CN216532401U

CN216532401U - Multilayer liquid cooling plate and radiator

Info

Publication number: CN216532401U
Application number: CN202123193766.0U
Authority: CN
Inventors: 李想; 刘新生; 张晓屿; 叶青松; 倪杨; 连红奎; 孙萌; 范春波
Original assignee: Changzhou Weihan Thermal Control Technology Co ltd; Beijing Weihan Technology Co Ltd
Current assignee: Changzhou Weihan Thermal Control Technology Co ltd; Beijing Weihan Technology Co Ltd
Priority date: 2021-12-16
Filing date: 2021-12-16
Publication date: 2022-05-13
Anticipated expiration: 2031-12-16

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a multilayer liquid cooling plate and a radiator. The multilayer liquid cooling plate comprises a heat dissipation substrate, an upper cover plate and a lower cover plate; cooling grooves are formed in the two opposite sides of the heat dissipation substrate; the upper cover plate and the lower cover plate are respectively arranged on two opposite sides of the heat dissipation substrate and are used for covering and sealing the cooling groove; a medium input port and a medium output port are arranged on the side wall of the heat dissipation substrate and are respectively communicated with different cooling grooves; the radiating substrate is provided with a communication hole which is used for communicating the two cooling grooves. The embodiment of the utility model has the beneficial effects that: after the cooling grooves are formed in the two sides of the heat dissipation substrate, double-sided heat dissipation of the liquid cooling plate is achieved, heat dissipation efficiency is greatly improved, the number of the liquid cooling plates does not need to be increased, and the size of the whole device does not need to be increased.

Description

Multilayer liquid cooling plate and radiator

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a multilayer liquid cooling plate and a radiator.

Background

Renewable energy efficient power generation is one of the key technologies for implementing renewable energy substitution actions, constructing a novel power system taking new energy as a main body and realizing the strategic goal of 'double carbon'. The large photovoltaic direct current boosting system can gather advantageous resources and play a scale effect, greatly reduces the power generation cost, is an important development direction of renewable energy power generation, has the advantages of being simpler, more efficient and more stable in direct current collection and connection, and is a great trend in the future.

The existing solar photovoltaic power generation system firstly inverts low-voltage direct current into low-voltage alternating current through an inverter, then boosts the voltage through a transformer, and converts the low-voltage alternating current into alternating current to be incorporated into a power grid.

In the existing direct current boosting grid-connected device, because the number of related components is large, heat dissipation treatment needs to be carried out on the components so as to guarantee the normal service life of each component.

The heat dissipation mode of the existing direct current boosting grid-connected device is that one liquid cooling plate corresponds to one part needing heat dissipation or corresponds to the part needing heat dissipation on the same side, when the parts needing heat dissipation are more, when the parts needing heat dissipation are spatially arranged, a plurality of liquid cooling plates are needed, and the heat dissipation efficiency can be ensured.

Due to the arrangement mode, the heat dissipation cost is greatly increased, and the overall size is increased.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a multilayer liquid cooling plate and a radiator, which can quickly radiate heat of more components needing heat radiation and arranged in space under the condition of not increasing the number of liquid cooling plates.

The embodiment of the utility model is realized by the following steps:

in a first aspect, the present invention provides a multilayer liquid cooling plate, comprising a heat dissipation substrate, an upper cover plate and a lower cover plate;

cooling grooves are formed in the two opposite sides of the heat dissipation substrate;

the upper cover plate and the lower cover plate are respectively arranged on two opposite sides of the heat dissipation substrate and are used for covering and sealing the cooling groove;

a medium input port and a medium output port are formed in the side wall of the heat dissipation substrate and are respectively communicated with different cooling grooves;

the heat dissipation substrate is provided with a communication hole which is used for communicating the two cooling grooves.

In an optional embodiment, at least one barrier strip is arranged in the cooling tank, and the barrier strip is used for forming a cooling flow channel in the cooling tank;

in the same cooling flow channel, the medium input port and the communicating hole are respectively arranged at two ends of the cooling flow channel, and the medium output port and the communicating hole are respectively arranged at two ends of the cooling flow channel.

In an alternative embodiment, a plurality of partition fins for partitioning the cooling flow channel into a plurality of cooling branch flows are provided in the cooling flow channel.

In an alternative embodiment, the partition fin is shaped as a flat plate or a wave plate.

In an alternative embodiment, a plurality of partition grooves for communicating adjacent two of the cooling branch streams are provided in the partition fin.

In an alternative embodiment, an end of the partition fin remote from the end of the cooling slot abuts the upper cover plate or the lower cover plate.

In an alternative embodiment, the separating fins in two of the cooling slots are staggered.

In an alternative embodiment, the number of the heat dissipation substrates is multiple, and the heat dissipation substrates are stacked;

in the plurality of radiating substrates, the medium input port and the medium output port are respectively arranged on the radiating substrate at the uppermost layer and the radiating substrate at the lowermost layer, and the medium input port and the medium output port are not arranged on the radiating substrate in the middle;

or, the heat dissipation substrate further comprises a blocking plate, and the blocking plate is used for blocking the medium input port and the medium output port which are arranged in the middle position on the heat dissipation substrate.

In an alternative embodiment, the connection mode between the upper cover plate and the heat dissipation substrate is vacuum brazing;

the lower cover plate and the heat dissipation substrate are connected in a vacuum brazing mode.

In a second aspect, the utility model also provides a heat sink comprising a multilayer liquid-cooled panel as described in any one of the above.

The embodiment of the utility model has the beneficial effects that:

after the cooling grooves are formed in the two sides of the heat dissipation substrate, double-sided heat dissipation of the liquid cooling plate is achieved, heat dissipation efficiency is greatly improved, the number of the liquid cooling plates does not need to be increased, and the size of the whole device does not need to be increased.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is an exploded view of a multilayer liquid-cooled panel provided by an embodiment of the present invention;

fig. 2 is a front view of a heat dissipating substrate of a multilayer liquid-cooled panel according to an embodiment of the present invention;

fig. 3 is a bottom view of a heat-dissipating substrate of a multilayer liquid-cooled plate according to an embodiment of the present invention;

FIG. 4 is a cross-sectional view A-A of FIG. 3;

FIG. 5 is a reference diagram illustrating a usage state of a multi-layer liquid cooling panel according to an embodiment of the present invention;

fig. 6-1 to 6-6 are simulated cloud charts of the multi-layer liquid cooling plate according to the embodiment of the utility model.

Icon: 1-upper cover plate; 2-a heat-dissipating substrate; 3-lower cover plate; 4-a media input port; 5-a media output port; 6-a communicating hole; 7-separating fins; 8-cooling the substream; 9-spacing grooves; 10-barrier strip; 11-a heat source.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the description refers must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Some embodiments of the utility model are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

In a first aspect, the present invention provides a multilayer liquid cooling plate, as shown in fig. 1 to 5, comprising a heat dissipation substrate 2, an upper cover plate 1 and a lower cover plate 3; cooling grooves are formed in the two opposite sides of the heat dissipation substrate 2; the upper cover plate 1 and the lower cover plate 3 are respectively arranged at two opposite sides of the heat dissipation substrate 2 and are used for covering and sealing the cooling tank; a medium input port 4 and a medium output port 5 are arranged on the side wall of the radiating substrate 2, and the medium input port 4 and the medium output port 5 are respectively communicated with different cooling grooves; the heat dissipation substrate 2 is provided with a communication hole 6, and the communication hole 6 is used for communicating the two cooling grooves.

The multilayer liquid cooling plate in this embodiment is divided into three parts, be upper cover plate 1, lower cover plate 3 and set up heat dissipation base plate 2 at the middle part respectively, wherein, the both sides of heat dissipation base plate 2 all are provided with the cooling bath, and upper cover plate 1 and lower cover plate 3 are used for covering the both sides cooling bath on heat dissipation base plate 2 respectively and seal for whole liquid cooling plate can only carry out the heat dissipation medium through medium input port 4 and medium output port 5 and be input and output.

In the present embodiment, the communication hole 6 is provided on the heat dissipation substrate 2, and the communication hole 6 communicates the cooling grooves on both sides of the heat dissipation substrate 2, so that the two cooling grooves are communicated as a cooling channel by the communication hole 6.

After being input into one cooling tank from the medium input port 4, the cooling medium enters into the other cooling tank through the communication hole 6 and is output through the medium output port 5, so that a cooling cycle of the multilayer liquid cooling plate is formed.

Due to the arrangement, the multilayer liquid cooling plate can be cooled on two sides, namely, the positions corresponding to the upper cover plate 1 and the lower cover plate 3 can be effectively cooled, and the overall cooling efficiency is improved.

When the part (i.e. the heat source 11) that needs to be cooled, the multilayer liquid cooling plate is arranged among the heat sources 11, namely, the heat sources 11 are arranged on the upper side surface and the lower side surface of the multilayer liquid cooling plate, so that the heat sources 11 on the two sides can be rapidly cooled, the cooling efficiency is accelerated, and the cooling effect is ensured.

In the present embodiment, the cooling medium may be a cooling liquid, an antifreeze, or water or another liquid cooling medium.

In the present embodiment, the communication hole 6 and the medium input port 4 are provided at opposite ends in the cooling bath, respectively, and the medium input port 4 and the medium output port 5 are provided at the same end of the heat-dissipating substrate 2.

In the present embodiment, the shapes, sizes, etc. of the medium input port 4 and the medium output port 5 may be set according to the parameters of the actual multilayer liquid cooling plate, and may be, but not limited to, directional holes, circular holes, etc.

In an alternative embodiment, at least one barrier strip 10 is arranged in the cooling tank, and the barrier strip 10 is used for forming a cooling flow channel in the cooling tank; in the same cooling flow channel, the medium input port 4 and the communicating hole 6 are respectively arranged at two ends of the cooling flow channel, and the medium output port 5 and the communicating hole 6 are respectively arranged at two ends of the cooling flow channel.

In this embodiment, the barrier strip 10 is a strip-shaped block structure, and one end of the barrier strip is connected to one sidewall of the cooling tank, so as to block the circulation of the cooling medium; and a gap is left between the other end of the cooling pipe and the opposite side wall in the cooling groove, so that the cooling medium can flow.

The barrier strip 10 is connected with the bottom of the cooling groove in a sealing mode, and is connected with the upper cover plate 1 or the lower cover plate 3 in a sealing mode, and normal circulation of a cooling flow channel formed through the barrier strip 10 can be avoided.

By the arrangement mode, the cooling flow channel can be formed in the cooling groove, the circulation time of the cooling medium in the cooling groove is prolonged, and the cooling effect is further ensured.

When the number of the barrier strips 10 is one, a reciprocating channel is formed in the cooling groove, and the medium input port 4, the communication hole 6 and the medium output port 5 are all arranged at the same end of the heat dissipation substrate 2.

As shown in fig. 2 and 3, the direction indicated by the arrow indicates the flow direction of the cooling medium.

After entering the cooling tank through the medium inlet 4, the cooling medium enters the cooling tank on the opposite side through the cooling flow channel and the communication hole 6, and then is output through the medium outlet 5 to form a cooling passage.

It should be noted that, when the number of the barrier strips 10 is plural, the barrier strips 10 are respectively disposed on two opposite sidewalls in the cooling groove and are staggered, so as to increase the length of the cooling flow channel.

In an alternative embodiment, a plurality of partition fins 7 are provided in the cooling flow channel, and the partition fins 7 are used to partition the cooling flow channel into a plurality of cooling tributaries 8.

When the number of the barrier strips 10 is small, the width of the whole cooling flow channel is large, and when the cooling medium flows, the flow area is large, so that the flow speed of the cooling medium is relatively low, and the heat exchange efficiency is reduced.

In this embodiment, after the partition fins 7 are provided in the cooling flow channel, the cooling flow channel is partitioned to form a plurality of cooling branches 8, so that the flow area is reduced, and the cooling efficiency is increased.

Meanwhile, in this embodiment, the partition fins 7 are heat-conducting media, and can conduct heat exchanged between the upper cover plate 1 or the lower cover plate 3 and the heat source 11, which is equivalent to increase the contact area between the heat-exchanging medium and the upper cover plate 1, increase the heat-exchanging effect, and accelerate the cooling efficiency.

In this embodiment, parallel arrangement between adjacent separating fin 7 can make 8 interior flow rates of cooling tributary even, avoids the velocity of flow fast hour slowly, has guaranteed cooling efficiency and heat transfer effect.

In the present embodiment, the pitch between any adjacent two of the partition fins 7 is the same.

Specifically, in the present embodiment, the interval between the partition fins 7 is 3.5mm, and the thickness of the partition fins 7 is 1.5 mm.

It should be noted that the parameters such as the distance and the thickness of the partition fins 7 can be set according to the parameters such as the thickness and the width of the actual multilayer liquid cooling plate.

In an alternative embodiment, the partition fin 7 is shaped as a flat plate or a wave plate.

In the present embodiment, the shape of the partition fin 7 is a wavy plate structure as shown in fig. 2 and 3.

When the partition fins 7 are provided as corrugated plates, the length of circulation of the cooling medium and the contact area with the upper deck 1 or the lower deck 3 can be increased.

It should be noted that the separating fin 7 may be provided in the form of a wave plate as shown in fig. 2 and 3, or in the form of a flat plate.

In an alternative embodiment, the partition fin 7 is provided with a plurality of spacing grooves 9, and the spacing grooves 9 are used for communicating two adjacent cooling branch flows 8.

After the separation grooves 9 are formed in the separation fins 7, interaction of the cooling branches 8 can be increased, heat exchange is more uniform and faster, and meanwhile, the heat exchange area of the cooling medium is also increased.

In the present embodiment, the partition grooves 9 are uniformly provided on the partition fin 7.

Specifically, in the present embodiment, the width of each of the spacing grooves 9 is 4mm, and the distance between two adjacent spacing grooves 9 is 46 mm.

It should be noted that the parameters such as the width of the spacing groove 9 and the distance between two spacing grooves 9 are not limited to the above parameters, and may be set according to the actual thickness, width, length, etc. of the multilayer liquid cooling plate.

In an alternative embodiment, the end of the separating fin 7 remote from the end of the cooling channel abuts the upper cover plate 1 or the lower cover plate 3.

In the present embodiment, the contact between the partition fin 7 and the upper cover plate 1 or the lower cover plate 3 increases the heat exchange area between the upper cover plate 1 or the lower cover plate 3 and the cooling medium.

In an alternative embodiment, the separating fins 7 in the two cooling channels are staggered.

Due to the arrangement, when heat exchange is carried out on the separating fins 7 in the two cooling grooves, heat of the heat source 11 can be transferred to the opposite cooling grooves, the heat exchange effect is improved, and the cooling efficiency is improved.

In the present invention, the heat dissipation substrates 2 may be arranged in multiple layers, and the multiple layers of heat dissipation substrates 2 are stacked and sequentially connected in series to form a longer cooling channel, so as to further improve the cooling effect.

When the number of the heat dissipation substrates 2 is plural, the arrangement manner thereof is at least the following two cases.

In the first case: in the plurality of radiating substrates 2, the medium input port 4 and the medium output port 5 are respectively arranged on the radiating substrate 2 at the uppermost layer and the lowermost layer, and the medium input port 4 and the medium output port 5 are not arranged on the radiating substrate 2 in the middle.

When the number of the heat dissipation substrates 2 is two, only one through hole communicated with the outside is arranged on each of the two heat dissipation substrates 2 to serve as a medium input port 4 or a medium output port 5, the two heat dissipation substrates 2, the upper cover plate 1 and the lower cover plate 3 form three cooling cavities, and the medium input port 4 and the medium output port 5 are respectively arranged in the cooling cavities of the uppermost layer and the lowermost layer.

When the number of the heat dissipation substrates 2 is three or more, the heat dissipation substrates 2 at the uppermost layer and the lowermost layer are respectively provided with the medium output port 5 and the medium output port 5, and the heat dissipation substrate 2 at the intermediate layer is not provided with the medium input port 4 and the medium output port 5, so that the sealing performance of the whole cooling flow channel is ensured.

In the second case: the structure of the heat dissipation substrate 2 is unchanged, and the heat dissipation substrate further comprises a plugging plate, wherein the plugging plate is used for plugging a medium input port 4 and a medium output port 5 which are arranged on the heat dissipation substrate 2 at the middle position.

That is to say, except leaving the medium output port 5 and the medium output port 5 at the two ends of the cooling flow channel, the other medium output ports 5 and the medium output ports 5 are all plugged by plugging plates, so that the sealing performance of the whole cooling flow channel is ensured.

In an alternative embodiment, the connection mode between the upper cover plate 1 and the heat dissipation substrate 2 is vacuum brazing; the connection mode between the lower cover plate 3 and the heat dissipation substrate 2 is vacuum brazing.

Through the mode of vacuum brazing, can guarantee the leakproofness between upper cover plate 1 and heat dissipation base plate 2, between lower cover plate 3 and the heat dissipation base plate 2.

It should be noted that, the connection mode between the upper cover plate 1 and the heat dissipation substrate 2 and the connection mode between the lower cover plate 3 and the heat dissipation substrate 2 may be vacuum brazing, but the connection mode is not limited to vacuum brazing, and may also be other fixed connection modes as long as the connection stability and the sealing performance can be ensured.

The heat exchange effect of the multilayer liquid cooling plate is explained through a specific certain direct-current boosting grid-connected module.

Performance requirements

At the ambient temperature of 40 ℃, the heat dissipation mode is water cooling, the temperature difference of inlet and outlet water is not more than 5 ℃, and the temperature rise requirement is as follows:

the main power device losses are shown in the following table:

serial number	Name (R)	Package with a metal layer	Heat loss (w) (Single)	Number of
					1	IGBT module (VT3)	Rectangular parallelepiped	500	1
2	RCD absorption resistor	Rectangular parallelepiped	26	1
					3	Coupling inductor	Rectangular parallelepiped	77	1
4	IGBT module (VT1-VT2)	Prim epack	600	2
					5	Output diode	Rectangular parallelepiped	170	4
6	Hollow inductor	Rectangular parallelepiped	24	1
					7	Output capacitor	Cylinder body		5	2

According to the situation, simulation is carried out, and the simulation conditions are as follows:

1. total heat loss 2517 w;

cold plate size: L285W 220H 20 mm;

2. ambient temperature: 40 ℃;

3. the water inlet temperature is as follows: 40 ℃;

4. cooling water flow rate: 0.6t/h is 0.6m ^ 3/h.

The simulation results are shown in fig. 6-1 to 6-6.

The following table is summarized according to the simulation results:

according to the simulation result, the temperature rise of each heat source meets the requirements of customers.

In a second aspect, the utility model also provides a heat sink comprising a multilayer liquid-cooled panel according to any one of the preceding claims.

By using the multilayer liquid cooling plate, the heat dissipation efficiency is improved under the condition that the volume of the heat sink is not changed.

The embodiment of the utility model has the beneficial effects that:

after the cooling grooves are formed in the two sides of the heat dissipation substrate 2, double-sided heat dissipation of the liquid cooling plate is achieved, heat dissipation efficiency is greatly improved, the number of the liquid cooling plates does not need to be increased, and the size of the whole device does not need to be increased.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A multilayer liquid cooling plate is characterized by comprising a heat dissipation substrate, an upper cover plate and a lower cover plate;

cooling grooves are formed in two opposite sides of the heat dissipation substrate;

2. The multilayer liquid-cooled plate of claim 1, wherein at least one barrier strip is disposed within the cooling channel, the barrier strip configured to form a cooling channel within the cooling channel;

3. The multilayer liquid-cooled plate of claim 2, wherein a plurality of partition fins are provided in the cooling flow channel for dividing the cooling flow channel into a plurality of cooling tributaries.

4. The multilayer liquid cooling panel as claimed in claim 3, wherein the partition fin is shaped as a flat plate or a wavy plate.

5. The multilayer liquid cooling plate according to claim 3, wherein a plurality of spacing grooves for communicating adjacent two of the cooling branch streams are provided on the partition fin.

6. The multilayer liquid cooling plate of claim 3, wherein an end of the partition fin distal from the end of the cooling slot abuts the upper cover plate or the lower cover plate.

7. The multilayer liquid cooling panel of claim 3 wherein said spacer fins in two of said cooling channels are staggered.

8. The multilayer liquid cooling panel of claim 1, wherein the number of heat-dissipating substrates is plural, and plural heat-dissipating substrates are stacked;

9. The multilayer liquid-cooled panel of claim 1, wherein the connection between the upper cover plate and the heat-dissipating substrate is vacuum brazing;

10. A heat sink comprising the multilayer liquid-cooled panel according to any one of claims 1 to 9.