CN212625501U

CN212625501U - Semiconductor chip's pressfitting structure

Info

Publication number: CN212625501U
Application number: CN202021385014.7U
Authority: CN
Inventors: 王晨玮; 其他发明人请求不公开姓名
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-15
Filing date: 2020-07-15
Publication date: 2021-02-26
Anticipated expiration: 2030-07-15

Abstract

The utility model discloses a semiconductor chip's pressfitting structure, include: a base; the clamping structure is fixedly arranged on the upper wall of the base and is positioned on the central line of the left end; the utility model relates to the technical field of chip processing, in particular to a downward pressing structure which is fixedly arranged on the upper wall of a base and is positioned on the central line of the right end, wherein a chip which is knocked and arranged in a packaging shell is placed on a bearing plate, and then two first electric push rods are controlled to contract to drive a moving block to move relatively, so that a stress rod is limited after contacting the packaging shell, and a spring is compressed; finally, the pressing plate is lowered to perform pressing by controlling the extension of the second electric push rod; the design structure is simple, the operation is convenient, the movement can be prevented in a limiting way in the pressing process, the packaging structure can be also suitable for more packaged chips with middle shapes, and more time and labor force can be saved.

Description

Semiconductor chip's pressfitting structure

Technical Field

The utility model relates to a chip processing technology field specifically is a semiconductor chip's pressfitting structure.

Background

Etching and wiring the semiconductor sheet to obtain a semiconductor device capable of realizing a certain function; not only silicon chips, but also semiconductor materials such as gallium arsenide and germanium are common; semiconductors are also trending like automobiles; in the seventies of the twentieth century, the dynamic random access memory (D-RAM) market of the intel and other american enterprises became popular; but in the eighties of the twentieth century, the japanese business listing of the first place, which required high performance D-RAM, due to the advent of large computers;

in the production of semiconductor devices, a chip is fixed in a packaging shell and connected with a conductive contact pin for installation and use; this is also a protection for the chip; after the packaging shell is installed, the packaging shell needs to be extruded by virtue of pressing equipment during fixing, so that the packaging shell is completely fixed without gaps, and the subsequent use requirement is kept; however, some of the existing pressing processes are completed manually, which requires a lot of time, and the existing pressing devices have complex structures and cannot ensure stable butt joint of the package housings during pressing, so a pressing structure for semiconductor chips is currently designed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor chip's pressfitting structure to the solution keeps the pressfitting butt joint stable and save time's problem.

In order to achieve the above object, the utility model provides a following technical scheme: a bonding structure of a semiconductor chip includes:

a base;

the clamping structure is fixedly arranged on the upper wall of the base and is positioned on the central line of the left end;

the pressing structure is fixedly arranged on the upper wall of the base and is positioned on the central line of the right end;

the clamping structure includes: the device comprises a support column, a bearing disc, two pairs of moving blocks with the same structure, a transfer disc, a pair of transfer rods with the same structure, two pairs of transmission rods with the same structure, a pair of first electric push rods with the same structure, two pairs of stress rods with the same structure and two pairs of springs with the same structure;

one end of each supporting column is fixedly welded on the upper wall of the base and positioned on a central line at the left end, the bearing disc is horizontally and fixedly welded on the other end of each supporting column, the side wall of each supporting column is provided with two pairs of sliding grooves with the same structure at equal circumferential intervals, the two pairs of moving blocks are respectively and movably embedded in the sliding grooves of the bearing disc, the central part of the top end of each moving block is provided with a rectangular limiting through hole, the adapter disc is movably sleeved on the other end of each supporting column and positioned below the bearing disc, one end of each adapter rod is respectively and fixedly welded on the lower wall at the bottom end of each moving block and respectively positioned at the central part of the adapter rod in mutual symmetry, one end of each drive rod is respectively and movably arranged on the upper wall of the adapter disc and respectively positioned at the four corners, the other end of each drive rod is respectively and movably arranged on the upper wall, and the telescopic ends of the two pairs of stress rods are movably sleeved on two sides of the other end of the other switching rod respectively and are positioned on two sides of the support column respectively and are symmetrically parallel to each other, one ends of the two pairs of stress rods movably penetrate through rectangular limiting through holes in the side wall of the top end of the moving block respectively, and the two pairs of springs are movably sleeved on the two pairs of stress rods respectively and are positioned between the other end of the stress rod and the side wall of the moving block respectively.

Preferably, the pressing structure includes: the mounting frame, the second electric push rod and the pressing plate;

one end of the mounting frame is fixedly welded on the upper wall of the base and located on a right end central line, the other end of the mounting frame is located right above the bearing disc, the second electric push rod is fixedly welded on the lower wall of the other end of the mounting frame, inclined threads are formed in the circumference of the outer side wall of the telescopic end of the second electric push rod and located right above the bearing disc, the pressing plate is of a circular structure, a threaded pipe is formed in the central position of the upper wall of the pressing plate, and the pressing plate can be detachably arranged on the telescopic end of the second electric push rod and is connected with.

Preferably, the press plates can be used by being mounted with the same structure and different diameters according to different machining sizes.

Preferably, the mounting frame is of an L-shaped structure.

Preferably, the moving block is of an H-shaped structure.

Preferably, the transmission rods are of L-shaped structures and are sequentially installed in the same clockwise direction.

Preferably, the adapter rod is of a T-shaped structure.

Compared with the prior art, the beneficial effects of the utility model are that: according to the pressing structure of the semiconductor chip, the chip which is knocked and installed in the packaging shell is placed on the bearing plate, so that the two first electric push rods are controlled to contract to drive the two moving blocks to move relatively, and meanwhile, the other two moving blocks move relatively similarly through transmission of the transmission rod; then two stress rods contact the packaging shell first and then carry out primary limiting on two sides of the packaging shell, and two springs are compressed; the other two stress rods are also contacted with the packaging shell and then stop along with the movement of the two pairs of moving blocks, so that the front side and the rear side as well as the left side and the right side of the whole packaging shell are clamped, fixed and limited; finally, the pressing plate is lowered to perform pressing by controlling the extension of the second electric push rod; the design structure is simple, the operation is convenient, the movement can be prevented in a limiting way in the pressing process, the packaging structure can be also suitable for more packaged chips with middle shapes, and more time and labor force can be saved.

Drawings

Fig. 1 is a schematic view of the split structure of the present invention;

fig. 2 is a schematic view of the installation structure of the present invention;

FIG. 3 is a schematic view of the assembly structure of the present invention;

fig. 4 is a schematic diagram of a partially enlarged structure a of the present invention.

In the figure: 1. the clamping device comprises a base, 2, a clamping structure, 21, a support column, 22, a bearing disc, 23, a moving block, 24, an adapter disc, 25, an adapter rod, 26, a transmission rod, 27, a first electric push rod, 28, a stress rod, 29, a spring, 3, a pressing structure, 31, an installation frame, 32, a second electric push rod, 33 and a pressing plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a bonding structure of a semiconductor chip includes: a base 1; the clamping structure 2 is fixedly arranged on the upper wall of the base 1, is positioned on the central line of the left end and is pressed up and down by the structure 3, and is fixedly arranged on the upper wall of the base 1 and is positioned on the central line of the right end; clamping structure 2, comprising: the device comprises a support column 21, a bearing disc 22, two pairs of moving blocks 23 with the same structure, an adapter disc 24, a pair of adapter rods 25 with the same structure, two pairs of transmission rods 26 with the same structure, a pair of first electric push rods 27 with the same structure, two pairs of stress rods 28 with the same structure and two pairs of springs 29 with the same structure; one end of a pillar 21 is fixedly welded on the upper wall of the base 1 and is positioned on a center line of the left end, a bearing disc 22 is horizontally and fixedly welded on the other end of the pillar 21, the side wall of the bearing disc is provided with two pairs of chutes with the same structure at equal circumferential distance, two pairs of moving blocks 23 are respectively and movably embedded in the chutes of the bearing disc 22, the center part of the top end of the bearing disc is provided with a rectangular limit through hole, an adapter disc 24 is movably sleeved on the other end of the pillar 21 and is positioned below the bearing disc 22, one end of a pair of adapter rods 25 is respectively and fixedly welded on the lower wall of the bottom ends of one pair of moving blocks 23 and is respectively and symmetrically positioned at the center part, one end of two pairs of transmission rods 26 is respectively and movably arranged on the upper wall of the adapter disc 24 and is respectively positioned at four corners, the other end of the two pairs of first electric push, the telescopic ends of the two pairs of stress rods 28 are movably sleeved on two sides of the other end of the other adapter rod 25 respectively and are positioned on two sides of the strut 21 and are symmetrically parallel to each other respectively, one ends of the two pairs of stress rods 28 movably penetrate through rectangular limiting through holes in the side wall of the top end of the moving block 23 respectively, and the two pairs of springs 29 are movably sleeved on the two pairs of stress rods 28 respectively and are positioned between the other ends of the stress rods 28 and the side wall of the moving block 23 respectively; through the clamping structure 2, the semiconductor chip shells in various shapes can be clamped and stably kept.

The following electric devices have the following types and functions:

a first electric push rod: it is prior art, as long as the electric putter that is applicable to this scheme all can use.

A second electric push rod: it is prior art, as long as the electric putter that is applicable to this scheme all can use.

Preferably, the pressing structure 3 further includes: a mounting frame 31, a second electric push rod 32 and a pressure plate 33;

mounting bracket 31 one end is fixed to be welded in base 1 upper wall, and be located the right-hand member central line, and its other end is located bears directly over the dish 22, second electric putter 32 is fixed to be welded in mounting bracket 31 other end lower wall, and its flexible end lateral wall circumference has seted up oblique screw thread, and be located bears directly over the dish 22, clamp plate 33 is circular structure, and upper wall central point department has seted up the screwed pipe, clamp plate 33 can dismantle to settle on the flexible end of second electric putter 32, and connect soon mutually with electric putter.

As a preferred scheme, further, the pressing plate 33 can be used by the pressing plate 33 with the same mounting structure and different diameters according to different processing sizes, so as to meet design requirements and facilitate descending and pressing.

Preferably, the mounting frame 31 is an L-shaped structure, which facilitates installation and saves space.

Preferably, the moving block 23 is an H-shaped structure, so that the movement is limited conveniently.

Preferably, the driving rod 26 is an L-shaped structure, and it is installed in the same clockwise direction in turn for the design requirement, so as to drive the rotation.

Preferably, the adapter rod 25 is a T-shaped structure, which facilitates installation.

All the electrical components in the present application are connected with the power supply adapted to the electrical components through the wires, and an appropriate controller should be selected according to actual conditions to meet the control requirements, and specific connection and control sequences should be obtained.

Example (b): as can be seen from fig. 1-4 of the specification, firstly, after the device is stably placed and powered on through the base 1, the chip knocked in the packaging shell can be placed on the bearing plate 22, so that the two first electric push rods 27 in the clamping structure 2 are controlled to contract, the two moving blocks 23 are driven to move relatively through the adapter rod 25, and meanwhile, through the transmission of the transmission rod 26, the adapter plate 24 rotates on the support 21, so that the other two moving blocks 23 also move relatively; for example, the rectangular enclosure causes two of the force-bearing rods 28 to contact the enclosure first, and then to perform primary limit on two sides of the enclosure, and to compress the springs 29 on two of the force-bearing rods 28; then, with the movement of the two pairs of moving blocks 23, the other two stressed rods 28 are also contacted with the packaging shell for extrusion clamping, and then the driving of the first electric push rod 27 is stopped, so that the front side and the rear side as well as the left side and the right side of the whole packaging shell are clamped, fixed and limited; finally, the second electric push rod 32 on the mounting frame 31 is extended by controlling the pressing structure 3, so that the pressing plate 33 is lowered to perform pressing.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation; meanwhile, unless explicitly stated or limited otherwise, the terms "fixedly welded", "movably disposed", "movably embedded", "movably sleeved", "screwed", and the like are to be understood in a broad sense, and for example, the terms may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor chip's pressfitting structure characterized in that includes:

a base (1);

the clamping structure (2) is fixedly arranged on the upper wall of the base (1) and is positioned on the central line of the left end;

the pressing structure (3) is fixedly arranged on the upper wall of the base (1) and is positioned on the central line of the right end;

the clamping structure (2) comprising: the device comprises a support column (21), a bearing disc (22), two pairs of moving blocks (23) with the same structure, an adapter disc (24), a pair of adapter rods (25) with the same structure, two pairs of driving rods (26) with the same structure, a pair of first electric push rods (27) with the same structure, two pairs of stress rods (28) with the same structure and two pairs of springs (29) with the same structure;

one end of each support column (21) is fixedly welded on the upper wall of the base (1) and is positioned on a central line at the left end, the bearing disc (22) is horizontally and fixedly welded on the other end of each support column (21), two pairs of sliding grooves with the same structure are formed in the side wall of each support column at equal circumferential intervals, two pairs of moving blocks (23) are respectively and movably embedded in the sliding grooves of the bearing disc (22), a rectangular limiting through hole is formed in the central position of the top end of each moving block, the adapter disc (24) is movably sleeved on the other end of each support column (21) and is positioned below the bearing disc (22), one end of each adapter rod (25) is respectively and fixedly welded on the lower wall at the bottom end of each moving block (23) and is respectively and symmetrically positioned at the central position, one end of each drive rod (26) is respectively and movably arranged on the upper wall of the adapter disc (24) and is respectively positioned at a four-position corner, and the, one end of each first electric push rod (27) is fixedly arranged on two sides of the other end of one of the adapter rods (25), the telescopic ends of the first electric push rods are movably sleeved on two sides of the other end of the other adapter rod (25) respectively and are positioned on two sides of the support (21) and are symmetrically parallel to each other, one end of each of the two pairs of stress rods (28) movably penetrates through the rectangular limiting through hole in the side wall of the top end of the movable block (23), and the two pairs of springs (29) are movably sleeved on the two pairs of stress rods (28) respectively and are positioned between the other end of the stress rod (28) and the side wall of the movable block (23) respectively.

2. The bonding structure of semiconductor chips according to claim 1, wherein: the hold-down structure (3) comprises: a mounting frame (31), a second electric push rod (32) and a pressure plate (33);

mounting bracket (31) one end is fixed to be welded in base (1) upper wall, and is located the right-hand member central line to its other end is located and bears directly over dish (22), second electric putter (32) are fixed to be welded in mounting bracket (31) other end lower wall, and its flexible end lateral wall circumference has seted up oblique screw thread, and is located and bears directly over dish (22), clamp plate (33) are circular structure, and its upper wall central point department has seted up the screwed pipe, clamp plate (33) can be dismantled and settle on the flexible end of second electric putter (32), and connect soon mutually with electric putter.

3. A bonding structure of semiconductor chips according to claim 2, wherein: the pressing plate (33) can be used by mounting the pressing plate (33) with the same structure and different diameters according to different processing sizes.

4. A bonding structure of semiconductor chips according to claim 2, wherein: the mounting frame (31) is of an L-shaped structure.

5. The bonding structure of semiconductor chips according to claim 1, wherein: the moving block (23) is of an H-shaped structure.

6. The bonding structure of semiconductor chips according to claim 1, wherein: the transmission rod (26) is of an L-shaped structure and is sequentially installed in the same clockwise direction.

7. The bonding structure of semiconductor chips according to claim 1, wherein: the adapter rod (25) is of a T-shaped structure.