CN216531976U

CN216531976U - High-precision laser etching device

Info

Publication number: CN216531976U
Application number: CN202123111210.2U
Authority: CN
Inventors: 林金明; 林静; 李春山
Original assignee: Wuxi Ruimake Technology Co ltd
Current assignee: Wuxi Ruimake Technology Co ltd
Priority date: 2021-12-13
Filing date: 2021-12-13
Publication date: 2022-05-13
Anticipated expiration: 2031-12-13

Abstract

The utility model relates to a fine circuit etching technology's field especially relates to a high accuracy laser etching device, which comprises a base, be equipped with tool seat and laser etching subassembly on the base, be connected with first slider guide rail and second slider guide rail on the base, X axial and Y axial setting are followed respectively to first slider guide rail and second slider guide rail, second slider guide rail is connected on the slider of first slider guide rail, the tool seat is located on the slider of second slider guide rail, be equipped with the lifting unit who is used for driving tool seat lift on the slider of second slider guide rail, be equipped with utmost point axle adjusting part on the slider of second slider guide rail. The application has the advantages that the PCB circuit boards of different specifications are met, and the etching precision and quality are improved.

Description

High-precision laser etching device

Technical Field

The utility model relates to the field of fine circuit etching technology, in particular to a high-precision laser etching device.

Background

The PCB is also called as a printed circuit board, is a provider of electrical connection of electronic components, and is mainly designed by a layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate.

When the existing laser etching device carries out laser processing on the PCB, the jig base is only limited to move on an X axis and a Y axis, so that the etching specification of the PCB is greatly limited, and the etching precision and quality are reduced.

SUMMERY OF THE UTILITY MODEL

In order to satisfy the PCB circuit board of different specifications, improve sculpture precision and quality, this application provides a high accuracy laser etching device.

The application provides a high accuracy laser etching device adopts following technical scheme:

the utility model provides a high accuracy laser etching device, includes the base, is equipped with tool seat and laser etching subassembly on the base, be connected with first slider guide rail and second slider guide rail on the base, X axial and Y axial setting are followed respectively to first slider guide rail and second slider guide rail, second slider guide rail is connected on the slider of first slider guide rail, the tool seat is located on the slider of second slider guide rail, be equipped with the lifting unit who is used for driving tool seat lift on the slider of second slider guide rail, be equipped with utmost point axle adjusting part on the slider of second slider guide rail.

Preferably, the lifting assembly comprises a mounting seat and a lifting electric cylinder, the lifting electric cylinder is arranged in the mounting seat, and the jig seat is rotatably connected to the end part of a piston rod of the lifting electric cylinder, which penetrates out of the mounting seat.

Preferably, the jig base is connected with a connecting plate, the connecting plate is connected with a limiting block, the side wall of the mounting base is connected with a guide block, and a guide groove for the guide block to be inserted in a sliding mode is formed in the limiting block.

Preferably, the polar axis adjusting assembly is a polar axis adjuster.

In summary, the present application includes the following beneficial technical effects:

1. according to the utility model, the first slider guide rail, the second slider guide rail, the lifting assembly and the polar axis adjusting assembly are arranged, and the first slider guide rail, the second slider guide rail, the lifting assembly and the polar axis adjusting assembly are used for controlling the positions of the jig base on the X axis, the Y axis, the Z axis and the theta axis respectively, so that the etching position is accurately controlled, thereby achieving the effects of meeting the PCB circuit boards with different specifications and improving the etching precision and quality.

Drawings

FIG. 1 is a schematic overall structure diagram of a high-precision laser etching apparatus in an embodiment of the present application;

fig. 2 is an enlarged view for embodying a in the embodiment of the present application.

Description of reference numerals: 1. a base; 2. a jig base; 21. a connecting plate; 211. a limiting block; 3. laser etching the component; 4. a first slider guide rail; 5. a second slider guide; 6. a lifting assembly; 61. a mounting seat; 611. a guide block; 62. a lifting electric cylinder; 7. a polar axis adjuster; 8. scalable dust cover.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

The embodiment of the application discloses a high-precision laser etching device. Referring to fig. 1 and 2, high accuracy laser etching device includes base 1, install tool seat 2 and laser etching subassembly 3 on the base 1, be connected with first slider guide rail 4 and second slider guide rail 5 on the base 1, X axial and Y axial setting are followed respectively to first slider guide rail 4 and second slider guide rail 5, second slider guide rail 5 is connected on first slider guide rail 4's slider, tool seat 2 is located second slider guide rail 5's slider, be equipped with lifting unit 6 on second slider guide rail 5's the slider, be equipped with utmost point axle adjusting part on second slider guide rail 5's the slider, wherein, all be connected with scalable dust cover 8 on first slider guide rail 4 and the second slider guide rail 5, be used for protecting the slider guide rail.

Referring to fig. 2, the lifting assembly 6 includes a mounting base 61 and a lifting electric cylinder 62, the mounting base 61 is connected to the slider of the second slider guide 5, the mounting base 61 is disposed along the slider perpendicular to the second slider guide 5, the lifting electric cylinder 62 is disposed in the mounting base 61, the jig base 2 is rotatably connected to the end of the lifting electric cylinder 62, which penetrates through the mounting base 61, and the jig base 2 is disposed in the direction parallel to the base 1.

Referring to fig. 2, be connected with connecting plate 21 on tool seat 2, connecting plate 21 sets up along the direction of perpendicular to tool seat 2, connecting plate 21 is located tool seat 2's lower surface, connecting plate 21 is equipped with two respectively relatively in the both sides of mount pad 61, be connected with stopper 211 on connecting plate 21, be connected with guide block 611 on the lateral wall of mount pad 61, guide block 611 is along the high setting of mount pad 61, set up on the stopper 211 and supply guide block 611 sliding insertion's guide way, tool seat 2 is at the lift in-process, the cooperation through guide block 611 and stopper 211 is favorable to improving tool seat 2 at the stability of removal in-process.

Referring to fig. 2, the polar axis adjustment assembly is a polar axis adjuster 7.

The implementation principle of the high-precision laser etching device in the embodiment of the application is as follows: when the device is used, a circuit board to be etched is placed on the jig base 2, the X-axis position of the circuit board is adjusted through the first slider guide rail 4, the X-axis position of the circuit board is adjusted through the second slider guide rail 5, the distance between the jig base 2 and the laser etching component 3 is adjusted through the lifting electric cylinder 62 to lift the jig base 2, the position of the jig base 2 is compensated through the polar axis adjuster 7, and finally the laser etching component 3 performs etching processing on the circuit board with the etching on the jig base 2.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a high accuracy laser etching device, includes base (1), is equipped with tool seat (2) and laser etching subassembly (3) on base (1), its characterized in that: be connected with first slider guide rail (4) and second slider guide rail (5) on base (1), X axial and Y axial setting are followed respectively in first slider guide rail (4) and second slider guide rail (5), second slider guide rail (5) are connected on the slider of first slider guide rail (4), tool seat (2) are located on the slider of second slider guide rail (5), be equipped with lifting unit (6) that are used for driving tool seat (2) to go up and down on the slider of second slider guide rail (5), be equipped with utmost point axle adjusting part on the slider of second slider guide rail (5).

2. A high-precision laser etching apparatus according to claim 1, characterized in that: the lifting assembly (6) comprises a mounting seat (61) and a lifting electric cylinder (62), the lifting electric cylinder (62) is arranged in the mounting seat (61), and the jig seat (2) is rotatably connected to the end part of a piston rod of the lifting electric cylinder (62) penetrating out of the mounting seat (61).

3. A high-precision laser etching apparatus according to claim 2, characterized in that: the jig is characterized in that a connecting plate (21) is connected onto the jig base (2), a limiting block (211) is connected onto the connecting plate (21), a guide block (611) is connected onto the side wall of the mounting base (61), and a guide groove for the guide block (611) to slide and insert is formed in the limiting block (211).

4. A high-precision laser etching apparatus according to claim 1, characterized in that: the polar axis adjusting component is a polar axis adjuster (7).