CN216532438U

CN216532438U - High power density power of easily assembling

Info

Publication number: CN216532438U
Application number: CN202123434392.7U
Authority: CN
Inventors: 邓世国; 余培; 李伟强; 李佳春
Original assignee: Nanjing Kuke Electronic Technology Co ltd
Current assignee: Nanjing Kuke Electronic Technology Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-05-13
Anticipated expiration: 2031-12-31

Abstract

The utility model provides an easily assembled high power density power supply, comprising: the first PCBA board comprises a first PCB board and electronic components arranged on the first PCB board; the second PCBA comprises a second PCB and electronic components arranged on the second PCB, wherein pins are arranged on one side of the second PCB, and the second PCB is inserted into the first PCB through the pins; and the isolating piece isolates the electronic components on the first PCBA board and the second PCBA board. The structural design of the power supply enables the assembly process to be simple and easy to operate, greatly reduces the assembly working hours in the production process and improves the production efficiency.

Description

High power density power of easily assembling

Technical Field

The utility model relates to the field of power supply design, in particular to an easily-assembled high-power-density power supply.

Background

With the rapid development of power semiconductors and the continuous improvement of device integration, power adapters for smart phones and notebook computers are continuously developing toward miniaturization and portability. However, miniaturization brings with it more serious electromagnetic interference (EMI), electromagnetic shielding (EMS), and heat dissipation issues. In order to solve this problem, the power supply in the prior art mostly adopts a structural design manner of stacking multiple layers of PCB boards, for example: the PCB four-layer board is adopted to achieve better EMI resistance effect and heat dissipation effect. However, the method has the problems of complex assembly, high material cost, difficult maintenance and the like in production. In addition, the stacking of multiple layers of PCBs tends to cause interference between the devices in each layer, which can make EMI and EMS issues relatively difficult to deal with, or even meet only the most basic safety requirements. Therefore, on the basis of good heat dissipation and interference resistance, it is an important improvement objective for those skilled in the art to design and develop a high power density power supply with simple structure and convenient assembly so as to improve the production efficiency.

SUMMERY OF THE UTILITY MODEL

It is an object of the present invention to overcome the disadvantages of the prior art and to provide a high power density power supply that is easy to assemble.

In order to achieve the above objects and other objects, the present invention is achieved by the following technical solutions: a high power density power supply that is easy to assemble, comprising: the first PCBA board comprises a first PCB board and electronic components arranged on the first PCB board; the second PCBA comprises a second PCB and electronic components arranged on the second PCB, wherein pins are arranged on one side of the second PCB, and the second PCB is inserted into the first PCB through the pins; and the isolating piece isolates the electronic components on the first PCBA board and the second PCBA board.

In an embodiment, the spacer includes a fastening plate for fastening the second PCB, and one side of the first PCB is formed with a socket.

In an embodiment, the power supply further comprises a heat sink welded to the first and second PCBA boards.

In an embodiment, the spacer further comprises a first cavity for receiving a transformer on the second PCBA board.

In an embodiment, the spacer further comprises a second cavity for receiving and spacing electronic components on the first PCBA board.

The utility model only adopts two PCBA boards to complete the arrangement of all electronic components, and the design of the fastening board and the first cavity ensures that the separator is firmly arranged on the second PCBA board. The assembly operation of the power supply can be completed only by simple three steps: first, fitting the spacer on the second PCBA board; secondly, vertically inserting the second PCBA board into one side of the first PCBA board, and welding; finally, the heat sink is assembled and welded to the first and second PCBA plates. The structural design of the power supply enables the assembly process to be simple and easy to operate, greatly reduces the assembly working hours in the production process and improves the production efficiency.

Drawings

Fig. 1 is a perspective view of the main internal structure of a novel high power density power supply according to the present invention.

Figure 2 shows a perspective view of a second PCBA plate and spacer in accordance with the present invention at an angle.

Figure 3 shows a perspective view of a second PCBA plate and spacer of the present invention from another angle.

Fig. 4 is a schematic diagram showing the main structure of a novel high power density power supply according to the present invention before assembly.

Fig. 5 is a schematic diagram illustrating an assembled state of the main structure of a novel high power density power supply according to the present invention.

Figure 6 is a schematic diagram of the placement of electronic components on one surface of a first PCBA board in accordance with the present invention.

Figure 7 shows a schematic layout of electronic components on one surface of a second PCBA board according to the utility model.

Detailed Description

Please refer to fig. 1 to 7. The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification.

It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification to understand and read by those skilled in the art, and are not used to limit the practical limit conditions of the present invention, so they have no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the present invention without affecting the function and the achievable purpose of the present invention. In addition, the terms such as "front", "rear", "upper", "lower", "left", "right", "middle" and "one" used in the present specification are used for clarity of description, and are not intended to limit the scope of the present invention, and changes or modifications in the relative relationship may be made without substantial technical changes.

As shown in fig. 1, the present invention provides a novel high power density power supply that basically comprises a first PCBA board 10, a second PCBA board 20 and a spacer 30. The second PCBA board 20 is arranged on one side of the first PCBA board 10 in a direction substantially perpendicular to the first PCBA board 10. The first PCBA board 10 and the second PCBA board 20 carry electronic components thereon. Since the 3D space layout of the power supply is relatively compact, the design of the spacer 30 may effectively separate the electronic components on the first PCBA board 10 and the second PCBA board 20 in view of safety code requirements.

Further, as shown in FIG. 2, the spacer 30 is sleeved over the second PCBA board 20. The spacer 30 includes a fastening plate 311, and the fastening plate 311 is used for snapping the second PCB board 21 (shown in fig. 3). The spacer 30 also includes a first cavity 31, the first cavity 31 for receiving the transformer 22 on the second PCBA board 20. The design of fastening plate 311 and first cavity 31 allows spacer 30 to be securely mounted on second PCBA board 20.

As shown in fig. 3, the spacer 30 further comprises a second cavity 32, the second cavity 32 being adapted to receive and space electronic components on the first PCBA board 10.

Fig. 4 and 5 are schematic views of the power supply before and after assembly, respectively, and as shown in fig. 4 and 5, the power supply further includes a heat sink 40 and a housing (not shown), the heat sink 40 being welded to the first PCBA board 10 and the second PCBA board 20, the first PCBA board 10, the second PCBA board 20, the spacer 30 and the heat sink 40 being mounted within the housing. A plug (not shown) is also mounted on the housing for connection to an external power source. The assembly operation of the power supply can be completed only by simple three steps: first, the spacer 30 is assembled on the second PCBA board 20; secondly, vertically inserting the second PCBA board 20 into one side of the first PCBA board 10, and welding; finally, the heat sink 40 is assembly welded to the first PCBA board 10 and the second PCBA board 20. The structural design of the power supply enables the assembly process to be simple and easy to operate, and greatly reduces the assembly working hours in the production process.

As shown in fig. 6, the first PCBA board 10 includes a first PCB board 11, an input interface 12, an output interface 13, a Y-capacitor 14, and a filter inductor 15. A plurality of jacks 111 are formed in one side of the first PCB 11, and the jacks 111 are used for plugging the second PCBA board 20. The input interface 12, the output interface 13, the Y capacitor 14 and the filter inductor 15 are disposed on one surface of the first PCB 11, the input interface 12 and the output interface 13 are disposed at two ends of the first PCB 11, respectively, the filter inductor 15 is disposed between the input interface 12 and the output interface 13, and the Y capacitor 14 is disposed between the filter inductor 15 and the output interface 13. Certain spaces are reserved between the filter inductor 15 and the input interface 12 and between the filter inductor 15 and the output interface 13 for accommodating electronic components on the second PCBA board 20. The output interface 13 can be USB Type-C, USB Type-A, USB Type-B, special USB and the like.

Referring to fig. 1 and 7, the second PCBA board 20 includes a second PCB board 21 electrically connected to the first PCBA board 10, and a transformer 22 and an energy storage capacitor 23 disposed on one surface of the second PCB board 21. One side of the second PCB 21 is provided with a plurality of pins 211, and the second PCB 21 is inserted into the first PCB 11 through the pins 211, such that the transformer 22 and the energy storage capacitor 23 are substantially parallel to the first PCB 11 and extend above the first PCB 11. The transformer 22 and the energy storage capacitor 23 are respectively disposed at two ends of the second PCB 21, the energy storage capacitor 23 is disposed above a space left between the filter inductor 15 and the input interface 12, and the transformer 22 is disposed above a space left between the filter inductor 15 and the output interface 13.

As shown in fig. 7, the energy storage capacitor 23 includes a first energy storage capacitor 231 and a second energy storage capacitor 232, the volume of the first energy storage capacitor 231 is larger than that of the second energy storage capacitor 232, the first energy storage capacitor 231 is disposed on a side far from the pin 211, and the second energy storage capacitor 232 is disposed on a side close to the pin 211.

As shown in fig. 4 and 5, the first PCBA board 10 further includes a synchronous rectification MOS transistor 16 and a rectification bridge 17, and the synchronous rectification MOS transistor 16 and the rectification bridge 17 are disposed on the other surface of the first PCB board 11. The synchronous rectification MOS transistor 16 is disposed at one end of the output interface 13. The rectifier bridge 17 is disposed at one end of the input interface 12, and is mainly used for converting an ac input into a dc output.

The second PCBA board 20 further includes a heat-dissipating copper foil 24 and a power switch 25, the heat-dissipating copper foil 24 and the power switch 25 being arranged on the other surface of the second PCB board 21. The heat-dissipating copper foil 24 is disposed at one end of the transformer 22, and is used for conducting out heat generated at the bottom of the transformer 22. The power switch 25 is arranged between the transformer 22 and the energy storage capacitor 23, and the power switch 25 and the filter inductor 15 are approximately located at the same horizontal height after the power supply is assembled.

Further, the first PCB 11 is arranged with the surface of the synchronous rectification MOS transistor 16 and the rectification bridge 17 facing the housing of the power supply, the second PCB 20 is arranged with the surface of the power switch 25 facing the housing of the power supply, and the projection positions of the synchronous rectification MOS transistor 16 and the rectification bridge 17 on the first PCB 10 and the projection positions of the power switch 25 on the second PCB 20 are mutually staggered. Therefore, the synchronous rectification MOS tube 16, the rectifier bridge 17 and the power switch 25 which generate more heat are distributed in space and radiate heat outwards, and a better heat radiation effect is achieved.

Further, the filter inductor 15 and the synchronous rectification MOS tube 16 are arranged on the opposite side of the second PCBA board 20 from the side vertically inserted into the first PCBA board 10. By the arrangement, the filter inductor 15, the synchronous rectification MOS tube 16, the rectifier bridge 17, the transformer 22 and the power switch 25 which generate more heat can be far away from each other and staggered horizontally and vertically, so that the overall heat dissipation of the power supply is facilitated. In addition, the filter inductor 15 and the transformer 22 can dissipate heat to the outside over a larger area by means of the heat sink 40 disposed on the side thereof.

Furthermore, the filter inductor 15, the synchronous rectification MOS transistor 16, the transformer 22 and the power switch 25, which are main electromagnetic interference sources, are far away from each other and staggered horizontally and vertically, so that interference signals are equally divided horizontally and vertically, mutual interference of the signals is effectively avoided, and a better anti-EMI effect can be obtained.

In conclusion, the utility model has simple structure and convenient assembly, can improve the production efficiency of the power supply and simultaneously can ensure good heat dissipation and anti-interference capability.

Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value. The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A high power density power supply that is easy to assemble, comprising:

the first PCBA board comprises a first PCB board and electronic components arranged on the first PCB board, and one side of the first PCB board is provided with a jack;

the second PCBA comprises a second PCB and electronic components arranged on the second PCB, wherein one side of the second PCB is provided with pins, and the second PCB is inserted into the jack of the first PCB through the pins;

and the isolating piece isolates the electronic components on the first PCBA board and the second PCBA board.

2. An easily assembled high power density power supply according to claim 1, comprising: the spacer includes a fastening plate for snapping the second PCB.

3. An easily assembled high power density power supply according to claim 1 further comprising a heat sink welded to the first and second PCBA plates.

4. An easily assembled high power density power supply according to claim 2, wherein the spacer further comprises a first cavity for receiving a transformer on the second PCBA board.

5. An easily assembled high power density power supply according to claim 3 wherein the spacer further comprises a second cavity for receiving and spacing electronic components on the first PCBA board.