CN216528941U

CN216528941U - LED lamp bead, LED lamp strip and LED display module

Info

Publication number: CN216528941U
Application number: CN202220023883.8U
Authority: CN
Inventors: 卢鹏; 王金鑫; 姜攀; 胡华东
Original assignee: Jiangxi Zhaochi Photoelectric Co ltd
Current assignee: Jiangxi Zhaochi Photoelectric Co ltd
Priority date: 2022-01-05
Filing date: 2022-01-05
Publication date: 2022-05-13
Anticipated expiration: 2032-01-05

Abstract

The utility model provides an LED lamp bead, a preparation method of the LED lamp bead, an LED lamp bar and an LED display module, wherein the LED lamp bead comprises an LED support, the LED support is made of conductive materials, the surface of the LED support is electrically connected with an IC module, the top of the LED support is annularly paved with an insulating layer, the insulating layer covers the IC module, the middle part of the insulating layer surrounds a solid crystal area, the IC module and the solid crystal area are arranged at intervals, an LED chip is arranged in the solid crystal area, and the LED chip is electrically connected with the LED support. The application provides a LED lamp pearl can be effectual separately set up IC module and LED chip, meanwhile, can also be in the same place both effectual electric connection to further promoted the space utilization in solid crystalline region, increased the IC module that has the heat dissipation function simultaneously, for the LED chip provides protection device, effectively strengthen LED chip radiating effect, improve LED chip overtemperature prote and safe durable performance.

Description

LED lamp bead, LED lamp strip and LED display module

Technical Field

The utility model relates to the technical field of LEDs, in particular to an LED lamp bead, an LED lamp bar and an LED display module.

Background

An LED, also called a light emitting diode, is a commonly used light emitting device, emits light by energy released by recombination of electrons and holes, and is widely used in the field of illumination.

Among the current LED, LED chip and IC module are its important component, and wherein, the LED chip is used for converting electric energy into light energy for launch light, and the life-span of LED chip is directly relevant with LED's life, and the IC module is used for dispelling the heat for the LED chip, in order to provide the excess temperature protection of LED chip and promote safe durable performance.

In the existing LED production process, most manufacturers fix the IC module and the LED chip in the same die bonding area, and the installation space of the die bonding area is limited, and the IC module can occupy a certain space, so that the size of the LED chip can be limited, the space utilization rate of the die bonding area is reduced, the heat dissipation effect of the LED chip is influenced, and the service life of the LED chip is further influenced.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model aims to provide an LED lamp bead, an LED lamp strip and an LED display module, so as to solve the problems that in the prior art, an IC module and an LED chip are fixed in the same die bonding area, the size of the LED chip is limited due to the limited installation space of the die bonding area and the IC module occupies a certain space, the space utilization rate of the die bonding area is reduced, the heat dissipation effect of the LED chip is influenced, and the service life of the LED chip is influenced.

The first aspect of the embodiment of the utility model provides an LED lamp bead, which comprises an LED support, wherein the LED support is made of a conductive material, the surface of the LED support is electrically connected with an IC module, an insulating layer is annularly paved on the top of the LED support, the insulating layer covers the IC module, the middle of the insulating layer surrounds a solid crystal area, the IC module and the solid crystal area are arranged at intervals, an LED chip is arranged in the solid crystal area, and the LED chip is electrically connected with the LED support.

The beneficial effects of the utility model are: through the surperficial electric connection IC module at the LED support, further, lay one deck insulating layer at the top ring-type of LED support, it is concrete, this insulating layer can cover above-mentioned IC module, and encloses into a solid brilliant district at the middle part of insulating layer, during the use, gu brilliant LED chip in this solid brilliant district to when can be effectual separately setting up IC module and LED chip, with both electric connection together. The utility model provides a LED lamp pearl can be effectual separately set up IC module and LED chip, meanwhile, can also be in the same place effectual electric connection between them to further promoted the space utilization in solid crystal region, promoted the life of LED chip and the product yield of LED lamp pearl simultaneously, be favorable to large-scale production and use.

Preferably, the thickness of the LED chip is smaller than the height of the insulating layer.

Preferably, the IC module is soldered on the LED support.

Preferably, the LED chip is soldered in the die attach region.

Preferably, the insulating layer is formed by laying epoxy resin.

Preferably, the LED support is made of a copper sheet.

The second aspect of the embodiment of the utility model provides an LED lamp bar, which comprises the LED lamp bead.

The third aspect of the embodiment of the utility model provides an LED display module, which includes the above LED light bar.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

Fig. 1 is a schematic structural diagram of an LED lamp bead according to a first embodiment of the present invention;

fig. 2 is a cross-sectional view of an LED lamp bead provided in the first embodiment of the present invention.

Description of the main element symbols:

LED support	10	IC module	20
				Insulating layer	30	Solid crystal region	40
LED chip	50

The following detailed description will further illustrate the utility model in conjunction with the above-described figures.

Detailed Description

To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Several embodiments of the utility model are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the current LED production process, most manufacturers fix the IC module and the LED chip in the same solid crystal area, because the installation space of the solid crystal area is limited, and the IC module can occupy a certain space, thereby limiting the size of the LED chip, reducing the space utilization rate of the solid crystal area, simultaneously influencing the heat dissipation effect of the LED chip and further influencing the service life of the LED chip.

In view of the above, referring to fig. 1 to 2, the LED lamp bead provided in the first embodiment of the present invention is shown, and the LED lamp bead provided in this embodiment can effectively separate the IC module from the LED chip, and at the same time, can effectively electrically connect the IC module and the LED chip together, so as to further improve the space utilization rate of the die attach area, and simultaneously improve the service life of the LED chip and the product yield of the LED lamp bead, which is beneficial to large-scale production and use.

Specifically, the LED lamp pearl that this embodiment provided includes LED support 10, LED support 10 adopts conducting material to make, the surperficial electric connection of LED support 10 has IC module 20, an insulating layer 30 has been laid to LED support 10's top annular, insulating layer 30 covers IC module 20, and the middle part of insulating layer 30 encloses into a solid crystalline region 40, IC module 20 sets up with solid crystalline region 40 interval, be equipped with LED chip 50 in the solid crystalline region 40, LED chip 50 and LED support 10 electric connection.

It should be noted that, the LED chip 50 is also referred to as an LED light emitting chip, is a solid semiconductor device, and is a core component of an LED lamp, and its main functions are: the electric energy is converted into light energy, so that light can be emitted. The IC module 20 is also called an IC chip, and an integrated circuit formed by a large number of microelectronic devices (transistors, resistors, capacitors, etc.) is placed on a plastic substrate to form a chip. In the actual use process, the IC module 20 has a heat dissipation function, and serves as a protection device for the LED chip 50, so as to effectively enhance the heat dissipation effect of the LED chip, and provide over-temperature protection and safety and durability of the LED chip 50.

Further, as shown in fig. 1 to fig. 2, in this embodiment, in order to avoid the LED chip 50 and the IC module 20 being mounted in the same area, in this embodiment, the IC module 20 is first electrically connected to the outer surface of the LED support 10, preferably, in this embodiment, the IC module 20 is directly soldered to the upper surface of the LED support 10, and in other cases, the IC module 20 and the LED support 10 can also be electrically connected together through a wire, which is within the protection scope of this embodiment.

Furthermore, in this embodiment, for convenience of implementation, it is preferable that the LED support 10 is made of a copper sheet, and for further improving the conductive efficiency, the LED support 10 may be made of pure copper. In the present embodiment, after the IC module 20 is soldered to the surface of the LED support 10, the insulating layer 30 is preferably formed by laying an epoxy resin on the surface of the LED support 10 to which the IC module 20 is soldered, wherein the epoxy resin has good insulating property and good viscosity.

As shown in fig. 1 and fig. 2, in the process of laying the insulating layer 30, in the embodiment, the insulating layer 30 is annularly laid on the surface edge of the LED support 10, and the insulating layer 30 covers the IC module 20, so that a certain protection can be provided for the IC module 20. In addition, in the embodiment, an annular die attach region 40 is reserved in the middle of the insulating layer 30, and in specific implementation, as shown in fig. 1, the LED chip 50 is welded in the die attach region 40, and the thickness of the LED chip 50 is smaller than the height of the insulating layer 30, so that the LED chip 50 can be protected to a certain extent, wherein the LED chip 50 is a front-mounted chip or a flip chip.

In specific implementation, the IC module 20 is electrically connected to the surface of the LED support 10, and further, an insulating layer 30 is annularly laid on the top of the LED support 10, specifically, the insulating layer 30 can cover the IC module 20, and the middle of the insulating layer 30 surrounds a die bonding area 40, and when in use, the LED chip 50 is die bonded in the die bonding area 40, so that the IC module 20 and the LED chip 50 can be effectively separated from each other and electrically connected together. The utility model provides a LED lamp pearl can be effectual separately set up IC module 20 and LED chip 50, meanwhile, can also be in the same place effectual electric connection between them to further promoted solid crystal region 40's space utilization, promoted LED chip 50's life and this LED lamp pearl's product yield simultaneously, be favorable to large-scale production and use.

The second embodiment of the utility model provides an LED lamp strip, and in specific implementation, the LED lamp strip comprises the LED lamp bead provided by the first embodiment.

In a specific embodiment, the LED display module includes the LED light bar provided in the second embodiment.

It should be noted that the implementation process described above is only for illustrating the applicability of the present application, but this does not mean that the LED lamp bead of the present application has only the above-mentioned one implementation flow, and on the contrary, the LED lamp bead of the present application can be incorporated into the feasible embodiments of the present application as long as the LED lamp bead of the present application can be implemented.

In summary, the LED lamp bead, the preparation method thereof, the LED lamp strip and the LED display module in the above embodiments of the present invention can effectively separate the IC module 20 from the LED chip 50, and at the same time, can effectively electrically connect the IC module 20 and the LED chip 50 together, thereby further improving the space utilization rate of the die attach area 40, and simultaneously improving the service life of the LED chip 50 and the product yield of the LED lamp bead, which is beneficial to large-scale production and use.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a LED lamp pearl which characterized in that: the LED support is made of conductive materials, an IC module is electrically connected to the surface of the LED support, an insulating layer is annularly paved at the top of the LED support and covers the IC module, a solid crystal area is surrounded in the middle of the insulating layer, the IC module and the solid crystal area are arranged at intervals, an LED chip is arranged in the solid crystal area, and the LED chip is electrically connected with the LED support.

2. The LED lamp bead of claim 1, wherein: the thickness of the LED chip is smaller than the height of the insulating layer.

3. The LED lamp bead of claim 1, wherein: the IC module is welded on the LED bracket.

4. The LED lamp bead of claim 1, wherein: the LED chip is welded in the die bonding area.

5. The LED lamp bead of claim 1, wherein: the insulating layer is formed by laying epoxy resin.

6. The LED lamp bead of claim 1, wherein: the LED support is made of copper sheets.

7. The utility model provides a LED lamp strip which characterized in that: the LED lamp bead comprises the LED lamp bead of any one of claims 1 to 6.

8. The utility model provides a LED display module assembly which characterized in that: comprising the LED light bar of claim 7.