided with a plurality of layers, the plurality of layers of quantum dot coatings 12 are arranged in the light-transmitting member 1 at intervals, and the plurality of layers of quantum dot coatings 12 are arranged in one-to-one correspondence with the plurality of groups of LED chips 4. The multilayer quantum dot coatings 12 are spaced at a certain distance from each other, so that later-stage cutting is facilitated.

The manufacturing steps of the LED package structure in this embodiment are as follows:

step 1: manufacturing an LED packaging support 2, leading out a lead 6 in the support from the lower part of an LED chip 4, and fixing the LED chip 4 above a die bonding layer 5;

step 2: filling the inner gap of the packaging bracket 2 with epoxy resin 8;

and step 3: the manufacturing method of the light-transmitting member 1 made of the ultrathin glass comprises the following steps: firstly, quantum dot coating is carried out on a first glass layer 11, and the quantum dot coating 12 can be coated in a screen printing mode, an ink-jet printing mode, a spraying mode, a spin coating mode and the like; the size of the pattern on the quantum dot coating 12 is distributed according to the size of the packaging support 2. As shown in fig. 4, a certain gap is formed between each pattern, which is convenient for packaging and cutting, and then the second glass layer 13 is covered by the spot frame sealing glue for curing and packaging. Then, cutting the packaging bracket 2 into a required size in a laser cutting mode;

and 4, step 4: and placing the light-transmitting piece 1 above the packaging support 2 and curing and bonding the light-transmitting piece and the epoxy resin 8.

The embodiment also provides a display device, which comprises a power supply and the LED packaging structure, wherein the power supply is electrically connected with the lead of the LED packaging structure and provides stable and continuous electric energy for the LED chip 4. The display device can be applied to the fields of vehicle-mounted displays, notebook computers and the like.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the utility model. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An LED package structure, comprising:

the light-transmitting piece (1) comprises a first glass layer (11), a quantum dot coating (12) and a second glass layer (13), wherein the quantum dot coating (12) is packaged between the first glass layer (11) and the second glass layer (13);

the packaging support (2), the sealing cover of the light-transmitting piece (1) is arranged at the top of the packaging support (2) and surrounds the packaging support (2) to form a containing cavity (3), and a die bonding area (31) is convexly arranged at the bottom of the containing cavity (3);

and the LED chip (4) is arranged in the die bonding area (31).

2. The LED package structure according to claim 1, further comprising a solid crystal layer (5), wherein the solid crystal layer (5) is disposed between the solid crystal region (31) and the LED chip (4).

3. The LED packaging structure according to claim 1, further comprising a lead (6), wherein the lead (6) is inserted into the bottom of the package support (2), one end of the lead (6) extends into the accommodating cavity (3) and is electrically connected to the LED chip (4), and the other end of the lead (6) extends out of the bottom of the package support (2) and is connected to an external power supply.

4. The LED package structure according to claim 3, wherein the lead (6) comprises a positive copper-clad line (61) and a negative copper-clad line (62), the positive copper-clad line (61) is connected with the positive electrode of the LED chip (4) through a gold wire (7), and the negative copper-clad line (62) is connected with the negative electrode of the LED chip (4) through the gold wire (7).

5. The LED package structure according to any one of claims 1-4, further comprising an epoxy resin (8), wherein the accommodating cavity (3) is filled with the epoxy resin (8).

6. The LED packaging structure according to claim 5, wherein the LED packaging structure is provided with a plurality of sets of the LED chips (4), and the LED chips (4) are arranged at intervals at the bottom of the light-transmitting member (1).

7. The LED package structure according to claim 6, wherein the LED chip (4) is a blue chip, a red chip or a green chip.

8. The LED packaging structure according to claim 6, wherein the quantum dot coating (12) is provided with a plurality of layers, the plurality of layers of quantum dot coatings (12) are arranged in the light-transmitting member (1) at intervals, and the plurality of layers of quantum dot coatings (12) are arranged in one-to-one correspondence with the plurality of groups of LED chips (4).

9. The LED package structure according to claim 5, wherein the thickness of the first glass layer (11) and the second glass layer (13) is not more than 0.1 mm.

10. A display device comprising a power supply and the LED package structure of any one of claims 1-9, the power supply being electrically connected to the leads of the LED package structure.