CN110992663A - Network controller - Google Patents
Network controller Download PDFInfo
- Publication number
- CN110992663A CN110992663A CN201911177011.6A CN201911177011A CN110992663A CN 110992663 A CN110992663 A CN 110992663A CN 201911177011 A CN201911177011 A CN 201911177011A CN 110992663 A CN110992663 A CN 110992663A
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- CN
- China
- Prior art keywords
- heat dissipation
- heat
- shell
- groups
- bin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 56
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 238000004891 communication Methods 0.000 claims abstract description 23
- 238000005057 refrigeration Methods 0.000 claims abstract description 17
- 238000009434 installation Methods 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 5
- 238000009413 insulation Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
-
- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C23/00—Non-electrical signal transmission systems, e.g. optical systems
- G08C23/04—Non-electrical signal transmission systems, e.g. optical systems using light waves, e.g. infrared
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A network controller comprises a circuit board, a shell, a plurality of semiconductor refrigeration pieces and a heat conducting plate; the shell is provided with a switch, and a heat dissipation plate arranged in the shell is used for dividing the interior of the shell into an installation bin and a heat dissipation bin; the mounting bin is provided with an end cover at the upper end of the shell; a plurality of mounting holes for mounting a plurality of heat-conducting plates and a plurality of heat dissipation holes are uniformly formed in the bottom surface of the heat dissipation bin; the circuit board is arranged on the end face of the heat dissipation plate, which is positioned on the installation bin, and is provided with a power supply module, a controller and a plurality of groups of wireless communication modules; the plurality of groups of semiconductor refrigeration pieces are positioned in the heat dissipation bin, and the plurality of groups of semiconductor refrigeration pieces are respectively arranged on the end surfaces of the heat dissipation plates positioned in the heat dissipation bin; the heat dissipation plate is provided with heat insulation glue for isolating the hot ends and the cold ends of the plurality of groups of semiconductor refrigeration pieces; the plurality of radiating fins are respectively arranged at the hot ends of the plurality of groups of semiconductor refrigerating fins one by one; the heat conducting columns are respectively connected with the radiating fins and the heat conducting plates. The invention has convenient use and good heat dissipation.
Description
Technical Field
The invention relates to the technical field of network controllers, in particular to a network controller.
Background
At present, most household appliances are controlled by remote control signals, each household appliance is provided with a matched remote controller, once the remote controller is lost, a new remote controller needs to be additionally arranged, and the remote controllers of the household appliances are incompatible and inconvenient to use; the temperature generated by the operation of the remote controller affects the use performance of the remote controller; to this end, a network controller is proposed in the present application.
Disclosure of Invention
Objects of the invention
In order to solve the technical problems in the background art, the invention provides a network controller which is convenient to use and good in heat dissipation.
(II) technical scheme
The invention provides a network controller, which comprises an end cover, a circuit board, a shell, a plurality of semiconductor refrigerating fins, a plurality of radiating fins, a plurality of heat conducting columns and a heat conducting plate, wherein the end cover is provided with a plurality of through holes;
the switch is arranged on the shell, and the heat dissipation plate is arranged in the shell; the heat dissipation plate is used for dividing the interior of the shell into an installation bin and a heat dissipation bin; the upper end of the shell of the mounting bin is provided with an opening; the end cover is arranged on the opening end surface of the shell; a plurality of mounting holes for mounting a plurality of heat-conducting plates are uniformly formed in the bottom surface of the heat dissipation bin, and a plurality of heat dissipation holes are formed in the shell of the heat dissipation bin;
the circuit board is arranged on the end face of the heat dissipation plate, which is positioned on the installation bin, and is provided with a power supply module, a controller and a plurality of groups of wireless communication modules; the power supply module is electrically connected with the switch, the circuit board and the controller; the controller is respectively connected with a plurality of groups of wireless communication modules;
the plurality of groups of semiconductor refrigeration pieces are positioned in the heat dissipation bin, the plurality of groups of semiconductor refrigeration pieces are respectively arranged on the end surface of the heat dissipation bin, on which the heat dissipation plate is positioned, and the cold ends of the plurality of groups of semiconductor refrigeration pieces are pressed tightly against the heat dissipation plate; the heat dissipation plate is provided with heat insulation glue for isolating the hot ends and the cold ends of the plurality of groups of semiconductor refrigeration pieces; the plurality of groups of semiconductor refrigerating pieces are connected with the controller;
the plurality of radiating fins are respectively arranged at the hot ends of the plurality of groups of semiconductor refrigerating fins one by one; one end of each heat conduction column is connected with the corresponding heat radiating fin, and the other end of each heat conduction column is connected with the corresponding heat conducting plate.
Preferably, the wireless communication module comprises a WIFI module, an infrared module, a Bluetooth module, a USB module and a serial port module; and the side wall of the shell is provided with a transmitting hole at the position opposite to the transmitting head of the infrared module.
Preferably, a plurality of supporting legs are uniformly arranged on the lower end face of the shell; the supporting legs are made of rubber materials.
Preferably, a plurality of filter screens are respectively arranged in the plurality of radiating holes.
Preferably, a flange plate is arranged on the outer peripheral surface of the opening of the shell; an annular groove is formed in the inner circumferential surface of the end cover;
the flange plate is matched with the connecting groove.
Preferably, the end face of the flange plate remote from the housing is provided with a spherical surface.
Preferably, the heat-conducting column and the heat-conducting plate are both made of copper or copper alloy materials.
Preferably, one end of the heat conduction column is rotatably connected with the radiating fin, and the other end of the heat conduction column is in threaded connection with the heat conduction plate.
Preferably, the end cover and the shell are of rectangular parallelepiped structures.
Preferably, the end face of the heat dissipation plate in the installation bin is coated with a layer of heat dissipation silicone grease.
The technical scheme of the invention has the following beneficial technical effects:
according to the invention, the network module made of the circuit board, the power supply module, the controller and the plurality of groups of wireless communication modules is integrated with a plurality of wireless communication modules, so that the wireless communication module has the advantages of small volume and low cost; the network controller adopts an integrated network module, a user can replace the network module according to actual needs, and the integration level is high. The switch is used for controlling the working state of the network controller and controlling the network controller to start or close. The network controller supports multiple wireless communication protocols such as WIFI, infrared and Bluetooth, and is suitable for conversion among various protocols on different occasions; the network module is arranged in the sealed space to avoid dust and other pollution, and high temperature generated by the operation of the network module in the installation bin is radiated through the arranged heating panel and the multiple groups of semiconductor refrigerating sheets, so that the use performance of the network module is greatly improved.
Drawings
Fig. 1 is a schematic structural diagram of a network controller according to the present invention.
Fig. 2 is a schematic diagram of a partially enlarged structure at a in a network controller according to the present invention.
Fig. 3 is a schematic diagram of a partially enlarged structure at B in a network controller according to the present invention.
Fig. 4 is a front view of a network controller according to the present invention.
Reference numerals: 1. an end cap; 2. installing a bin; 3. a power supply module; 4. a circuit board; 5. a controller; 6. a wireless communication module; 7. a heat dissipation plate; 8. a housing; 9. a flange plate; 10. heat dissipation holes; 11. supporting legs; 12. a filter screen; 13. heat insulation glue; 14. a semiconductor refrigeration sheet; 15. a heat sink; 16. a heat-conducting column; 17. a heat conducting plate; 18. and (7) installing holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1 to 4, the network controller according to the present invention includes an end cap 1, a circuit board 4, a housing 8, a plurality of semiconductor cooling fins 14, a plurality of heat sinks 15, a plurality of heat conducting pillars 16, and a heat conducting plate 17;
a switch is arranged on the shell 8, and a heat dissipation plate 7 is arranged in the shell 8; the heat dissipation plate 7 is used for dividing the interior of the shell 8 into an installation bin 2 and a heat dissipation bin; the upper end of the shell 8 of the mounting bin 2 is provided with an opening; the end cover 1 is arranged on the opening end face of the shell 8; a plurality of mounting holes 18 for mounting a plurality of heat conducting plates 17 are uniformly arranged on the bottom surface of the heat dissipation bin, and a plurality of heat dissipation holes 10 are arranged on the shell 8 of the heat dissipation bin;
the circuit board 4 is arranged on the end face, located on the installation bin 2, of the heat dissipation plate 7, and the circuit board 4 is provided with a power module 3, a controller 5 and a plurality of groups of wireless communication modules 6; the power module 3 is electrically connected with the switch, the circuit board 4 and the controller 5; the controller 5 is respectively connected with a plurality of groups of wireless communication modules 6;
the network module made of the circuit board 4, the power module 3, the controller 5 and the plurality of groups of wireless communication modules 6 is integrated with a plurality of wireless communication modules, and has small volume and low cost. If the electric appliance needs to be remotely controlled, the signal to be transmitted is received through WIFI, USB, Bluetooth or a serial port, and the infrared remote control signal is converted through the infrared module to be transmitted, so that the electric appliance is controlled to work. The shell adopts a flat structure and has small volume. If need carry out bluetooth communication with certain equipment, receive through WIFI, USB, infrared or serial ports and wait to launch the signal to send after passing through bluetooth module conversion format, perhaps receive the signal through bluetooth module, then convert corresponding USB, infrared or serial ports data and send.
The network controller adopts an integrated network module, a user can replace the network module according to actual needs, and the integration level is high. The switch is used for controlling the working state of the network controller and controlling the network controller to start or close. The network controller supports multiple wireless communication protocols such as WIFI, infrared and Bluetooth and is suitable for conversion among various protocols on different occasions.
A plurality of groups of semiconductor refrigeration pieces 14 are positioned in the heat dissipation bin, the plurality of groups of semiconductor refrigeration pieces 14 are respectively arranged on the end surface of the heat dissipation bin where the heat dissipation plate 7 is positioned, and the cold ends of the plurality of groups of semiconductor refrigeration pieces 14 are all tightly pressed on the heat dissipation plate 7; the heat dissipation plate 7 is provided with heat insulation glue 13 for isolating the hot ends and the cold ends of a plurality of groups of semiconductor refrigeration pieces 14; the plurality of groups of semiconductor refrigerating pieces 14 are connected with the controller 5;
the plurality of radiating fins 15 are respectively arranged at the hot ends of the plurality of groups of semiconductor refrigerating fins 14 one by one; one ends of the heat conduction columns 16 are connected to the heat dissipation fins 15, and the other ends of the heat conduction columns 16 are connected to the heat conduction plates 17.
According to the invention, a network module made of the circuit board 4, the power module 3, the controller 5 and the plurality of groups of wireless communication modules 6 is integrated with a plurality of wireless communication modules, so that the wireless communication module has the advantages of small volume and low cost; the network controller adopts an integrated network module, a user can replace the network module according to actual needs, and the integration level is high. The switch is used for controlling the working state of the network controller and controlling the network controller to start or close. The network controller supports multiple wireless communication protocols such as WIFI, infrared and Bluetooth, and is suitable for conversion among various protocols on different occasions; the network module is arranged in a sealed space to prevent dust and other pollution, and high temperature generated by the operation of the network module in the installation bin is radiated through the arranged heat radiation plate 7 and the multiple groups of semiconductor refrigerating sheets 14, so that the service performance of the network module is greatly improved.
In an optional embodiment, the wireless communication module comprises a WIFI module, an infrared module, a bluetooth module, a USB module and a serial port module; and the side wall of the shell 8 is provided with a transmitting hole at the position opposite to the transmitting head of the infrared module.
In an alternative embodiment, the lower end surface of the shell 8 is uniformly provided with a plurality of supporting feet 11; the supporting legs 11 are made of rubber; the supporting feet 11 are provided to improve the stability of the device.
In an alternative embodiment, a plurality of filtering nets 12 are respectively disposed in the plurality of heat dissipation holes 10.
In an alternative embodiment, a flange plate 9 is provided on the outer peripheral surface of the opening of the housing 8; an annular groove is arranged on the inner circumferential surface of the end cover 1;
the flange plate 9 fits into the coupling recess.
In an alternative embodiment the end face of the flange plate 9 remote from the housing 8 is provided with a spherical surface.
In an alternative embodiment, the heat-conducting columns 16 and the heat-conducting plate 17 are made of copper or copper alloy material.
In an alternative embodiment, one end of the heat-conducting post 16 is rotatably connected to the heat sink 15, and the other end of the heat-conducting post 16 is screwed to the heat-conducting plate 17.
In an alternative embodiment, both the end cap 1 and the housing 8 are rectangular parallelepiped in shape.
In an alternative embodiment, the end surface of the heat dissipation plate 7 located inside the mounting chamber 2 is coated with a layer of heat dissipation silicone grease to improve the heat dissipation performance.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (10)
1. The network controller is characterized by comprising an end cover (1), a circuit board (4), a shell (8), a plurality of semiconductor refrigerating fins (14), a plurality of radiating fins (15), a plurality of heat conducting columns (16) and a heat conducting plate (17);
a switch is arranged on the shell (8), and a heat dissipation plate (7) is arranged in the shell (8); the heat dissipation plate (7) is used for dividing the interior of the shell (8) into an installation bin (2) and a heat dissipation bin; the upper end of the shell (8) of the installation bin (2) is provided with an opening; the end cover (1) is arranged on the opening end surface of the shell (8); a plurality of mounting holes (18) for mounting a plurality of heat-conducting plates (17) are uniformly formed in the bottom surface of the heat dissipation bin, and a plurality of heat dissipation holes (10) are formed in the shell (8) of the heat dissipation bin;
the circuit board (4) is arranged on the end face, located on the installation bin (2), of the heat dissipation plate (7), and the circuit board (4) is provided with a power supply module (3), a controller (5) and a plurality of groups of wireless communication modules (6); the power supply module (3) is electrically connected with the switch, the circuit board (4) and the controller (5); the controller (5) is respectively connected with a plurality of groups of wireless communication modules (6);
a plurality of groups of semiconductor refrigeration sheets (14) are positioned in the heat dissipation bin, the plurality of groups of semiconductor refrigeration sheets (14) are respectively arranged on the end surface of the heat dissipation bin where the heat dissipation plate (7) is positioned, and the cold ends of the plurality of groups of semiconductor refrigeration sheets (14) are pressed tightly on the heat dissipation plate (7); wherein, the heat dissipation plate (7) is provided with a heat insulation glue (13) for isolating the hot ends and the cold ends of a plurality of groups of semiconductor refrigeration sheets (14); the plurality of groups of semiconductor refrigerating pieces (14) are connected with the controller (5);
the plurality of radiating fins (15) are respectively arranged at the hot ends of the plurality of groups of semiconductor refrigerating fins (14) one by one; one end of each of the plurality of heat-conducting columns (16) is connected with the plurality of radiating fins (15), and the other end of each of the plurality of heat-conducting columns (16) is connected with the plurality of heat-conducting plates (17).
2. The network controller according to claim 1, wherein the wireless communication module comprises a WIFI module, an infrared module, a Bluetooth module, a USB module and a serial port module; the side wall of the shell (8) is provided with a transmitting hole at the position opposite to the transmitting head of the infrared module.
3. A network controller according to claim 1, characterized in that the lower end surface of the housing (8) is uniformly provided with a plurality of supporting feet (11); the supporting legs (11) are made of rubber materials.
4. A network controller according to claim 1, characterised in that a plurality of filters (12) are provided within each of the plurality of louvers (10).
5. A network controller according to claim 1, characterized in that a flange plate (9) is provided on the outer peripheral surface of the opening of the housing (8); an annular groove is arranged on the inner circumferential surface of the end cover (1);
the flange plate (9) is matched with the connecting groove.
6. A network controller as claimed in claim 5, characterized in that the end face of the flange plate (9) remote from the housing (8) is provided with a spherical surface.
7. A network controller according to claim 1, characterised in that the heat-conducting columns (16) and the heat-conducting plates (17) are made of copper or copper alloy material.
8. A network controller according to claim 1, characterised in that one end of the heat conducting column (16) is rotatably connected to the heat sink (15) and the other end of the heat conducting column (16) is screwed to the heat conducting plate (17).
9. A network controller according to claim 1, characterised in that the end cap (1) and the housing (8) are of cuboid configuration.
10. A network controller according to claim 1, characterised in that the end surface of the heat sink (7) located inside the mounting compartment (2) is coated with a layer of heat sink silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911177011.6A CN110992663A (en) | 2019-11-26 | 2019-11-26 | Network controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911177011.6A CN110992663A (en) | 2019-11-26 | 2019-11-26 | Network controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110992663A true CN110992663A (en) | 2020-04-10 |
Family
ID=70087179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911177011.6A Pending CN110992663A (en) | 2019-11-26 | 2019-11-26 | Network controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110992663A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399778A (en) * | 2020-10-27 | 2021-02-23 | 上海无线电设备研究所 | Combined heat dissipation device for multiple high-power chips |
| CN112738179A (en) * | 2020-12-23 | 2021-04-30 | 万申科技股份有限公司 | Edge calculation control equipment based on heterogeneous network |
| WO2023110156A1 (en) * | 2021-12-15 | 2023-06-22 | Valeo Comfort And Driving Assistance | Electronic assembly |
-
2019
- 2019-11-26 CN CN201911177011.6A patent/CN110992663A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399778A (en) * | 2020-10-27 | 2021-02-23 | 上海无线电设备研究所 | Combined heat dissipation device for multiple high-power chips |
| CN112738179A (en) * | 2020-12-23 | 2021-04-30 | 万申科技股份有限公司 | Edge calculation control equipment based on heterogeneous network |
| WO2023110156A1 (en) * | 2021-12-15 | 2023-06-22 | Valeo Comfort And Driving Assistance | Electronic assembly |
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| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200410 |
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| WD01 | Invention patent application deemed withdrawn after publication |