CN220367914U - Matrix semiconductor lead frame - Google Patents
Matrix semiconductor lead frame Download PDFInfo
- Publication number
- CN220367914U CN220367914U CN202322032374.9U CN202322032374U CN220367914U CN 220367914 U CN220367914 U CN 220367914U CN 202322032374 U CN202322032374 U CN 202322032374U CN 220367914 U CN220367914 U CN 220367914U
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- lead frame
- pins
- mounting unit
- pin
- frame body
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- 239000011159 matrix material Substances 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000009434 installation Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to the technical field of semiconductor package manufacture, in particular to a matrix semiconductor lead frame, which comprises a frame substrate and a plurality of mounting units arranged in the frame substrate in a matrix manner, wherein each mounting unit comprises a first mounting unit and a second mounting unit, and the first mounting unit and the second mounting unit have the same structure; the first mounting unit comprises a lead frame body, one side of the inner wall of the lead frame body is provided with a plurality of first pins, and the other side of the inner wall of the lead frame body is provided with a plurality of second pins corresponding to the first pins in position; the outer walls of one ends of the first pins, which are close to the second pins, are connected with each other through the connecting sheets, and compared with the prior art, the utility model greatly improves the connection strength of the first pins and the second pins, is not easy to deform when the first pins are subjected to external force, and in addition, the lead frame is provided with a plurality of mounting units, so that each mounting unit is convenient to maintain independently, and meanwhile, the quantity can be adjusted.
Description
Technical Field
The utility model relates to the technical field of semiconductor package manufacturing, in particular to a matrix semiconductor lead frame.
Background
The lead frame has the main functions of providing a carrier for the chip to mechanically support, forming an electric signal path by connecting the chip circuit inside and outside as a conductive medium, and radiating heat generated during the operation of the chip together with the packaging shell to form a heat radiation channel.
Chinese patent grant publication No. CN206574707U discloses a matrix lead frame comprising: a frame and a lead frame; the lead frames are distributed in the frame in a matrix arrangement mode; the lead frame includes: the second pin is positioned in the first pin; the upper side edge and the lower side edge of the frame are provided with a plurality of holes for positioning; each adjacent lead frames are connected through connecting ribs for reinforcing the strength of the whole frame.
The above-mentioned patent is as prior art although solved at present at the lower technical problem of production efficiency of the less in-process density of production lead frame, but its first pin and the second pin that adopts do not have bearing structure, consequently take place to warp easily when receiving external force, and its lead frame and frame structure as an organic whole in addition can not realize nimble equipment and dismantle the maintenance and cause its stability and convenience to reduce thereby.
Disclosure of Invention
(one) solving the technical problems
In view of the above problems with the prior art, the present utility model provides a matrix semiconductor lead frame.
(II) technical scheme
In order to achieve the above purpose, the utility model is realized by the following technical scheme: the matrix semiconductor lead frame comprises a frame substrate and a plurality of mounting units arranged in the frame substrate in a matrix manner, wherein each mounting unit comprises a first mounting unit and a second mounting unit, and the first mounting unit and the second mounting unit have the same structure;
the first mounting unit comprises a lead frame body, one side of the inner wall of the lead frame body is provided with a plurality of first pins, and the other side of the inner wall of the lead frame body is provided with a plurality of second pins corresponding to the first pins in position;
the outer walls of one ends of the first pins, which are close to the second pins, are connected with each other through connecting sheets, and the outer walls of the two first pins positioned at the edge are connected with the lead frame body through the connecting sheets.
As a preferable scheme of the matrix semiconductor lead frame, a U-shaped groove is formed at one end of the first pin, which is close to the second pin, and an extension part is formed at one end of the second pin, which is close to the first pin, and extends into the U-shaped groove.
Through adopting above-mentioned technical scheme, through setting up U-shaped groove and extension, can improve lead frame's planarization, the U-shaped groove can play the guard action to the extension simultaneously.
As a preferable scheme of the matrix semiconductor lead frame, a protruding part is further arranged on one side of the outer wall of the lead frame body, a groove is arranged on one side of the outer wall of the lead frame body, which is symmetrical to the protruding part, and the protruding part and the groove are suitable for being connected with a frame substrate.
Through adopting above-mentioned technical scheme, through setting up recess and bellying, be convenient for fix a position the installation unit, can improve the stability of installation unit simultaneously.
As a preferable mode of the matrix semiconductor lead frame of the utility model, a plurality of the first pins and the second pins are uniformly arranged.
Through adopting above-mentioned technical scheme, through making first pin and second pin evenly arrange, can promote lead frame's pleasing to the eye degree, convenient production simultaneously.
As a preferable scheme of the matrix semiconductor lead frame of the utility model, the second pins are in a shape of a convex.
Through adopting above-mentioned technical scheme, can increase the area of stress of second pin through making the second pin be "protruding" font, stability is good.
As an optimal scheme of the matrix semiconductor lead frame, a plurality of positioning grooves are formed in the peripheral outer edges of the frame substrate, and arc-shaped chamfer angles are formed in four corners of the frame substrate.
Through adopting above-mentioned technical scheme, through seting up the constant head tank, be convenient for install lead frame, fix a position lead frame.
(III) advantageous effects the present utility model provides a matrix type semiconductor lead frame. The beneficial effects are as follows:
compared with the prior art, the utility model greatly improves the connection strength of the first pin and the second pin, is not easy to deform when the lead frame is subjected to external force, and is convenient to independently maintain each mounting unit by mounting a plurality of mounting units on the lead frame, and meanwhile, the utility model can be used for adjusting the quantity.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a schematic view of a frame substrate according to the present utility model;
FIG. 3 is an enlarged view of the first mounting unit of FIG. 1 in accordance with the present utility model;
fig. 4 is an enlarged view of the second mounting unit of fig. 1 according to the present utility model.
In the figure, 1, a frame substrate; 2. a first mounting unit; 201. a lead frame body; 202. a first pin; 2021. a U-shaped groove; 203. a second pin; 2031. an extension; 204. a boss; 205. a groove; 206. a connecting sheet; 3. a second mounting unit; 4. a positioning groove; 5. arc chamfering.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
Example 1
Referring to fig. 1 to 4, a first embodiment of the present utility model provides a matrix type semiconductor lead frame, which includes a frame substrate 1 and a plurality of mounting units arranged in a matrix type in the frame substrate 1, the plurality of mounting units being detachably connected to the frame substrate 1, the mounting units including a first mounting unit 2 and a second mounting unit 3, the first mounting unit 2 and the second mounting unit 3 having the same structure, and the first mounting unit 2 and the second mounting unit 3 being symmetrically arranged when being arranged;
the first mounting unit 2 comprises a lead frame 201, wherein one side of the inner wall of the lead frame 201 is provided with a plurality of first pins 202, and the other side of the inner wall of the lead frame 201 is provided with a plurality of second pins 203 corresponding to the first pins 202 in position;
the outer walls of one ends of the first pins 202, which are close to the second pins 203, are connected with each other through the connecting sheet 206, and the outer walls of the two first pins 202 at the edge are connected with the lead frame 201 through the connecting sheet 206, so that the connection stability of the first pins 202 is greatly improved through the arrangement of the connecting sheet 206.
Example 2
Referring to fig. 1 to 4, which are a second embodiment of the present utility model, the embodiment is based on the previous embodiment, and a matrix type semiconductor lead frame includes a frame substrate 1 and a plurality of mounting units arranged in a matrix type in the frame substrate 1, the mounting units including a first mounting unit 2 and a second mounting unit 3, the first mounting unit 2 and the second mounting unit 3 having the same structure;
the first mounting unit 2 comprises a lead frame 201, wherein one side of the inner wall of the lead frame 201 is provided with a plurality of first pins 202, and the other side of the inner wall of the lead frame 201 is provided with a plurality of second pins 203 corresponding to the first pins 202 in position;
the outer walls of one ends of the first pins 202 close to the second pins 203 are connected with each other through connecting sheets 206, and the outer walls of the two first pins 202 at the edge are connected with the lead frame 201 through connecting sheets 206.
Further, a U-shaped groove 2021 is disposed at an end of the first pin 202 near the second pin 203, an extension portion 2031 is disposed at an end of the second pin 203 near the first pin 202, and the extension portion 2031 extends into the U-shaped groove 2021.
By adopting the above technical scheme, through setting up U-shaped groove 2021 and extension 2031, can improve the planarization of lead frame, and U-shaped groove 2021 can play the guard action to extension 2031 simultaneously.
Further, a protruding portion 204 is further provided on one side of the outer wall of the lead frame 201, a groove 205 is provided on one side of the outer wall of the lead frame 201 symmetrical to the protruding portion 204, and the protruding portion 204 and the groove 205 are adapted to be connected to the frame substrate 1.
Through adopting above-mentioned technical scheme, through setting up recess 205 and bellying 204, be convenient for fix a position the installation unit, can improve the stability of installation unit simultaneously.
Further, the plurality of first pins 202 and the plurality of second pins 203 are uniformly arranged.
Through adopting above-mentioned technical scheme, through making first pin 202 and second pin 203 evenly arrange, can promote lead frame's pleasing to the eye degree, convenient production simultaneously.
Further, the second pins 203 are in a shape of a "convex".
Through adopting above-mentioned technical scheme, through making second pin 203 be "protruding" font can increase the area of being under force of second pin 203, stability is good.
Further, a plurality of positioning grooves 4 are formed in the peripheral outer edges of the frame substrate 1, and arc-shaped chamfer angles 5 are formed in four corners of the frame substrate 1.
Through adopting above-mentioned technical scheme, through seting up constant head tank 4, be convenient for install the lead frame, fix a position the lead frame.
Working principle: compared with the prior art, the utility model has the advantages that the first pin 202 is connected with the lead frame body 201 through the connecting sheet 206, the connection strength of the first pin 202 and the second pin 203 is greatly improved, the lead frame is not easy to deform when external force is applied, in addition, the plurality of mounting units are arranged on the lead frame, so that each mounting unit is convenient to maintain independently, and meanwhile, the quantity adjustment can be required, and the applicability is strong.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
Claims (6)
1. A matrix semiconductor lead frame comprising a frame substrate (1) and a plurality of mounting units arranged in a matrix within the frame substrate (1), characterized in that: the mounting unit comprises a first mounting unit (2) and a second mounting unit (3), and the first mounting unit (2) and the second mounting unit (3) are identical in structure;
the first mounting unit (2) comprises a lead frame body (201), wherein one side of the inner wall of the lead frame body (201) is provided with a plurality of first pins (202), and the other side of the inner wall of the lead frame body (201) is provided with a plurality of second pins (203) corresponding to the first pins (202);
the outer walls of one ends of the first pins (202) close to the second pins (203) are connected with each other through connecting sheets (206), and the outer walls of the two first pins (202) located at the edges are connected with the lead frame body (201) through the connecting sheets (206).
2. The matrix semiconductor lead frame of claim 1, wherein: one end of the first pin (202) close to the second pin (203) is provided with a U-shaped groove (2021), one end of the second pin (203) close to the first pin (202) is provided with an extension part (2031), and the extension part (2031) extends into the U-shaped groove (2021).
3. The frame as claimed in claim 1, wherein: the lead frame is characterized in that a protruding portion (204) is further arranged on one side of the outer wall of the lead frame body (201), a groove (205) is formed in one side, symmetrical to the protruding portion (204), of the outer wall of the lead frame body (201), and the protruding portion (204) and the groove (205) are suitable for being connected with the frame substrate (1).
4. The matrix semiconductor lead frame of claim 1, wherein: the first pins (202) and the second pins (203) are uniformly distributed.
5. The matrix semiconductor lead frame of claim 4, wherein: the second pins (203) are in a convex shape.
6. The matrix semiconductor lead frame of claim 1, wherein: a plurality of positioning grooves (4) are formed in the peripheral outer edges of the frame substrate (1), and arc-shaped chamfer angles (5) are formed in four corners of the frame substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322032374.9U CN220367914U (en) | 2023-07-31 | 2023-07-31 | Matrix semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322032374.9U CN220367914U (en) | 2023-07-31 | 2023-07-31 | Matrix semiconductor lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220367914U true CN220367914U (en) | 2024-01-19 |
Family
ID=89519300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322032374.9U Active CN220367914U (en) | 2023-07-31 | 2023-07-31 | Matrix semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220367914U (en) |
-
2023
- 2023-07-31 CN CN202322032374.9U patent/CN220367914U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |