CN216391516U

CN216391516U - High-precision multilayer PCB circuit board

Info

Publication number: CN216391516U
Application number: CN202122777409.2U
Authority: CN
Inventors: 万媛萍
Original assignee: Suzhou Wutong Electronic Co ltd
Current assignee: Suzhou Wutong Electronic Co ltd
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2022-04-26
Anticipated expiration: 2031-11-12

Abstract

The utility model discloses a high-precision multilayer PCB circuit board, and relates to the technical field of PCBs. The plate comprises a plate body, wherein a soldering bath is arranged on the surface of the plate body, the plate body comprises an inner layer and an outer layer, a metal partition plate is arranged in the middle of the outer layer, a through hole is formed in the plate body, tin points are filled in the through hole, an outer flaring is arranged on the outer surface of the soldering bath, an inserted bar and an inserting groove are arranged in the soldering bath, the inner layer and the outer layer are both provided with two layers, the two inner layers are mutually attached, and the two outer layers are respectively attached to the outer surfaces of the two inner layers; through setting up metal partition board both sides formation electromagnetic interference resistant interlayer about the plate body, shield external electromagnetic signal, reduce the PCB inboard circuit and receive the interference, set up the soldering bath and restrict the solder joint, restrict the scope of dripping of liquid tin, avoid liquid tin to stretch to other positions, guarantee the soldering precision to guarantee the holistic work precision of circuit board.

Description

High-precision multilayer PCB circuit board

Technical Field

The utility model relates to the technical field of PCBs, in particular to a high-precision multilayer PCB.

Background

The PCB multilayer board is a multilayer circuit board used in electrical products, and relates to a wide range of fields, such as household appliances, computer periphery, communication, photoelectric equipment, instruments and meters, toys, aerospace, military industry, medical products, LED lighting and other industries.

In the prior art, a multilayer PCB is used as a common electronic element in a large amount in work such as circuit design, teaching and the like, and the operation precision of a circuit is easily influenced by states such as a tin soldering point state, a magnetic field of a connecting device and the like, so that the operation effect of the circuit is poor.

SUMMERY OF THE UTILITY MODEL

The utility model provides a high-precision multilayer PCB circuit board to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: a high-precision multilayer PCB comprises a board body, wherein a soldering groove is formed in the surface of the board body;

the plate body comprises an inner layer and an outer layer, a metal partition plate is arranged in the middle of the outer layer, a through hole is formed in the plate body, and tin dots are filled in the through hole;

the outer surface of the soldering bath is provided with an outer flaring, and the inside of the soldering bath is provided with an inserted bar and a slot.

Further, inlayer and skin all are provided with two, and two inlayers are laminated each other, and two skins are laminated respectively at the surface of two inlayers.

Furthermore, the upper surface and the lower surface of the inner layer and the outer layer are respectively provided with an easily-interfered circuit and an anti-interference circuit, and the circuits are connected with the tin point at the through hole.

Furthermore, the soldering groove is provided with two, and two soldering groove symmetry joint are at the upper and lower both ends of through-hole, and two soldering grooves pass through the inserted bar and peg graft with the slot.

Furthermore, the outer surface of the soldering tin groove is inclined, and the soldering tin groove is adhered to the surface of the plate body through colloid.

Furthermore, the opposite face of soldering tin groove is provided with the flange, and above-mentioned flange and through-hole looks adaptation to the joint is in the through-hole.

Compared with the prior art, the utility model provides the multilayer PCB with high precision, which has the following beneficial effects:

this multilayer PCB circuit board that precision is high forms the electromagnetic interference resistance interlayer through setting up metal partition about the plate body both sides, shields outside electromagnetic signal, reduces the PCB inboard circuit and receives the interference, sets up the soldering groove and restricts the solder joint, restricts the drip scope of liquid tin, avoids liquid tin to stretch to other positions, guarantees the soldering precision to guarantee the holistic work precision of circuit board.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a cross-sectional view of the present invention;

fig. 3 is a schematic view of a solder bath structure according to the present invention.

In the figure: 1. a plate body; 11. an inner layer; 12. an outer layer; 13. a metal separator; 14. a through hole; 15. tin points; 2. a soldering bath; 21. flaring outside; 22. inserting a rod; 23. and (4) a slot.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the utility model discloses a high-precision multilayer PCB circuit board, which comprises a board body 1, wherein a soldering tin groove 2 is arranged on the surface of the board body 1;

the plate body 1 comprises an inner layer 11 and an outer layer 12, a metal partition plate 13 is arranged in the middle of the outer layer 12, a through hole 14 is formed in the plate body 1, and tin points 15 are filled in the through hole 14;

the outer surface of the soldering bath 2 is provided with an outer flaring 21, and the inside of the soldering bath 2 is provided with an inserted bar 22 and an inserting groove 23.

Specifically, the inner layer 11 and the outer layer 12 are both provided with two layers, the two inner layers 11 are mutually attached, and the two outer layers 12 are respectively attached to the outer surfaces of the two inner layers 11; and the upper and lower surfaces of the inner layer 11 and the outer layer 12 are respectively provided with an easily-interfered circuit and an anti-interfered circuit, and the circuits are electrically connected with a tin point 15 at a through hole 14.

In this embodiment, the metal partition plate 13 is arranged in the middle of the outer layer 12, so that the electromagnetic signal shielding function is achieved, the outer layer 12 is arranged outside the inner layer 11, the electromagnetic signal interference on the inner layer 11 is reduced, and the electromagnetic protection effect is achieved on the easily interfered circuit on the inner layer 11, so that the circuit operation precision is improved.

Specifically, the number of the soldering tin grooves 2 is two, the two soldering tin grooves 2 are symmetrically clamped at the upper end and the lower end of the through hole 14, and the two soldering tin grooves 2 are inserted into the slots 23 through the insertion rods 22.

In this embodiment, two soldering tin grooves 2 are combined through the insertion of the insertion rod 22 and the insertion slot 23, so that the soldering tin grooves are convenient to install and position, and the twisting between the two soldering tin grooves 2 is avoided.

Specifically, the outer surface of the soldering tin groove 2 is inclined, and the soldering tin groove 2 is adhered to the surface of the plate body 1 through colloid.

In this embodiment, the soldering groove 2 is improved in smoothness with the plate body 1 by the inclined surface of the outer surface, and avoids the hooking phenomenon with other structures.

Specifically, the opposite surface of the soldering tin groove 2 is provided with a flange, and the flange is matched with the through hole 14 and is clamped in the through hole 14.

In the present embodiment, the flange serves to fix the position of the soldering groove 2, and prevents the soldering groove 2 from being dislocated during use.

In conclusion, this multilayer PCB circuit board that precision is high forms electromagnetic interference resistant interlayer through setting up metal baffle 13 in plate body 1 upper and lower both sides, shields outside electromagnetic signal, reduces the PCB inboard circuit and receives the interference, sets up soldering bath 2 and limits the welding point, limits the scope of dripping of liquid tin, avoids liquid tin to stretch to other positions, guarantees the soldering precision to guarantee the holistic work precision of circuit board.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a multilayer PCB circuit board that precision is high, includes plate body (1), its characterized in that: a tin soldering groove (2) is formed in the surface of the plate body (1);

the plate body (1) comprises an inner layer (11) and an outer layer (12), a metal partition plate (13) is arranged in the middle of the outer layer (12), a through hole (14) is formed in the plate body (1), and tin dots (15) are filled in the through hole (14);

the outer surface of the soldering bath (2) is provided with an outer flaring (21), and the inside of the soldering bath (2) is provided with an inserted bar (22) and an inserting groove (23).

2. A high precision multilayer PCB circuit board according to claim 1, wherein: the inner layer (11) and the outer layer (12) are both provided with two layers, the two inner layers (11) are mutually attached, and the two outer layers (12) are respectively attached to the outer surfaces of the two inner layers (11).

3. A high precision multilayer PCB circuit board according to claim 1, wherein: the upper surface and the lower surface of the inner layer (11) and the outer layer (12) are respectively provided with an easily-interfered circuit and an anti-interfered circuit, and the circuits are electrically connected with the tin points (15) at the through holes (14).

4. A high precision multilayer PCB circuit board according to claim 1, wherein: the soldering tin grooves (2) are arranged in two numbers, the two soldering tin grooves (2) are symmetrically clamped at the upper end and the lower end of the through hole (14), and the two soldering tin grooves (2) are connected with the inserting grooves (23) in an inserting mode through the inserting rods (22).

5. A high precision multilayer PCB circuit board according to claim 1, wherein: the outer surface of the soldering tin groove (2) is inclined, and the soldering tin groove (2) is adhered to the surface of the plate body (1) through colloid.

6. A high precision multilayer PCB circuit board according to claim 1, wherein: the opposite face of soldering tin groove (2) is provided with the flange, and above-mentioned flange and through-hole (14) looks adaptation to the joint is in through-hole (14).