CN212461652U

CN212461652U - Packaging hardware is used in chip processing

Info

Publication number: CN212461652U
Application number: CN202021780971.XU
Authority: CN
Inventors: 谢平亚; 刘平
Original assignee: Shenzhen Xindeyuan Technology Co ltd
Current assignee: Shenzhen Xindeyuan Technology Co ltd
Priority date: 2020-08-24
Filing date: 2020-08-24
Publication date: 2021-02-02
Anticipated expiration: 2030-08-24

Abstract

The utility model belongs to the field of chip processing, in particular to a packaging device for chip processing, which comprises a frame, a bottom plate and a substrate packaging and fixing structure, wherein the bottom plate is arranged at the end part of the frame, two clamping grooves are arranged on the end surface of the bottom plate, two sliders are respectively connected on the two clamping grooves in a sliding way, and a reset spring is connected between the inner side wall of each clamping groove and each slider; the substrate packaging and fixing structure is arranged on the end face of the bottom plate and comprises a plurality of fixing clamping blocks, a swinging rod, a push plate and a driving device, and the fixing clamping blocks are respectively connected with the sliding blocks; the end parts of the fixed clamping blocks are respectively provided with a push plate, the end surfaces of the push plates, which are close to the fixed clamping blocks, are in contact with the fixed clamping blocks through a pressing wheel, the end parts, which are far away from the pressing wheel, of the push plates are hinged with a first push rod and a second push rod, and the free ends of the first push rod and the second push rod are movably connected with the end surface of the bottom plate. The utility model discloses can utilize base plate encapsulation fixed knot to construct and fix the chip substrate, guarantee the stability of chip substrate in follow-up packaging process.

Description

Packaging hardware is used in chip processing

Technical Field

The utility model relates to a chip processing field specifically is an encapsulating device is used in chip processing.

Background

The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, and has wide application in radio, television and temperature measurement, for example, a diode is a device made of a semiconductor, the semiconductor is a material with controllable electric conductivity ranging from an insulator to a conductor, the importance of the semiconductor is very great from the viewpoint of technology or economic development, most of electronic products in the present day, such as computers, mobile phones or digital audio recorders, have very close relationship with the semiconductor, common semiconductor materials include silicon, germanium, gallium arsenide and the like, and silicon is the most influential one of various semiconductor materials in commercial application.

The electronic packaging is just a tube shell for mounting the integrated circuit built-in chip for external use, plays a role of placing, fixing and sealing, protects the integrated circuit built-in chip, and enhances the environmental adaptation capability, and riveting points on the integrated circuit chip are also contacts which are welded on pins of the packaging tube shell. Packaging structure's rationality and scientificity will directly influence integrated circuit's quality, and current electronic packaging all installs a chip substrate with the subassembly on, and this chip substrate passes through fixed knot to be constructed fixed back, and rethread packaging hardware encapsulates it, and current packaging hardware's fixed knot constructs can not effectively fix the chip substrate, leads to the condition that follow-up encapsulation in-process may appear removing.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a packaging hardware is used in chip processing to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a packaging device for chip processing comprises a frame, a bottom plate and a substrate packaging and fixing structure, wherein the bottom plate is arranged at the end part of the frame, two clamping grooves are formed in the end surface of the bottom plate, two sliding blocks are connected to the two clamping grooves in a sliding manner, and a reset spring is connected between the inner side wall of each clamping groove and each sliding block; the substrate packaging and fixing structure is arranged on the end face of the bottom plate and comprises a plurality of fixing clamping blocks, a swinging rod, a push plate and a driving device, and the fixing clamping blocks are respectively connected with the sliding blocks; the end parts of the fixed clamping blocks are respectively provided with a push plate, the end surfaces of the push plates, which are close to the fixed clamping blocks, are in contact with the fixed clamping blocks through a pressing wheel, the end parts, which are far away from the pressing wheel, of the push plates are hinged with a first push rod and a second push rod, and the free ends of the first push rod and the second push rod are movably connected with the end surface of the bottom plate.

Preferably, the swing rod is arc-shaped and comprises a first swing part and a second swing part which are connected through a hinge, the first swing part is arranged on two sides of the second swing part and is movably connected with the two first push rods respectively.

Preferably, the driving device is used for driving the swinging rod to operate, the driving device comprises a motor, a guide rail, a sliding plate and a pushing block, the motor and the guide rail are fixedly arranged on the end face of the bottom plate, and the output end of the motor is connected with a rotating disc.

Preferably, the connecting rod is hinged at the eccentric position of the end face of the rotating disc, the free end of the connecting rod is movably connected with the sliding plate, and the sliding plate is in sliding connection with the guide rail.

Preferably, the end part of the sliding plate close to the swinging rod is connected with a pushing block, and the pushing block can push the swinging rod to operate when the motor operates.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses can utilize base plate encapsulation fixed knot to construct and fix the chip substrate, guarantee the stability of chip substrate in follow-up packaging process. The substrate packaging fixing structure drives the rotating disc to operate through the motor, the rotating disc is made to drive the sliding plate to move through the connecting rod, the pushing block at the end part of the sliding plate pushes the second swinging part of the swinging rod, the second swinging part pulls the first swinging part, the first swinging part is utilized to drive the two push rods, the push rods are made to drive the push plate, the push plate is made to push the fixing clamping block to move, the fixing clamping block is utilized to fix the chip substrate, the push plate is always parallel to the fixing clamping block, the fact that the fixing clamping block is pushed in the vertical direction can be guaranteed, the clamping force which is beneficial to the fixing clamping block is uniformly distributed, and the local stress of the fixing clamping block is.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is an enlarged schematic structural diagram of a in fig. 1 according to the present invention.

In the figure: 1. a base plate; 101. a clamping groove; 102. a return spring; 2. fixing the clamping block; 3. a swing lever; 31. a first swing portion; 32. a second swing portion; 4. pushing the plate; 5. a pinch roller; 6. a first push rod; 7. a second push rod; 8. a guide rail; 9. a slide plate; 10. a pushing block; 11. rotating the disc; 12. a connecting rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1-2, the present invention provides a technical solution: a packaging device for chip processing comprises a rack, a bottom plate 1 and a substrate packaging and fixing structure, wherein the bottom plate 1 is arranged at the end part of the rack, two clamping grooves 101 are formed in the end surface of the bottom plate 1, two sliding blocks are connected to the two clamping grooves 101 in a sliding manner, and a reset spring 102 is connected between the inner side wall of each clamping groove 101 and each sliding block; the substrate packaging and fixing structure is arranged on the end face of the bottom plate 1 and comprises a plurality of fixing clamping blocks 2, a swinging rod 3, a push plate 4 and a driving device, and the fixing clamping blocks 2 are connected to the sliding blocks respectively; the end part of the fixed clamping block 2 is provided with a push plate 4, the end surface of the push plate 4 close to the fixed clamping block 2 is contacted with the fixed clamping block 2 through a pressing wheel 5, the end part of the push plate 4 far away from the pressing wheel 5 is hinged with a first push rod 6 and a second push rod 7, and the free end of the first push rod 6 and the free end of the second push rod 7 are movably connected with the end surface of the bottom plate 1.

In the present embodiment, the swing rod 3 is arc-shaped and includes a first swing portion 31 and a second swing portion 32 connected by a hinge, the first swing portion 31 is disposed on two sides of the second swing portion 32 and movably connected to the two first push rods 6 respectively.

In this embodiment, the driving device is used for driving the swing rod 3 to operate, the driving device includes a motor, a guide rail 8, a sliding plate 9 and a pushing block 10, the motor and the guide rail 8 are fixedly installed on the end surface of the bottom plate 1, and the output end of the motor is connected with a rotating disc 11.

In the embodiment, a connecting rod 12 is hinged at an eccentric position of the end surface of the rotating disc 11, the free end of the connecting rod 12 is movably connected with the sliding plate 9, and the sliding plate 9 is in sliding connection with the guide rail 8.

In this embodiment, a pushing block 10 is connected to the end of the sliding plate 9 close to the swing lever 3, and the pushing block 10 can push the swing lever 3 to operate when the motor operates.

The utility model discloses can utilize base plate encapsulation fixed knot to construct and fix the chip substrate, guarantee the stability of chip substrate in follow-up packaging process. The substrate packaging fixing structure drives the rotating disc 11 to operate through the motor, the rotating disc 11 drives the sliding plate 9 to move through the connecting rod 12, the pushing block 10 at the end part of the sliding plate 9 pushes the second swinging part 32 of the swinging rod 3, the second swinging part 32 pulls the first swinging part 31, the first swinging part 31 is utilized to drive the two push rods 6, the push rods 6 are enabled to drive the push plate 4, the push plate 4 is enabled to push the fixing clamping block 2 to move, the fixing clamping block 2 is utilized to fix the chip substrate, the push plate 4 is always parallel to the fixing clamping block 2, the fact that the fixing clamping block 2 is pushed in the vertical direction can be guaranteed, the clamping force which is beneficial to the fixing clamping block 2 is evenly distributed, and local stress of the fixing clamping block is avoided.

It is worth noting that: whole device is connected with power and total control button, and it realizes controlling it through total control button, because the equipment that control button matches is equipment commonly used, belongs to current mature technology, no longer gives unnecessary details its electric connection relation and concrete circuit structure here.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The packaging device for chip processing is characterized by comprising a rack, a bottom plate (1) and a substrate packaging and fixing structure, wherein the bottom plate (1) is arranged at the end part of the rack, two clamping grooves (101) are formed in the end surface of the bottom plate (1), two sliding blocks are connected to the two clamping grooves (101) in a sliding manner, and a reset spring (102) is connected between the inner side wall of each clamping groove (101) and each sliding block; the substrate packaging and fixing structure is arranged on the end face of the bottom plate (1), and comprises a plurality of fixing clamping blocks (2), a swinging rod (3), a push plate (4) and a driving device, wherein the fixing clamping blocks (2) are respectively connected to the sliding blocks; the end part of the fixed clamping block (2) is provided with a push plate (4), the end face of the push plate (4) close to the fixed clamping block (2) is contacted with the fixed clamping block (2) through a pressing wheel (5), the end part of the push plate (4) far away from the pressing wheel (5) is hinged with a first push rod (6) and a second push rod (7), and the free ends of the first push rod (6) and the second push rod (7) are movably connected with the end face of the bottom plate (1).

2. The packaging apparatus for chip processing according to claim 1, wherein: the swing rod (3) is arc-shaped and comprises a first swing portion (31) and a second swing portion (32) which are connected through a hinge, and the first swing portion (31) is arranged on two sides of the second swing portion (32) and is movably connected with the two first push rods (6) respectively.

3. The packaging apparatus for chip processing according to claim 1, wherein: the driving device is used for driving the swinging rod (3) to operate and comprises a motor, a guide rail (8), a sliding plate (9) and a pushing block (10), the motor and the guide rail (8) are fixedly arranged on the end face of the bottom plate (1), and the output end of the motor is connected with a rotating disc (11).

4. The packaging apparatus for chip processing according to claim 3, wherein: the eccentric position of the end face of the rotating disc (11) is hinged with a connecting rod (12), the free end of the connecting rod (12) is movably connected with a sliding plate (9), and the sliding plate (9) is in sliding connection with the guide rail (8).

5. The packaging apparatus for chip processing according to claim 4, wherein: the end part of the sliding plate (9) close to the swinging rod (3) is connected with a pushing block (10), and the pushing block (10) can push the swinging rod (3) to operate when the motor operates.