CN216490572U

CN216490572U - Copper-clad heat dissipation structure of multilayer mobile phone circuit board

Info

Publication number: CN216490572U
Application number: CN202121868684.9U
Authority: CN
Inventors: 胡建宏
Original assignee: Kunshan Leiwei Photoelectric Technology Co ltd
Current assignee: Kunshan Leiwei Photoelectric Technology Co ltd
Priority date: 2021-08-11
Filing date: 2021-08-11
Publication date: 2022-05-10
Anticipated expiration: 2031-08-11

Abstract

The utility model relates to a copper-clad heat dissipation structure of a multilayer mobile phone circuit board, which comprises a board body, wherein a supporting frame is arranged below the board body, a chip is arranged on the board body, a heat conduction assembly is arranged on the chip, the heat conduction assembly comprises a fixing frame and a heat conduction plate, a protection frame is arranged above the board body, rubber rings are arranged at the upper end and the lower end of the protection frame, a plurality of anti-static assemblies and elimination resistors are arranged on the protection frame, the anti-static assemblies comprise transverse plates, conducting wires and conducting columns, heat of the chip can be directly transmitted to a mobile phone shell through the heat conduction plate, heat dissipation is accelerated, the protection frame with the rubber rings can play a waterproof role, the board body is protected, and the anti-static assemblies can transmit static electricity to the elimination resistors so that static electricity disappears.

Description

Copper-clad heat dissipation structure of multilayer mobile phone circuit board

Technical Field

The utility model relates to the technical field of multilayer circuit boards, in particular to a copper-clad heat dissipation structure of a multilayer mobile phone circuit board.

Background

Because the components on the mobile phone circuit board are very numerous, under the condition that the size of the mobile phone is not changed greatly, the mobile phone circuit board uses a multilayer circuit board, the multilayer circuit board is provided with at least three routing layers, two routing layers are arranged on two surfaces of the circuit board, other routing layers are arranged in the middle of the circuit board, the electrical connection between the routing layers is usually realized by plating through holes on the cross section of the circuit board, when the mobile phone is used, the components on the circuit board generate heat, sometimes people feel obvious temperature rise, most of the heat is generated by a processor, in order to protect the circuit board, the mobile phone shell can not be directly contacted with the components on the circuit board, a certain gap always exists, the heat of the processor can not be transmitted to the mobile phone shell in time, the mobile phone circuit board is basically exposed after the mobile phone shell is removed, once the cell-phone falls into the aquatic, water can be very easy get into the cell-phone after earphone, earphone hole, horn hole department, just very big possibility touches the circuit board, leads to the cell-phone to damage, if the static appears on the cell-phone circuit board, will influence the use of circuit board, in the serious time, probably punctures circuit board and above-mentioned component, leads to the circuit board to damage, but current cell-phone does not have the structure of static elimination.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides a copper-clad heat dissipation structure of a multilayer mobile phone circuit board

(II) technical scheme

In order to achieve the purpose, the utility model provides the following technical scheme: the copper-clad heat dissipation structure of the multilayer mobile phone circuit board comprises a board body, copper clad layers are arranged on two sides and inside of the board body, the edge of the plate body is provided with a mounting hole, a supporting frame is arranged below the plate body, a chip is arranged on the plate body, the chip is provided with a heat conducting component, the heat conducting component comprises a fixing frame and a heat conducting plate, the fixing frame is fixedly connected with the plate body, the heat conducting plate is detachably connected with the fixing frame and comprises a metal heat conducting substrate and a graphene heat radiating film, a plurality of heat conducting strips are arranged between the metal heat conducting substrate and the graphene heat dissipation film, a protective frame is arranged above the plate body, the upper end and the lower end of the protective frame are both provided with rubber rings, the protective frame is detachably connected with the supporting frame, the protection frame is provided with a plurality of wiring ports, and the protection frame is provided with a plurality of anti-static components and a plurality of eliminating resistors.

Preferably, prevent that static subassembly includes diaphragm, wire and leads electrical pillar, the one end and the protective frame of diaphragm are connected, and the other end and lead electrical pillar and connect, the one end of wire with lead electrical pillar electric connection, and the other end and eliminate the resistance connection.

In further preferred, the side of heat-conducting plate all is provided with a plurality of connecting plate, the side of the bottom of connecting plate is provided with the card strip, the side of fixed frame is provided with the first draw-in groove of a plurality of, the inner wall of first draw-in groove sets up to the arc wall.

In a further preferred embodiment, a thermally conductive silicone grease is disposed between the thermally conductive plate and the chip.

Preferably in further, be provided with a plurality of locating piece on the carriage, the edge of plate body is provided with a plurality of constant head tank, locating piece and constant head tank correspond the setting.

In a further preferred embodiment, the support frame and the mounting hole are connected by bolts.

Preferably in further, the side of the plate body is provided with a plurality of connecting grooves, the inner side of the supporting frame is provided with a plurality of second clamping grooves, the inner wall of each second clamping groove is arc-shaped, the bottom end of the protective frame is provided with a clamping plate, and the bottom of the clamping plate is provided with a second clamping block and is arranged in the second clamping groove.

In a further preferred mode, a conductive tube is arranged at one end of the transverse plate, a spring is arranged in the conductive tube, a first limiting ring is arranged at the top end of the conductive column, the end of the conductive column is arranged in the conductive tube, and a second limiting ring is arranged in the conductive tube.

(III) advantageous effects

Compared with the prior art, the utility model provides a copper-clad heat dissipation structure of a multilayer mobile phone circuit board, which has the following beneficial effects:

according to the utility model, the metal heat conducting substrate, the heat conducting strips and the graphene heat radiating plate can absorb heat generated by a chip and transmit the heat to the mobile phone shell, so that a large amount of heat of the chip is dissipated, and the damage of the chip due to overhigh temperature is avoided.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic cross-sectional view of the present invention;

FIG. 3 is a schematic cross-sectional view of a conductive tube and a conductive post according to the present invention;

FIG. 4 is a schematic top view of the plate body according to the present invention;

fig. 5 is an enlarged view of a portion of a structure in fig. 1.

In the figure: 1. a plate body; 2. coating a copper layer; 3. mounting holes; 4. a support frame; 5. a chip; 6. a fixing frame; 7. a heat conducting plate; 8. a metal heat-conducting substrate; 9. a graphene heat dissipation film; 10. a heat conducting strip; 11. a protective frame; 12. a rubber ring; 13. a wiring port; 14. eliminating the resistance; 15. a transverse plate; 16. a wire; 17. a conductive post; 18. a connecting plate; 19. clamping the strip; 20. a first card slot; 21. heat-conducting silicone grease; 22. positioning blocks; 23. positioning a groove; 24. connecting grooves; 25. a second card slot; 26. clamping a plate; 27. a second fixture block; 28. a conductive tube; 29. a spring; 30. a first limit ring; 31. and a second limit ring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b):

referring to fig. 1-5, the copper-clad heat dissipation structure of the multi-layer mobile phone circuit board comprises a board body 1, copper-clad layers 2 are respectively arranged on two sides and inside of the board body 1, a mounting hole 3 is arranged at the edge of the board body 1, a supporting frame 4 is arranged below the board body 1, a chip 5 is arranged on the board body 1, a heat conduction assembly is arranged on the chip 5, the heat conduction assembly comprises a fixing frame 6 and a heat conduction plate 7, the fixing frame 6 is fixedly connected with the board body 1, the heat conduction plate 7 is detachably connected with the fixing frame 6, the heat conduction plate 7 comprises a metal heat conduction substrate 8 and a graphene heat dissipation film 9, a plurality of heat conduction strips 10 are arranged between the metal heat conduction substrate 8 and the graphene heat dissipation film 9, a protective frame 11 is arranged above the board body 1, rubber rings 12 are respectively arranged at the upper end and the lower end of the protective frame 11, and the protective frame 11 is detachably connected with the supporting frame 4, the protection frame 11 is provided with a plurality of wiring ports 13, and the protection frame 11 is provided with a plurality of anti-static components and a eliminating resistor 14.

In this embodiment, the anti-static component includes a horizontal plate 15, a conducting wire 16 and a conducting post 17, one end of the horizontal plate 15 is connected to the protection frame 11, and the other end is connected to the conducting post 17, one end of the conducting wire 16 is electrically connected to the conducting post 17, and the other end is connected to the eliminating resistor 14. Thereby eliminating static electricity better.

In this embodiment, the side of heat-conducting plate 7 all is provided with a plurality of connecting plate 18, the side of the bottom of connecting plate 18 is provided with card strip 19, the side of fixed frame 6 is provided with the first draw-in groove 20 of a plurality of, the inner wall of first draw-in groove 20 sets up to the arc wall. The connecting plate 18 has elasticity and can deform, when the heat conducting plate 7 is fixed, the connecting plate 18 is tightly attached to the fixing frame 6, when the clamping strip 19 contacts the fixing frame 6, the connecting plate 18 can deform, so that the connecting plate 18 continues to move downwards until the clamping strip 19 enters the first clamping groove 20, and the heat conducting plate 7 cannot be easily detached.

In the present embodiment, a heat conductive silicone grease 21 is provided between the heat conductive plate 7 and the chip 5. The heat conduction silicone grease 21 can transfer heat on the chip 5 to the heat conduction plate 7, so that the situation that the heat cannot be transferred quickly due to a gap between the heat conduction plate 7 and the chip 5 is avoided.

In this embodiment, be provided with a plurality of locating piece 22 on the carriage 4, the edge of plate body 1 is provided with a plurality of constant head tank 23, locating piece 22 and constant head tank 23 correspond the setting. The positioning block 22 and the positioning groove 23 can ensure that the plate body 1 is accurately positioned when being placed on the supporting frame 4.

In the present embodiment, the support frame 4 and the mounting hole 3 are connected by bolts. The bolted connection can secure the panel body 1 and the support frame 4 sufficiently.

In this embodiment, the side of the plate body 1 is provided with a plurality of connecting groove 24, the inboard of carriage 4 is provided with a plurality of second draw-in groove 25, the inner wall of second draw-in groove 25 sets up to the arc, the bottom of protective frame 11 is provided with cardboard 26, the bottom of cardboard 26 is provided with second fixture block 27, and sets up in second draw-in groove 25. Connecting groove 24 makes the inboard that inserts braced frame 4 that cardboard 26 can be smooth, cardboard 26 can warp, make the fixture block insert second fixture block 27 smoothly and insert in second draw-in groove 25, make protective frame 11 fixed, fixed effectual, fixed mode is simple, in order to avoid protective frame 11 difficult quilt to be dismantled, the cross-section of second fixture block 27 and the inner wall of second draw-in groove 25 all are the arc, drag protective frame 11 with strength and just can take out second fixture block 27 from second draw-in groove 25.

In this embodiment, one end of the transverse plate 15 is provided with a conductive tube 28, the conductive wire 16 is provided with a spring 29, the top end of the conductive column 17 is provided with a first limit ring 30, and the end is arranged in the conductive tube 28, and the conductive tube 28 is provided with a second limit ring 31. The conductive post 17 is movable in the conductive tube 28, and the spring 29 can tightly press the conductive post 17 against the board body 1, so as to prevent the conductive post 17 from contacting the board body 1 too short or damaging the board body 1 too long.

The working principle is as follows:

to sum up, when in use, the support frame 4 is preferably fixed inside the mobile phone case by using bolts, the plate body 1 is placed on the support frame 4, the positioning block 22 is aligned with the positioning slot 23, so that the positioning block 22 falls into the positioning slot 23, the mounting hole 3 on the plate body 1 is aligned with the corresponding position on the support frame 4, then the plate body 1 is connected with the support frame 4 by using the bolt, then the protection frame 11 is placed on the plate body 1, the bottom end of the clamping plate 26 passes through the connecting slot 24, then the second clamping block 27 contacts the support frame 4, the cross section of the second clamping block 27 is arc-shaped, after the clamping block contacts the support frame 4, the clamping plate 26 is deformed, so that the clamping plate 26 can continuously move downwards until the clamping block enters the second clamping slot 25, so that the protection frame 11 is fixed, when the protection frame 11 is fixed, the conductive post 17 contacts the plate body 1, and compresses the spring 29 in the conductive tube 28, then, the heat conducting plate 7 is installed, firstly, heat conducting silicone grease 21 is coated on the chip 5, then, the connecting plate 18 at the bottom of the heat conducting plate 7 is inserted into the outer side of the fixing frame 6, the clamping strip 19 on the connecting plate 18 contacts the fixing frame 6 and deforms the connecting plate 18 until the clamping strip 19 is clamped into the first clamping groove 20, then, the mobile phone shell is installed, the graphene heat dissipation film 9 at the top of the heat conducting plate 7 contacts with the mobile phone shell, the rubber ring 12 at the upper end of the protective frame 11 also contacts with the mobile phone shell, after the chip 5 generates heat, the heat can be transferred to the metal heat conducting substrate 8 through the heat conducting silicone grease 21 and then transferred to the graphene heat dissipation film 9 through the heat conducting strip 10, the graphene heat dissipation film 9 transfers the heat to the mobile phone shell and dissipates the heat to the outside, a cavity formed by the heat conducting strip 10 can dissipate part of the heat to the protective frame 11, the temperature in the protective frame 11 rises and is transferred to the outside through the mobile phone shell, if intake in the cell-phone, water can be blocked by protective frame 11, the rubber strip at protective frame 11 upper and lower both ends can be dead with the gap closure between protective frame 11 and plate body 1 or the cell-phone shell, avoid water to get into between the protective frame 11, make plate body 1 wet, after producing static on plate body 1, static can be given rapidly and lead electrical pillar 17, then through conducting tube 28 and wire 16, give and give elimination resistance 14, elimination resistance 14 makes the static elimination, elimination resistance 14 can use MMBZ33VAL resistance.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Multilayer mobile phone circuit board's copper-clad heat radiation structure, which comprises a plate body (1), the both sides and the inside of plate body (1) all are provided with and cover copper layer (2), the edge of plate body (1) is provided with mounting hole (3), the below of plate body (1) is provided with carriage (4), be provided with chip (5), its characterized in that on plate body (1): the chip (5) is provided with a heat conduction component which comprises a fixing frame (6) and a heat conduction plate (7), the fixing frame (6) is fixedly connected with the plate body (1), the heat conducting plate (7) is detachably connected with the fixing frame (6), the heat conducting plate (7) comprises a metal heat conducting substrate (8) and a graphene heat radiating film (9), a plurality of heat conducting strips (10) are arranged between the metal heat conducting substrate (8) and the graphene heat dissipation film (9), a protective frame (11) is arranged above the plate body (1), rubber rings (12) are arranged at the upper end and the lower end of the protective frame (11), the protective frame (11) is detachably connected with the supporting frame (4), a plurality of wiring ports (13) are arranged on the protective frame (11), the protection frame (11) is provided with a plurality of anti-static components and a eliminating resistor (14).

2. The copper-clad heat dissipation structure of the multilayer mobile phone circuit board of claim 1, wherein: prevent static subassembly and include diaphragm (15), wire (16) and lead electrical pillar (17), the one end and the protective frame (11) of diaphragm (15) are connected, and the other end and lead electrical pillar (17) and connect, the one end and the conductive pillar (17) electric connection of wire (16), and the other end and elimination resistance (14) are connected.

3. The copper-clad heat dissipation structure of the multilayer mobile phone circuit board of claim 1, wherein: the side of heat-conducting plate (7) all is provided with a plurality of connecting plate (18), the side of the bottom of connecting plate (18) is provided with card strip (19), the side of fixed frame (6) is provided with the first draw-in groove of a plurality of (20), the inner wall of first draw-in groove (20) sets up to the arc wall.

4. The copper-clad heat dissipation structure of the multilayer mobile phone circuit board of claim 1, wherein: and a heat-conducting silicone grease (21) is arranged between the heat-conducting plate (7) and the chip (5).

5. The copper-clad heat dissipation structure of the multilayer mobile phone circuit board of claim 1, wherein: be provided with a plurality of locating piece (22) on carriage (4), the edge of plate body (1) is provided with a plurality of constant head tank (23), locating piece (22) and constant head tank (23) correspond the setting.

6. The copper-clad heat dissipation structure of the multilayer mobile phone circuit board of claim 1, wherein: the supporting frame (4) is connected with the mounting hole (3) through a bolt.

7. The copper-clad heat dissipation structure of the multilayer mobile phone circuit board of claim 1, wherein: the side of plate body (1) is provided with a plurality of connecting groove (24), the inboard of carriage (4) is provided with a plurality of second draw-in groove (25), the inner wall of second draw-in groove (25) sets up to the arc, the bottom of protective frame (11) is provided with cardboard (26), the bottom of cardboard (26) is provided with second fixture block (27), and sets up in second draw-in groove (25).

8. The copper-clad heat dissipation structure of the multilayer mobile phone circuit board of claim 2, wherein: one end of the transverse plate (15) is provided with a conductive tube (28), a spring (29) is arranged in the conductive wire (16) tube, the top end of the conductive column (17) is provided with a first limiting ring (30), the end is arranged in the conductive tube (28), and a second limiting ring (31) is arranged in the conductive tube (28).