CN216532441U

CN216532441U - Novel high power density power

Info

Publication number: CN216532441U
Application number: CN202123453045.9U
Authority: CN
Inventors: 邓世国; 余培; 李伟强; 李佳春
Original assignee: Nanjing Kuke Electronic Technology Co ltd
Current assignee: Nanjing Kuke Electronic Technology Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-05-13
Anticipated expiration: 2031-12-31

Abstract

The utility model provides a novel high power density power supply, comprising: the PCB comprises a first PCBA board and a second PCBA board, wherein the first PCBA board comprises a first PCB board and electronic components arranged on the first PCBA board, the second PCBA board comprises a second PCB board and electronic components arranged on the second PCB board, and the second PCBA board is arranged on one side of the first PCBA board in a direction perpendicular to the first PCBA board; the electronic components arranged on one surface of the first PCB board comprise rectifier switches, the electronic components arranged on one surface of the second PCB board comprise power switches, and the projection positions of the rectifier switches on the first PCBA board and the projection positions of the power switches on the second PCBA board are mutually staggered. The 3D cloth plate is simple in design structure, strong in anti-interference capability and good in heat dissipation effect.

Description

Novel high power density power

Technical Field

The utility model relates to the field of power supply design, in particular to a novel high-power-density power supply for 3D (three-dimensional) cloth boards.

Background

With the rapid development of power semiconductors and the continuous improvement of device integration, power adapters for smart phones and notebook computers are continuously developing toward miniaturization and portability. However, miniaturization brings with it more serious electromagnetic interference (EMI), electromagnetic shielding (EMS), and heat dissipation issues. In order to solve the problem, the power supply in the prior art mostly adopts a structural design mode of stacking multiple layers of PCB boards, but the mode easily causes mutual interference among devices of each layer, which makes the EMI and EMS problems relatively difficult to handle, and even some power supplies can only meet the most basic safety requirements. Therefore, designing and developing a novel high power density power supply with simple structure, strong anti-interference capability and good heat dissipation effect is an important improvement target for those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provide a novel high-power-density power supply.

In order to achieve the above objects and other objects, the present invention is achieved by the following technical solutions: a novel high power density power supply, comprising: the PCB comprises a first PCBA board and a second PCBA board, wherein the first PCBA board comprises a first PCB board and electronic components arranged on the first PCBA board, the second PCBA board comprises a second PCB board and electronic components arranged on the second PCB board, and the second PCBA board is arranged on one side of the first PCBA board in a direction perpendicular to the first PCBA board; the electronic components arranged on one surface of the first PCB board comprise rectifier switches, the electronic components arranged on one surface of the second PCB board comprise power switches, and the projection positions of the rectifier switches on the first PCBA board and the projection positions of the power switches on the second PCBA board are mutually staggered.

In an embodiment, the first PCB board is arranged with a surface of the rectifier switch facing a housing of the power supply, and the second PCBA board is arranged with a surface of the power switch facing a housing of the power supply.

In an embodiment, the electronic component disposed on the other surface of the first PCB includes an input interface, an output interface, a Y capacitor, and a filter inductor, the input interface and the output interface are respectively disposed at two ends of the first PCB, the filter inductor is disposed between the input interface and the output interface, the Y capacitor is disposed between the filter inductor and the output interface, the Y capacitor is directly bridged across two ends of the input interface and the output interface, and a certain space is left between the filter inductor and the input interface and between the filter inductor and the output interface.

In one embodiment, the rectifier switch includes a synchronous rectification MOS transistor disposed at one end of the output interface and a rectifier bridge disposed at one end of the input interface.

In an embodiment, the electronic component disposed on the other surface of the second PCB includes a transformer and an energy storage capacitor, and the transformer and the energy storage capacitor are respectively disposed at two ends of the second PCB.

In an embodiment, the transformer and the energy storage capacitor extend substantially parallel to and above the first PCB, and the energy storage capacitor is arranged above a space left between the filter inductor and the input interface, and the transformer is arranged above a space left between the filter inductor and the output interface.

In one embodiment, the power switch is disposed between the transformer and the energy storage capacitor and is located at approximately the same level as the filter inductance.

In one embodiment, the isolator comprises a first cavity, and the filter inductor and the synchronous rectification MOS tube are arranged on the opposite side of one side of the second PCBA board vertically inserted into the first PCBA board, so that the filter inductor, the synchronous rectification MOS tube, the rectifier bridge, the transformer and the power switch are far away from each other and staggered horizontally and vertically.

In one embodiment, the second PCBA board further comprises a heat dissipating copper foil disposed on one surface of the second PCB board at one end of the transformer.

According to the 3D board distribution design provided by the utility model, interference sources such as the filter inductor, the synchronous rectification MOS tube, the transformer, the power switch and the like are arranged in a staggered manner in a horizontal and vertical manner, the distance between the interference sources is shortened, the mutual interference of signals is effectively avoided, and a better anti-EMI effect can be obtained; meanwhile, the rectifier switch and the power switch are distributed on the two PCB boards as surface mount heat sources in a staggered mode, and the filter inductor and the transformer are far away from other heat sources, so that a good heat dissipation effect can be achieved; in addition, the Y capacitor is directly bridged at two ends of the input interface and the output interface, so that the interference to devices can be effectively prevented, a better EMS (energy management system) resisting effect is obtained, and the excellent electrical performance and the working stability of the whole machine are guaranteed. Compared with the traditional design scheme, the 3D board distribution design scheme provided by the utility model has the advantage that the power density of the power supply can be improved by more than 10%.

Drawings

Fig. 1 is a schematic perspective view of a novel high power density power supply according to the present invention.

Fig. 2 is a schematic diagram showing the arrangement of electronic components on a surface of the first PCB according to the present invention.

Fig. 3 shows a schematic diagram of the cross-over of the Y capacitor in the present invention.

Fig. 4 is a schematic diagram showing the arrangement of electronic components on a surface of the second PCB in the present invention.

Fig. 5 is a perspective view of another embodiment of a novel high power density power supply according to the present invention.

Fig. 6 is an exploded view of a novel high power density power supply of the present invention.

Detailed Description

Please refer to fig. 1 to 6. The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification.

It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification to understand and read by those skilled in the art, and are not used to limit the practical limit conditions of the present invention, so they have no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the present invention without affecting the function and the achievable purpose of the present invention. In addition, the terms such as "front", "rear", "upper", "lower", "left", "right", "middle" and "one" used in the present specification are used for clarity of description, and are not intended to limit the scope of the present invention, and changes or modifications in the relative relationship may be made without substantial technical changes.

As shown in fig. 1, the present invention provides a novel high power density power supply that generally includes a first PCBA board 10 and a second PCBA board 20. The first PCBA board 10 includes a first PCB board 11 and electronic components disposed thereon, and the second PCBA board 20 includes electronic components disposed on a second PCB board 21 and thereon. The second PCBA board 20 is arranged on one side of the first PCBA board 10 in a direction substantially perpendicular to the first PCBA board 10. Set up in electronic components on first PCB board 11 one surface includes rectifier switch, rectifier switch includes synchronous rectification MOS pipe 16 and rectifier bridge 17, set up in electronic components on second PCB board 21 one surface includes power switch 25, synchronous rectification MOS pipe 16 and rectifier bridge 17 are in projection position on the first PCBA board with power switch 25 is in projection position on the second PCBA board is staggered each other. Therefore, the synchronous rectification MOS tube 16, the rectifier bridge 17 and the power switch 25 which are beneficial to generating more heat are distributed and radiated outwards in space, a better radiating effect is achieved, and meanwhile signal interference among the synchronous rectification MOS tube, the rectifier bridge 17 and the power switch is avoided.

The power supply further comprises a spacer 30, a heat sink 40 and a housing (not shown), the spacer 30 being designed to effectively separate electronic components on the first PCBA board 10 and the second PCBA board 20. The heat sink 40 is welded to the first PCBA board 10 and the second PCBA board 20, the first PCBA board 10, the second PCBA board 20, the spacer 30 and the heat sink 40 being mounted within the housing. And the first PCB board 11 is arranged with the surface of the rectifier switch facing the housing of the power supply, and the second PCBA board 21 is arranged with the surface of the power switch 25 facing the housing of the power supply, so as to further facilitate the outward heat dissipation of the synchronous rectifier MOS transistor 16, the rectifier bridge 17 and the power switch 25. A plug (not shown) is also mounted on the housing for connection to an external power source.

As shown in fig. 2, an input interface 12, an output interface 13, a Y capacitor 14 and a filter inductor 15 are disposed on the other surface of the first PCB 11. A plurality of jacks 111 are formed in one side of the first PCB 11, and the jacks 111 are used for plugging the second PCBA board 20. The input interface 12 and the output interface 13 are respectively disposed at two ends of the first PCB 11, the filter inductor 15 is disposed between the input interface 12 and the output interface 13, and the Y capacitor 14 is disposed between the filter inductor 15 and the output interface 13. Certain spaces are reserved between the filter inductor 15 and the input interface 12 and between the filter inductor 15 and the output interface 13 for accommodating electronic components on the second PCBA board 20. Further, please refer to fig. 1, the synchronous rectification MOS transistor 16 is disposed at one end of the output interface 13, and the rectifier bridge 17 is disposed at one end of the input interface 12, and is mainly used for converting an ac input into a dc output. The output interface 13 can be USB Type-C, and can also be USB Type-A, USB Type-B, special USB and the like.

Referring to fig. 2 and fig. 3, the Y capacitor CY is directly connected across two ends of the power circuit, that is, two ends of the input interface 12 and the output interface 13, the first voltage input by the input interface 12 is V1, and the second voltage output by the output interface 13 is V2, at this time, the path of the EMS is shortest and is substantially straight, so that interference to other devices can be effectively prevented, and a better anti-EMS effect can be obtained. The input interface 12 and the output interface 13 are arranged on the same PCB board, and the safety distance of the primary and secondary sides is ensured by the two ends of the Y capacitor 14, so that the PCB size is minimized. Because the primary and secondary main power loops are on the first PCB 11, the input and output relationship is realized in a straight-in and straight-out manner, thereby avoiding interference to the control part and ensuring excellent electrical performance and working stability of the whole machine.

Referring to fig. 4 and 5, a transformer 22 and an energy storage capacitor 23 are disposed on the other surface of the second PCB 21, and the transformer 22 and the energy storage capacitor 23 are disposed at two ends of the second PCB 21, respectively. A plurality of protruding pins 211 are disposed on one side of the second PCB 21, the second PCB 21 is vertically inserted into one side of the first PCB 11 through the pins 211, such that the transformer 22 and the energy storage capacitor 23 are substantially parallel to the first PCB 11 and extend above the first PCB 11, the energy storage capacitor 23 is disposed above a space left between the filter inductor 15 and the input interface 12, and the transformer 22 is disposed above a space left between the filter inductor 15 and the output interface 13.

As shown in fig. 4, the energy storage capacitor 23 includes a first energy storage capacitor 231 and a second energy storage capacitor 232, the volume of the first energy storage capacitor 231 is larger than the volume of the second energy storage capacitor 232, the first energy storage capacitor 231 is disposed on a side far from the pin 211, and the second energy storage capacitor 232 is disposed on a side close to the pin 211.

As shown in fig. 6, the power switch 25 is disposed between the transformer 22 and the energy storage capacitor 23, and the power switch 25 and the filter inductor 15 are located at approximately the same level after the power supply is assembled. The filter inductor 15 and the synchronous rectification MOS tube 16 are arranged on the opposite side of the second PCBA board 20 from the side vertically inserted into the first PCBA board 10. By the arrangement, the filter inductor 15, the synchronous rectification MOS tube 16, the rectifier bridge 17, the transformer 22 and the power switch 25 which generate more heat can be far away from each other and staggered horizontally and vertically, so that the overall heat dissipation of the power supply is facilitated. In addition, the filter inductor 15 and the transformer 22 can dissipate heat to the outside over a larger area by means of the heat sink 40 disposed on the side thereof.

Furthermore, the filter inductor 15, the synchronous rectification MOS transistor 16, the transformer 22 and the power switch 25, which are main electromagnetic interference sources, are far away from each other and staggered horizontally and vertically, so that interference signals are equally divided horizontally and vertically, mutual interference of the signals is effectively avoided, and a better anti-EMI effect can be obtained.

Further, the second PCBA board 20 further includes a heat-dissipating copper foil 24, the heat-dissipating copper foil 24 being disposed on one surface of the second PCB board 21. The heat-dissipating copper foil 24 is disposed at one end of the transformer 22, and is used for conducting out heat generated at the bottom of the transformer 22.

In conclusion, the Y capacitor 14 is directly bridged at two ends of the power circuit, so that a better EMS resistance effect can be obtained, and the excellent electrical performance and the working stability of the whole machine are guaranteed; in addition, the utility model adopts a design scheme of 3D layout, fully utilizes the segment difference on the space to place each heating electronic component or electromagnetic interference electronic component, maximizes the space utilization rate, can respectively guide the heat generated by each heating electronic component out of the power supply from four surfaces, and avoids the mutual influence of signals of each electromagnetic interference electronic component, so that the power density of the power supply can be improved by more than 10 percent compared with the traditional design scheme.

Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value. The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A novel high power density power supply, comprising:

a first PCBA board including a first PCB board and electronic components arranged thereon,

the second PCBA comprises a second PCB and electronic components arranged on the second PCB, and the second PCBA is arranged on one side of the first PCBA in a direction perpendicular to the first PCBA;

the electronic components arranged on one surface of the first PCB board comprise rectifier switches, the electronic components arranged on one surface of the second PCB board comprise power switches, and the projection positions of the rectifier switches on the first PCBA board and the projection positions of the power switches on the second PCBA board are mutually staggered.

2. The novel high power density power supply of claim 1, wherein the first PCB board is arranged with a surface of the rectifier switch facing the housing of the power supply, and the second PCB board is arranged with a surface of the power switch facing the housing of the power supply.

3. The novel high power density power supply according to claim 1, wherein the electronic components disposed on the other surface of the first PCB comprise an input interface, an output interface, a Y capacitor and a filter inductor, the input interface and the output interface are respectively disposed at two ends of the first PCB, the filter inductor is disposed between the input interface and the output interface, the Y capacitor is disposed between the filter inductor and the output interface, the Y capacitor is directly bridged between two ends of the input interface and the output interface, and a certain space is left between the filter inductor and the input interface and between the filter inductor and the output interface.

4. The novel high power density power supply according to claim 3, wherein said rectifier switch comprises a synchronous rectifier MOS transistor and a rectifier bridge, said synchronous rectifier MOS transistor is disposed at one end of said output interface, and said rectifier bridge is disposed at one end of said input interface.

5. The novel high power density power supply according to claim 4, wherein the electronic components disposed on the other surface of the second PCB board comprise a transformer and an energy storage capacitor, and the transformer and the energy storage capacitor are respectively disposed at two ends of the second PCB board.

6. The novel high power density power supply of claim 5 wherein the transformer and energy storage capacitor extend substantially parallel to and above the first PCB, and the energy storage capacitor is disposed above the space left between the filter inductor and the input interface, and the transformer is disposed above the space left between the filter inductor and the output interface.

7. The novel high power density power supply of claim 5 wherein the power switch is disposed between the transformer and the energy storage capacitor and at approximately the same level as the filter inductance.

8. The novel high power density power supply of claim 7, wherein the filter inductor and the synchronous rectification MOS tube are arranged on the opposite side of the side where the second PCBA board is vertically inserted into the first PCBA board, so that the filter inductor, the synchronous rectification MOS tube, the rectification bridge, the transformer and the power switch are far away from each other and staggered horizontally and vertically.

9. The novel high power density power supply of claim 5, wherein the second PCBA board further comprises a heat dissipating copper foil disposed on one surface of the second PCB board at one end of the transformer.