CN105578790A - Surface mounting machine - Google Patents

Surface mounting machine Download PDF

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Publication number
CN105578790A
CN105578790A CN201610055631.2A CN201610055631A CN105578790A CN 105578790 A CN105578790 A CN 105578790A CN 201610055631 A CN201610055631 A CN 201610055631A CN 105578790 A CN105578790 A CN 105578790A
Authority
CN
China
Prior art keywords
surface mounting
axis track
axis
frame
chip mounter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610055631.2A
Other languages
Chinese (zh)
Inventor
倪美香
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taicang Jinglin Machinery Technology Co Ltd
Original Assignee
Taicang Jinglin Machinery Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taicang Jinglin Machinery Technology Co Ltd filed Critical Taicang Jinglin Machinery Technology Co Ltd
Priority to CN201610055631.2A priority Critical patent/CN105578790A/en
Publication of CN105578790A publication Critical patent/CN105578790A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Abstract

The invention discloses a surface mounting machine. The surface mounting machine comprises a rack, a surface mounting mechanism and a transmission mechanism, wherein the transmission mechanism comprises X-Y axis servo positioning mechanisms, an X-axis rail and Y-axis rails, the Y-axis rails are arranged on the two sides of the rack, the X-axis rail is in cross connection with the Y-axis rails by the X-Y axis servo positioning mechanisms clamped on the Y-axis rails, the surface mounting mechanism is clamped on the X-axis rail, a movable clamping plate and a fixed clamping plate are arranged at the bottom of the rack, an engagement device is arranged inside a machine body and comprises fixing blocks, a linkage shaft, gears and tooth bars, the fixing blocks are welded and connected to the two ends of the movable clamping plate and are in penetrated connection by the linkage shaft, the gears fixed at the two ends of the linkage shaft by bearings are engaged with the tooth bars fixedly arranged at the bottom of the rack, and a shaking arm is arranged at one end of the linkage shaft. In the surface mounting machine, the engagement device adopts a physical method of gear rolling to control the distance between the two clamping plates, the surface mounting machine has the advantages of energy saving and environmental friendliness, is simple to use and convenient to maintain and is suitably used for surface mounting of printed boards of various specifications, the distance control accuracy is improved, and the investment of the production cost is greatly reduced.

Description

A kind of chip mounter
Technical field
The present invention relates to surface mount machinery field, be specially a kind of chip mounter.
Technical background
Surface mounting technology is most popular a kind of technology and technique in current Electronic Assemblies industry.It a kind ofly will be arranged on the surface of printed circuit board or the surface of other substrates without pin or short leg surface-assembled components and parts, again by the circuit interconnection technique of the method such as Reflow Soldering or immersed solder in addition welding assembly, chip mounter realizes high speed, the high-precision equipment being placed with components and parts, after it is configured in point gum machine or screen process press, by mobile mounting head, Surface Mount Component, is placed on printed circuit board pad accurately.Due to the difference of circuit, the size dimension of printed circuit board also can be different, and the configuration of the chip mounter of many sizes or model is produced to enterprise and brought certain financial burden, adds cost and drops into.
For solving the problem, spy provides a kind of new technical scheme.
Summary of the invention
The object of this invention is to provide that a kind of structure is simple, the adjustable chip mounter laying arbitrary dimension circuit board of processing ease.
The present invention is achieved through the following technical solutions:
A kind of chip mounter, comprise frame, plaster mechanism, connecting gear, described connecting gear comprises X-Y axle servo-positioning mechanism, X-axis track and Y-axis track, frame both sides are located at by described Y-axis track, described X-axis track is by being fastened on the X-Y axle servo-positioning mechanism commissure Y-axis track on Y-axis track, described plaster mechanism is arranged on X-axis track, movable clamp and fixing chuck plate is provided with bottom described frame, described internal body is provided with geared assembly, described geared assembly comprises fixed block, couple axle, gear and tooth bar, described state determines the soldered two ends at movable clamp of block, described fixed block is worn by couple axle and is connected, the gears meshing being fixed on couple axle two ends by bearing is installed in the tooth bar bottom frame, described couple axle one end is provided with swing arm.
Further, the frame surface position corresponding to described tooth bar and lateral location are provided with rolling groove.
Further, described plaster mechanism comprises suction nozzle, whirligig and lowering or hoisting gear.
Further, described plaster mechanism is provided with camera head.
Further, feeder channel is provided with between described fixing chuck plate and frame.
The invention has the beneficial effects as follows: the physical method of the geared assembly employing spur roller gear of this chip mounter controls the distance between two clamps, energy-conserving and environment-protective, use simple, easy to maintenance, improve the accuracy of distance controlling, be applicable to the paster of many specifications printed board, greatly reduce the input of production cost.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of geared assembly in Fig. 1.
Wherein: 1, frame, 2, Y-axis track, 3, X-Y axle servo-positioning mechanism, 4, X-axis track, 5, camera head, 6, plaster mechanism, 7, printed circuit board, 8, movable clamp, 9, fixing chuck plate, 10, feeder channel, 11, couple axle, 12, tooth bar, 13, rolling groove, 14, bearing, 15, suction nozzle, 16, whirligig, 17, lowering or hoisting gear, 18, fixed block, 19, gear, 20, swing arm.
Embodiment
As shown in Fig. 1 ~ 2, a kind of chip mounter, comprise frame 1, plaster mechanism 6, connecting gear, connecting gear comprises X-Y axle servo-positioning mechanism 3, X-axis track 4 and Y-axis track 2, frame 1 both sides are located at by Y-axis track 2, X-axis track 4 is by being fastened on the X-Y axle servo-positioning mechanism 3 commissure Y-axis track 2 on Y-axis track 2, plaster mechanism 6 is arranged on X-axis track 4, plaster mechanism 6 comprises suction nozzle 15, be connected with suction nozzle 15 and the whirligig 16 that suction nozzle 15 can be made to rotate and the lowering or hoisting gear 17 that suction nozzle 15 and whirligig 16 be elevated can be controlled, any movement of suction nozzle 15 in frame 1 can be realized, the absorption completing components and parts and the operation of accurately placing on a printed circuit board, plaster mechanism 6 is provided with camera head 5, the error of components and parts and datum mark can be located more accurately, movable clamp 8 and fixing chuck plate 9 is provided with bottom frame 1, feeder channel 10 is provided with between fixing chuck plate 9 and frame 1, feeder channel 10 supports the sequence to components and parts, location, body 1 inside is provided with geared assembly, geared assembly comprises fixed block 18, couple axle 11, gear 19 and tooth bar 12, the soldered two ends at movable clamp 8 of fixed block 18, fixed block 18 is by couple axle 11 company of wearing, the gear 19 being fixed on couple axle 11 two ends by bearing 14 engages the tooth bar 12 be installed in bottom frame 1, couple axle 11 one end is provided with swing arm 20, frame 1 surface location corresponding to tooth bar 12 and lateral location are provided with rolling groove 13, facilitate moving forward of movable clamp 8 and swing arm 20.The physical method of geared assembly employing gear 19 rolling of this chip mounter controls the distance between two clamps, and energy-conserving and environment-protective, use simple, easy to maintenance, improve the accuracy of distance controlling, be applicable to the paster of many specifications printed board, greatly reduce the input of production cost.

Claims (5)

1. a chip mounter, comprise frame, plaster mechanism, connecting gear, described connecting gear comprises X-Y axle servo-positioning mechanism, X-axis track and Y-axis track, frame both sides are located at by described Y-axis track, described X-axis track is by being fastened on the X-Y axle servo-positioning mechanism commissure Y-axis track on Y-axis track, described plaster mechanism is arranged on X-axis track, it is characterized in that: bottom described frame, be provided with movable clamp and fixing chuck plate, described internal body is provided with geared assembly, described geared assembly comprises fixed block, couple axle, gear and tooth bar, described state determines the soldered two ends at movable clamp of block, described fixed block is worn by couple axle and is connected, the gears meshing being fixed on couple axle two ends by bearing is installed in the tooth bar bottom frame, described couple axle one end is provided with swing arm.
2. a kind of chip mounter according to claim 1, is characterized in that: the frame surface position corresponding to described tooth bar and lateral location are provided with rolling groove.
3. a kind of chip mounter according to claim 1, is characterized in that: described plaster mechanism comprises suction nozzle, whirligig and lowering or hoisting gear.
4. a kind of chip mounter according to claim 1, is characterized in that: described plaster mechanism is provided with camera head.
5. a kind of chip mounter according to claim 1, is characterized in that: be provided with feeder channel between described fixing chuck plate and frame.
CN201610055631.2A 2016-01-27 2016-01-27 Surface mounting machine Pending CN105578790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610055631.2A CN105578790A (en) 2016-01-27 2016-01-27 Surface mounting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610055631.2A CN105578790A (en) 2016-01-27 2016-01-27 Surface mounting machine

Publications (1)

Publication Number Publication Date
CN105578790A true CN105578790A (en) 2016-05-11

Family

ID=55888292

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610055631.2A Pending CN105578790A (en) 2016-01-27 2016-01-27 Surface mounting machine

Country Status (1)

Country Link
CN (1) CN105578790A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106413376A (en) * 2016-08-02 2017-02-15 太仓市伦文机械有限公司 Placement machine
CN113347870A (en) * 2021-06-02 2021-09-03 安徽德浦照明科技有限公司 LED chip mounter feeding agencies

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2141969A1 (en) * 2008-07-04 2010-01-06 Thales Nederland B.V. A method for making a three-dimensional multi-layered interconnect device
CN104202915A (en) * 2014-08-18 2014-12-10 苏州克兰兹电子科技有限公司 Chip mounter delivery mechanism allowing delivery of multi-size PCBs (Printed Circuit Board)
CN104202911A (en) * 2014-08-18 2014-12-10 苏州克兰兹电子科技有限公司 Chip mounting machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2141969A1 (en) * 2008-07-04 2010-01-06 Thales Nederland B.V. A method for making a three-dimensional multi-layered interconnect device
CN104202915A (en) * 2014-08-18 2014-12-10 苏州克兰兹电子科技有限公司 Chip mounter delivery mechanism allowing delivery of multi-size PCBs (Printed Circuit Board)
CN104202911A (en) * 2014-08-18 2014-12-10 苏州克兰兹电子科技有限公司 Chip mounting machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106413376A (en) * 2016-08-02 2017-02-15 太仓市伦文机械有限公司 Placement machine
CN113347870A (en) * 2021-06-02 2021-09-03 安徽德浦照明科技有限公司 LED chip mounter feeding agencies
CN113347870B (en) * 2021-06-02 2022-04-22 安徽德浦照明科技有限公司 LED chip mounter feeding agencies

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20160511

RJ01 Rejection of invention patent application after publication