CN216325818U - Earphone antenna mounting equipment - Google Patents
Earphone antenna mounting equipment Download PDFInfo
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- CN216325818U CN216325818U CN202122368713.1U CN202122368713U CN216325818U CN 216325818 U CN216325818 U CN 216325818U CN 202122368713 U CN202122368713 U CN 202122368713U CN 216325818 U CN216325818 U CN 216325818U
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- antenna
- axis moving
- mainboard
- moving module
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Abstract
The utility model discloses an earphone antenna installation device, which comprises: a frame, a first feeding mechanism and a second feeding mechanism which are arranged at one side of the frame and respectively send out a mainboard tray and an antenna tray, a first blanking mechanism and a second blanking mechanism which are arranged at the other side of the frame and are used for receiving the mainboard tray and the antenna tray, a first carrying mechanism which is arranged between the first feeding mechanism and the first blanking mechanism and is used for transferring the mainboard tray, a second carrying mechanism which is arranged between the second feeding mechanism and the second blanking mechanism and is used for transferring the antenna tray, a solder paste dispensing mechanism which is arranged at one end of the first carrying mechanism and is used for dripping solder paste on a mainboard in the mainboard tray, a laser welding mechanism which is arranged at the other end of the first carrying mechanism and is used for welding the antenna and the mainboard, and an assembling mechanism which is arranged on the frame and is used for carrying the antenna to the mainboard tray and is butted with the mainboard, a plurality of mainboards are arranged on the mainboard tray, a plurality of antennas are arranged on the antenna tray.
Description
The technical field is as follows:
the utility model relates to the technical field of automatic production, in particular to earphone antenna mounting equipment.
Background art:
along with the continuous development of scientific technology, more and more people like wireless earphones, and it has the portability that wired earphones can't replace, replaces the wire rod through radio wave and connects, has saved the restraint sense of earphone cord, makes the user experience more comfortable. And the antenna for receiving signals needs to be installed in the wireless earphone, and because the size of the antenna and the size of the mainboard in the earphone are both very small, the traditional manual welding is obviously not suitable any more, and the accuracy and the efficiency of the welding of the antenna and the mainboard are difficult to meet.
In view of the above, the present inventors propose the following.
The utility model has the following contents:
the utility model aims to overcome the defects of the prior art and provides earphone antenna mounting equipment.
In order to solve the technical problems, the utility model adopts the following technical scheme: this earphone antenna mounting apparatus includes: the antenna tray feeding device comprises a rack, a first feeding mechanism arranged on one side of the rack and used for sending out a main board tray, a second feeding mechanism arranged on the side of the first feeding mechanism and used for sending out an antenna tray, a first blanking mechanism arranged on the other side of the rack and used for receiving the main board tray, a second blanking mechanism arranged on the side of the first blanking mechanism and used for receiving the antenna tray, a first carrying mechanism arranged between the first feeding mechanism and the first blanking mechanism and used for transferring the main board tray, a second carrying mechanism arranged between the second feeding mechanism and the second blanking mechanism and used for transferring the antenna tray, a solder paste dropping mechanism arranged at one end of the first carrying mechanism and used for dropping solder paste on a main board in the main board tray, a laser welding mechanism arranged at the other end of the first carrying mechanism and used for welding an antenna and the main board, and a solder paste dropping mechanism arranged on the other end of the first carrying mechanism and used for welding the antenna and the main board, and a laser welding mechanism arranged on the rack and used for enabling the antenna to be fed from the antenna to be fed by the main board Carry on the antenna tray the assembly devices who docks with the mainboard on the mainboard tray, arrange on the mainboard tray and placed a plurality of the mainboard, arrange on the antenna tray and placed a plurality of the antenna.
Furthermore, in the above technical solution, the assembly mechanism includes a first X-axis moving module installed on the frame and stretching over the first carrying mechanism and the second carrying mechanism, a CCD vision alignment system installed on the first X-axis moving module and used for positioning by taking a picture, and a material taking device disposed beside the CCD vision alignment system and used for grabbing the antenna, and the first X-axis moving module can drive the CCD vision alignment system and the material taking device to reciprocate between the first carrying mechanism and the second carrying mechanism.
Furthermore, in the above technical solution, the material taking device includes a box installed on the first X-axis moving module, a Z-axis moving driving device installed in the box, a material taking claw installed at a lower end of the Z-axis moving driving device and used for taking the antenna, and a Z-axis rotation driving device installed in the box and used for driving the Z-axis moving driving device to rotate, and the material taking claw is provided with a plurality of negative pressure suction holes.
Furthermore, in the above technical solution, the laser welding mechanism includes a second X-axis moving module installed on the frame and crossing over the first carrying mechanism, a non-contact laser soldering head installed on the second X-axis moving module and used for irradiating laser onto the motherboard tray, and a laser generator installed beside the non-contact laser soldering head.
Furthermore, in the above technical solution, the solder paste dispensing mechanism includes a third X-axis moving module installed on the frame and crossing over the first carrying mechanism, a Z-axis moving module installed on the third X-axis moving module, and a solder paste dropping cylinder installed on the Z-axis moving module and used for dropping solder paste onto the main board in the main board tray.
Furthermore, in the above technical scheme, a first positioning block and a second positioning block which are respectively used for positioning the upper end and the lower end of the tin dropping needle cylinder are installed on the moving seat of the Z-axis moving module, the needle head at the lower end of the tin dropping needle cylinder penetrates through the first positioning block, and the upper portion of the tin dropping needle cylinder penetrates through the second positioning block and is locked and fixed through a bolt.
Furthermore, in the above technical solution, the first carrying mechanism includes a first Y-axis moving module installed on the rack and a first positioning module installed on the first Y-axis moving module and used for bearing and positioning the motherboard tray, and the second carrying mechanism includes a second Y-axis moving module installed on the rack and parallel to the first Y-axis moving module and a second positioning module installed on the second Y-axis moving module and used for bearing and positioning the antenna tray.
Furthermore, in the above technical solution, a third positioning module which has the same structure as the first positioning module and moves relatively independently is further installed on the first Y-axis moving module, and the second positioning module has the same structure as the first positioning module.
Further, in the above technical solution, the first feeding mechanism, the first discharging mechanism, the second feeding mechanism and the second discharging mechanism have the same structure.
Furthermore, in the above technical solution, a plurality of first positioning grooves for positioning the motherboard and arranged in a matrix are formed on the motherboard tray, a plurality of second positioning grooves for positioning the antenna and arranged in a matrix are formed on the antenna tray, and the shapes of the second positioning grooves are the same as those of the antenna.
After adopting the technical scheme, compared with the prior art, the utility model has the following beneficial effects: according to the utility model, the first feeding mechanism and the first discharging mechanism are matched with the first carrying mechanism to realize automatic feeding and discharging of the main board, the solder paste dotting mechanism and the laser welding mechanism which are arranged at two ends of the first carrying mechanism respectively perform solder paste dotting and soldering on the main board, meanwhile, the second carrying mechanism which is arranged beside the first carrying mechanism in parallel is matched with the second feeding mechanism and the second discharging mechanism to realize automatic feeding and tray recovery of the antenna, the antenna is installed on the main board which is completely soldered at the midpoint of the first carrying mechanism from the second carrying mechanism through the assembling mechanism arranged between the solder paste dotting mechanism and the laser welding mechanism, and then the laser welding mechanism performs non-contact welding, so that the antenna is quickly welded on the main board, and the welding precision and the welding efficiency are high. Secondly, compare in manual welding and do not need touching the antenna through laser welding, can avoid taking place the displacement between welding process in antenna and the mainboard, improve the welding precision, reduce the substandard product and produce.
Description of the drawings:
FIG. 1 is a first schematic structural diagram of the present invention;
FIG. 2 is a second schematic structural view of the present invention;
FIG. 3 is a perspective view of a material extracting apparatus of the present invention;
FIG. 4 is a perspective view of a solder paste dispensing mechanism according to the present invention;
FIG. 5 is a perspective view of a motherboard tray in accordance with the present invention;
fig. 6 is a perspective view of an antenna tray of the present invention;
FIG. 7 is an enlarged view of a portion of FIG. 4 at A;
fig. 8 is a partially enlarged view at B in fig. 5.
The specific implementation mode is as follows:
the utility model is further illustrated below with reference to specific embodiments and the accompanying drawings.
Referring to fig. 1 to 8, there is provided an earphone antenna mounting apparatus, including: the antenna tray feeding device comprises a rack 1, a first feeding mechanism 2 arranged on one side of the rack 1 and used for sending out a mainboard tray 101, a second feeding mechanism 20 arranged on the side of the first feeding mechanism 2 and used for sending out an antenna tray 102, a first discharging mechanism 3 arranged on the other side of the rack 1 and used for receiving the mainboard tray 101, a second discharging mechanism 30 arranged on the side of the first discharging mechanism 3 and used for receiving the antenna tray 102, a first carrying mechanism 4 arranged between the first feeding mechanism 2 and the first discharging mechanism 3 and used for transferring the mainboard tray 101, a second carrying mechanism 5 arranged between the second feeding mechanism 20 and the second discharging mechanism 30 and used for transferring the antenna tray 102, a solder paste dropping mechanism 6 arranged at one end of the first carrying mechanism 4 and used for dropping solder paste on the mainboard tray 103 in the mainboard tray 101, a first feeding mechanism 6, a second feeding mechanism and a second feeding mechanism for feeding solder paste on the mainboard tray 103 in the mainboard tray 101, The laser welding mechanism 7 is arranged at the other end of the first carrying mechanism 4 and used for welding the antenna 104 and the mainboard 103, and the assembling mechanism 8 is installed on the rack 1 and used for carrying the antenna 104 from the antenna tray 102 to the mainboard tray 101 and butting with the mainboard 103, a plurality of mainboards 103 are arranged on the mainboard tray 101, and a plurality of antennas 104 are arranged on the antenna tray 102. Adopt first feed mechanism 2 and first feed mechanism 3 to cooperate first transport mechanism 4 to realize the automatic unloading of mainboard 103, and by some tin cream mechanism 6 and laser welding mechanism 7 that set up at first transport mechanism 4 both ends respectively to mainboard 103 point tin cream and soldering tin, simultaneously, by the cooperation of second feed mechanism 20 and second unloading mechanism 30 of second transport mechanism 5 that sets up side by side at first transport mechanism 4 realize the automatic feeding and the tray of antenna 104 and retrieve, install antenna 104 from second transport mechanism 5 to the mainboard 103 that the point had been accomplished the tin cream in first transport mechanism 4 through the assembly devices 8 that sets up between some tin cream mechanism 6 and laser welding mechanism 7, again carry out non-contact welding by laser welding mechanism 7, thereby realize welding antenna 104 to mainboard 103 fast, welding precision and welding efficiency are high. Secondly, compare in manual welding and do not need touching antenna 104 through laser welding, can avoid taking place the displacement between antenna 104 and the mainboard 104 in the welding process, improve the welding precision, reduce the substandard product and produce.
The assembly mechanism 8 comprises a first X-axis moving module 81 installed on the frame 1 and stretching over the first carrying mechanism 4 and the second carrying mechanism 5, a CCD vision alignment system 82 installed on the first X-axis moving module 81 and used for photographing and positioning, and a material taking device 83 arranged beside the CCD vision alignment system 82 and used for grabbing the antenna 104, wherein the first X-axis moving module 81 can drive the CCD vision alignment system 82 and the material taking device 83 to reciprocate between the first carrying mechanism 4 and the second carrying mechanism 5. A plurality of material taking devices 83 are arranged on the first X-axis moving module 81 in parallel, so that the assembly efficiency is improved, and the tin paste is prevented from being solidified.
The material taking device 83 includes a box 831 installed on the first X-axis moving module 81, a Z-axis moving driving device 832 installed in the box 831, a material taking claw 833 installed at a lower end of the Z-axis moving driving device 832 and used for grabbing the antenna 104, and a Z-axis rotating driving device 834 installed in the box 831 and used for driving the Z-axis moving driving device 832 to rotate, wherein a plurality of negative pressure suction holes 835 are formed in the material taking claw 833. Adopt the adsorbed mode of negative pressure to snatch, not only can avoid damaging antenna 104, can also prevent to bump when placing antenna 104 on mainboard 103 to improve the butt joint precision between mainboard 103 and the antenna 104, improve follow-up welding precision. Secondly, the negative pressure adsorption grabbing antenna 103 can also prevent the material taking claw 833 from scraping and rubbing solder paste on the main board 103 in the lowering process, the welding success rate is improved, and the generation of inferior products is reduced.
The laser welding mechanism 7 comprises a second X-axis moving module 71 installed on the frame 1 and stretching over the first carrying mechanism 4, a non-contact laser soldering tin head 72 installed on the second X-axis moving module 71 and used for irradiating laser onto the mainboard tray 101, and a laser generator 73 arranged beside the non-contact laser soldering tin head 72. This non-contact laser welder head 72 is the divergent formula laser head, can send large tracts of land laser beam to weld antenna 104 on the mainboard tray 101 and mainboard 103 fast, improve welding efficiency, avoid the tin cream to solidify simultaneously.
The solder paste dispensing mechanism 6 includes a third X-axis moving module 61 mounted on the frame 1 and crossing over the first carrying mechanism 4, a Z-axis moving module 62 mounted on the third X-axis moving module 61, and a solder dropping needle cylinder 63 mounted on the Z-axis moving module 62 and used for dropping solder paste onto the motherboard 103 in the motherboard tray 101. A plurality of solder dropping needle cylinders 63 are arranged on the Z-axis moving module 62 in parallel to improve the dropping efficiency and avoid solder paste solidification.
A first positioning block 64 and a second positioning block 65 which are respectively used for positioning the upper end and the lower end of the tin dropping needle cylinder 63 are arranged on the moving seat of the Z-axis moving module 62, the needle head at the lower end of the tin dropping needle cylinder 63 penetrates through the first positioning block 64, and the upper part of the tin dropping needle cylinder 63 penetrates through the second positioning block 65 and is locked and fixed through a bolt 66.
The first carrying mechanism 4 includes a first Y-axis moving module 41 installed on the rack 1, and a first positioning module 42 installed on the first Y-axis moving module 41 and used for bearing and positioning the motherboard tray 101, and the second carrying mechanism 5 includes a second Y-axis moving module 51 installed on the rack 1 and parallel to the first Y-axis moving module 41, and a second positioning module 52 installed on the second Y-axis moving module 51 and used for bearing and positioning the antenna tray 102.
The first Y-axis moving module 41 is further provided with a third positioning module 43 which has the same structure as the first positioning module 42 and moves relatively independently, and the second positioning module 52 has the same structure as the first positioning module 42.
The first feeding mechanism 2 and the first discharging mechanism 3, and the second feeding mechanism 20 and the second discharging mechanism 30 have the same structure.
A plurality of first positioning grooves 105 which are used for positioning the mainboard 103 and are arranged in a matrix are formed on the mainboard tray 101, a plurality of second positioning grooves 106 which are used for positioning the antennas 104 and are arranged in a matrix are formed on the antenna tray 102, and the shapes of the second positioning grooves 106 are the same as those of the antennas 104.
In summary, when the present invention works, the motherboard trays 101 full of the motherboard 103 are stacked and placed in the first feeding mechanism 2, and the antenna trays 102 full of the antenna 104 are stacked and placed in the second feeding mechanism 20; further, the first Y-axis moving module 41 of the first carrying mechanism 4 drives the first positioning module 42 to approach and butt with the first feeding mechanism 2, and then the first feeding mechanism 2 transfers the motherboard tray 101 to the first positioning module 42; further, the first Y-axis moving module 41 drives the first positioning module 42 to move to the solder paste dispensing mechanism 6, and then the solder paste dispensing mechanism 6 drops solder paste to the corresponding position of the main board 103 on the first positioning module 42, meanwhile, the second Y-axis moving module 51 of the second carrying mechanism 5 drives the second positioning module 52 to move to be butted with the second feeding mechanism 20, and the second feeding mechanism 20 transfers the antenna tray 102 to the second positioning module 52; further, after the mainboard 101 on the first positioning module 42 finishes the solder paste dotting process, the first Y-axis moving module 41 of the first carrying mechanism 4 drives the third positioning module 43 to approach and butt against the first positioning module 42, the first positioning module 42 transfers the mainboard tray 101 which finishes the solder paste dotting process to the third positioning module 43, the first Y-axis moving module 41 drives the third positioning module 43 to move to the assembling mechanism 8, the second Y-axis moving module 51 drives the second positioning module 52 to move to be parallel to the third positioning module 43, and meanwhile, the first Y-axis moving module 41 drives the first positioning module 42 to connect the next mainboard tray 101 from the feeding mechanism 2 and move to the solder paste dotting mechanism 6 for solder paste dotting; further, the assembling mechanism 8 grasps the antennas 104 in the second positioning module 52 one by one and places them on the main board 103 in the third positioning module 43 and connects them; further, after the antennas 104 on the second positioning module 52 are all mounted on the main board 103 of the third positioning module 43, the first Y-axis moving module 41 drives the third positioning module 43 to move the butted main board 103 and antennas 104 to the laser welding mechanism 7, and then the laser scanning welding is completed by the laser welding mechanism 7; further, the first Y-axis moving module 41 drives the third positioning module 43 to move the motherboard tray 101 welded with the antenna 104 to be butted with the first blanking mechanism 3, the first blanking mechanism 3 stacks the antenna tray 101, meanwhile, the second Y-axis moving module 51 drives the second positioning module 52 to move to be butted with the second blanking mechanism 30, and the second blanking mechanism 30 stacks the empty antenna tray 102; finally, the main board tray 101 stacked in the first blanking mechanism 3 and the antenna tray 102 stacked in the second blanking mechanism 30 are manually taken out. In the above working steps, after the third positioning module 43 completes the blanking of the motherboard tray 101, the first Y-axis moving module 41 drives the third positioning module 43 to move to be in butt joint with the first positioning module 42 so as to connect the motherboard tray 101 after the solder paste dotting is completed, and meanwhile, the second Y-axis moving module 51 drives the second positioning module 52 to move to the second feeding mechanism 20, to connect the next antenna tray 102, and to move to the assembling mechanism 8, so that the motherboard 103 and the antenna 104 are continuously welded without stopping.
It should be understood that the above description is only exemplary of the present invention, and is not intended to limit the scope of the present invention, which is defined by the appended claims.
Claims (10)
1. An earphone antenna mounting apparatus, comprising: the antenna tray feeding device comprises a rack (1), a first feeding mechanism (2) arranged on one side of the rack (1) and used for sending out a main board tray (101), a second feeding mechanism (20) arranged on the side of the first feeding mechanism (2) and used for sending out an antenna tray (102), a first blanking mechanism (3) arranged on the other side of the rack (1) and used for receiving the main board tray (101), a second blanking mechanism (30) arranged on the side of the first blanking mechanism (3) and used for receiving the antenna tray (102), a first carrying mechanism (4) arranged between the first feeding mechanism (2) and the first blanking mechanism (3) and used for transferring the main board tray (101), a second carrying mechanism (5) arranged between the second feeding mechanism (20) and the second blanking mechanism (30) and used for transferring the antenna tray (102), Set up in first transport mechanism (4) one end and be used for to go up some tin cream mechanism (6) of dropwise add tin cream on mainboard (103) in mainboard tray (101), set up in first transport mechanism (4) other end is used for welding laser welding mechanism (7) of antenna (104) and mainboard (103) and install in on frame (1) and be used for with antenna (104) are followed carry to on antenna tray (102) assembly devices (8) with mainboard (103) butt joint on mainboard tray (101), arrange on mainboard tray (101) and placed a plurality of mainboard (103), arrange on antenna tray (102) and placed a plurality of antenna (104).
2. An earphone antenna mounting device according to claim 1, wherein: the assembly mechanism (8) comprises a first X-axis moving module (81) which is arranged on the rack (1) and stretches over the first carrying mechanism (4) and the second carrying mechanism (5), a CCD vision alignment system (82) which is arranged on the first X-axis moving module (81) and used for photographing and positioning, and a material taking device (83) which is arranged beside the CCD vision alignment system (82) and used for grabbing the antenna (104), wherein the first X-axis moving module (81) can drive the CCD vision alignment system (82) and the material taking device (83) to reciprocate between the first carrying mechanism (4) and the second carrying mechanism (5).
3. An earphone antenna mounting device according to claim 2, wherein: the material taking device (83) comprises a box body (831) installed on the first X-axis moving module (81), a Z-axis moving driving device (832) installed in the box body (831), a material taking claw (833) installed at the lower end of the Z-axis moving driving device (832) and used for grabbing the antenna (104), and a Z-axis rotating driving device (834) installed in the box body (831) and used for driving the Z-axis moving driving device (832) to rotate, wherein a plurality of negative pressure suction holes (835) are formed in the material taking claw (833).
4. An earphone antenna mounting device according to claim 1, wherein: the laser welding mechanism (7) comprises a second X-axis moving module (71) which is arranged on the rack (1) and stretches over the first carrying mechanism (4), a non-contact laser welding tin head (72) which is arranged on the second X-axis moving module (71) and used for irradiating laser on the mainboard tray (101), and a laser generator (73) which is arranged beside the non-contact laser welding tin head (72).
5. An earphone antenna mounting device according to claim 1, wherein: the solder paste dispensing mechanism (6) comprises a third X-axis moving module (61) which is arranged on the rack (1) and stretches over the first carrying mechanism (4), a Z-axis moving module (62) which is arranged on the third X-axis moving module (61), and a solder paste dripping needle cylinder (63) which is arranged on the Z-axis moving module (62) and is used for dripping solder paste on a main board (103) in the main board tray (101).
6. An earphone antenna mounting device according to claim 5, wherein: install on the removal seat of Z axle removal module (62) and be used for the location respectively first locating piece (64) and second locating piece (65) of dripping tin cylinder (63) upper end and lower extreme, the syringe needle of dripping tin cylinder (63) lower extreme passes first locating piece (64), the upper portion of dripping tin cylinder (63) is passed second locating piece (65) and is locked fixedly through bolt (66).
7. An earphone antenna mounting device according to any one of claims 1-6, wherein: the first carrying mechanism (4) comprises a first Y-axis moving module (41) arranged on the rack (1) and a first positioning module (42) which is arranged on the first Y-axis moving module (41) and used for bearing and positioning the mainboard tray (101), and the second carrying mechanism (5) comprises a second Y-axis moving module (51) which is arranged on the rack (1) and parallel to the first Y-axis moving module (41) and a second positioning module (52) which is arranged on the second Y-axis moving module (51) and used for bearing and positioning the antenna tray (102).
8. An earphone antenna mounting device according to claim 7, wherein: and the first Y-axis moving module (41) is also provided with a third positioning module (43) which has the same structure as the first positioning module (42) and moves relatively independently, and the second positioning module (52) has the same structure as the first positioning module (42).
9. An earphone antenna mounting device according to claim 8, wherein: the first feeding mechanism (2) and the first blanking mechanism (3) as well as the second feeding mechanism (20) and the second blanking mechanism (30) are identical in structure.
10. An earphone antenna mounting device according to claim 1, wherein: the shaping has a plurality of to be used for the location on mainboard tray (101) mainboard (103) and be first constant head tank (105) of matrix arrangement, the shaping has a plurality of to be used for the location on antenna tray (102) antenna (104) and be second constant head tank (106) of matrix arrangement, just second constant head tank (106) with antenna (104) shape is the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122368713.1U CN216325818U (en) | 2021-09-28 | 2021-09-28 | Earphone antenna mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122368713.1U CN216325818U (en) | 2021-09-28 | 2021-09-28 | Earphone antenna mounting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216325818U true CN216325818U (en) | 2022-04-19 |
Family
ID=81174815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122368713.1U Expired - Fee Related CN216325818U (en) | 2021-09-28 | 2021-09-28 | Earphone antenna mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216325818U (en) |
-
2021
- 2021-09-28 CN CN202122368713.1U patent/CN216325818U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220419 |