CN216372856U

CN216372856U - Slicing device

Info

Publication number: CN216372856U
Application number: CN202122726405.1U
Authority: CN
Inventors: 周汉知; 李晶
Original assignee: Sichuan Lvran Science And Technology Group Co ltd
Current assignee: Sichuan Lvran Science And Technology Group Co ltd
Priority date: 2021-11-09
Filing date: 2021-11-09
Publication date: 2022-04-26
Anticipated expiration: 2031-11-09

Abstract

A slicing device comprises a slicing mechanism, wherein a plurality of limiting mechanisms are arranged on the lower side of the slicing mechanism, the slicing mechanism is provided with a top pushing mechanism, the top pushing mechanism is used for supporting and clamping the lower end of a wafer rod and driving the wafer rod to feed to the slicing mechanism under the guiding of the limiting mechanisms, and the slicing mechanism is used for slicing the wafer disk.

Description

Slicing device

Technical Field

The utility model relates to the technical field related to chip processing, in particular to a slicing device.

Background

Chips are a general term for semiconductor device products, and are a way to miniaturize circuits in electronics, and are often fabricated on the surface of a semiconductor wafer.

Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.

Present when carrying out the cutting of brilliant circular rod, generally adopt metal cutter for cutting the part, this kind of cutter is when carrying out the cutting of brilliant disc, at first cut the roughness of terminal surface great, thereby inconvenient polishing operation in the later stage of carrying out, secondly cut the broken phenomenon of brilliant disc of in-process appearance very easily, because the great reason of rotation centrifugal force, the diameter of brilliant circular rod is generally great simultaneously, consequently, the metal cutter's that uses diameter is also great, consequently when cutting, the phenomenon of shake often takes place for metal cutter, consequently, also bring adverse effect to the operation of cutting of brilliant disc.

SUMMERY OF THE UTILITY MODEL

The utility model provides a slicing device, which is used for solving the defects of the prior art, can automatically and efficiently finish the cutting operation of a wafer disc, adopts a flexible material for cutting during cutting, avoids the adverse effect of a metal cutter on the cutting quality of the wafer disc, and has strong practicability.

In order to achieve the purpose of the utility model, the following technology is adopted:

a slicing device comprises a slicing mechanism, wherein a plurality of limiting mechanisms are arranged on the lower side of the slicing mechanism, the slicing mechanism is provided with an upward pushing mechanism, the upward pushing mechanism is used for supporting and clamping the lower end of a wafer rod and driving the wafer rod to feed to the slicing mechanism under the guiding of the limiting mechanisms, and the slicing mechanism is used for slicing the wafer disk;

slicing mechanism is including cutting the bottom plate, cut the bottom plate downside and install a pair of spill support, it all is equipped with the curb plate to cut the bottom plate both sides, a pair of translation bearing frame is all installed to the outer wall of curb plate, every all be equipped with many guide arms of cutting between to the translation bearing frame, the translation motor is all installed to the translation bearing frame that is located one end, the output shaft of translation motor all is connected with the translation screw rod, the translation screw rod all is equipped with the translation seat, the bearing frame is all installed and cut to translation seat outer wall, it all is connected with the branch and cuts the wheel to cut the bearing frame upside, one of them cuts the wheel and is connected with and cuts the motor, it is equipped with cuts the rope to cut the wheel cover.

Furthermore, a center hole is formed in the geometric center of the slitting bottom plate.

Further, the outer wall of the slitting rope is provided with a plurality of diamonds.

Furthermore, the limiting mechanism comprises a pair of limiting bearing seats, a pair of connecting guide pillars is arranged between the limiting bearing seats, a limiting motor is installed on the limiting bearing seat located on the outer side, the limiting bearing seat located on the inner side is installed on the lower side of the slitting bottom plate, an output shaft of the limiting motor is connected with a limiting lead screw, the limiting lead screw is provided with a limiting seat, a pair of inner push rods is arranged on the limiting seat in an inward extending mode, a rotating seat is installed at the inner side end of each inner push rod, and a limiting wheel is arranged on the rotating seat.

Further, the mechanism of pushing up is including being two pairs of top bearing frame that vertical distribution set up, it pushes up the guide arm to be equipped with many between every pair of top bearing frame, the top motor is all installed to the top bearing frame that is located the lower extreme, the output shaft of top motor all is connected with the top lead screw, it all is equipped with the footstock to go up the top lead screw, it is equipped with the top dish to go up between the footstock, it is a pair of overhanging board that is equipped with of symmetrical structure to go up the top dish, the centre gripping bearing frame is all installed to overhanging board downside tip, be equipped with many centre gripping guide arms between the centre gripping bearing frame, the centre gripping motor is installed to one of them centre gripping bearing frame, the output shaft of centre gripping motor has the centre gripping lead screw, the screw thread at centre gripping lead screw both ends revolves to opposite, the both ends of centre gripping lead screw all are equipped with the grip slipper, the overhanging board is all worn in the upper end of grip slipper, the upper end of grip slipper all is equipped with the holder.

Furthermore, the clamping piece is of a V-shaped structure, and a soft rubber pad is arranged on the inner wall of the clamping piece.

The technical scheme has the advantages that:

when the wafer disc is processed, the wafer disc can be automatically and efficiently cut, the flexible material is adopted for cutting during cutting, the adverse effect of a metal cutter on the cutting quality of the wafer disc is avoided, the feeding operation of the wafer bar can be automatically performed during cutting, and meanwhile, the wafer bar can be limited during cutting, so that the cutting effect of the wafer bar is improved, and the wafer disc cutting device has strong practicability.

Drawings

Fig. 1 shows a perspective view of a first embodiment.

Fig. 2 shows a perspective view of the second embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.

As shown in fig. 1-2, a slicing device comprises a slicing mechanism 1, a plurality of limiting mechanisms 2 are arranged on the lower side of the slicing mechanism 1, the slicing mechanism 1 is provided with an upward pushing mechanism 3, the upward pushing mechanism 3 is used for supporting and clamping the lower end of a wafer rod and driving the wafer rod to feed to the slicing mechanism 1 under the guidance of the limiting mechanisms 2, and the slicing mechanism 1 is used for slicing the wafer disk.

The device conveniently cuts the single wafer of wafer dish through slicer mechanism 1, stop gear 2 and 3 operation of going up a mechanism. Wherein, slicing mechanism 1 can carry out the monolithic to the wafer dish and cut the operation, because adopted flexible material to cut the wafer stick, consequently improved the effect of cutting of wafer stick. When cutting the wafer stick, the limiting mechanism 2 plays a limiting role in the outer side of the wafer stick, on one hand, the stability of the wafer stick during cutting operation can be ensured, the phenomenon that the cutting end face is not parallel and level is avoided, on the other hand, the feeding operation of the wafer stick also plays a limiting role, and therefore the stability during feeding is ensured. Go up top mechanism 3 and can drive the wafer stick and upwards carry out automatic feed to can carry out stable centre gripping to the lower extreme of wafer stick, improve the efficiency of cutting of wafer stick through this mechanism. In operation, place the wafer stick on mechanism 3 of pushing up, carry out the centre gripping to the lower extreme of wafer stick through mechanism 3 of pushing up, spacing through stop gear 2 to the wafer stick after, spacing completion back, wafer stick upward movement under the drive of mechanism 3 of pushing up, after the wafer stick removes one section distance, cut the wafer stick through slicer mechanism 1, so reciprocal until the wafer stick is cut the completion.

Slicing mechanism 1 is including cutting bottom plate 10, cut bottom plate 10 downside and install a pair of spill support 191, cut bottom plate 10 both sides and all be equipped with curb plate 11, a pair of translation bearing frame 12 is all installed to the outer wall of curb plate 11, every all be equipped with many between the translation bearing frame 12 and cut guide arm 13, translation motor 14 is all installed to the translation bearing frame 12 that is located one end, translation motor 14's output shaft all is connected with translation screw 15, translation screw 15 all is equipped with translation seat 16, translation seat 16 outer wall all installs and cuts bearing frame 17, it all is connected with branch cutting wheel 19 to cut bearing frame 17 upside, one of them divides cutting wheel 19 to be connected with and cuts motor 18, it is equipped with cuts rope 190 to divide cutting wheel 19 cover, the department of geometric center of cutting bottom plate 10 has seted up centre bore 100, it is equipped with a plurality of diamonds to cut rope 190 outer wall. Wherein, this mechanism is owing to adopted the rope 190 of cutting that has the diamond, consequently avoids when cutting, because the poor phenomenon of quality of cutting that the reason of cutter itself leads to, need ensure the tensioning degree of cutting the rope 190 when cutting certainly, avoids appearing cutting the rope 190 when cutting and appears shaking. When cutting, cut motor 18 and drive and cut wheel 19 and rotate, cut wheel 19 will drive when rotating and cut rope 190 and rotate, the final operation of cutting to the wafer stick is accomplished through cutting rope 190, simultaneously need synchronous start translation motor 14 when cutting, translation screw 15 rotates under translation motor 14's drive, will drive translation seat 16 and move under translation screw 15's rotation, and translation seat 16 will drive when the motion and cut rope 190 and feed forward, thereby the operation is cut to the monolithic of final completion wafer.

The limiting mechanism 2 comprises a pair of limiting bearing seats 20, a pair of connecting guide pillars 21 is arranged between the limiting bearing seats 20, a limiting motor is mounted on the limiting bearing seat 20 located on the outer side, the limiting bearing seat 20 located on the inner side is mounted on the lower side of the slitting bottom plate 10, an output shaft of the limiting motor is connected with a limiting lead screw 22, the limiting lead screw 22 is provided with a limiting seat 23, the limiting seat 23 is provided with a pair of inner push rods 24 in an inward extending mode, a rotating seat 26 is mounted at the inner side end of each inner push rod 24, and a limiting wheel 27 is arranged on the rotating seat 26. This mechanism is when spacing to the wafer stick, start spacing motor, spacing lead screw 22 rotates under the drive of spacing motor, spacing lead screw 22 will drive spacing seat 23 when rotating and move along the length direction who connects guide pillar 21, and spacing seat 23's motion will be adjusted spacing position of taking turns 17 accurately, finally make spacing wheel 17 act on the outer wall of wafer stick, still need adjust the degree of erectting of wafer stick simultaneously when spacing, make the wafer stick be the state of erectting, and the stability of wafer stick motion can be ensured in setting up of spacing wheel 17.

The upper jacking mechanism 3 comprises two pairs of upper jacking bearing seats 30 which are vertically distributed, a plurality of upper jacking guide rods 31 are arranged between each pair of upper jacking bearing seats 30, upper jacking motors 32 are respectively arranged on the upper jacking bearing seats 30 at the lower ends, an output shaft of each upper jacking motor 32 is connected with an upper jacking screw rod 33, each upper jacking screw rod 33 is provided with an upper jacking seat 34, an upper jacking disc 35 is arranged between the upper jacking seats 34, each upper jacking disc 35 is provided with a pair of outward extending plates 36 in a symmetrical structure, the lower end parts of the outward extending plates 36 are respectively provided with a clamping bearing seat 37, a plurality of clamping guide rods 38 are arranged between the clamping bearing seats 37, one clamping bearing seat 37 is provided with a clamping motor 39, the output shaft of the clamping motor 39 is connected with a clamping screw rod 390, the screw threads at the two ends of the clamping screw rod 390 are opposite in rotating direction, the two ends of the clamping screw rod 390 are respectively provided with a clamping seat 391, the upper end of each clamping seat 391 extends through the corresponding outward extending plate 36, and the upper end of each clamping seat 391 is provided with a clamping piece 392, the clamping member 392 is a V-shaped structure, and a soft rubber pad is disposed on the inner wall of the clamping member 392.

Go up when pushing up mechanism 3 and carry out the centre gripping to the lower extreme of wafer stick, start centre gripping motor 39, centre gripping lead screw 390 rotates under centre gripping motor 39's drive, centre gripping lead screw 390 will drive holder 391 when rotating and be close to, finally accomplish the lower extreme centre gripping to the wafer stick through holder 392, the degree of erectting of wafer stick can be ensured to this kind of centre gripping mode, thereby the effect of cutting of wafer stick has been ensured, simultaneously in order to ensure the effect of centre gripping, set up the inner wall of holder 392 into V-arrangement mechanism, corresponding soft rubber pad has been set up to its inner wall simultaneously.

When the upward pushing mechanism 3 drives the wafer rod to move upward and feed the wafer rod, the upward pushing motor 32 is started, the upward pushing screw rod 33 is driven by the upward pushing motor 32 to rotate, the upward pushing screw rod 33 drives the upward pushing base 34 to move when rotating, the upward movement of the upward pushing base 34 drives the wafer rod to move upward through the upward pushing disc 35, the feeding movement is convenient to control, and the feeding precision is high.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is apparent that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A slicing device is characterized by comprising a slicing mechanism (1), wherein a plurality of limiting mechanisms (2) are arranged on the lower side of the slicing mechanism (1), the slicing mechanism (1) is provided with an upper ejection mechanism (3), the upper ejection mechanism (3) is used for supporting and clamping the lower end of a wafer rod and driving the wafer rod to feed to the slicing mechanism (1) under the guidance of the limiting mechanisms (2), and the slicing mechanism (1) is used for slicing the wafer;

slicing mechanism (1) is including cutting bottom plate (10), cut bottom plate (10) downside and install a pair of spill support (191), cut bottom plate (10) both sides and all be equipped with curb plate (11), a pair of translation bearing frame (12) are all installed to the outer wall of curb plate (11), every all be equipped with many between translation bearing frame (12) and cut guide arm (13), translation motor (14) are all installed in translation bearing frame (12) that are located one end, the output shaft of translation motor (14) all is connected with translation screw rod (15), translation screw rod (15) all are equipped with translation seat (16), translation seat (16) outer wall all installs and cuts bearing frame (17), it all is connected with branch and cuts wheel (19) to cut bearing frame (17) upside, one of them divides and cuts wheel (19) and is connected with and cuts motor (18), divide and cut wheel (19) cover and be equipped with and cut rope (190).

2. Slicing device according to claim 1, characterized in that the slitting baseplate (10) is provided with a central hole (100) in the geometric centre thereof.

3. The slicing device according to claim 1, wherein the outer wall of the dividing line (190) is provided with a plurality of diamonds.

4. The slicing device according to claim 1, wherein the limiting mechanism (2) comprises a pair of limiting bearing seats (20), a pair of connecting guide pillars (21) is arranged between the limiting bearing seats (20), a limiting motor is arranged on the limiting bearing seat (20) positioned on the outer side, the limiting bearing seat (20) positioned on the inner side is arranged on the lower side of the slitting bottom plate (10), an output shaft of the limiting motor is connected with a limiting lead screw (22), the limiting lead screw (22) is provided with a limiting seat (23), the limiting seat (23) is provided with a pair of inner push rods (24) in an inward extending manner, the inner end of each inner push rod (24) is provided with a rotating seat (26), and each rotating seat (26) is provided with a limiting wheel (27).

5. The slicing device as claimed in claim 1, wherein the upper jacking mechanism (3) comprises two pairs of upper jacking bearing seats (30) which are vertically distributed, a plurality of upper jacking guide rods (31) are arranged between each pair of upper jacking bearing seats (30), an upper jacking motor (32) is arranged on each upper jacking bearing seat (30) at the lower end, an output shaft of each upper jacking motor (32) is connected with an upper jacking rod (33), each upper jacking rod (33) is provided with an upper jacking seat (34), an upper jacking disc (35) is arranged between the upper jacking seats (34), a pair of outward extending plates (36) are symmetrically arranged on each upper jacking disc (35), clamping bearing seats (37) are arranged on the lower end portions of the outward extending plates (36), a plurality of clamping guide rods (38) are arranged between the clamping bearing seats (37), a clamping motor (39) is arranged on one clamping bearing seat (37), an output shaft of each clamping motor (39) is connected with a clamping screw rod (390), the screw thread of centre gripping lead screw (390) both ends is turned to opposite, and the both ends of centre gripping lead screw (390) all are equipped with grip slipper (391), and the upper end of grip slipper (391) all passes in overhanging plate (36), and the upper end of grip slipper (391) all is equipped with holder (392).

6. The slicing apparatus as claimed in claim 5, wherein the holding member (392) has a V-shaped configuration, and the inner wall of the holding member (392) is provided with a soft rubber pad.