CN104202911A - Chip mounting machine - Google Patents

Chip mounting machine Download PDF

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Publication number
CN104202911A
CN104202911A CN201410405903.8A CN201410405903A CN104202911A CN 104202911 A CN104202911 A CN 104202911A CN 201410405903 A CN201410405903 A CN 201410405903A CN 104202911 A CN104202911 A CN 104202911A
Authority
CN
China
Prior art keywords
chip mounting
suction nozzle
pcb
gear
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410405903.8A
Other languages
Chinese (zh)
Inventor
王福来
江长河
朱操超
毛利强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU KELANCI ELECTRONIC SCIENCE & TECHNOLOGY Co Ltd
Original Assignee
SUZHOU KELANCI ELECTRONIC SCIENCE & TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU KELANCI ELECTRONIC SCIENCE & TECHNOLOGY Co Ltd filed Critical SUZHOU KELANCI ELECTRONIC SCIENCE & TECHNOLOGY Co Ltd
Priority to CN201410405903.8A priority Critical patent/CN104202911A/en
Publication of CN104202911A publication Critical patent/CN104202911A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a chip mounting machine. The chip mounting machine comprises a frame (10), a chip mounting mechanism (20), a PCB (printed circuit board) conveying mechanism (30), a feeding mechanism (40) and a camera (50) mounted on the chip mounting mechanism (20), wherein the chip mounting mechanism (20) is arranged above the PCB conveying mechanism (30) and comprises an X-Y-axis servo positioning mechanism (21), and the feeding mechanism (40) is arranged beside the PCB conveying mechanism (30). Every printed circuit board to be mounted with a chip is provided with at least one reference point, the camera mounted on the chip mounting mechanism is used for shooting an image of the reference point and sending the image to a computer for analysis and processing, the computer calculates an error between a sheet-like component and the reference point and feeds back the processing result to a motion control system, and the motion control system adjusts the position of the chip mounting mechanism through the X-Y-axis servo positioning mechanism, so that the sheet-like component can be accurately mounted to the printed circuit board. Therefore, the mounting accuracy of the chip mounting machine is improved.

Description

A kind of chip mounter
Technical field:
The present invention relates to surface mounting technology, in particular to a kind of chip mounter.
Background technology:
Surface mounting technology (English full name Surface Mount Technology is called for short SMT) is most popular a kind of technology and technique in current Electronic Assemblies industry.It is that one will be without pin or short leg surface-assembled components and parts (the English SMC/SMD of abbreviation, Chinese claims sheet components and parts) be arranged on printed circuit board (English full name Printed Circuit Board, be called for short PCB) surface or the surface of other substrate on, then by the in addition circuit load technology of welding assembly of the method such as Reflow Soldering or immersed solder.
Chip mounter is the equipment for realizing at a high speed, be placed with accurately SMD components, after it is configured in point gum machine or screen process press, by mobile mounting head, Surface Mount Component, is placed on PCB pad exactly.Chip mounter is in whole SMT production equipment, to be worth that proportion maximum, technology content are the highest, electronic manufacturing equipment to whole assembling production capacity and effectiveness affects maximum.
Nowadays,, as premier global electronic information products manufacture base, many electronic and electrical equipment output of domestic product have occupied first, the whole world.Be accompanied by this manufacturing tide, SMT technology is used widely in the products such as Chinese computer, network service, consumer electronics and automotive electronics, and the SMT industry of China is just welcoming the gold period in developing history.
But the SMT equipment development level of China need to improve, at present, except producing screen printer, welding and the cleaning equipment of certain level, can't manufacture high-performance picking machine system equipment.Along with the development in epoch, China constantly expands in this SMT technical elements and the gap on external, and therefore, research and development have the chip mounter of China's independent intellectual property right, and development and even the national development strategy of the electronics and information industry to China are all significant.
Application number 201110378524.0, the patent application in November 24 2011 applying date discloses a kind of easy chip mounter, include cabinet, cabinet is provided with Y-axis transmission mechanism, Y-axis transmission mechanism is provided with X-axis transmission mechanism, X-axis transmission mechanism is provided with placement head, cabinet, one side of Y-axis transmission mechanism is provided with loader, cabinet is also connected with operating platform, operating platform is provided with LCDs, action button and mains switch, drive the movement of placement head by X-Y axle interlock motion, in the time of work, placement head moves around between feed appliance and pcb board, element is taken out from feed appliance, through the adjustment to position of components and direction, realize the work that automatically mounts.Although this patent application has the advantages that to save labour turnover, but, described in this patent application, when work, element is taken out from feed appliance, through the adjustment to position of components and direction, realize and automatically mount work, and how the adjustment of position of components and direction realizes, this patent application does not disclose correlative detail, can learn from the information that this patent application is disclosed, the adjustment of position of components and direction only can drive placement head to realize by X-Y axle interlock motion.But surface mounting technology is a very meticulous job, if only drive placement head to realize the adjustment of position of components and direction by X-Y axle interlock motion, so, the precision mounting will be difficult to be improved.
Summary of the invention:
Technical problem solved by the invention: prior art only drives placement head to realize the adjustment of position of components and direction by X-Y axle interlock motion, will be difficult to improve the precision mounting.
The invention provides following technical scheme: a kind of chip mounter, comprise frame, rack-mounted plaster mechanism, rack-mounted PCB connecting gear, rack-mounted feeding machanism, described plaster mechanism is positioned at the top of PCB connecting gear, described feeding machanism is positioned at PCB connecting gear side, described plaster mechanism comprises X-Y axle servo-positioning mechanism, described chip mounter also comprises the camera head being arranged on plaster mechanism, and described camera head is for monitoring the position of PCB.
By technique scheme, PCB connecting gear is used for transmitting printed circuit board (PCB), and printed circuit board is resided in to plaster mechanism below temporarily, and plaster mechanism is attached to sheet components and parts on the corresponding position of printed circuit board, and feeding machanism is supplied with sheet components and parts to plaster mechanism.
Treat to have a datum mark at least on the printed circuit board of paster at each piece, be arranged on the image of the camera head shooting datum mark on plaster mechanism, send to Computer Analysis processing, Computer calculates the error of sheet components and parts and datum mark, and result is fed back to kinetic control system, kinetic control system, by the position of X-Y axle servo-positioning institutional adjustment plaster mechanism, is attached on printed circuit board sheet components and parts exactly, has improved the placement accuracy of chip mounter.
As a further improvement on the present invention, described plaster mechanism also comprises placement head mechanism, described X-Y axle servo-positioning mechanism comprises X-axis guide rail, Y-axis guide rail, described placement head mechanism is arranged on Y-axis guide rail, can move along Y-axis guide rail direction, and Y-axis guide rail can move along X-axis guide rail direction simultaneously, in the coordinate system that placement head mechanism just can form at X-Y axle like this, move arbitrarily, realize the location of sheet components and parts.Described X-Y axle servo-positioning mechanism adopts brshless DC motor as carrying out components and parts, feedback device adopts grating scale, GT-400-SV type motion control card (the solid High Seience Technology Co., Ltd. in Shenzhen produces) is as control unit, these composition position feedback closed-loop control systems, have realized higher positioning precision and locating speed faster.
As a further improvement on the present invention, described placement head mechanism comprise suction nozzle, be connected with suction nozzle and can make suction nozzle rotation whirligig, can make the lowering or hoisting gear of described suction nozzle and whirligig lifting.Wherein, described whirligig comprises the motor being connected with suction nozzle by machine shaft, and described lowering or hoisting gear comprises motor, is arranged on the gear on machine shaft, the tooth bar engaging with gear, and described tooth bar is perpendicular to machine shaft.Lowering or hoisting gear is converted into rotatablely moving of motor the rectilinear motion of vertical direction, and the motor in whirligig acts directly on suction nozzle and rotatablely moves to realize it.
Brief description of the drawings:
Below in conjunction with accompanying drawing, the present invention is described further:
Fig. 1 is the structural representation of a kind of chip mounter of the present invention;
Fig. 2 is the structural representation of the lowering or hoisting gear in Tu1Zhong placement head mechanism;
Fig. 3 is the structural representation of the whirligig in Tu1Zhong placement head mechanism.
Symbol description in figure:
10-frame;
20-plaster mechanism; 21-X-Y axle servo-positioning mechanism; 211-X axis rail; 212-Y axis rail; 22-placement head mechanism; 221-suction nozzle; 222-motor; 223-motor; 224-gear; 225-tooth bar;
30-PCB connecting gear;
40-feeding machanism;
50-camera head;
90-printed circuit board.
Embodiment:
As shown in Figure 1, a kind of chip mounter, comprises frame 10, is arranged on plaster mechanism 20 in frame 10, is arranged on PCB connecting gear 30 in frame 10, is arranged on feeding machanism 40 in frame 10, is arranged on the camera head 50 on plaster mechanism 20.
As shown in Figure 1, described plaster mechanism 20 is positioned at the top of PCB connecting gear 30, described plaster mechanism 20 comprises X-Y axle servo-positioning mechanism 21, placement head mechanism 22, described X-Y axle servo-positioning mechanism 21 comprises X-axis guide rail 211, Y-axis guide rail 212, and described placement head mechanism 22 is arranged on Y-axis guide rail 212.As shown in Figure 3, described placement head mechanism 22 comprises suction nozzle 221, is connected with suction nozzle 221 and can makes motor 222 that suction nozzle 221 rotates, can make the lowering or hoisting gear of described suction nozzle 221 and whirligig lifting.Wherein, as shown in Figure 2, described lowering or hoisting gear comprises motor 223, is arranged on the gear 224 on machine shaft, the tooth bar 225 engaging with gear 224, and described tooth bar 225 is perpendicular to machine shaft.
As shown in Figure 1, described PCB connecting gear 30 is for transmitting and locating printed circuit board 90.
As shown in Figure 1, described feeding machanism 40 is positioned at PCB connecting gear 30 sides.
In practical operation, treat at each piece, on the printed circuit board 90 of paster, a datum mark is at least set.PCB connecting gear 30 transmits printed circuit board 90 and resides in temporarily placement head mechanism 22 belows, the i.e. below of suction nozzle 221.As shown in Figure 1, be arranged on camera head 50 in placement head mechanism 22 and take the image of datum mark, send to Computer Analysis processing, Computer calculates the error of sheet components and parts and datum mark, and result is fed back to kinetic control system, kinetic control system is adjusted the position of placement head mechanism 22 by X-Y axle servo-positioning mechanism 21, sheet components and parts are attached on the corresponding position of printed circuit board 90 exactly, and feeding machanism 40 is supplied with sheet components and parts to placement head mechanism 22.
Above content is only preferred embodiments of the present invention, for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, and this description should not be construed as limitation of the present invention.

Claims (4)

1. a chip mounter, comprise frame (10), be arranged on the plaster mechanism (20) in frame (10), be arranged on the PCB connecting gear (30) in frame (10), be arranged on the feeding machanism (40) in frame (10), described plaster mechanism (20) is positioned at the top of PCB connecting gear (30), described feeding machanism (40) is positioned at PCB connecting gear (30) side, described plaster mechanism (20) comprises X-Y axle servo-positioning mechanism (21), it is characterized in that: also comprise the camera head (50) being arranged on plaster mechanism (20), described camera head (50) is for monitoring the position of PCB.
2. a kind of chip mounter as claimed in claim 1, it is characterized in that: described plaster mechanism (20) also comprises placement head mechanism (22), described X-Y axle servo-positioning mechanism (21) comprises X-axis guide rail (211), Y-axis guide rail (212), and described placement head mechanism (22) is arranged on Y-axis guide rail (212).
3. a kind of chip mounter as claimed in claim 2, is characterized in that: described placement head mechanism (22) comprises suction nozzle (221), is connected the whirligig that also can make suction nozzle (221) rotation, the lowering or hoisting gear that can make described suction nozzle (221) and whirligig lifting with suction nozzle (221).
4. a kind of chip mounter as claimed in claim 3, it is characterized in that: described whirligig comprises the motor (222) being connected with suction nozzle (221) by machine shaft, described lowering or hoisting gear comprises motor (223), is arranged on the gear (224) on machine shaft, the tooth bar (225) engaging with gear (224), and described tooth bar (225) is perpendicular to machine shaft.
CN201410405903.8A 2014-08-18 2014-08-18 Chip mounting machine Pending CN104202911A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410405903.8A CN104202911A (en) 2014-08-18 2014-08-18 Chip mounting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410405903.8A CN104202911A (en) 2014-08-18 2014-08-18 Chip mounting machine

Publications (1)

Publication Number Publication Date
CN104202911A true CN104202911A (en) 2014-12-10

Family

ID=52088114

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410405903.8A Pending CN104202911A (en) 2014-08-18 2014-08-18 Chip mounting machine

Country Status (1)

Country Link
CN (1) CN104202911A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105578790A (en) * 2016-01-27 2016-05-11 太仓井林机械科技有限公司 Surface mounting machine
CN105578789A (en) * 2016-01-27 2016-05-11 太仓井林机械科技有限公司 Pick-and-place machine
CN114071987A (en) * 2020-07-29 2022-02-18 北大方正集团有限公司 SMT chip mounter, copper embedding method, device and medium

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236598A (en) * 1988-07-27 1990-02-06 Matsushita Electric Ind Co Ltd Packaging of electronic component
CN2867813Y (en) * 2006-01-11 2007-02-07 广东风华高新科技股份有限公司 Swing-type electronic element paster
CN201869518U (en) * 2010-12-01 2011-06-15 宁波市新泽谷机械有限公司 Plug-in head lifting mechanism of horizontal type plug-in machine
CN102194927A (en) * 2010-03-04 2011-09-21 杭州中为光电技术有限公司 Light-emitting diode (LED) fluorescent lamp chip mounter
CN204191030U (en) * 2014-08-18 2015-03-04 苏州克兰兹电子科技有限公司 A kind of chip mounter

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236598A (en) * 1988-07-27 1990-02-06 Matsushita Electric Ind Co Ltd Packaging of electronic component
CN2867813Y (en) * 2006-01-11 2007-02-07 广东风华高新科技股份有限公司 Swing-type electronic element paster
CN102194927A (en) * 2010-03-04 2011-09-21 杭州中为光电技术有限公司 Light-emitting diode (LED) fluorescent lamp chip mounter
CN201869518U (en) * 2010-12-01 2011-06-15 宁波市新泽谷机械有限公司 Plug-in head lifting mechanism of horizontal type plug-in machine
CN204191030U (en) * 2014-08-18 2015-03-04 苏州克兰兹电子科技有限公司 A kind of chip mounter

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105578790A (en) * 2016-01-27 2016-05-11 太仓井林机械科技有限公司 Surface mounting machine
CN105578789A (en) * 2016-01-27 2016-05-11 太仓井林机械科技有限公司 Pick-and-place machine
CN114071987A (en) * 2020-07-29 2022-02-18 北大方正集团有限公司 SMT chip mounter, copper embedding method, device and medium

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Application publication date: 20141210

RJ01 Rejection of invention patent application after publication