CN210444717U - Heat dissipation device for integrated circuit packaging test - Google Patents
Heat dissipation device for integrated circuit packaging test Download PDFInfo
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- CN210444717U CN210444717U CN201921315461.2U CN201921315461U CN210444717U CN 210444717 U CN210444717 U CN 210444717U CN 201921315461 U CN201921315461 U CN 201921315461U CN 210444717 U CN210444717 U CN 210444717U
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- heat dissipation
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- integrated circuit
- heat
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Abstract
The utility model discloses a heat abstractor for integrated circuit packaging test, including base and box, the base joint is fixed at the back of box, the box upper end back has seted up the thermovent, install first dustproof otter board on the thermovent, and install second dustproof otter board on the through-hole that the top of casing was seted up, the air outlet of draught fan communicates with the casing through the guide duct, the bottom of casing is seted up the atmospheric pressure balancing mouth that communicates with the external world, install the check valve on the atmospheric pressure balancing mouth, fixed mounting has the singlechip on the inner wall of box, the inboard top fixed mounting of box has temperature sensor; carry out the heat absorption cooling to the box through setting up the semiconductor refrigeration piece to and the singlechip controls the radiating effect, the heat dissipation of being convenient for, make the inside heat of device in time discharge, guarantee the good operational environment of electronic components, the life of extension equipment avoids only influencing going on of detection, reduces detection error.
Description
Technical Field
The utility model relates to an electrical detection device technical field specifically is a heat abstractor is used in integrated circuit encapsulation test.
Background
In the process of manufacturing and assembling electrical equipment, transistors, resistors and capacitors are integrated and packaged in high density inside the equipment to obtain an integrated circuit package, and the condition of the integrated circuit package mounted on a printed circuit board is detected by a tester, and particularly, in the case of testing the integrated circuit package mounted on the printed circuit board in a large-scale device, a test point is set to the position for testing.
Carry out the heat dissipation through radiator fan and heat conduction copper in the testing arrangement of current to inside electronic equipment and handle, the radiating effect is poor for the inside heat of device can't in time distribute, and fragile electronic accessories not only influences going on that detects, leads to the termination that detects, can influence the testing result moreover, leads to detecting error too much. Therefore, it is desirable to provide a heat dissipation device for integrated circuit package testing.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor is used in integrated circuit encapsulation test is convenient for dispel the heat for the inside heat of device is in time discharged, ensures the good operational environment of electronic accessories, prolongs the life of equipment, with the problem of proposing in solving above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation device for integrated circuit packaging test comprises a base and a box body, wherein the base is clamped and fixed on the back surface of the box body, the back of the upper end of the box body is provided with a heat dissipation opening, a first dustproof screen plate is arranged on the heat dissipation opening, and the inner side of the heat dissipation port is fixedly provided with a heat dissipation fan, the inner wall of the lower side of the box body is embedded with a semiconductor refrigeration sheet, an induced draft fan is fixedly arranged on the refrigerating surface of the semiconductor refrigerating sheet, a shell is fixedly arranged at the bottom of the box body, and a second dustproof screen plate is arranged on a through hole arranged at the top of the shell, the air outlet of the induced draft fan is communicated with the shell through an air guide pipe, the bottom of the shell is provided with an air pressure balancing port communicated with the outside, the air pressure balancing port is provided with a one-way valve, the inner wall of the box body is fixedly provided with a single chip microcomputer, and the top of the inner side of the box body is fixedly provided with a temperature sensor.
Preferably, the electric signal output end of the temperature sensor is electrically connected with the signal receiving end of the single chip microcomputer through a wire, and the electric control output end of the single chip microcomputer is electrically connected with the electric control ends of the semiconductor refrigeration sheet and the induced draft fan through wires respectively.
Preferably, the type of the temperature sensor is AD590, and the signal of the single chip microcomputer is AT89C 51.
Preferably, the base is provided with a mounting hole, the base is welded with a clamping block, and the back of the box body is provided with a clamping groove in sliding clamping connection with one end of the clamping block.
Preferably, the front surface of the box body is provided with a box door, one side of the box door is hinged with the box body through a hinge, and a handle is fixedly installed on the box door.
Preferably, a support frame is fixedly installed in the box body, and an installation plate is fixedly installed on the support frame.
Preferably, the heating surface of the semiconductor refrigeration piece is provided with a heat conduction block through the fitting of heat conduction silicone grease, and the heat conduction block is arranged on the end surface outside the box body and provided with a radiating fin.
Compared with the prior art, the beneficial effects of the utility model are that:
carry out the heat absorption cooling to the box through setting up the semiconductor refrigeration piece to and the singlechip controls the radiating effect, the heat dissipation of being convenient for, make the inside heat of device in time discharge, guarantee the good operational environment of electronic components, the life of extension equipment avoids only influencing going on of detection, reduces detection error.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the interior of the middle box body of the present invention;
fig. 3 is a block diagram of the electrical connection controlled by the single chip microcomputer according to the present invention.
In the figure: 1. a base; 2. a box body; 3. a heat dissipation port; 4. a heat radiation fan; 5. a first dust-proof screen plate; 6. a semiconductor refrigeration sheet; 7. an induced draft fan; 8. an air guide pipe; 9. a single chip microcomputer; 10. a temperature sensor; 11. a housing; 12. a second dust-proof screen plate; 13. an air pressure balancing port; 14. a one-way valve; 15. a clamping block; 16. a box door; 17. mounting a plate; 18. a heat conducting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a heat dissipation device for integrated circuit packaging test comprises a base 1 and a box body 2, wherein the base 1 is clamped and fixed on the back of the box body 2, a heat dissipation port 3 is formed in the back of the upper end of the box body 2, a first dustproof screen plate 5 is installed on the heat dissipation port 3, a heat dissipation fan 4 is fixedly installed on the inner side of the heat dissipation port 3, a semiconductor refrigeration sheet 6 is embedded on the inner wall of the lower side of the box body 2, an induced draft fan 7 is fixedly installed on the refrigeration surface of the semiconductor refrigeration sheet 6, a shell 11 is fixedly installed at the bottom of the box body 2, a second dustproof screen plate 12 is installed on a through hole formed in the top of the shell 11, an air outlet of the induced draft fan 7 is communicated with the shell 11 through an air guide pipe 8, an air pressure balance port 13 communicated with the outside is formed in the bottom of the shell 11, a one-way valve 14 is, and a temperature sensor 10 is fixedly arranged at the top of the inner side of the box body 2.
Specifically, the electrical signal output end of the temperature sensor 10 is electrically connected with the signal receiving end of the single chip microcomputer 9 through a wire, and the electric control output end of the single chip microcomputer 9 is electrically connected with the electric control ends of the semiconductor refrigeration sheet 6 and the induced draft fan 7 through wires respectively.
Specifically, the model of the temperature sensor 10 is AD590, and the signal of the single chip microcomputer 9 is AT89C 51.
Specifically, the base 1 is provided with a mounting hole, the base 1 is welded with the fixture block 15, and the back of the box body 2 is provided with a clamping groove which is slidably clamped with one end of the fixture block 15.
Specifically, a door 16 is disposed on the front surface of the box body 2, one side of the door 16 is hinged to the box body 2 through a hinge, and a handle is fixedly mounted on the door 16.
Specifically, a support frame is fixedly arranged in the box body 2, and an installation plate 17 is fixedly arranged on the support frame; the detection device body is convenient to install and fix through the installation plate 17.
Specifically, the heating surface of the semiconductor refrigeration sheet 6 is provided with a heat conduction block 18 through the fitting of heat conduction silicone grease, and the heat conduction block 18 is arranged on the end surface outside the box body 2 and provided with a heat radiation fin.
The working principle is as follows: when the device is used, the temperature sensor 10 is used for detecting the internal temperature of the box body 2, a detection result is transmitted to the single chip microcomputer 9 in real time as an electric signal, the single chip microcomputer 9 converts the received electric signal into a numerical value to be compared with a set threshold value, when the numerical value is larger than or equal to the threshold value, the single chip microcomputer 9 controls the semiconductor refrigerating sheet 6 and the induced draft fan 7 to be started, the refrigerating surface of the semiconductor refrigerating sheet 6 absorbs heat to reduce the ambient air temperature, the induced draft fan 7 discharges low-temperature air through the air guide pipe 8 through the shell 11, and forms circulating air flow with the heat dissipation fan 4 on the upper portion of the box body 2 to discharge hot air flow above the box body 2, so that heat inside the device is discharged in time, the good running environment of electronic accessories is guaranteed, the service life; when the numerical value is smaller than the threshold value, the single chip microcomputer 9 closes the control semiconductor refrigerating sheet 6 and the induced draft fan 7, and heat dissipation is performed through independent work of the cooling fan 4, so that energy is saved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a heat abstractor is used in integrated circuit encapsulation test, includes base (1) and box (2), its characterized in that: the base (1) is clamped and fixed on the back face of the box body (2), the heat dissipation port (3) is formed in the back face of the upper end of the box body (2), a first dustproof screen plate (5) is installed on the heat dissipation port (3), a heat dissipation fan (4) is fixedly installed on the inner side of the heat dissipation port (3), a semiconductor refrigerating sheet (6) is embedded on the inner wall of the lower side of the box body (2), a draught fan (7) is fixedly installed on the refrigerating face of the semiconductor refrigerating sheet (6), a shell (11) is fixedly installed at the bottom of the box body (2), a second dustproof screen plate (12) is installed on a through hole formed in the top of the shell (11), an air outlet of the draught fan (7) is communicated with the shell (11) through an air guide pipe (8), an air pressure balance port (13) communicated with the outside is formed in the bottom of the shell (11), and a one-way, the temperature control box is characterized in that a single chip microcomputer (9) is fixedly mounted on the inner wall of the box body (2), and a temperature sensor (10) is fixedly mounted at the top of the inner side of the box body (2).
2. The heat dissipation device for testing of integrated circuit packages as claimed in claim 1, wherein: the signal of telecommunication output of temperature sensor (10) passes through the wire and singlechip (9) signal reception end electric connection, the automatically controlled output of singlechip (9) passes through the wire respectively with the automatically controlled end electric connection of semiconductor refrigeration piece (6) and draught fan (7).
3. The heat dissipation device for testing of integrated circuit packages as claimed in claim 1, wherein: the type of the temperature sensor (10) is AD590, and the signal of the singlechip (9) is AT89C 51.
4. The heat dissipation device for testing of integrated circuit packages as claimed in claim 1, wherein: the base (1) is provided with a mounting hole, the base (1) is welded with a clamping block (15), and the back of the box body (2) is provided with a clamping groove in sliding clamping connection with one end of the clamping block (15).
5. The heat dissipation device for testing of integrated circuit packages as claimed in claim 1, wherein: the front surface of the box body (2) is provided with a box door (16), one side of the box door (16) is hinged with the box body (2) through a hinge, and a handle is fixedly installed on the box door (16).
6. The heat dissipation device for testing of integrated circuit packages as claimed in claim 1, wherein: the box (2) is internally and fixedly provided with a support frame, and the support frame is fixedly provided with a mounting plate (17).
7. The heat dissipation device for testing of integrated circuit packages as claimed in claim 1, wherein: the heating surface of the semiconductor refrigerating sheet (6) is provided with a heat conducting block (18) through the fitting of heat conducting silicone grease, and the heat conducting block (18) is arranged on the end surface of the outer side of the box body (2) and provided with a radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921315461.2U CN210444717U (en) | 2019-08-14 | 2019-08-14 | Heat dissipation device for integrated circuit packaging test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921315461.2U CN210444717U (en) | 2019-08-14 | 2019-08-14 | Heat dissipation device for integrated circuit packaging test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210444717U true CN210444717U (en) | 2020-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921315461.2U Active CN210444717U (en) | 2019-08-14 | 2019-08-14 | Heat dissipation device for integrated circuit packaging test |
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| CN (1) | CN210444717U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968613A (en) * | 2021-04-22 | 2021-06-15 | 山东航吉电子科技有限公司 | Variable frequency power supply with dustproof construction |
-
2019
- 2019-08-14 CN CN201921315461.2U patent/CN210444717U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968613A (en) * | 2021-04-22 | 2021-06-15 | 山东航吉电子科技有限公司 | Variable frequency power supply with dustproof construction |
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