CN110831366A - Intelligent power line carrier device - Google Patents

Intelligent power line carrier device Download PDF

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Publication number
CN110831366A
CN110831366A CN201910935483.7A CN201910935483A CN110831366A CN 110831366 A CN110831366 A CN 110831366A CN 201910935483 A CN201910935483 A CN 201910935483A CN 110831366 A CN110831366 A CN 110831366A
Authority
CN
China
Prior art keywords
shell
conducting plate
power carrier
temperature controller
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910935483.7A
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Chinese (zh)
Inventor
李少杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luan Yanshan Automation Equipment Sales Co Ltd
Original Assignee
Luan Yanshan Automation Equipment Sales Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luan Yanshan Automation Equipment Sales Co Ltd filed Critical Luan Yanshan Automation Equipment Sales Co Ltd
Priority to CN201910935483.7A priority Critical patent/CN110831366A/en
Publication of CN110831366A publication Critical patent/CN110831366A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0204Mounting supporting structures on the outside of casings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B3/00Line transmission systems
    • H04B3/54Systems for transmission via power distribution lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209Thermal management, e.g. fan control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Abstract

The invention discloses an intelligent power carrier device, which comprises a shell, wherein horizontally arranged partition plates are sequentially welded in the shell from top to bottom, a rectangular mounting hole is formed in the center of the top of the partition plate positioned at the bottom, an upper heat conducting plate is clamped in the mounting hole, a hollow rubber ring is bonded at the bottom of the upper heat conducting plate, a semiconductor refrigerating sheet is clamped in the rubber ring, a lower heat conducting plate is placed on one side, away from the upper heat conducting plate, of the semiconductor refrigerating sheet, and a cooling fan is installed at the bottom of the lower heat conducting plate through a bolt. According to the invention, the temperature inside the shell is intelligently controlled through the temperature controller, and the temperature inside the shell is taken away through the semiconductor refrigerating sheet and the cooling fan, so that internal electronic elements can be effectively prevented from being damaged due to heat generated by the household intelligent power carrier module in use, and the provided household intelligent power carrier module is safe and reliable.

Description

Intelligent power line carrier device
Technical Field
The invention relates to the technical field of intelligent home furnishing, in particular to an intelligent power line carrier device.
Background
The power carrier is a special communication mode of a power system, the power carrier communication is a technology for carrying out high-speed transmission on analog or digital signals in a carrier mode by utilizing the existing power line, the power carrier communication is characterized in that a network does not need to be erected again, data transmission can be carried out as long as a power line is arranged, a new stage is brought to the development of the power carrier technology along with the rise of the topic of a household intelligent system, in the household intelligent system, the household intelligent system taking the power carrier as a core is most popular, in the household environment, the characteristic of 'wall is more numerous' seriously influences the quality of wireless transmission, particularly the defect is more obvious in villas and jump-level houses, if a special wired network is erected, besides the cost is increased, the position of a household appliance is difficult and complicated to change in the future daily life, and opportunity is brought to the power carrier communication without re-erecting the power line, but the phenomenon that current house intelligence power line carrier module can appear generating heat when using, leads to inside electronic component to receive the damage easily, and the reliability is low.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides an intelligent power carrier device.
In order to achieve the purpose, the invention adopts the following technical scheme:
an intelligent power carrier device comprises a shell, wherein horizontally arranged partition plates are sequentially welded in the shell from top to bottom, a rectangular mounting hole is formed in the center of the top of the partition plate positioned at the bottom, an upper heat conducting plate is clamped in the mounting hole, a hollow rubber ring is bonded at the bottom of the upper heat conducting plate, a semiconductor refrigerating sheet is clamped in the rubber ring, a lower heat conducting plate is placed on one side, away from the upper heat conducting plate, of the semiconductor refrigerating sheet, a radiating fan is mounted at the bottom of the lower heat conducting plate through bolts, sucking discs are connected to four corners of one side of the shell through bolts, a horizontally arranged power carrier circuit board is connected to the center of the interior of the shell through screws, a round hole is formed in one side of the top of the shell, a sealing pipe is inserted in the round hole, and a containing hole is formed in the other side of the top, and one side of the accommodating hole is connected with a sealing cover through a hinge, the middle part of one end of the shell is provided with a jack, the inner part of the jack is connected with a wiring plug, the middle part of the inner wall of one side of the shell is connected with a temperature controller through a screw, the temperature controller is connected with a temperature sensor through a signal wire, and the temperature sensor is connected with the shell through a bolt.
Preferably, the bottom surface of the shell is provided with heat dissipation meshes, and the heat dissipation meshes are matched with the heat dissipation fan.
Preferably, the quantity of wiring plug is two to four, and two to four top of wiring plug all weld there is the rubber buffer.
Preferably, a power supply lead is inserted into the sealing tube, and the other end of the power supply lead is welded with the power carrier circuit board.
Preferably, the power line carrier circuit board, the wiring plug and the temperature controller are all located between the two partition boards, and a gap is reserved between the partition board located above and the inner wall of the top of the shell.
Preferably, the semiconductor refrigeration piece and the cooling fan are both connected with a switch through wires, the switch is connected with a temperature controller through wires, and the type of the temperature controller is XH-W1209.
The invention has the beneficial effects that: according to the power carrier device provided by the invention, the sucker is arranged on one side of the shell, the shell can be adsorbed on the wall surface or the surface of a household appliance through the sucker, meanwhile, a power supply lead can be contained in the shell, the service life of the power supply lead is prolonged, meanwhile, the upper heat conducting plate, the semiconductor refrigerating sheet, the lower heat conducting plate and the radiating fan are arranged at the bottom of the shell, the temperature in the shell is intelligently controlled through the temperature controller, the temperature in the shell is taken away through the semiconductor refrigerating sheet and the radiating fan, the damage to internal electronic elements caused by heat generated by the household intelligent power carrier module in use can be effectively avoided, and the novel household intelligent power carrier module is safe and reliable.
Drawings
Fig. 1 is a schematic structural diagram of an intelligent power line carrier device according to the present invention;
fig. 2 is a schematic structural diagram of an intelligent power line carrier device according to the present invention.
In the figure: the device comprises a sucker 1, a rubber ring 2, a shell 3, a partition plate 4, a sealing tube 5, a power supply lead 6, a sealing cover 7, a power carrier circuit board 8, a wiring plug 9, a temperature controller 10, an upper heat-conducting plate 11, a semiconductor refrigerating plate 12, a lower heat-conducting plate 13, a heat-radiating fan 14 and a heat-radiating mesh 15.
Detailed Description
In order that those skilled in the art can better understand the present invention, the following technical solutions are further described with reference to the accompanying drawings and examples.
Referring to fig. 1-2, the intelligent power carrier device comprises a housing 3, a horizontally arranged partition plate 4 is welded in the housing 3 from top to bottom in sequence, a rectangular mounting hole is formed in the center of the top of the partition plate 4 at the bottom, an upper heat conducting plate 11 is clamped in the mounting hole, a hollow rubber ring 2 is bonded at the bottom of the upper heat conducting plate 11, a semiconductor refrigerating sheet 12 is clamped in the rubber ring 2, a lower heat conducting plate 13 is placed on one side of the semiconductor refrigerating sheet 12 away from the upper heat conducting plate 11, a heat radiating fan 14 is installed at the bottom of the lower heat conducting plate 13 through a bolt, suction cups 1 are connected to four corners of one side of the housing 3 through bolts, a horizontally arranged power carrier circuit board 8 is connected to the center of the interior of the housing 3 through screws, a circular hole is formed in one side of the top of the housing 3, a sealing pipe 5 is inserted in the interior of, and one side of the accommodating hole is connected with a sealing cover 7 through a hinge, the middle part of one end of the shell 3 is provided with a jack, the inner part of the jack is connected with a wiring plug 9 in a clamping manner, the middle part of the inner wall of one side of the shell 3 is connected with a temperature controller 10 through a screw, the temperature controller 10 is connected with a temperature sensor through a signal wire, and the temperature sensor is connected with the shell 3 through a bolt.
In the invention, the bottom surface of a shell 3 is provided with heat dissipation meshes 15, the heat dissipation meshes 15 are matched with a heat dissipation fan 14, the number of wiring plugs 9 is two to four, rubber plugs are welded on the tops of the two to four wiring plugs 9, a power supply wire 6 is inserted into a sealing tube 5, the other end of the power supply wire 6 is welded with a power carrier circuit board 8, the wiring plugs 9 and a temperature controller 10 are all positioned between two partition plates 4, a gap is reserved between the upper partition plate 4 and the inner wall of the top of the shell 3, a semiconductor refrigeration sheet 12 and the heat dissipation fan 14 are connected with a switch through wires, the switch is connected with the temperature controller 10 through wires, and the model of the temperature controller 10 is XH-W1209.
The working principle is as follows: install sucking disc 1 in one side of casing 3, can adsorb casing 3 on wall or domestic appliance surface through sucking disc 1, open closing cap 7, take out switch on with power wire 6, open the rubber buffer, through plug switch-on output, when using, heat-conducting plate 11 is installed to casing 3's bottom, semiconductor refrigeration piece 12, heat-conducting plate 13 and radiator fan 14 down, through the inside temperature of temperature controller 10 intelligent control casing 3, take away the inside temperature of casing 3 through semiconductor refrigeration piece 12 and radiator fan 14, guarantee the operation of house intelligence power line carrier module safety and stability.
The above examples are merely representative of preferred embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, various changes, modifications and substitutions can be made without departing from the spirit of the present invention, and these are all within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (3)

1. The utility model provides an intelligent power carrier device, includes casing (3), its characterized in that, the inside of casing (3) is from last down in proper order the butt fusion have baffle (4) that the level set up, and be located the top central authorities of baffle (4) of bottom and set up the mounting hole of rectangle, the inside joint of mounting hole has last heat-conducting plate (11), the bottom of going up heat-conducting plate (11) bonds has hollow rubber circle (2), the inside joint of rubber circle (2) has semiconductor refrigeration piece (12), heat-conducting plate (13) down has been placed to one side that last heat-conducting plate (11) was kept away from to semiconductor refrigeration piece (12), the bottom of heat-conducting plate (13) is installed through the bolt and is had radiator fan (14) down, there is sucking disc (1) one side four corners of casing (3) all through bolted connection, the inside central authorities of casing (3) have power carrier circuit board (8) that the level set up, a round hole is formed in one side of the top of the shell (3), a sealing pipe (5) is inserted into the round hole, a containing hole is formed in the other side of the top of the shell (3), a sealing cover (7) is connected to one side of the containing hole through a hinge, a jack is formed in the middle of one end of the shell (3), a wiring plug (9) is clamped inside the jack, a temperature controller (10) is connected to the middle of the inner wall of one side of the shell (3) through a screw, the temperature controller (10) is connected with a temperature sensor through a signal line, and the temperature sensor is connected with the shell (3) through a bolt; the bottom surface of the shell (3) is provided with heat dissipation meshes (15), and the heat dissipation meshes (15) are matched with the heat dissipation fan (14); the number of the wiring plugs (9) is two to four, and rubber plugs are welded to the tops of the two to four wiring plugs (9); the semiconductor refrigeration piece (12) and the cooling fan (14) are connected with a switch through wires, the switch is connected with the temperature controller (10) through wires, and the model of the temperature controller (10) is XH-W1209.
2. The smart power carrier device according to claim 1, wherein a power supply wire (6) is inserted into the sealing tube (5), and the other end of the power supply wire (6) is welded to the power carrier circuit board (8).
3. A smart power carrier device as claimed in claim 1, characterised in that the power carrier circuit board (8), the connection plug (9) and the temperature controller (10) are located between two partitions (4), and a gap is left between the upper partition (4) and the top inner wall of the housing (3).
CN201910935483.7A 2019-09-29 2019-09-29 Intelligent power line carrier device Pending CN110831366A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910935483.7A CN110831366A (en) 2019-09-29 2019-09-29 Intelligent power line carrier device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910935483.7A CN110831366A (en) 2019-09-29 2019-09-29 Intelligent power line carrier device

Publications (1)

Publication Number Publication Date
CN110831366A true CN110831366A (en) 2020-02-21

Family

ID=69548566

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910935483.7A Pending CN110831366A (en) 2019-09-29 2019-09-29 Intelligent power line carrier device

Country Status (1)

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CN (1) CN110831366A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114428540A (en) * 2020-10-29 2022-05-03 广州塔克兰森信息科技有限公司 MIXD-C1 intelligent conference platform

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409641A (en) * 1980-06-02 1983-10-11 Robert Bosch Gmbh Environmentally protected electronic network structure and housing combination
CN207399204U (en) * 2017-10-14 2018-05-22 嘉兴智盈电子技术有限公司 For the reliable home furnishings intelligent power line carrier module of indoor security
CN207408578U (en) * 2017-10-26 2018-05-25 武汉武高电测电气有限公司 A kind of frequency conversion mutual inductor comprehensive tester of reliable working performance

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409641A (en) * 1980-06-02 1983-10-11 Robert Bosch Gmbh Environmentally protected electronic network structure and housing combination
CN207399204U (en) * 2017-10-14 2018-05-22 嘉兴智盈电子技术有限公司 For the reliable home furnishings intelligent power line carrier module of indoor security
CN207408578U (en) * 2017-10-26 2018-05-25 武汉武高电测电气有限公司 A kind of frequency conversion mutual inductor comprehensive tester of reliable working performance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114428540A (en) * 2020-10-29 2022-05-03 广州塔克兰森信息科技有限公司 MIXD-C1 intelligent conference platform

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Application publication date: 20200221

RJ01 Rejection of invention patent application after publication