CN216389321U - High-power multi-chip packaging structure - Google Patents
High-power multi-chip packaging structure Download PDFInfo
- Publication number
- CN216389321U CN216389321U CN202122518384.4U CN202122518384U CN216389321U CN 216389321 U CN216389321 U CN 216389321U CN 202122518384 U CN202122518384 U CN 202122518384U CN 216389321 U CN216389321 U CN 216389321U
- Authority
- CN
- China
- Prior art keywords
- plate
- packaging
- pressing mechanism
- pins
- power multi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of semiconductor packaging structures, and discloses a high-power multi-chip packaging structure which comprises a packaging plate and a bearing plate, wherein the bearing plate is movably arranged at two ends of the surface of the top of the packaging plate, the packaging plate is arranged at the bottom of the bearing plate, the packaging plate comprises a pressing mechanism, the pressing mechanism is arranged at two ends inside the packaging plate, a connecting plate is movably connected to the top of the pressing mechanism, clamping plates are arranged on the periphery of the top of the pressing mechanism, pins are arranged on one side of the bottom of each clamping plate, a supporting plate is fixedly connected to the bottom of the pressing mechanism, positioning plates are arranged at two ends of the outer side of the supporting plate, a sliding plate is arranged inside the positioning plates, and connecting rods are slidably connected to two ends of the outer side of the sliding plate. The pins penetrate through the inside of the bearing plate and are communicated with the heat dissipation pins, so that a plurality of high-power device chips can be effectively mixed and packaged, the heat dissipation efficiency is high, the packaging and processing technology is simple, and the reliability and the yield of products are improved.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging structures, in particular to a high-power multi-chip packaging structure.
Background
A semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. The semiconductor has wide application in radio, television and temperature measurement. Such as diodes, are devices fabricated using semiconductors. Semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. The importance of semiconductors is enormous, both from a technological and economic point of view. Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications.
At present, the existing installation process is inconvenient to disassemble and assemble, and the heat generated inside cannot be timely dissipated when the device is used, so that the device needs to be improved.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a high power multi-chip package structure, which solves the above problems.
In order to achieve the purpose, the utility model provides the following technical scheme:
a high-power multi-chip packaging structure comprises a packaging plate and a bearing plate, wherein the bearing plate is movably arranged at two ends of the top surface of the packaging plate, and the packaging plate is arranged at the bottom of the bearing plate.
The packaging plate comprises a pressing mechanism, the pressing mechanism is arranged at two ends inside the packaging plate, a connecting plate is movably connected to the top of the pressing mechanism, a clamping plate is arranged on the periphery of the top of the pressing mechanism, and pins are arranged on one side of the bottom of the clamping plate.
The bearing plate comprises positioning holes and heat dissipation pins, the positioning holes are formed in two ends of the surface of the bearing plate, and the heat dissipation pins are arranged on the side face of the bearing plate.
Preferably, pressing mechanism bottom fixedly connected with backup pad, backup pad outside both ends are provided with the locating plate, the inside slide that is provided with of locating plate, slide outside both ends sliding connection has the connecting rod, connecting rod outside one end swing joint has elastic spring, elastic spring bottom swing joint has the fly leaf.
Preferably, the pins penetrate through the inside of the bearing plate and are communicated with the heat dissipation pins, so that a plurality of high-power device chips can be effectively mixed and packaged, the heat dissipation efficiency is high, the packaging and processing technology is simple, and the reliability and the yield of products can be improved.
Preferably, both ends outside the supporting plate are fixedly connected with the sliding plate, the sliding plate is connected with the surface of the positioning plate in a sliding mode, and the movable plate can be synchronously driven to move after the pressing mechanism is pressed down by a worker, so that the clamping and fixing effects are achieved.
Preferably, the movable plate moves synchronously with the supporting plate through the elastic spring, so that the chip is conveniently clamped on the supporting plate, otherwise, after the movable plate is pressed again, the movable plate can be effectively clamped in a groove formed in the side edge of the supporting plate, and the movable plate is folded.
Preferably, the locating plate outside one end is seted up flutedly, just the fly leaf passes through elastic spring and recess activity joint, and the staff is after connecting the chip card at the loading board, through pressing the loading board, under pressing mechanism's effect, can effectively let the backup pad downstream, and then lets the connecting rod drive elastic spring and move down, can let the fly leaf expand in locating plate bottom one side, after the fly leaf forms 90 with the locating plate, connecting rod outside one end and fly leaf surface joint reach the effect of fixed joint.
The utility model provides a high-power multi-chip packaging structure, which has the following beneficial effects:
(1) the pins penetrate through the interior of the bearing plate and are communicated with the heat dissipation pins, so that a plurality of high-power device chips can be effectively mixed and packaged, the heat dissipation efficiency is high, the packaging processing technology is simple, and the reliability and the yield of products are improved.
(2) According to the chip card fixing device, the groove is formed in one end of the outer side of the positioning plate, the movable plate is movably clamped with the groove through the elastic spring, after a worker connects a chip card to the bearing plate, the bearing plate is pressed, the supporting plate can effectively move downwards under the action of the pressing mechanism, the connecting rod drives the elastic spring to move downwards, the movable plate can be unfolded on one side of the bottom of the positioning plate, and after the movable plate and the positioning plate form an angle of 90 degrees, one end of the outer side of the connecting rod is clamped with the surface of the movable plate, so that the fixed clamping effect is achieved.
Drawings
FIG. 1 is a schematic view of the overall structure of the front side of the present invention;
FIG. 2 is a schematic view of a front carrier plate structure according to the present invention;
FIG. 3 is a schematic view of the side package board and carrier board connection structure of the present invention;
fig. 4 is a structural overall schematic diagram of a side pressing mechanism of the present invention.
In the figure: 1. a package board; 101. a pressing mechanism; 102. a connecting plate; 103. clamping a plate; 104. a pin; 105. a support plate; 106. positioning a plate; 107. a connecting rod; 108. a slide plate; 109. an elastic spring; 110. a movable plate; 2. a carrier plate; 201. positioning holes; 202. and a heat dissipation pin.
Detailed Description
As shown in fig. 1 to 4, the present invention provides a technical solution:
a high-power multi-chip packaging structure comprises a packaging plate 1 and a bearing plate 2, wherein the bearing plate 2 is movably arranged at two ends of the top surface of the packaging plate 1, and the packaging plate 1 is arranged at the bottom of the bearing plate 2.
The packaging plate 1 comprises a pressing mechanism 101, the pressing mechanism 101 is arranged at two ends inside the packaging plate 1, a connecting plate 102 is movably connected at the top of the pressing mechanism 101, a clamping plate 103 is arranged around the top of the pressing mechanism 101, a pin 104 is arranged at one side of the bottom of the clamping plate 103, a supporting plate 105 is fixedly connected at the bottom of the pressing mechanism 101, two ends of the outer side of the supporting plate 105 are fixedly connected with a sliding plate 108, the sliding plate 108 is in sliding connection with the surface of a positioning plate 106, a worker can synchronously drive the movable plate 110 to move after pressing down the pressing mechanism 101, the clamping and fixing effects are achieved, the positioning plate 106 is arranged at two ends of the outer side of the supporting plate 105, a groove is formed in one end of the outer side of the positioning plate 106, the movable plate 110 is movably clamped with the groove through an elastic spring 109, the worker can effectively enable the supporting plate 105 to move downwards by pressing the supporting plate 2 after connecting the chip card to the supporting plate 2, and then the connecting rod 107 drives the elastic spring 109 to move downwards, so that the movable plate 110 can be unfolded at one side of the bottom of the positioning plate 106, after the movable plate 110 and the positioning plate 106 form an angle of 90 degrees, one end of the outer side of the connecting rod 107 is clamped with the surface of the movable plate 110, thereby achieving the effect of fixed clamping, the positioning plate 106 is internally provided with the sliding plate 108, two ends of the outer side of the sliding plate 108 are slidably connected with the connecting rod 107, one end of the outer side of the connecting rod 107 is movably connected with the elastic spring 109, the bottom of the elastic spring 109 is movably connected with the movable plate 110, the movable plate 110 and the supporting plate 105 synchronously move through the elastic spring 109, so that the chip card can be conveniently connected on the bearing plate 2, otherwise, after being pressed again, the movable plate 110 can be effectively clamped in a groove formed in the side of the supporting plate 105, and the movable plate 110 can be folded.
The bearing plate 2 comprises a positioning hole 201 and heat dissipation pins 202, the positioning hole 201 is formed in two ends of the surface of the bearing plate 2, the heat dissipation pins 202 are arranged on the side face of the bearing plate 2, and the pins 104 penetrate through the inside of the bearing plate 2 and are communicated with the heat dissipation pins 202, so that a plurality of high-power device chips can be effectively mixed and packaged, the heat dissipation efficiency is high, the packaging processing technology is simple, and the reliability and the yield of products are improved.
In conclusion, the pins 104 penetrate through the inside of the bearing plate 2 and are communicated with the heat dissipation pins 202, so that a plurality of high-power device chips can be effectively mixed and packaged, the heat dissipation efficiency is high, the packaging processing technology is simple, and the reliability and the yield of products can be improved; the positioning plate 106 is provided with a groove at one end outside, the movable plate 110 is movably clamped with the groove through the elastic spring 109, after the chip card is connected with the supporting plate 2, a worker can effectively enable the supporting plate 105 to move downwards under the action of the pressing mechanism 101 by pressing the supporting plate 2, so that the connecting rod 107 drives the elastic spring 109 to move downwards, the movable plate 110 can be unfolded at one side of the bottom of the positioning plate 106, and after the movable plate 110 and the positioning plate 106 form 90 degrees, one end outside the connecting rod 107 is clamped with the surface of the movable plate 110 to achieve the effect of fixed clamping.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Claims (6)
1. The utility model provides a high-power multi-chip packaging structure, includes package board (1) and loading board (2), its characterized in that: the bearing plates (2) are movably arranged at two ends of the top surface of the packaging plate (1), and the packaging plate (1) is arranged at the bottom of the bearing plates (2);
the packaging plate (1) comprises a pressing mechanism (101), the pressing mechanism (101) is arranged at two ends inside the packaging plate (1), the top of the pressing mechanism (101) is movably connected with a connecting plate (102), clamping plates (103) are arranged on the periphery of the top of the pressing mechanism (101), and pins (104) are arranged on one side of the bottom of each clamping plate (103);
the bearing plate (2) comprises positioning holes (201) and heat dissipation pins (202), the positioning holes (201) are formed in two ends of the surface of the bearing plate (2), and the heat dissipation pins (202) are arranged on the side face of the bearing plate (2).
2. The high power multi-chip package structure of claim 1, wherein: pressing means (101) bottom fixedly connected with backup pad (105), backup pad (105) outside both ends are provided with locating plate (106), locating plate (106) inside is provided with slide (108), slide (108) outside both ends sliding connection has connecting rod (107), connecting rod (107) outside one end swing joint has elastic spring (109), elastic spring (109) bottom swing joint has fly leaf (110).
3. The high power multi-chip package structure of claim 1, wherein: the pins (104) penetrate through the interior of the bearing plate (2) and are communicated with the heat dissipation pins (202).
4. A high power multi-chip package structure according to claim 2, wherein: the two ends of the outer side of the supporting plate (105) are fixedly connected with a sliding plate (108), and the sliding plate (108) is connected with the surface of the positioning plate (106) in a sliding manner.
5. A high power multi-chip package structure according to claim 2, wherein: the movable plate (110) moves synchronously with the support plate (105) through an elastic spring (109).
6. A high power multi-chip package structure according to claim 2, wherein: one end of the outer side of the positioning plate (106) is provided with a groove, and the movable plate (110) is movably clamped with the groove through an elastic spring (109).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122518384.4U CN216389321U (en) | 2021-10-19 | 2021-10-19 | High-power multi-chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122518384.4U CN216389321U (en) | 2021-10-19 | 2021-10-19 | High-power multi-chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216389321U true CN216389321U (en) | 2022-04-26 |
Family
ID=81245589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122518384.4U Active CN216389321U (en) | 2021-10-19 | 2021-10-19 | High-power multi-chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216389321U (en) |
-
2021
- 2021-10-19 CN CN202122518384.4U patent/CN216389321U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20060263938A1 (en) | Stacked module systems and method | |
| CN109962147A (en) | A kind of metal substrate LED core chip package with pooling feature | |
| US9615483B2 (en) | Techniques and configurations associated with a package load assembly | |
| CN216389321U (en) | High-power multi-chip packaging structure | |
| CN111029293B (en) | Equipment for preventing deformation and used for semiconductor production and processing and using method thereof | |
| US20140354314A1 (en) | Thermal interface techniques and configurations | |
| CN109887863B (en) | IC packaging board installer | |
| Patterson et al. | A W-band CMOS PA encapsulated in an organic flip-chip package | |
| CN113629029B (en) | Semiconductor device and method for producing semiconductor device | |
| CN212991040U (en) | Packaging equipment for semiconductor production | |
| CN112850150A (en) | Multi-station pickup device for electronic part machining | |
| CN219226266U (en) | Fixing device for semiconductor packaging | |
| CN210325763U (en) | Packaging structure of semiconductor device | |
| CN204179065U (en) | Be suitable for the operation panel of semiconductor device paster processing procedure | |
| CN210245470U (en) | High-efficiency encapsulation moisture-proof integrated circuit device | |
| CN216250702U (en) | Semiconductor chip packaging module structure with low thermal resistance | |
| CN205488098U (en) | Big power semiconductor of area heat dissipation | |
| CN218824558U (en) | Manual high-voltage insulation test station | |
| CN212461652U (en) | Packaging hardware is used in chip processing | |
| Liu et al. | Systematic evaluation of die thinning application in a power SIPs by simulation | |
| CN207353239U (en) | A kind of mass-producted semi-finished product structure of integrated circuit semiconductor apparatus | |
| CN210498890U (en) | Power semiconductor chip welding device | |
| CN215069959U (en) | Lead frame for arranging chip and packaging body | |
| CN212625501U (en) | Semiconductor chip's pressfitting structure | |
| CN217542838U (en) | Clamping device for testing semiconductor wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |