CN216806803U

CN216806803U - Semiconductor chip presss from both sides with getting device

Info

Publication number: CN216806803U
Application number: CN202123209802.8U
Authority: CN
Inventors: 周武
Original assignee: Guangdong Kunsheng Semiconductor Co ltd
Current assignee: Guangdong Kunsheng Semiconductor Co ltd
Priority date: 2021-12-20
Filing date: 2021-12-20
Publication date: 2022-06-24
Anticipated expiration: 2031-12-20

Abstract

The utility model discloses a clamping device for a semiconductor chip, which comprises a connecting seat, wherein a handrail is fixedly connected above the connecting seat, a connecting block is arranged in the connecting seat in a penetrating manner, one end of the connecting block penetrates through the connecting seat and is provided with an opening, the connecting block can move relatively under the action of a first sliding groove in the connecting seat by holding supporting rods on two sides simultaneously, a first spring and a clamping plate are arranged on one side of the connecting block, the semiconductor chip can be clamped through the clamping plates on the two sides, the clamping plates can be ensured not to damage the chip under the action of the first spring, a first connecting rod and a second connecting rod are arranged on one end of the supporting rod, when the supporting rods move relatively, a sliding block on the second connecting rod slides in a second sliding groove in the first connecting rod, and can reset under the action of the second spring in the inner part after the supporting rods are loosened, thereby realizing the practicability of the device.

Description

Semiconductor chip presss from both sides with getting device

Technical Field

The utility model relates to the field of clamping devices, in particular to a clamping device for a semiconductor chip.

Background

A semiconductor chip: etching and wiring are performed on the semiconductor wafer to form a semiconductor device capable of realizing a certain function. Not only silicon chips, but also gallium arsenide (gallium arsenide is toxic, so some inferior circuit boards do not decompose it), germanium and other semiconductor materials are commonly included. Semiconductors are also in the trend of automobiles. In the seventies of the twentieth century, american enterprises such as intel have gained popularity in the dynamic random access memory (D-RAM) market. But in the eighties of the twentieth century, the japanese business listing of the first place, which required high performance D-RAM, due to the advent of large computers;

the device is got to current semiconductor chip clamp is when using, and the fixed positioning presss from both sides the structure of getting not perfect enough in advance, and the fixed clamp of fixing is not convenient for fix in advance gets, avoids appearing damaging other chips to when getting, the variation in size of chip makes current device limitation higher, is difficult to press from both sides the work of getting, so need the semiconductor chip that can solve above problem to press from both sides the device with getting now.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a clamping device for a semiconductor chip.

In order to achieve the purpose, the utility model adopts the following technical scheme: a clamping device for a semiconductor chip comprises a connecting seat, wherein a handrail is fixedly connected above the connecting seat, a connecting block penetrates through the connecting seat, one end of the connecting block penetrates through the connecting seat and is provided with an opening, and a first spring is arranged at one end of the connecting block;

the other end of the first spring is provided with a clamping plate which is a rubber clamping plate.

As a further description of the above technical solution:

the other end of connecting block runs through the connecting seat and is provided with first spout, the connecting block carries out sliding connection with first spout.

As a further description of the above technical solution:

the support rod is arranged above the connecting block, a first connecting rod is fixedly connected to one end of the support rod, and a second sliding groove is formed in the first connecting rod.

As a further description of the above technical solution:

the other end of the first connecting rod is correspondingly provided with a second connecting rod, the first connecting rod and the second connecting rod penetrate through the handrail and are provided with through holes inwards, one end of the second connecting rod penetrates through the first connecting rod and is provided with a sliding block inwards, and one end of the sliding block is provided with a second spring.

As a further description of the above technical solution:

a supporting column is arranged on one side of the connecting seat, a driving motor is arranged above the supporting column, and a contact element is arranged below the supporting column.

As a further description of the above technical solution:

one end of the driving motor penetrates through the support column and is internally provided with a screw rod, and one end of the connecting seat penetrates through the support column and is provided with a third sliding groove.

As a further description of the above technical solution:

and a thread block is connected to the screw rod in a threaded manner, and one end of the thread block penetrates through the third sliding groove and is arranged outwards.

The utility model has the following beneficial effects:

1. compared with the prior art, the clamping device for the semiconductor chip can move the device through manual work, the supporting rods on two sides can be held simultaneously, the connecting block can move relatively under the action of the first sliding groove in the connecting seat, the first spring and the clamping plate are arranged on one side of the connecting block, the semiconductor chip can be clamped through the clamping plates on two sides, the clamping plate can be ensured not to damage the chip under the action of the first spring, the first connecting rod and the second connecting rod are arranged at one end of the supporting rod, when the supporting rod moves relatively, the sliding block on the second connecting rod slides in the second sliding groove in the first connecting rod, and after the supporting rod is loosened, the sliding block can reset under the action of the second spring in the connecting rod, so that the practicability of the device is realized;

2. compared with the prior art, this connecting seat both sides of device are got with pressing from both sides to semiconductor chip are provided with the support column, driving motor through the start-up top can make the lead screw rotate, inside screw thread piece carries out threaded connection with the lead screw, the one end and the screw thread piece of connecting seat are connected, and under the effect of third spout, can make the lead screw rotate and drive the screw thread piece and carry out the motion from top to bottom, thereby make the connecting seat carry out regulation from top to bottom, make the device can carry out the regulation of height with this, with this come to press from both sides the chip of equidimension not and get, realize the convenience of device.

Drawings

Fig. 1 is a cross-sectional view of a clamping apparatus for semiconductor chips according to the present invention;

FIG. 2 is a schematic view of the structure A in FIG. 1;

FIG. 3 is a schematic view of the structure B in FIG. 1;

fig. 4 is a schematic diagram of a supporting pillar structure of a clamping device for semiconductor chips according to the present invention.

Illustration of the drawings:

1. a handrail; 2. a support bar; 3. a support pillar; 4. a first chute; 5. connecting blocks; 6. a contact member; 7. a first spring; 8. an opening; 9. a splint; 10. a drive motor; 11. a through hole; 12. a second chute; 13. a first connecting rod; 14. a second spring; 15. a slider; 16. a second connecting rod; 17. a third chute; 18. a connecting seat; 19. a lead screw; 20. a thread block.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, one embodiment of the present invention is provided: a clamping device for a semiconductor chip comprises a connecting seat 18, a handrail 1 is fixedly connected above the connecting seat 18, the device can be taken and moved through the handrail 1, a connecting block 5 is arranged inside the connecting seat 18 in a penetrating mode, one end of the connecting block 5 penetrates through the connecting seat 18 and is provided with an opening 8, the connecting block 5 can be moved through the opening 8, a first spring 7 is arranged at one end of the connecting block 5, a clamping plate 9 is arranged at the other end of the first spring 7, the clamping plate 9 is a rubber clamping plate 9, the chip can be clamped through the clamping plate 9, and the chip can be prevented from being damaged under the action of the first spring 7;

the other end of the connecting block 5 penetrates through the connecting seat 18 to be provided with a first sliding groove 4, the connecting block 5 is in sliding connection with the first sliding groove 4, the supporting rod 2 is arranged above the connecting block 5, one end of the supporting rod 2 is fixedly connected with a first connecting rod 13, and the connecting block 5 can slide in the first sliding groove 4 by pressing the supporting rod 2;

a second connecting rod 16 is correspondingly arranged at the other end of the first connecting rod 13, the first connecting rod 13 and the second connecting rod 16 penetrate through the handrail 1 and are internally provided with through holes 11, the first connecting rod 13 and the second connecting rod 16 can pass in and out of the handrail 1 through the through holes 11, a second sliding chute 12 is arranged inside the first connecting rod 13, one end of the second connecting rod 16 penetrates through the first connecting rod 13 and is internally provided with a sliding block 15, one end of the sliding block 15 is provided with a second spring 14, when the supporting rod 2 moves relatively, the sliding block 15 on the second connecting rod 16 slides in the second sliding chute 12 inside the first connecting rod 13, and after the supporting rod 2 is loosened, the resetting can be carried out under the action of the second spring 14 inside;

one side of the connecting seat 18 is provided with a supporting column 3, a driving motor 10 is arranged above the supporting column 3, one end of the driving motor 10 penetrates through the supporting column 3 and is internally provided with a screw rod 19, one end of the connecting seat 18 penetrates through the supporting column 3 and is provided with a third sliding groove 17, a thread block 20 is in threaded connection with the screw rod 19, one end of the thread block 20 is connected with the connecting seat 18, a contact element 6 is arranged below the supporting column 5, the screw rod 19 can be rotated by starting the driving motor 10 above, the internal thread block 20 is in threaded connection with the screw rod 19, one end of the connecting seat 18 is connected with the thread block 20, and under the action of the third sliding groove 17, the screw rod 19 can be rotated to drive the thread block 20 to move up and down, so that the connecting seat 18 can be adjusted up and down, the device can be adjusted in height, and chips with different sizes can be clamped, the convenience of the device is realized.

The working principle is as follows: this a press from both sides and get device and can remove the device through the manual work, bracing piece 2 through holding both sides simultaneously, can make connecting block 5 carry out relative motion under the effect of connecting seat 18 inside first spout 4, be provided with first spring 7 and splint 9 in one side of connecting block 5, splint 9 through both sides can press from both sides the semiconductor chip and get, can guarantee under the effect of first spring 7 that splint 9 can not cause the damage to the chip, and the one end of bracing piece 2 is provided with head rod 13 and second connecting rod 16, when bracing piece 2 carries out relative motion, slider 15 on the second connecting rod 16 slides in the inside second spout 12 of head rod 13, after loosening bracing piece 2, can reset under the effect of the inside second spring 14, thereby realize the practicality of device.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. A clamping device for a semiconductor chip comprises a connecting seat (18), and is characterized in that: a handrail (1) is fixedly connected above the connecting seat (18), a connecting block (5) penetrates through the connecting seat (18), one end of the connecting block (5) penetrates through the connecting seat (18) and is provided with an opening (8), and one end of the connecting block (5) is provided with a first spring (7);

the other end of the first spring (7) is provided with a clamping plate (9), and the clamping plate (9) is a rubber clamping plate (9).

2. The semiconductor chip gripper as claimed in claim 1, wherein: the other end of the connecting block (5) penetrates through the connecting seat (18) and is provided with a first sliding groove (4), and the connecting block (5) is connected with the first sliding groove (4) in a sliding mode.

3. The semiconductor chip gripper as claimed in claim 1, wherein: the support rod (2) is arranged above the connecting block (5), a first connecting rod (13) is fixedly connected to one end of the support rod (2), and a second sliding groove (12) is formed in the first connecting rod (13).

4. The semiconductor chip gripper as claimed in claim 3, wherein: the handrail is characterized in that a second connecting rod (16) is correspondingly arranged at the other end of the first connecting rod (13), a through hole (11) is formed in the handrail (1) in a penetrating mode through the first connecting rod (13) and the second connecting rod (16), a sliding block (15) is arranged in the handrail in a penetrating mode through the first connecting rod (13) at one end of the second connecting rod (16), and a second spring (14) is arranged at one end of the sliding block (15).

5. The semiconductor chip gripper as claimed in claim 1, wherein: a supporting column (3) is arranged on one side of the connecting seat (18), a driving motor (10) is arranged above the supporting column (3), and a contact piece (6) is arranged below the supporting column (3).

6. The semiconductor chip gripper as claimed in claim 5, wherein: one end of the driving motor (10) penetrates through the supporting column (3) and is internally provided with a lead screw (19), and one end of the connecting seat (18) penetrates through the supporting column (3) and is provided with a third sliding groove (17).

7. The semiconductor chip gripper as claimed in claim 6, wherein: a thread block (20) is connected to the screw rod (19) in a threaded manner, and one end of the thread block (20) penetrates through the third sliding groove (17) and is arranged outwards.