CN216560205U - Integrated water-cooling high-low temperature testing device - Google Patents
Integrated water-cooling high-low temperature testing device Download PDFInfo
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- CN216560205U CN216560205U CN202123208469.9U CN202123208469U CN216560205U CN 216560205 U CN216560205 U CN 216560205U CN 202123208469 U CN202123208469 U CN 202123208469U CN 216560205 U CN216560205 U CN 216560205U
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Abstract
The utility model provides an integrated water-cooling high and low temperature testing device which comprises a mounting table, a horizontal adjusting mechanism and a vertical adjusting mechanism, wherein the horizontal adjusting mechanism is arranged on the mounting table and used for mounting and fixing a circuit board and adjusting the horizontal position of the circuit board, the vertical adjusting mechanism is vertically arranged on the mounting table relative to the horizontal adjusting mechanism, and the integrated water-cooling high and low temperature testing device also comprises a heat conducting assembly, a temperature sensor and a controller. This integral type water-cooling high low temperature testing arrangement through the heat sink board on the heat conduction subassembly heat conduction rate between semiconductor TEC and the contact preliminary acceleration, carries out temperature detection and feeds back the detected signal to the controller through the temperature sensor in the heat sink board simultaneously to it, and the controller controls semiconductor TEC's current size and then controls semiconductor TEC's heat conduction rate for the temperature of contact reaches the test value of chip on the circuit board fast, and then makes this testing arrangement be fit for the chip test of different temperature requirements and use.
Description
Technical Field
The utility model relates to the technical field of chip testing, in particular to an integrated water-cooling high-low temperature testing device.
Background
A multi-chip module (MCM) is a module in which a plurality of chips are electrically connected to a same circuit board and are used to interconnect the chips, and these components are usually mounted on a multilayer-interconnect board by wire bonding, tape bonding, or flip chip, and the multi-chip module usually requires a high-temperature test device to perform a performance test on the multi-chip module during the production process, so as to test various performance indexes of each chip on the multi-chip module and further determine whether the multi-chip module meets the production standard.
Traditional high low temperature test equipment generally is box formula structural design, and it is whole test usually, is not convenient for carry out different temperature tests to the chip of the last difference of multi-chip component, leads to using the condition such as inconvenient to take place, so proposes an integral type water-cooling high low temperature test device and solves above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides an integrated water-cooling high and low temperature testing device convenient to use.
The technical scheme of the utility model is realized as follows: the utility model provides an integrated water-cooling high-low temperature testing device which comprises a mounting table, a horizontal adjusting mechanism and a vertical adjusting mechanism, wherein the horizontal adjusting mechanism is arranged on the mounting table and is used for mounting and fixing a circuit board and adjusting the horizontal position of the circuit board;
the vertical adjusting mechanism is used for adjusting the position between the heat conducting assembly and the circuit board;
the heat conduction assembly is arranged on the vertical adjusting mechanism and is used for refrigerating or heating the chip on the circuit board;
the temperature sensor is arranged in the heat conduction assembly and used for detecting the temperature of the heat conduction assembly;
the controller is arranged in the mounting table and is electrically connected with the heat conduction assembly and the temperature sensor;
the signal input end of the controller is electrically connected with the temperature sensor, the controller is used for receiving a temperature signal acquired by the temperature sensor, the output end of the controller is electrically connected with the heat conducting assembly, and the controller is used for controlling the current or the heat conducting rate of the heat conducting assembly.
On the basis of the above technical scheme, preferably, the heat conduction assembly comprises a heat exchange assembly, a semiconductor TEC, a heat sink plate and a contact, the heat exchange assembly is arranged on the vertical adjusting mechanism, the semiconductor TEC is arranged on one side, close to the circuit board, of the heat exchange assembly, the heat sink plate is arranged on one side, far away from the heat exchange assembly, of the semiconductor TEC, the contact is arranged on one side, far away from the semiconductor TEC, of the heat sink plate and abuts against a chip on the circuit board, the temperature sensor is arranged in the heat sink plate, and the output end of the controller is electrically connected with the semiconductor TEC.
Still further preferably, the heat exchange assembly comprises a water tank and a sealing cover, the water tank is arranged on the vertical adjusting mechanism and located on one side, away from the heat sink plate, of the semiconductor TEC, the sealing cover is arranged on one side, away from the semiconductor TEC, of the water tank, and the water tank is used for guiding water and exchanging heat for the semiconductor TEC.
Preferably, the water tank is internally provided with a spiral guide groove, and the sealing cover is provided with a water inlet pipe and a water outlet pipe which are matched with the spiral guide groove.
Compared with the prior art, the utility model has the following beneficial effects:
heat conduction rate between semiconductor TEC and the contact is preliminarily accelerated through a heat sink plate on the heat conduction assembly, meanwhile, temperature detection is carried out on the semiconductor TEC through a temperature sensor in the heat sink plate, and a detection signal is fed back to a controller, the controller controls the current of the semiconductor TEC and further controls the heat conduction rate of the semiconductor TEC, so that the temperature of the contact quickly reaches a test value of a chip on a circuit board, the test device is further suitable for testing the chips with different temperature requirements, the heat conduction rate between a water tank and the semiconductor TEC is accelerated through water inside the water tank on the heat exchange assembly, and finally, the heat exchange area and the heat exchange efficiency between the water and the water tank are further increased through a spiral diversion trench inside the water tank, and therefore the test efficiency and the use convenience of the test device are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a front sectional view of the structure of an integrated water-cooling high and low temperature testing device of the present invention;
FIG. 2 is a partial view of a rear view of the structure of an integrated water-cooling high and low temperature testing device according to the present invention;
FIG. 3 is a structural right side sectional view of an integrated water-cooling high and low temperature testing device of the present invention;
FIG. 4 is a perspective view of the heat exchange assembly of the present invention;
fig. 5 is an exploded view of the heat exchange assembly of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
As shown in fig. 1, the integrated water-cooling high and low temperature testing device of the present invention includes an installation platform 1, a horizontal adjusting mechanism 2, a vertical adjusting mechanism 3, a heat conducting assembly 4, a temperature sensor 5 and a controller 6.
The horizontal adjusting mechanism 2 is used for installing and fixing the circuit board and adjusting the horizontal position of the circuit board, the horizontal adjusting mechanism 2 comprises a first screw rod 21 and a sliding mechanism 22, the first screw rod 21 is rotatably installed on the installation platform 1 along the axial direction of the first screw rod, the sliding mechanism 22 is installed on the installation platform 1 along the axial direction of the first screw rod 21 in a sliding manner and is in threaded engagement with the first screw rod 21, and the circuit board is fixedly installed on one side, far away from the installation platform 1, of the sliding mechanism 22; perpendicular adjustment mechanism 3 is used for adjusting the position between heat-conducting component 4 and the circuit board, perpendicular adjustment mechanism 3 includes locating component 31, adjust the pole 32, pivot 33, synchronizing wheel 34 and hold-in range 35, it installs on mount table 1 and extends to inside mount table 1 to adjust pole 32 along its axial rotation, pivot 33 is for adjusting pole 32 parallel mount in mount table 1, all cup jointed synchronizing wheel 34 on adjusting pole 32 and the pivot 33, hold-in range 35 cup joints on two synchronizing wheels 34, locating component 31 is used for connecting hold-in range 35 and heat-conducting component 4, as shown in fig. 2.
The heat conduction assembly 4 is used for refrigerating or heating the chip on the circuit board; specifically, the heat conducting assembly 4 includes a heat exchanging assembly 41, a semiconductor TEC42, a heat sink plate 43 and a contact 44, the heat exchanging assembly 41 is fixedly mounted on the vertical adjusting mechanism 3, the semiconductor TEC42 is fixedly mounted on one side of the heat exchanging assembly 41 close to the circuit board, the heat sink plate 43 is fixedly mounted on one side of the semiconductor TEC42 far from the heat exchanging assembly 41, the contact 44 is fixedly mounted on one side of the heat sink plate 43 far from the semiconductor TEC42 and supports a chip on the circuit board, the temperature sensor 5 is fixedly mounted in the heat sink plate 43, and the controller 6 is fixedly mounted in the mounting table 1 and electrically connected with the semiconductor TEC42 and the temperature sensor 5, as shown in fig. 3; the heat conduction rate between the semiconductor TEC42 and the contact 44 is preliminarily increased through the heat sinking plate 43, meanwhile, the temperature sensor 5 inside the heat sinking plate 43 is used for carrying out temperature detection on the semiconductor TEC and feeding a detected temperature signal back to the controller 6, the controller is used for controlling the current of the semiconductor TEC42 according to the obtained temperature signal, the heat transmission rate of the semiconductor TEC42 is further accurately controlled, the temperature on the contact 44 is enabled to conveniently and quickly reach the test temperature of the chip on the circuit board, and the test device is enabled to be convenient for testing the chips with different temperature test requirements.
In order to further improve the use convenience of the test device; specifically, the heat exchange assembly 41 further includes a water tank 411 and a sealing cover 412, the water tank 411 is fixedly mounted on the vertical adjustment mechanism 3 and located on one side of the semiconductor TEC42 far away from the heat sink plate 43, and the sealing cover 412 is fixedly mounted on one side of the water tank 411 far away from the semiconductor TEC42, as shown in fig. 4; the water tank 411 is subjected to heat exchange through the water inside the water tank 411, and the heat transfer rate between the water tank 411 and the heat sink plate 43 is controlled through the semiconductor TEC42, so that the test efficiency and the use convenience of the test device are improved.
In order to further improve the use convenience of the test device; specifically, a spiral flow guide groove a is formed in the water tank 411, and a water inlet pipe b and a water outlet pipe c which are matched with the spiral flow guide groove a are fixedly installed on the sealing cover 412, as shown in fig. 5; water is guided in from the center of the water tank 411 through the water inlet pipe b, water is guided outwards in a rotating mode along the center of the water tank 411 through the spiral guide groove a, the contact area and the heat exchange efficiency of the water and the inner wall of the water tank 411 are increased, and finally the water is guided out through the water outlet pipe c, so that the testing efficiency and the use convenience of the testing device are further improved.
In the technical scheme, the controller 6, the temperature sensor 5 and a control circuit of the semiconductor TEC42 are in the prior art.
The working principle of the technical scheme is as follows:
firstly, judging the test type of a chip on a circuit board, namely high-temperature test or low-temperature test;
if the test is a high-temperature test:
hot water is guided through the spiral guide groove a on the water tank 411 and heats the water tank 411 by guiding the hot water into the water inlet pipe b, and the water is guided out through the water outlet pipe c;
then, the controller 6 controls the semiconductor TEC42 on the heat conducting assembly 4 to be powered on, the semiconductor TEC42 transfers heat on the water tank 411 to the heat sink plate 43 and the contact 44, meanwhile, the temperature sensor 5 detects the temperature on the heat sink plate 43 in real time and feeds the temperature back to the controller 6, and the controller 6 controls the circuit size and the power on and off of the semiconductor TEC42, so that the temperature on the contact 44 is convenient to rapidly heat to the testing temperature of the chip on the circuit board, and quantitative heating and high-temperature testing effects are realized;
if the test is a low-temperature test:
then, by leading the condensed water into the water inlet pipe b, the condensed water is guided through the spiral guide groove a on the water tank 411 and refrigerates the water tank 411, and the water is led out through the water outlet pipe c;
then, the controller 6 controls the semiconductor TEC42 on the heat conducting assembly 4 to be powered on, the semiconductor TEC42 transfers heat on the water tank 411 to the heat sink plate 43 and the contact 44, meanwhile, the temperature sensor 5 detects the temperature on the heat sink plate 43 in real time and feeds the temperature back to the controller 6, and the controller 6 controls the circuit size and the power on and off of the semiconductor TEC42, so that the temperature on the contact 44 is convenient to heat the test temperature of the chip on the circuit board quickly, and quantitative refrigeration and low-temperature test effects are realized.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (4)
1. The utility model provides an integral type water-cooling high low temperature testing arrangement, its includes mount table (1), horizontal adjustment mechanism (2) and vertical adjustment mechanism (3), and horizontal adjustment mechanism (2) set up on mount table (1) and are used for installing and fix and adjust the horizontal position of circuit board to the circuit board, and vertical adjustment mechanism (3) set up on mount table (1) its characterized in that for horizontal adjustment mechanism (2) perpendicularly: the device also comprises a heat conduction assembly (4), a temperature sensor (5) and a controller (6);
the vertical adjusting mechanism (3) is used for adjusting the position between the heat conducting component (4) and the circuit board;
the heat conduction assembly (4) is arranged on the vertical adjusting mechanism (3) and is used for refrigerating or heating the chip on the circuit board;
the temperature sensor (5) is arranged in the heat conduction assembly (4) and is used for detecting the temperature of the heat conduction assembly (4);
the controller (6) is arranged in the mounting table (1) and is electrically connected with the heat conduction assembly (4) and the temperature sensor (5);
the signal input end of the controller (6) is electrically connected with the temperature sensor (5), the controller (6) is used for receiving a temperature signal acquired by the temperature sensor (5), the output end of the controller (6) is electrically connected with the heat conducting component (4), and the controller (6) is used for controlling the current magnitude or the heat conducting rate of the heat conducting component (4).
2. The integrated water-cooling high and low temperature testing device of claim 1, wherein: the heat conducting assembly (4) comprises a heat exchange assembly (41), a semiconductor TEC (42), a heat sinking plate (43) and a contact (44), the heat exchange assembly (41) is arranged on the vertical adjusting mechanism (3), the semiconductor TEC (42) is arranged on one side, close to the circuit board, of the heat exchange assembly (41), the heat sinking plate (43) is arranged on one side, far away from the heat exchange assembly (41), of the semiconductor TEC (42), the contact (44) is arranged on one side, far away from the semiconductor TEC (42), of the heat sinking plate (43) and supports chips on the circuit board, the temperature sensor (5) is arranged in the heat sinking plate (43), and the output end of the controller (6) is electrically connected with the semiconductor TEC (42).
3. The integrated water-cooling high and low temperature testing device as claimed in claim 2, wherein: the heat exchange assembly (41) comprises a water tank (411) and a sealing cover (412), the water tank (411) is arranged on the vertical adjusting mechanism (3) and located on one side, far away from the heat sink plate (43), of the semiconductor TEC (42), the sealing cover (412) is arranged on one side, far away from the semiconductor TEC (42), of the water tank (411), and the water tank (411) is used for guiding water and exchanging heat for the semiconductor TEC (42).
4. The integrated water-cooling high and low temperature testing device of claim 3, wherein: a spiral flow guide groove (a) is formed in the water tank (411), and a water inlet pipe (b) and a water outlet pipe (c) matched with the spiral flow guide groove are arranged on the sealing cover (412).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123208469.9U CN216560205U (en) | 2021-12-20 | 2021-12-20 | Integrated water-cooling high-low temperature testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123208469.9U CN216560205U (en) | 2021-12-20 | 2021-12-20 | Integrated water-cooling high-low temperature testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216560205U true CN216560205U (en) | 2022-05-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123208469.9U Active CN216560205U (en) | 2021-12-20 | 2021-12-20 | Integrated water-cooling high-low temperature testing device |
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| Country | Link |
|---|---|
| CN (1) | CN216560205U (en) |
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2021
- 2021-12-20 CN CN202123208469.9U patent/CN216560205U/en active Active
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