CN216460400U - Reciprocating type belt cleaning device of wafer machinery - Google Patents
Reciprocating type belt cleaning device of wafer machinery Download PDFInfo
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- CN216460400U CN216460400U CN202122389968.6U CN202122389968U CN216460400U CN 216460400 U CN216460400 U CN 216460400U CN 202122389968 U CN202122389968 U CN 202122389968U CN 216460400 U CN216460400 U CN 216460400U
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Abstract
The utility model relates to the field of wafer process manufacturing, in particular to a wafer mechanical reciprocating type cleaning device. It includes supporting mechanism, angle adjustment mechanism, the reciprocating adjustment module, be used for carrying out abluent cleaning head to the wafer, supporting mechanism includes longitudinal support pole, horizontal bracing piece, longitudinal support pole one end fixed connection, horizontal bracing piece is connected to its other end, angle adjustment mechanism connects on horizontal bracing piece, angle adjustment mechanism is including adjusting the fixed plate, the reciprocating adjustment module is connected on adjusting the fixed plate, the end-to-end connection cleaning head of reciprocating adjustment module, the reciprocating adjustment module drives the cleaning head and carries out reciprocating motion to the wafer cleaning process. The mechanical reciprocating motion of this device through reciprocating adjustment module drives the cleaning head and makes a round trip to move and increase the potential energy, and abluent cleanliness factor is guaranteed to the washing wafer that can be better. And the angle position between the cleaning head and the wafer can be adjusted at will according to the position of the wafer, so that the best cleaning effect is achieved.
Description
Technical Field
The utility model relates to the field of wafer process manufacturing, in particular to a wafer mechanical reciprocating type cleaning device.
Background
In the wafer processing process, in order to ensure the cleanness of the produced wafer, the surface of the wafer is cleaned, the cleaning nozzle is adopted to flush the surface of the wafer in the current cleaning process of the wafer, the cleaning mode is single, pollutants which are adhered to the surface of the wafer tightly cannot be well removed, and the cleaning effect of cleaning needs to be improved.
SUMMERY OF THE UTILITY MODEL
The utility model provides a wafer mechanical reciprocating type cleaning device, and aims to solve the problems that the existing wafer cleaning mode is single and the cleaning effect needs to be improved.
The utility model provides a wafer mechanical reciprocating type cleaning device which comprises a supporting mechanism, an angle adjusting mechanism, a reciprocating adjusting module and a cleaning head for cleaning a wafer, wherein the supporting mechanism comprises a longitudinal supporting rod and a transverse supporting rod, one end of the longitudinal supporting rod is fixedly connected, the other end of the longitudinal supporting rod is connected with the transverse supporting rod, the angle adjusting mechanism is connected to the transverse supporting rod, the angle adjusting mechanism comprises an adjusting fixing plate, the reciprocating adjusting module is connected to the adjusting fixing plate, the tail end of the reciprocating adjusting module is connected with the cleaning head, and the reciprocating adjusting module drives the cleaning head to reciprocate in the wafer cleaning process.
As a further improvement of the utility model, the reciprocating adjusting module comprises a voice coil motor and a reciprocating fixing plate, wherein one end of the voice coil motor is fixed on the adjusting fixing plate, and the other end of the voice coil motor is connected with the reciprocating fixing plate.
As a further improvement of the utility model, the reciprocating adjusting module comprises a reciprocating buffer block, the reciprocating buffer block is fixed on the adjusting fixing plate, and the reciprocating fixing plate is connected to the reciprocating buffer block in a sliding manner.
As a further improvement of the present invention, the cleaning head is a megasonic cleaning head.
As a further improvement of the utility model, the angle adjusting mechanism comprises an adjusting block, the adjusting fixing plate is connected to the adjusting block, and the adjusting block is connected to the transverse supporting rod in a sliding manner, is adjusted in angle and is fixed through a fastener.
As a further improvement of the utility model, the supporting mechanism comprises a supporting block, two through holes which are perpendicular to each other are arranged on the supporting block, and the through holes of the supporting block are respectively connected with the longitudinal supporting rod and the transverse supporting rod.
The utility model has the beneficial effects that: this device drives the cleaning head through the mechanical reciprocating motion of reciprocating adjustment module and makes a round trip to move and increase the potential energy, and abluent cleanliness factor is guaranteed to the washing wafer that can be better. And the angle position between the cleaning head and the wafer can be adjusted at will according to the position of the wafer, so that the best cleaning effect is achieved.
Drawings
FIG. 1 is a perspective view of a wafer mechanical reciprocating cleaning apparatus according to the present invention;
FIG. 2 is a structural side view of a wafer mechanical reciprocating cleaning apparatus of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1 to 2, the wafer mechanical reciprocating cleaning device of the present invention includes a supporting mechanism, an angle adjusting mechanism 3, a reciprocating adjusting module 4, and a cleaning head 5 for cleaning a wafer, wherein the supporting mechanism includes a longitudinal supporting rod 1 and a transverse supporting rod 2, one end of the longitudinal supporting rod 1 is fixedly connected, and the other end is connected to the transverse supporting rod 2, the angle adjusting mechanism 3 includes an adjusting fixing plate 31, the reciprocating adjusting module 4 is connected to the adjusting fixing plate 31, the end of the reciprocating adjusting module 4 is connected to the cleaning head 5, and the reciprocating adjusting module 4 drives the cleaning head 5 to perform reciprocating motion during the cleaning process of the wafer.
Vertical height and the transverse distance that cleaning head 5 needs to be in can be adjusted in vertical bracing piece 1, the setting of horizontal bracing piece 2, and the angle of 5 required orientations of cleaning head can be adjusted to angle adjustment mechanism 3, and reciprocal regulation module 4 provides a reciprocating motion's orbit for cleaning head 5, makes cleaning head 5 spun rivers cooperation reciprocating motion, forms the rivers mode of a vibration wave to can fully wash away the pollutant on the wafer.
The reciprocating adjusting module 4 comprises a voice coil motor 41 and a reciprocating fixing plate 42, wherein one end of the voice coil motor 41 is fixed on the adjusting fixing plate 31, and the other end thereof is connected with the reciprocating fixing plate 42. The main part of the reciprocating motion is preferably a voice coil motor 41, which can drive a reciprocating fixing plate 42 to make a linear reciprocating motion, thereby driving the cleaning head 5 to make a reciprocating motion, and finally acting on the water flow to form a vibration wave type cleaning mode.
The reciprocating adjusting module 4 comprises a reciprocating buffer block 43, the reciprocating buffer block 43 is fixed on the adjusting fixing plate 31, and the reciprocating fixing plate 42 is slidably connected on the reciprocating buffer block 43. The reciprocating buffer block 43 prevents the reciprocating fixing plate 42 from moving too fast to cause collision damage, and the reciprocating frequency of the cleaning head 5 is more stable and softer.
The cleaning head 5 is a megasonic cleaning head. The cleaning head 5 can be a common liquid-spraying cleaning head, and can also be replaced by a megasonic cleaning head to meet different wafer cleaning requirements.
The angle adjusting mechanism 3 comprises an adjusting block 32, an adjusting fixing plate 31 is connected to the adjusting block 32, and the adjusting block 32 is slidably connected to the transverse supporting rod 2 and fixed through a fastener after the angle is adjusted. The adjusting block 32 can rotate around the transverse supporting rod 2, and is fixed by a fastener after rotating to a required angle, so as to drive and adjust the voice coil motor, the cleaning head 5 and other components on the fixing plate 31 to face to the required angle.
The supporting mechanism comprises a supporting block 6, two through holes which are perpendicular to each other are formed in the supporting block 6, and the through holes of the supporting block 6 are respectively connected with the longitudinal supporting rod 1 and the transverse supporting rod 2. The supporting block 6 plays a role in connecting the longitudinal supporting rod 1 and the transverse supporting rod 2, and can slide on the longitudinal supporting rod 1, when the supporting block is moved to a required height, the supporting block is fixed through a fastener, the transverse supporting rod 2 can also slide in the supporting block 6, and after the supporting block is moved to a required length, the supporting block is fixed through the fastener, so that longitudinal and transverse distance adjustment is completed.
The operation action of the wafer mechanical reciprocating type cleaning device is as follows: adjust the height of supporting shoe 6 on longitudinal support pole 1 earlier and fix, adjust the transverse distance of horizontal bracing piece 2 and fix on supporting shoe 6, will have reciprocal regulation module 4, the angle adjusting module 3 of cleaning head 5 connects on horizontal bracing piece 2, and according to actual conditions rotation regulation its angle, make cleaning head 5 aim at the abluent wafer of wanting, open voice coil motor 41, cleaning head 5 or megasonic wave cleaning head, reciprocal regulation module 3 drives cleaning head 5 and is reciprocating motion, the rivers that form the vibration wave wash the wafer surface.
The foregoing is a more detailed description of the utility model in connection with specific preferred embodiments and it is not intended that the utility model be limited to these specific details. For those skilled in the art to which the utility model pertains, several simple deductions or substitutions can be made without departing from the spirit of the utility model, and all shall be considered as belonging to the protection scope of the utility model.
Claims (6)
1. The utility model provides a reciprocating type belt cleaning device of wafer machinery, its characterized in that includes supporting mechanism, angle adjustment mechanism, reciprocating adjustment module, is used for carrying out abluent cleaning head to the wafer, supporting mechanism includes longitudinal support pole, horizontal bracing piece, transverse support pole is connected to longitudinal support pole one end fixed connection, its other end, angle adjustment mechanism connects on horizontal bracing piece, angle adjustment mechanism is including adjusting the fixed plate, reciprocating adjustment module connects on adjusting the fixed plate, the end-to-end connection cleaning head of reciprocating adjustment module, reciprocating adjustment module drives the cleaning head and carries out reciprocating motion to the wafer cleaning process.
2. The mechanical reciprocating cleaning device for wafers as claimed in claim 1, wherein the reciprocating adjustment module comprises a voice coil motor and a reciprocating fixing plate, one end of the voice coil motor is fixed on the adjusting fixing plate, and the other end of the voice coil motor is connected with the reciprocating fixing plate.
3. The mechanical reciprocating wafer cleaning device as claimed in claim 2, wherein the reciprocating adjustment module includes a reciprocating buffer block fixed on an adjustment fixing plate, and the reciprocating fixing plate is slidably connected to the reciprocating buffer block.
4. The mechanical reciprocating cleaning device for wafers as claimed in claim 1, wherein the cleaning head is a megasonic cleaning head.
5. The mechanical reciprocating cleaning device for wafers as claimed in claim 1, wherein the angle adjusting mechanism comprises an adjusting block, the adjusting fixing plate is connected to the adjusting block, and the adjusting block is slidably connected to the transverse supporting rod and fixed by a fastener after being adjusted in angle.
6. The wafer mechanical reciprocating cleaning device as claimed in claim 1, wherein the supporting mechanism comprises a supporting block, two through holes perpendicular to each other are formed on the supporting block, and the through holes of the supporting block are respectively connected with the longitudinal supporting rod and the transverse supporting rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122389968.6U CN216460400U (en) | 2021-09-29 | 2021-09-29 | Reciprocating type belt cleaning device of wafer machinery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122389968.6U CN216460400U (en) | 2021-09-29 | 2021-09-29 | Reciprocating type belt cleaning device of wafer machinery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216460400U true CN216460400U (en) | 2022-05-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122389968.6U Active CN216460400U (en) | 2021-09-29 | 2021-09-29 | Reciprocating type belt cleaning device of wafer machinery |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216460400U (en) |
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2021
- 2021-09-29 CN CN202122389968.6U patent/CN216460400U/en active Active
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