CN220934047U - Thimble adjusting jig for semiconductor packaging die bonder - Google Patents
Thimble adjusting jig for semiconductor packaging die bonder Download PDFInfo
- Publication number
- CN220934047U CN220934047U CN202322299180.5U CN202322299180U CN220934047U CN 220934047 U CN220934047 U CN 220934047U CN 202322299180 U CN202322299180 U CN 202322299180U CN 220934047 U CN220934047 U CN 220934047U
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- base
- thimble
- side wall
- block
- die bonder
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 238000001125 extrusion Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of semiconductor packaging, and discloses a thimble adjusting jig for a semiconductor packaging die bonder, which comprises a base, an anti-slip pad fixedly arranged at the bottom of the base, a side plate fixedly arranged at the top of the base, and a processing component arranged at the side wall position of the base, wherein the processing component comprises a loading and unloading jig mechanism arranged at the side wall position of the base, the loading and unloading jig mechanism is positioned at the top position of the base, an auxiliary mechanism is arranged at the side wall position of the base, the auxiliary mechanism is positioned at the lower position of the loading and unloading jig mechanism, and a sliding block is slidably arranged at the top of the base. The utility model solves the problems that in the prior art, the mounting and dismounting of the ejector pins under the normal condition of the semiconductor packaging die bonder are time-consuming and labor-consuming, the ejector pin seat is not well fixed when the ejector pins are manually mounted, the adjustment of the depth of the mounted ejector pins is not facilitated, and particularly, the consistency of the mounting depths of a plurality of ejector pins is difficult to ensure when the ejector pins are mounted.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a thimble adjusting jig for a semiconductor packaging die bonder.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by the semiconductor, the importance of the semiconductor is very great from the aspects of science and technology or economic development, and most of electronic products, such as core units in computers, mobile phones or digital recorders, are very closely related to the semiconductor, and when the semiconductor is processed, the semiconductor packaging die bonding machine thimble adjusting jig is used;
In the prior art, the mounting and dismounting of the ejector pins of the semiconductor packaging die bonder are time-consuming and labor-consuming under normal conditions, the ejector pin seat is not fixed well when the ejector pins are manually mounted, the adjustment of the depth of the mounted ejector pins is not facilitated, and particularly, the consistency of the mounting depths of the ejector pins is difficult to ensure when the ejector pins are mounted.
Disclosure of utility model
The utility model aims to provide a thimble adjusting jig for a semiconductor packaging die bonder, which achieves the aim of solving the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the thimble adjusting fixture for semiconductor packaging and die bonding machine comprises a base,
An anti-slip pad fixedly mounted at the bottom of the base;
the side plate is fixedly arranged at the top of the base;
and a processing assembly disposed at a side wall of the base;
The processing assembly comprises a loading and unloading jig mechanism arranged on the side wall of the base, and the loading and unloading jig mechanism is positioned on the top of the base;
the side wall of the base is provided with an auxiliary mechanism, and the auxiliary mechanism is positioned below the loading and unloading jig mechanism.
Preferably, the number of the anti-slip pads is four, the shapes and the sizes of the four anti-slip pads are equal, the four anti-slip pads are respectively and fixedly arranged at the four corners of the bottom of the base, and the stability of the device in use can be effectively improved through the anti-slip pads at the bottom.
Preferably, the top of base slidable mounting has the slider, the auxiliary block is installed at the top of slider, moves through the position of slider, further adjusts the position of thimble.
Preferably, the loading and unloading jig mechanism comprises a connecting block, the connecting block is fixedly arranged on the side wall of the sliding block, a sleeve joint block is inserted and arranged on the side wall of the connecting block, a thimble seat is fixedly arranged at the other end of the sleeve joint block, a thimble is arranged on the inner wall of the thimble seat in a clamping manner, and a screw cap is sleeved and arranged on the side wall of the thimble seat.
Preferably, the inner wall of screw cap and the lateral wall threaded connection of cup joint the piece, the lateral wall fixed mounting of screw cap has the rotating block, the inner wall cover of rotating block is established on the surface of thimble seat, the lateral wall contact of rotating block is provided with the spanner, can effectually rotate the rotating block through the handle.
Preferably, the auxiliary mechanism comprises a limiting block and a long rod, and one end of the limiting block is fixedly arranged on the side wall of the side plate.
Preferably, the long rod is fixedly arranged on the side wall of the sliding block, an extrusion spring is slidably arranged on the surface of the long rod, one end of the extrusion spring is fixedly connected with the side wall of the side plate, the other end of the extrusion spring is fixedly connected with the side wall of the sliding block, and the inner wall of the sliding block is slidably connected with the surface of the long rod.
The utility model provides a thimble adjusting jig for a semiconductor packaging die bonder. The beneficial effects are as follows:
(1) According to the utility model, when the thimble position is needed, the position of the rotating block can be rotated through the spanner, the rotating block effectively and rapidly adjusts the length of the thimble under the combined action of the screw cap, the thimble seat and the thimble, the thimble can be conveniently and rapidly installed and disassembled, the height of the thimble in the thimble seat is adjusted, the precision of installing the thimble is improved, more time is saved, the problem that the thimble installation and disassembly of the semiconductor packaging crystal gluing machine in the prior art are time-consuming and labor-consuming under normal conditions is solved, the thimble seat is not well fixed when the thimble is manually installed, the adjustment of the depth of installing the thimble is not facilitated, and especially, the installation depth consistency of a plurality of thimbles is difficult to ensure when the thimbles are installed.
(2) According to the utility model, the sleeving blocks are arranged on the surfaces of the connecting blocks by operators, so that the operators can push the positions of the sliding blocks, the sliding blocks effectively move the positions of the ejector pins under the combined action of the long rods and the extrusion springs, and the device is convenient for the operators to use better.
Drawings
FIG. 1 is a schematic view of the appearance structure of the present utility model;
FIG. 2 is a schematic view of the bottom structure of the present utility model;
FIG. 3 is a schematic view of the auxiliary mechanism of the present utility model;
FIG. 4 is an enlarged view of a portion of FIG. 2A in accordance with the present utility model;
fig. 5 is a schematic structural view of the wrench of the present utility model.
In the figure: 1. a base; 2. an anti-slip pad; 3. a slide block; 4. processing the assembly; 41. a loading and unloading jig mechanism; 411. a connecting block; 412. a thimble; 413. a sleeve joint block; 414. a screw cap; 415. a rotating block; 416. a needle holder; 42. an auxiliary mechanism; 421. a limiting block; 422. extruding a spring; 423. a long rod; 5. an auxiliary block; 6. a side plate; 7. and (5) a spanner.
Detailed Description
Example 1
As shown in fig. 1-5, the present utility model provides a technical solution: the thimble adjusting jig for the semiconductor packaging die bonder comprises a base 1, a slide block 3 is slidably arranged at the top of the base 1, an auxiliary block 5 is arranged at the top of the slide block 3, the thimble 412 is further adjusted by moving the slide block 3,
The anti-skid pads 2 are fixedly arranged at the bottom of the base 1, the number of the anti-skid pads 2 is four, the shapes and the sizes of the four anti-skid pads 2 are equal, the four anti-skid pads 2 are respectively and fixedly arranged at four corners of the bottom of the base 1, and the stability of the device in use can be effectively improved through the anti-skid pads 2 at the bottom;
A side plate 6 fixedly installed on the top of the base 1;
And a processing component 4 arranged at the side wall position of the base 1;
the processing component 4 comprises a loading and unloading jig mechanism 41 arranged at the side wall of the base 1, the loading and unloading jig mechanism 41 is positioned at the top of the base 1, the loading and unloading jig mechanism 41 comprises a connecting block 411, the connecting block 411 is fixedly arranged at the side wall of the sliding block 3, a sleeving block 413 is arranged on the side wall of the connecting block 411 in a plugging manner, a jacking seat 416 is fixedly arranged at the other end of the sleeving block 413, a thimble 412 is arranged on the inner wall of the jacking seat 416 in a clamping manner, a screw cap 414 is arranged on the side wall of the jacking seat 416 in a sleeving manner, the inner wall of the screw cap 414 is in threaded connection with the side wall of the sleeving block 413, a rotating block 415 is fixedly arranged on the side wall of the screw cap 414, the inner wall of the rotating block 415 is sleeved on the surface of the jacking seat 416, a spanner 7 is arranged on the side wall of the rotating block 415 in a contact manner, the rotating block 415 can be effectively rotated through the spanner 7, through the position of the rotating block 415 which is rotated by the wrench 7 when the thimble 412 is needed, the length of the thimble 412 can be effectively and quickly adjusted by the rotating block 415 under the combined action of the screw cap 414, the thimble seat 416 and the thimble 412, the thimble can be conveniently and quickly installed and disassembled, the height of the thimble in the thimble seat is adjusted, the precision of installing the thimble is improved, more time is saved, the problem that the thimble seat is difficult to be fixed when the thimble is manually installed in the normal condition of the semiconductor packaging crystal gluing machine in the prior art, and especially the installation depth of a plurality of thimbles is difficult to be ensured to be consistent when the thimbles are installed is solved;
When the position of the thimble 412 is required, the position of the rotating block 415 can be rotated through the wrench 7, the rotating block 415 effectively drives the position of the screw cap 414 to rotate, when the screw cap 414 is separated from the thimble seat 416, an operator can quickly adjust the position of the thimble 412, and when the position is adjusted to a proper position, the position of the screw cap 414 can be stabilized through the wrench 7 again, so that the length of the thimble 412 can be effectively and quickly adjusted;
example 2
On the basis of embodiment 1, an auxiliary mechanism 42 is installed at the side wall position of the base 1, the auxiliary mechanism 42 is located at the position below the loading and unloading jig mechanism 41, the auxiliary mechanism 42 comprises a limiting block 421 and a long rod 423, one end of the limiting block 421 is fixedly installed on the side wall of the side plate 6, the long rod 423 is fixedly installed on the side wall of the sliding block 3, an extrusion spring 422 is slidably installed on the surface of the long rod 423, one end of the extrusion spring 422 is fixedly connected with the side wall of the side plate 6, the other end of the extrusion spring 422 is fixedly connected with the side wall of the sliding block 3, the inner wall of the sliding block 3 is slidably connected with the surface of the long rod 423, a sleeving block 413 is installed on the surface of the connecting block 411 by an operator, the operator can push the position of the sliding block 3, the sliding block 3 effectively moves the position of the thimble under the combined action of the long rod 423 and the extrusion spring 422, and the device is convenient for the operator to use;
When an operator uses the device, firstly, the sleeving block 413 is arranged on the surface of the connecting block 411, after the sleeving block 413 is spliced on the surface of the connecting block 411, the operator can push the position of the sliding block 3, the sliding block 3 is effectively pushed to slide on the surface of the long rod 423, when the sliding block 3 slides, one end of the extrusion spring 422 is extruded, and when the side wall of the sliding block 3 is contacted with one end of the limiting block 421, the pushing of the sliding block 3 can be stopped.
Claims (7)
1. The thimble adjusting fixture for the semiconductor packaging die bonder comprises a base (1),
An anti-slip pad (2) fixedly arranged at the bottom of the base (1);
a side plate (6) fixedly arranged at the top of the base (1);
and a processing component (4) arranged at the side wall position of the base (1); the method is characterized in that:
The processing assembly (4) comprises a loading and unloading jig mechanism (41) arranged at the side wall position of the base (1), and the loading and unloading jig mechanism (41) is positioned at the top position of the base (1);
An auxiliary mechanism (42) is arranged at the side wall of the base (1), and the auxiliary mechanism (42) is positioned below the loading and unloading jig mechanism (41).
2. The semiconductor package die bonder mounting thimble adjustment jig according to claim 1, wherein: the number of the anti-slip pads (2) is four, the shapes and the sizes of the four anti-slip pads (2) are equal, and the four anti-slip pads (2) are respectively and fixedly arranged at the four corners of the bottom of the base (1).
3. The semiconductor package die bonder mounting thimble adjustment jig according to claim 1, wherein: the top of base (1) slidable mounting has slider (3), auxiliary block (5) are installed at the top of slider (3).
4. The semiconductor package die bonder mounting thimble adjustment jig according to claim 1, wherein: the assembling and disassembling jig mechanism (41) comprises a connecting block (411), the connecting block (411) is fixedly arranged on the side wall of the sliding block (3), a sleeving block (413) is spliced and arranged on the side wall of the connecting block (411), a thimble seat (416) is fixedly arranged at the other end of the sleeving block (413), a thimble (412) is arranged on the inner wall of the thimble seat (416) in a clamping mode, and a screw cap (414) is sleeved and arranged on the side wall of the thimble seat (416).
5. The semiconductor package die bonder mounting thimble adjustment jig according to claim 4, wherein: the inner wall of screw cap (414) is connected with the lateral wall thread of cup joint piece (413), the lateral wall fixed mounting of screw cap (414) has rotating block (415), the surface at thimble seat (416) is established to the inner wall cover of rotating block (415), the lateral wall contact of rotating block (415) is provided with spanner (7).
6. The semiconductor package die bonder mounting thimble adjustment jig according to claim 1, wherein: the auxiliary mechanism (42) comprises a limiting block (421) and a long rod (423), and one end of the limiting block (421) is fixedly arranged on the side wall of the side plate (6).
7. The semiconductor package die bonder mounting thimble adjustment jig according to claim 6, wherein: the long rod (423) is fixedly arranged on the side wall of the sliding block (3), an extrusion spring (422) is arranged on the surface of the long rod (423) in a sliding mode, one end of the extrusion spring (422) is fixedly connected with the side wall of the side plate (6), the other end of the extrusion spring (422) is fixedly connected with the side wall of the sliding block (3), and the inner wall of the sliding block (3) is in sliding connection with the surface of the long rod (423).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322299180.5U CN220934047U (en) | 2023-08-25 | 2023-08-25 | Thimble adjusting jig for semiconductor packaging die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322299180.5U CN220934047U (en) | 2023-08-25 | 2023-08-25 | Thimble adjusting jig for semiconductor packaging die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220934047U true CN220934047U (en) | 2024-05-10 |
Family
ID=90933335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322299180.5U Active CN220934047U (en) | 2023-08-25 | 2023-08-25 | Thimble adjusting jig for semiconductor packaging die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220934047U (en) |
-
2023
- 2023-08-25 CN CN202322299180.5U patent/CN220934047U/en active Active
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