CN216485129U - TO device burn-in test board - Google Patents
TO device burn-in test board Download PDFInfo
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- CN216485129U CN216485129U CN202122382121.5U CN202122382121U CN216485129U CN 216485129 U CN216485129 U CN 216485129U CN 202122382121 U CN202122382121 U CN 202122382121U CN 216485129 U CN216485129 U CN 216485129U
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- heat sink
- temperature
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- slot
- test
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Abstract
The utility model relates TO a TO device aging test board.A heat sink is erected on a bearing board in a suspended manner through a plurality of supporting points, the middle part of the heat sink is provided with a slot, and a temperature sensing thermocouple is inserted in the slot; after the scheme is adopted, the temperature of the heat sink and the temperature of the chip are basically consistent, and the temperature sensing thermocouple is inserted in the heat sink to monitor the temperature of the heat sink, so that the aging temperature of the chip can be accurately controlled.
Description
Technical Field
The utility model relates TO a TO device (Thin Small Outline Package), in particular TO a TO device aging test device.
Background
Burn-in testing is an important test for rejecting early failure products before the chip is delivered to a customer for use. Generally, the chip aging test needs to be carried out by firstly placing each chip to be tested in a test seat of an aging test jig plate, and then placing the aging test jig plate with the clamped chips in an aging test box for aging test; the temperature of an aging box is monitored only during the existing TO product batch aging test, the temperature is interfered by various factors, the temperature cannot completely reflect the temperature of the TO product, (the temperature can be generally 10 ℃ lower and still can be changed), if the aging temperature is greatly different, the aging effect of the TO product can be influenced, and therefore the measured temperature needs TO be corrected.
SUMMERY OF THE UTILITY MODEL
The utility model aims TO provide a TO aging test device capable of accurately monitoring the temperature of a chip.
In order TO achieve the above object, the present invention provides a TO device aging test board, which is arranged in a test box, and comprises a bearing board and a heat sink, wherein a plurality of chips are inserted into a chip holder on the heat sink, the test board is characterized in that: the heat sink is erected on the bearing plate in a suspended manner through a plurality of supporting points, the middle part of the heat sink is provided with a slot, and a temperature sensing thermocouple is inserted into the slot.
After the scheme is adopted, the temperatures of the heat sink and the chip are basically kept consistent, and the temperature sensing thermocouple is inserted into the heat sink to monitor the temperature of the heat sink, so that the aging temperature of the chip can be accurately controlled.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a cross-sectional view of the structure of the present invention.
Description of reference numerals:
1. a cutting plate; 2. a heat sink; 3. a slot; 4. a temperature sensing thermocouple; 5. a support; 6. a chip socket.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring TO fig. 1 and 2, the TO device burn-in test board of the present invention is disposed in a test box, and the TO device burn-in test board is composed of a carrier board 1, a heat sink 2, and a temperature sensing thermocouple 4, wherein the heat sink 2 is suspended on the carrier board 1 through a plurality of supports 5, a plurality of chips (not shown) are inserted into chip seats 6 on the heat sink 2, a slot 3 is disposed in the middle of the heat sink 2, and a temperature sensing thermocouple 4 is inserted into the slot 3.
Because the heat sink 2 is completely contacted with the TO, the heat sink 2 and the bearing plate 1 are suspended through the support 5 (which can be a heat insulating material), the temperature of the heat sink is the temperature of the chip, and the temperature sensing thermocouple can accurately monitor the temperature of the chip after being inserted into the heat sink, thereby ensuring the aging quality.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes in shape and structure made by using the contents of the present specification and drawings, or applied directly or indirectly to other related technical fields are included in the scope of the present invention.
Claims (1)
1. The utility model provides a TO device burn-in test board, this survey test panel setting is in the test box, including loading board, heat sink, in a plurality of chips plant the chip carrier on heat sink, its characterized in that: the heat sink is erected on the bearing plate in a suspended manner through a plurality of supporting points, the middle part of the heat sink is provided with a slot, and a temperature sensing thermocouple is inserted into the slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122382121.5U CN216485129U (en) | 2021-09-29 | 2021-09-29 | TO device burn-in test board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122382121.5U CN216485129U (en) | 2021-09-29 | 2021-09-29 | TO device burn-in test board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216485129U true CN216485129U (en) | 2022-05-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122382121.5U Active CN216485129U (en) | 2021-09-29 | 2021-09-29 | TO device burn-in test board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216485129U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116165517A (en) * | 2023-03-01 | 2023-05-26 | 苏州联讯仪器股份有限公司 | Testing device for testing chip |
-
2021
- 2021-09-29 CN CN202122382121.5U patent/CN216485129U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116165517A (en) * | 2023-03-01 | 2023-05-26 | 苏州联讯仪器股份有限公司 | Testing device for testing chip |
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