CN216413055U - Light and thin low-cost lead frame - Google Patents
Light and thin low-cost lead frame Download PDFInfo
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- CN216413055U CN216413055U CN202120628919.0U CN202120628919U CN216413055U CN 216413055 U CN216413055 U CN 216413055U CN 202120628919 U CN202120628919 U CN 202120628919U CN 216413055 U CN216413055 U CN 216413055U
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- lead frame
- heat sink
- thin
- radiating fin
- cost
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Abstract
A light and thin low-cost lead frame relates to the field of lead frames and comprises a lead frame main body and a plurality of radiating fins arranged on the lead frame main body, wherein the lead frame main body comprises a plurality of lead frame units for mounting chips and four radiating fin mounting parts symmetrically arranged on two sides of each lead frame unit; the radiating fins are provided with radiating fin pins corresponding to the riveting holes in position and number, and the radiating fin pins are fixed in the riveting holes in a riveting mode. Through the structure of the lifting part, under the condition that the thicknesses of the radiating fin and the lead frame body are not changed, the thickness of the radiating fin can be correspondingly reduced, so that the material consumption is reduced, and the purposes of lightness, thinness and low cost are achieved.
Description
Technical Field
The utility model relates to the field of lead frames, in particular to a light, thin and low-cost lead frame.
Background
The lead frame is used for electrically connecting some circuits and chips, and for the good operation of the chips and the circuits, a heat dissipation metal sheet is generally added on the upper end face of the main body part of the lead frame to enlarge the heat dissipation area, improve the heat dissipation efficiency, avoid the chips and the circuits from breaking down due to overheating, and prolong the service life of the chips and the circuits.
The periphery of the radiating fin is provided with a plurality of pins, the lead frame is provided with a plurality of corresponding riveting holes, and the pins are fixed with the lead frame in a riveting mode. Both the heat sink and the leadframe body require a certain thickness to meet the dimensional requirements of the product structure. However, the conventional lead frame body has a relatively thick thickness of the mounted heat sink due to its structure.
Disclosure of Invention
Aiming at the problems, the utility model provides a light, thin and low-cost lead frame, and the specific technical scheme is as follows:
a light and thin low-cost lead frame comprises a lead frame body and a plurality of radiating fins arranged on the lead frame body, wherein the lead frame body comprises a plurality of lead frame units for mounting chips and four radiating fin mounting parts symmetrically arranged on two sides of each lead frame unit, each radiating fin mounting part comprises a lifting part extending upwards in an inclined mode and riveting parts extending from the tail ends of the lifting parts in the horizontal direction, and the riveting parts are provided with riveting holes for mounting the radiating fins; the radiating fins are provided with radiating fin pins corresponding to the riveting holes in position and number, and the radiating fin pins are fixed in the riveting holes in a riveting mode.
Further, the lifting part is 1-3mm higher than the lead frame unit.
Further, the lead frame main part is integrated into one piece, and is a plurality of the lead frame unit sets gradually makes the lead frame main part is rectangular form structure.
Furthermore, the lead frame unit comprises a plurality of chip connecting pins arranged in the middle, the end parts of the plurality of chip connecting pins enclose a hollow area for placing a chip, and the end parts of the plurality of chip connecting pins are electrically connected with the chip.
Further, the chip connecting pin positioned on the outermost side is connected with the heat sink mounting part into a whole.
Further, the heat sink is located directly above the hollow region.
Further, the fin installation department includes two first fin installation departments and two second fin installation departments, wherein two first fin installation department sets up the both sides of lead frame unit, and two first fin installation department connects as an organic wholely, is located one in the outside the chip connects the pin and is connected as an organic wholely with the first fin installation department of one side wherein, two second fin installation department symmetry respectively sets up lead frame unit both sides.
Furthermore, two step protruding parts are further arranged on two sides of each lead frame unit, and the two step protruding parts are respectively positioned behind the two second heat radiating fin mounting parts and have a certain distance between the two step protruding parts.
The utility model has the beneficial effects that:
according to the light, thin and low-cost lead frame provided by the utility model, the heat radiating fin is lifted by utilizing the obliquely upward extending structure of the lifting part, so that the thickness of the heat radiating fin can be correspondingly reduced under the condition that the total thickness of the heat radiating fin and the lead frame main body is not changed, the material consumption is reduced, the cost expenditure is reduced, and the light, thin and low-cost purposes are further achieved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of a planar structure of a thin and low-cost lead frame according to the present invention;
FIG. 2 is a schematic side view of a conventional lead frame;
fig. 3 is a partial cross-sectional view of a prior art lead frame;
FIG. 4 is a partial cross-sectional view of a thin, lightweight, low-cost lead frame provided in accordance with the present invention;
FIG. 5 is an enlarged partial view of a lead frame unit provided by the present invention;
fig. 6 is another partial enlarged view of the lead frame unit provided by the present invention.
10-a lead frame body; 101-a lead frame unit; 102-chip connection pins; 103-a first heat sink mounting portion; 1031-riveting hole; 1032-lift; 1033-riveting part; 104-a second heat sink mounting portion; 105-a step projection;
20-a heat sink; 201-heatsink pins;
a is the total thickness from the top of the radiating fin to the lower end face of the lead frame body; b-the elevation height of the lead frame body.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1, 4 and 5, a light, thin and low-cost lead frame is provided in the present embodiment, and includes a lead frame body 10 and a plurality of heat sinks 20 disposed on the lead frame body 10.
The lead frame body 10 includes a plurality of lead frame units 101 for mounting chips, and four heat sink mounting portions symmetrically disposed on both sides of each lead frame unit 101. Further, the lead frame body 10 is integrally formed, and the plurality of lead frame units 101 are sequentially arranged so that the lead frame body 10 has a long structure.
Further, the lead frame unit 101 includes a plurality of chip connection pins 102 disposed in the middle, ends of the plurality of chip connection pins 102 enclose a hollow area for placing a chip, and the heat sink is located right above the hollow area. The ends of the plurality of chip connection pins 102 are for electrical connection with a chip.
Further, in this embodiment, the heat sink mounting portion includes two first heat sink mounting portions 103 and two second heat sink mounting portions 104, wherein the two first heat sink mounting portions 103 are disposed on one side of the lead frame unit 101, the two first heat sink mounting portions 103 are integrally connected, the outermost one of the chip connection pins 102 is integrally connected to one of the first heat sink mounting portions 103, and the two second heat sink mounting portions 104 are symmetrically disposed on two sides of the lead frame unit 101.
In this embodiment, as shown in fig. 4, each heat sink mounting portion includes a raised portion 1032 extending obliquely upward and a rivet portion 1033 extending from a distal end of the raised portion 1032 in a horizontal direction, and each rivet portion 1033 is provided with a rivet hole 1031 for mounting the heat sink 20.
The heat sink 20 is provided with heat sink pins 201 corresponding to the positions and the number of the staking holes 1031, and the heat sink pins 201 are fixed in the staking holes 1031 by staking.
Further, in this embodiment, the raised portion 1032 is 1-3mm higher than the lead frame unit. With reference to fig. 3 and 4, since the heat spreader 20 and the lead frame body 10 both need a certain thickness a to meet the size requirement of the product structure, under the condition that the total thickness of the heat spreader 20 and the lead frame body 10 is not changed, the heat spreader 20 is raised by a certain height B by using the obliquely upward extending structure of the lifting portion 1032, so that the thickness of the heat spreader 20 can be correspondingly reduced, the material consumption is reduced, and the purposes of light weight, thinness and low cost are achieved.
In addition, as shown in fig. 2 and 3, the lifting portion 1032 is formed by bending the heat sink mounting portion of the original lead frame, and other structures are not required to be added to the original lead frame, so that the structure is skillfully changed and simple.
As shown in fig. 6, the lead frame body 10 is further provided with two-step protruding portions 105 on both sides of each lead frame unit 101, and the two-step protruding portions 105 are respectively located behind the two second heat sink mounting portions 104 with a certain distance therebetween. This step bulge 105 has injectd the plastic-sealed body size when moulding plastics, and then need not reach the product size through dashing the excessive material, if do not have the stair structure, the product is made the back and has the plastic-sealed material in this position, need cut away once more, can increase production manufacturing procedure, causes the product cost to increase.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The light, thin and low-cost lead frame is characterized by comprising a lead frame body and a plurality of radiating fins arranged on the lead frame body, wherein the lead frame body comprises a plurality of lead frame units for mounting chips and four radiating fin mounting parts symmetrically arranged on two sides of each lead frame unit, each radiating fin mounting part comprises a lifting part extending in an inclined direction and riveting parts extending from the tail ends of the lifting parts along the horizontal direction, and the riveting parts are provided with riveting holes for mounting the radiating fins;
the radiating fins are provided with radiating fin pins corresponding to the riveting holes in position and number, and the radiating fin pins are fixed in the riveting holes in a riveting mode.
2. The thin, lightweight, low cost lead frame of claim 1, wherein the raised portion is 1-3mm above the lead frame element.
3. The light weight and low cost lead frame according to claim 1, wherein the lead frame body is formed integrally, and a plurality of lead frame units are arranged in sequence so that the lead frame body has an elongated structure.
4. The thin, lightweight, low-cost lead frame of claim 1, wherein the lead frame unit includes a plurality of chip connection pins disposed therebetween, ends of the plurality of chip connection pins define a hollow region for receiving a chip, and ends of the plurality of chip connection pins are electrically connected to the chip.
5. The thin, lightweight, low-cost lead frame of claim 4, wherein an outermost one of said chip attach pins is integrally connected to said heat sink mounting portion.
6. The thin, lightweight, low cost leadframe according to claim 4 wherein the heat sink is directly over the hollow region.
7. The light and thin low cost lead frame according to claim 5 wherein the heat sink mounting portions comprise two first heat sink mounting portions and two second heat sink mounting portions, wherein two of the first heat sink mounting portions are disposed on two sides of the lead frame unit, and the two first heat sink mounting portions are integrally connected, one of the chip connection pins located on the outermost side is integrally connected to the first heat sink mounting portion on one of the sides, and the two second heat sink mounting portions are symmetrically disposed on two sides of the lead frame unit, respectively.
8. The thin, lightweight, low-cost lead frame according to claim 7, wherein two step protrusions are formed on both sides of each lead frame unit, and the two step protrusions are respectively formed behind the two second heat sink mounting portions with a certain distance therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120628919.0U CN216413055U (en) | 2021-03-26 | 2021-03-26 | Light and thin low-cost lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120628919.0U CN216413055U (en) | 2021-03-26 | 2021-03-26 | Light and thin low-cost lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216413055U true CN216413055U (en) | 2022-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120628919.0U Active CN216413055U (en) | 2021-03-26 | 2021-03-26 | Light and thin low-cost lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216413055U (en) |
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2021
- 2021-03-26 CN CN202120628919.0U patent/CN216413055U/en active Active
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