CN219321337U

CN219321337U - Power semiconductor module substrate

Info

Publication number: CN219321337U
Application number: CN202223040846.7U
Authority: CN
Inventors: 钟明达
Original assignee: Shenzhen Jingda Youban Technology Co ltd
Current assignee: Shenzhen Jingda Youban Technology Co ltd
Priority date: 2022-11-14
Filing date: 2022-11-14
Publication date: 2023-07-07
Anticipated expiration: 2032-11-14

Abstract

The utility model discloses a power semiconductor module substrate, which comprises a bottom plate and a substrate, wherein a semiconductor is arranged on the substrate; the surface of the bottom plate is provided with a groove, and the substrate is arranged in the groove; more than one first limiting block is movably arranged on the surface of the bottom plate; the first limiting block is arranged at the upper end of the groove; the first limiting block is arranged at the upper end of the substrate; the side surfaces of the substrate are provided with first inclined planes; the side surface of the first limiting block is provided with a second inclined surface; the second inclined plane is attached to the first inclined plane; according to the utility model, the first inclined planes are arranged on the side surfaces of the substrates, the second inclined planes are arranged on the side surfaces of the first limiting blocks, and the second inclined planes are attached to the first inclined planes; when the substrate is pressed downwards into the groove, the first inclined surface presses the second inclined surface on the first limiting block, the first limiting block is pushed to one side until the substrate is completely installed in the groove, at the moment, the first elastic element releases force, the first limiting block resets, and the first limiting block is arranged at the upper end of the substrate; the bottom plate in the groove is fixed.

Description

Power semiconductor module substrate

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a power semiconductor module substrate.

Background

The power semiconductor module is a combination body according to certain functions and modes, the power semiconductor module is a high-power electronic power device which is encapsulated into a whole according to certain function combinations, and the power semiconductor module can realize different functions according to different packaged components;

at present, the connection mode between the circuit board and the outer shell in the power semiconductor module is that the bottom surface of the circuit board in the power semiconductor module is provided with a substrate, and the inner wall of the power semiconductor shell is provided with a groove for accommodating the substrate;

the substrate is fixed in the groove in the following manner: and after the organic silicon gel is solidified and solidified, the circuit board in the power semiconductor module is fixedly arranged in the outer shell, so that when the circuit board or an electronic device in the power semiconductor module is damaged, a worker is difficult to detach the circuit board in the power semiconductor module from the inner part of the outer shell, great inconvenience is brought to the maintenance work of the power semiconductor module, the detachment time is prolonged, and the maintenance efficiency of the power semiconductor module is reduced.

Disclosure of Invention

The technical problem to be solved by the utility model is to provide a power semiconductor module substrate; the substrate is arranged in the groove by arranging the groove on the surface of the bottom plate, more than one first limiting block is movably arranged on the surface of the bottom plate, the first limiting blocks are respectively arranged at the upper end of the groove, and the first limiting blocks are arranged at the upper end of the substrate; compared with the organic silicon gel solidification and solidification connection in the background art, the utility model has the characteristics of quick installation and convenient disassembly.

The power semiconductor module substrate is realized by the following technical scheme: comprises a base plate and a substrate, wherein a semiconductor is arranged on the substrate; the surface of the bottom plate is provided with a groove, and the substrate is arranged in the groove; more than one first limiting block is movably arranged on the surface of the bottom plate; the first limiting block is arranged at the upper end of the groove; the first limiting block is arranged at the upper end of the substrate;

the side surfaces of the substrate are provided with first inclined planes; the side surface of the first limiting block is provided with a second inclined surface; the second inclined plane is attached to the first inclined plane.

As the preferable technical scheme, more than one second limiting block is movably arranged on the surface of the bottom plate; the surface of the first limiting block is provided with a positioning groove; the second limiting block is inserted and arranged in the positioning groove;

the surface of the bottom plate is provided with a first limit groove, and a limit plate is arranged in the first limit groove; the second limiting block is fixed on the surface of the limiting plate; between the first limit groove and the limit plate a first elastic element is installed; the first limiting block is arranged at the upper end of the first limiting groove.

As a preferable technical scheme, a third inclined plane is arranged on the side surface of the second limiting block; the third inclined plane is arranged opposite to the first limiting block.

As the preferable technical scheme, the surface of the bottom plate is provided with more than one limiting chute, and a sliding rod and a sliding block are arranged in the limiting chute; the sliding block is provided with a sliding hole; the sliding rod is arranged in the sliding hole;

the outer side of the sliding rod is sleeved with a second elastic element; two ends of the second elastic element respectively support against the limiting chute and the sliding block; the first limiting block is arranged at the upper end of the sliding block.

As the preferable technical scheme, the surface of the bottom plate is provided with more than one limiting bracket, and the more than one limiting brackets are respectively arranged at the outer sides of the grooves; the substrate is arranged between the limiting brackets.

As an optimal technical scheme, a material returning plate is arranged in the groove; more than one third elastic element is arranged between the material returning plate and the groove.

The beneficial effects of the utility model are as follows: the substrate is arranged in the groove by arranging the groove on the surface of the bottom plate, more than one first limiting block is movably arranged on the surface of the bottom plate, the first limiting blocks are respectively arranged at the upper end of the groove, the first limiting blocks are arranged at the upper end of the substrate, the side surfaces of the substrate are respectively provided with a first inclined surface, the side surfaces of the first limiting blocks are provided with a second inclined surface, and the second inclined surfaces are attached to the first inclined surfaces; when the substrate is pressed downwards into the groove, the first inclined surface presses the second inclined surface on the first limiting block, the first limiting block is pushed to one side until the substrate is completely installed in the groove, at the moment, the first elastic element releases force, the first limiting block resets, and the first limiting block is arranged at the upper end of the substrate; the bottom plate in the groove is fixed.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a base plate;

FIG. 2 is a schematic cross-sectional view of a base plate;

FIG. 3 is a schematic view of a first stop block;

FIG. 4 is a schematic view of a second stop block;

FIG. 5 is a schematic diagram of a substrate I;

FIG. 6 is a schematic diagram II of a substrate;

fig. 7 is a schematic view of a power semiconductor module substrate of the present utility model.

Detailed Description

All of the features disclosed in this specification, or all of the steps in a method or process disclosed, may be combined in any combination, except for mutually exclusive features and/or steps.

As shown in fig. 1 to 7, a power semiconductor module substrate of the present utility model includes a base plate 1 and a substrate 13, and a semiconductor 15 is mounted on the substrate 13; the surface of the bottom plate 1 is provided with a groove 2, and a substrate 13 is arranged in the groove 2; more than one first limiting block 5 is movably arranged on the surface of the bottom plate 1; the first limiting block 5 is arranged at the upper end of the groove 2; the first limiting block 5 is arranged at the upper end of the substrate 13; the side surfaces of the substrate 13 are provided with first inclined planes 14; the side surface of the first limiting block 5 is provided with a second inclined surface 7; the second inclined plane 7 is attached to the first inclined plane 14; when the substrate is pressed downwards into the groove, the first inclined surface presses the second inclined surface on the first limiting block, the first limiting block is pushed to one side until the substrate is completely installed in the groove, at the moment, the first elastic element releases force, the first limiting block resets, and the first limiting block is arranged at the upper end of the substrate; the bottom plate in the groove is fixed.

In the embodiment, more than one second limiting block 18 is movably arranged on the surface of the bottom plate 1; the surface of the first limiting block 5 is provided with a positioning groove 3; the second limiting block 18 is inserted and arranged in the positioning groove 3; the surface of the bottom plate 1 is provided with a first limit groove 4, and a limit plate 16 is arranged in the first limit groove 4; the second limiting block 18 is fixed on the surface of the limiting plate 16; a first elastic element 8 is arranged between the first limit groove 4 and the limit plate 16; the first limiting block 5 is arranged at the upper end of the first limiting groove 4; in daily use, the second limiting block 81 is positioned in the first limiting groove 4, and the lower end of the first limiting block 5.

In the embodiment, a third inclined surface 17 is arranged on the side surface of the second limiting block 18; the third inclined surface 17 is opposite to the first limiting block 5. In the embodiment, more than one limiting chute 10 is arranged on the surface of the bottom plate 1, and a sliding rod 11 and a sliding block 9 are arranged in the limiting chute 10; the slide block 9 is provided with a slide hole (not shown); the slide bar 11 is arranged in the slide hole; the outer side of the slide bar 11 is sleeved with a second elastic element 12; two ends of the second elastic element 12 respectively support against the limit chute 10 and the sliding block 9; the first limiting block 5 is arranged at the upper end of the sliding block 9.

In the embodiment, the surface of the bottom plate 1 is provided with more than one limiting bracket 6, and the more than one limiting brackets 6 are respectively arranged at the outer side of the groove 2; the substrate 13 is arranged between the limit brackets 6 and plays a role in substrate installation and guide.

In the embodiment, a material returning plate 19 is arranged in the groove 2; more than one third elastic element 20 is arranged between the material returning plate 19 and the groove 2, and when the substrate is taken out, the substrate is pushed up by the third elastic element, so that the substrate can be conveniently taken out by a worker.

The beneficial effects of the utility model are as follows: the limiting plate is arranged in a first limiting groove on the surface of the bottom plate, a second limiting block is fixed on the surface of the limiting plate, a first elastic element is arranged between the first limiting groove and the limiting plate, the first limiting block is arranged at the upper end of the first limiting groove, a third inclined surface is arranged on the side surface of the second limiting block, and the third inclined surface is opposite to the first limiting block; when the substrate is pressed downwards into the groove, the first inclined surface extrudes the second inclined surface on the first limiting block to push the first limiting block to one side, the third inclined surface on the second limiting block is extruded by the first limiting block and is retracted into the first limiting groove, when the first limiting groove is opposite to the positioning groove from top to bottom, the second elastic element releases force, and the second limiting block is arranged in the fixing groove; when the substrate in the groove is taken out, the function of fixing the first limiting block is achieved, and the substrate in the groove is conveniently taken out.

The foregoing is merely illustrative of specific embodiments of the present utility model, and the scope of the utility model is not limited thereto, but any changes or substitutions that do not undergo the inventive effort should be construed as falling within the scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope defined by the claims.

Claims

1. A power semiconductor module substrate includes a base plate (1) and a substrate (13), a semiconductor (15) is mounted on the substrate (13); the method is characterized in that: the surface of the bottom plate (1) is provided with a groove (2), and the substrate (13) is arranged in the groove (2); more than one first limiting block (5) is movably arranged on the surface of the bottom plate (1); the first limiting block (5) is arranged at the upper end of the groove (2); the first limiting block (5) is arranged at the upper end of the substrate (13);

the side surfaces of the substrate (13) are provided with first inclined planes (14); the side surface of the first limiting block (5) is provided with a second inclined surface (7); the second inclined plane (7) is attached to the first inclined plane (14).

2. The power semiconductor module substrate according to claim 1, wherein: more than one second limiting block (18) is movably arranged on the surface of the bottom plate (1); a positioning groove (3) is formed in the surface of the first limiting block (5); the second limiting block (18) is inserted and arranged in the positioning groove (3);

the surface of the bottom plate (1) is provided with a first limit groove (4), and a limit plate (16) is arranged in the first limit groove (4); the second limiting block (18) is fixed on the surface of the limiting plate (16); a first elastic element (8) is arranged between the first limit groove (4) and the limit plate (16); the first limiting block (5) is arranged at the upper end of the first limiting groove (4).

3. The power semiconductor module substrate according to claim 2, wherein: a third inclined plane (17) is arranged on the side surface of the second limiting block (18); the third inclined surface (17) is arranged opposite to the first limiting block (5).

4. The power semiconductor module substrate according to claim 1, wherein: more than one limiting chute (10) is arranged on the surface of the bottom plate (1), and a sliding rod (11) and a sliding block (9) are arranged in the limiting chute (10); the sliding block (9) is provided with a sliding hole; the sliding rod (11) is arranged in the sliding hole;

the outer side of the sliding rod (11) is sleeved with a second elastic element (12); two ends of the second elastic element (12) respectively support against the limit chute (10) and the sliding block (9); the first limiting block (5) is arranged at the upper end of the sliding block (9).

5. The power semiconductor module substrate according to claim 1, wherein: the surface of the bottom plate (1) is provided with more than one limiting bracket (6), and the more than one limiting brackets (6) are respectively arranged at the outer side of the groove (2); the substrate (13) is arranged between the limit brackets (6).

6. The power semiconductor module substrate according to claim 1, wherein: a material returning plate (19) is arranged in the groove (2); more than one third elastic element (20) is arranged between the material returning plate (19) and the groove (2).