CN216437592U - Super-thick copper high-temperature-resistant multilayer circuit board - Google Patents

Abstract

The utility model provides an ultra-thick copper high temperature resistant multilayer circuit board, which relates to the technical field of circuit boards and aims to solve the problems that an auxiliary positioning and installation alternate structure is not arranged in the original multilayer circuit board, thereby not only reducing the accuracy of the operation pressing, but also reducing the problem of firm structure of the installation, overlapping and heating, and the ultra-thick copper high temperature resistant multilayer circuit board comprises a bottom plate and a prepreg, wherein the prepreg is arranged at the upper end of the bottom plate; the inner plate is arranged on the upper side of the prepreg, the prepreg is laid and arranged on the upper side of the inner plate, and the two prepregs respectively clamp and mount the inner plate up and down; and the top plate is arranged right above the prepreg. The utility model discloses in because the installation ball point can carry out the auxiliary line board and fix a position fixed point when installing layer number structure in proper order with seting up the location square hole, improved the accurate nature of circuit board structural operation.

Description

Super thick copper high temperature resistant multilayer circuit board

Technical Field

The utility model relates to a circuit board technical field, more specifically say, in particular to super thick copper high temperature resistant multilayer circuit board.

Background

A multilayer board is a multilayer wiring layer, and a dielectric layer is arranged between every two layers, wherein, the ultra-thick copper high-temperature resistant multilayer circuit board has at least three conductive layers, two layers are arranged on the outer surface, and the rest layer is combined in an insulating board, and the electrical connection between the layers is usually realized by plating through holes on the cross section of the circuit board.

When super thick copper high temperature resistant multilayer circuit board used, because original multilayer circuit board structure skew appears easily in coincidence, pressfitting operation and the inaccurate phenomenon of installation to do not have set up assistance-localization real-time and installation reinforcement and have alternated the structure, not only reduced the circuit board structure in the accurate nature of operation pressfitting, still reduced the circuit board installation simultaneously and overlapped the structural firmness of heating.

Therefore, in view of the above, research and improvement are made for the existing structure and defects, and an ultra-thick copper high-temperature-resistant multilayer circuit board is provided, so as to achieve the purpose of higher practical value.

Disclosure of Invention

In order to solve the technical problem, the utility model provides a super thick copper high temperature resistant multilayer circuit board to solve and not set up assistance-localization real-time and installation and alternate the structure in original multilayer circuit board, not only reduced the accurate nature at the operation pressfitting, still reduced the firm in structure's that the installation overlaps the heating problem.

The purpose and the efficacy of the ultra-thick copper high temperature resistant multilayer circuit board are achieved by the following specific technical means:

the ultra-thick copper high-temperature-resistant multilayer circuit board comprises a bottom plate and a prepreg, wherein the prepreg is arranged at the upper end of the bottom plate; the inner plate is arranged on the upper side of the prepreg, the prepreg is laid and arranged on the upper side of the inner plate, and the two prepregs respectively clamp and mount the inner plate up and down; the top plate is arranged at the right upper end of the prepreg; the positioning square holes are respectively formed in inner end faces of the left side and the right side of the bottom plate, the prepreg, the inner plate and the top plate; the inserted rods are vertically arranged on the left side and the right side of the bottom plate, the prepreg, the inner plate and the top plate respectively, and are correspondingly arranged on the hollowed inner sides of the positioning square holes; and the circuit layers are arranged and installed on the bottom plate, the prepreg, the inner plate and the top plate.

Furthermore, the positioning square hole comprises ball points, the ball points are arranged on the front side and the rear side of the positioning square hole, and the ball points are convexly arranged on the upper side end faces of the left end and the right end of the bottom plate, the prepreg, the inner plate and the top plate; the positions of the inserted rods mounted on the structures on the bottom plate, the prepreg, the inner plate and the top plate are different, and the positions of the positioning square holes formed in the structures on the bottom plate, the prepreg, the inner plate and the top plate are different.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the utility model can position the auxiliary circuit board at fixed points when the layer structure is sequentially installed due to the installation of the ball points and the arrangement of the positioning square holes, thereby improving the accuracy of the structure operation of the circuit board;

2. the utility model discloses because the inserted bar of installation can alternate the installation in proper order according to the installation number of piles of concrete multiply wood, carry out most basic structure location with the multilayer circuit board for the structural mounting of circuit board is more firm, increases the practicality of circuit board.

Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.

Drawings

Fig. 1 is a schematic view of the upper left front axial view structure of the present invention.

Fig. 2 is an axial view and a split schematic diagram of the whole structure of the present invention.

Fig. 3 is an axial view of the bottom plate, the prepreg, the positioning square hole and the insertion rod of the present invention.

Fig. 4 is an axial view of the prepreg, the inner plate, the positioning square hole and the insertion rod of the present invention.

Fig. 5 is a schematic view of the top plate, the positioning square hole, the insertion rod and the circuit layer of the present invention.

In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:

1. a bottom layer plate; 2. a prepreg; 3. an inner layer board; 4. a top layer plate; 5. positioning the square hole; 501. a ball point; 6. inserting a rod; 7. and a circuit layer.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through a central medium. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b):

as shown in figures 1 to 5:

the utility model provides a super thick copper high temperature resistant multilayer circuit board, including bottom plate 1, prepreg 2 installs in the upper end of bottom plate 1, in the operation process of multiply wood copying board, must polish prepreg 2, guarantees that the cloth cover of prepreg 2 should be level and smooth, no greasy dirt, no smudge, no foreign matter or other defects, no fracture and too much resin powder, just can exactly analyze the circuit diagram of model; the inner-layer board 3 is arranged on the upper side of the prepreg 2, the prepreg 2 is laid on the upper side of the inner-layer board 3, the inner-layer board 3 is clamped and arranged up and down by the two prepregs 2 respectively, the inner-layer board 3 is an inner core structure of the whole circuit board, and the prepreg 2 belongs to a dielectric layer and plays a role in dividing; the top plate 4 is arranged right above the prepreg 2, the top plate 4 and the bottom plate 1 are signal line layers, and copper foils are arranged on the top plate 4 and the bottom plate 1; the positioning square holes 5 are respectively formed in the inner end faces of the left side and the right side of the bottom plate 1, the prepreg 2, the inner plate 3 and the top plate 4, and the positioning square holes 5 are formed along with different use and installation sequences of each layer, so that the machine can fully identify and position the circuit board during operation of the multilayer circuit board; the inserting rods 6 are respectively vertically arranged at the left side and the right side of the bottom plate 1, the prepreg 2, the inner plate 3 and the top plate 4, the inserting rods 6 are correspondingly arranged at the hollowed inner sides of the positioning square holes 5, and the inserting rods 6 are structures for vertically fixing circuit boards, so that structural displacement of the circuit boards in the process of stacking layers is prevented; and the circuit layer 7 is arranged on the bottom plate 1, the prepreg 2, the inner plate 3 and the top plate 4, and a via hole, a microstrip line and the like are respectively paved and connected in the circuit layer 7.

Referring to fig. 2 and 3, the square positioning hole 5 includes, ball point 501 arranges and installs both sides around the square positioning hole 5, and ball point 501 all protrudes and installs on the upside terminal surface at both ends about bottom plate 1, prepreg 2, inner plate 3 and top plate 4, ball point 501 is also cooperating square positioning hole 5 to carry out the structure of assisting the location circuit board number of layers, just utilize ball point 501's structure to fix a position when two-layer structure carries out mutual pressfitting for the circuit board has improved the precision of structural operation.

Referring to fig. 1, fig. 4 and fig. 5, the positions of the inserted rods 6 of the structural installations on the bottom plate 1, the prepreg 2, the inner plate 3 and the top plate 4 are different, and the positions of the positioning square holes 5 set up by the structures on the bottom plate 1, the prepreg 2, the inner plate 3 and the top plate 4 are all different, the inserted rods 6 installed on the bottom plate 1 are respectively installed on the four sides, the most basic structural positioning is carried out, and the inserted rods 6 installed on the prepreg 2 and the inner plate 3 are sequentially positioned and installed in the middle, the inserted rods 6 installed on the top plate 4 are subjected to the last structural penetration, so that the structural installation of the circuit board is firm, and the practicability of the circuit board is improved.

The specific use mode and function of the embodiment are as follows:

during the use process, the bottom plate 1 is cut into small blocks, the positioning square holes 5 and the ball points 501 are sequentially arranged, arranged and installed, the bottom plate 1 is cut into the size of a required circuit board, the inserted rods 6 are respectively installed on the four sides of the bottom plate 1, then a layer of photosensitive wet film is coated, the prepreg 2 is installed, the inserted rods 6 are also installed on the prepreg 2 and correspondingly installed on the hollowed inner sides of the positioning square holes 5 arranged on the bottom plate 1, the ball points 501 on the prepreg 2 and the bottom plate 1 correspond to each other, then ultraviolet rays are projected through a template, circuit patterns are displayed on a core plate of the inner plate 3, the core plate is washed by sodium carbonate, all copper surfaces except the circuit patterns are removed, optical detection is carried out, and after the smoothness of the circuit patterns is detected, the inserted rods 6 on the upper prepreg 2 and the positioning square holes 5 and the ball points 501 on the inner plate 3 are installed correspondingly to each other, and riveting and laminating the prepreg 2, the inner layer board 3 and the multi-length memory core board at the upper end, pressing the prepreg, the inner layer board and the multi-length memory core board into a multi-layer board in a heating and hot pressing mode under a vacuum condition, and installing a circuit layer 7 in the structure arranged on the inner side of the multi-layer board so as to finish the using process of the multi-layer board.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims (5)

1. The ultra-thick copper high-temperature-resistant multilayer circuit board is characterized by comprising a bottom plate (1) and a prepreg (2), wherein the prepreg (2) is arranged at the upper end of the bottom plate (1); the inner layer plate (3) is arranged on the upper side of the prepreg (2), the prepreg (2) is paved and arranged on the upper side of the inner layer plate (3), and the two prepregs (2) respectively clamp and install the inner layer plate (3) up and down; the top plate (4), the top plate (4) is installed at the right upper end of the prepreg (2).

2. The ultra-thick copper high temperature resistant multilayer circuit board of claim 1, further comprising: the positioning square holes (5) are respectively formed in inner end faces of the left side and the right side of the bottom plate (1), the inner plate (3), the semi-solidified plate (2) and the top plate (4); the inserting rods (6) are respectively vertically arranged at the left side and the right side of the bottom plate (1), the prepreg (2), the inner plate (3) and the top plate (4), and the inserting rods (6) are correspondingly arranged at the hollowed inner sides of the positioning square holes (5); the circuit board comprises a circuit layer (7), wherein the circuit layer (7) is arranged and installed on a bottom plate (1), a prepreg (2), an inner plate (3) and a top plate (4).

3. The ultra-thick copper high-temperature-resistant multilayer circuit board according to claim 2, wherein the positioning square holes (5) comprise ball points (501), the ball points (501) are arranged on the front side and the rear side of the positioning square holes (5), and the ball points (501) are all installed on the upper side end faces of the left end face and the right end face of the bottom plate (1), the prepreg (2), the inner plate (3) and the top plate (4) in a protruding mode.

4. The ultra-thick copper high temperature resistant multilayer circuit board according to claim 1, wherein the position of the inserted bar (6) mounted on each structure of the bottom plate (1), the prepreg (2), the inner plate (3) and the top plate (4) is different.

5. The ultra-thick copper high-temperature-resistant multilayer circuit board according to claim 1, wherein the positions of the positioning square holes (5) formed in the bottom board (1), the prepreg (2), the inner board (3) and the top board (4) are different.

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