CN216313746U

CN216313746U - High-frequency circuit board heat sink is used in 5G communication

Info

Publication number: CN216313746U
Application number: CN202122943517.2U
Authority: CN
Inventors: 明万均
Original assignee: Shenzhen Aite Hongfa Electronics Co ltd
Current assignee: Shenzhen Aite Hongfa Electronics Co ltd
Priority date: 2021-11-29
Filing date: 2021-11-29
Publication date: 2022-04-15
Anticipated expiration: 2031-11-29

Abstract

The utility model discloses a high-frequency circuit board cooling device for 5G communication, which comprises a shell, wherein a circuit board body is arranged inside the shell, a water tank is fixedly connected to one side of the bottom of the shell, a water pump is arranged inside the water tank, the output end of the water pump is fixedly connected with a water inlet pipe, one end of the water inlet pipe penetrates through the shell, the outer surface of the water inlet pipe is fixedly communicated with one ends of a plurality of cooling copper pipes, the other ends of the plurality of cooling copper pipes are fixedly communicated with the outer surface of a water outlet pipe, one end of the water outlet pipe penetrates through the shell and is communicated with one end of a connecting pipe, the bottom of the connecting pipe is fixedly communicated with one end of a cooling copper pipe, the other end of the cooling copper pipe is fixedly communicated with one end of a drain pipe, and the other end of the drain pipe is fixedly communicated with the top end of the water tank. Through setting up the heat sink, convenience of customers cools down the circuit board to better protection circuit board.

Description

High-frequency circuit board heat sink is used in 5G communication

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a high-frequency circuit board cooling device for 5G communication.

Background

The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.

With the maturity of the application of 5G communication technology, the application field of 5G general high frequency circuit board is also more and more extensive, but the temperature that produces when current circuit board is worked is higher, and the shell that the circuit board was installed does not have the heat sink yet, and long-time use not only makes circuit board work efficiency reduce, also easily reduces the life of circuit board, for this reason we propose a high frequency circuit board heat sink for 5G communication.

Disclosure of Invention

In order to overcome the defects of the prior art, the utility model provides the high-frequency circuit board cooling device for 5G communication, which is convenient for a user to cool the circuit board by arranging the cooling device, thereby better protecting the circuit board.

In order to solve the technical problems, the utility model provides the following technical scheme: the utility model provides a 5G is high frequency circuit board heat sink for communication, includes the shell, the inside of shell is provided with the circuit board body, one side fixedly connected with water tank of shell bottom, the inside of water tank is provided with the water pump, the output fixedly connected with inlet tube of water pump, and the one end of inlet tube passes the shell, the surface of inlet tube is fixed with the one end of a plurality of cooling copper pipes and communicates with each other, and is a plurality of the other end of cooling copper pipe communicates with each other with the external fixation of outlet pipe, the one end of outlet pipe is passed the shell and is communicated with each other with the one end of connecting pipe, the bottom of connecting pipe communicates with each other with the one end stationary phase of heat dissipation copper pipe, the other end of heat dissipation copper pipe communicates with each other with the one end stationary phase of drain pipe, the other end of drain pipe communicates with each other with the top stationary phase of water tank.

As a preferred technical scheme of the utility model, the top of the water tank is fixedly connected with a heat dissipation cover, a motor is fixedly arranged in the heat dissipation cover, the output end of the motor is fixedly connected with fan blades, and the blowing direction of the fan blades corresponds to the position of the heat dissipation copper pipe.

As a preferred technical scheme of the utility model, the top and the bottom of the shell are both provided with a plurality of first heat dissipation grooves.

As a preferred technical scheme of the utility model, the number of the cooling copper pipes is at least three, and the cooling copper pipes are distributed at equal intervals.

As a preferred technical scheme of the utility model, the outer surface of each cooling copper pipe is provided with a plurality of cooling fins, and the outer surface of each heat dissipation copper pipe is provided with a plurality of heat dissipation fins.

As a preferred technical scheme of the utility model, the inner diameter of each cooling copper pipe is smaller than that of the water inlet pipe, and the inner diameter of each heat dissipation copper pipe is smaller than that of the connecting pipe.

As a preferable technical scheme of the utility model, the top and two sides of the heat dissipation cover are both provided with a plurality of second heat dissipation grooves.

Compared with the prior art, the utility model can achieve the following beneficial effects:

1. the cooling water in the water tank is conveyed into the water inlet pipe through the working of the water pump, the cooling water in the water inlet pipe then enters the interiors of a plurality of cooling copper pipes, at the moment, the cooling water in the cooling copper pipes absorbs heat, so that the circuit board body is cooled, the cooling water absorbing heat enters the interior of a water outlet pipe from the plurality of cooling copper pipes, and then enters the interiors of heat dissipation copper pipes through connecting pipes;

2. when the cooling water absorbing heat passes through the inside of the heat dissipation copper pipe, the motor works to drive the fan blades to rotate, and the fan blades can dissipate the heat of the heat dissipation copper pipe, so that the heat can be rapidly dissipated when the heat is absorbed for cooling, the circuit board body can be cooled in a circulating mode subsequently, and the heat dissipation capacity of the heat dissipation copper pipe is greatly improved through the design.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

FIG. 3 is an enlarged view of a portion of FIG. 2;

FIG. 4 is a schematic view of a heat dissipation copper tube according to the present invention;

wherein: 1. a housing; 2. a water tank; 3. a heat dissipation cover; 4. a water pump; 5. a water inlet pipe; 6. cooling the copper pipe; 7. a water outlet pipe; 8. a connecting pipe; 9. a heat dissipation copper pipe; 10. a drain pipe; 11. a motor; 12. a fan blade; 13. a first heat sink; 14. cooling fins; 15. a heat dissipating fin; 16. a circuit board body; 17. a second heat sink.

Detailed Description

The present invention will be further described with reference to specific embodiments for the purpose of facilitating an understanding of technical means, characteristics of creation, objectives and functions realized by the present invention, but the following embodiments are only preferred embodiments of the present invention, and are not intended to be exhaustive. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

Example (b):

as shown in fig. 1 to 4, a high-frequency circuit board cooling device for 5G communication comprises a housing 1, a circuit board body 16 is arranged inside the housing 1, a water tank 2 is fixedly connected to one side of the bottom of the housing 1, a water pump 4 is arranged inside the water tank 2, an output end of the water pump 4 is fixedly connected to a water inlet pipe 5, one end of the water inlet pipe 5 penetrates through the housing 1, the outer surface of the water inlet pipe 5 is fixedly communicated with one ends of a plurality of cooling copper pipes 6, the other ends of the plurality of cooling copper pipes 6 are fixedly communicated with the outer surface of a water outlet pipe 7, one end of the water outlet pipe 7 penetrates through the housing 1 to be communicated with one end of a connecting pipe 8, the bottom of the connecting pipe 8 is fixedly communicated with one end of a cooling copper pipe 9, the other end of the cooling copper pipe 9 is fixedly communicated with one end of a drain pipe 10, and the other end of the drain pipe 10 is fixedly communicated with the top end of the water tank 2;

cooling copper pipe 6 is located circuit board body 16's side, when needs are cooled down

circuit board body

16, 4 works of water pump, the inside cooling water transportation entering inlet tube 5 with 2 inside cooling water of water tank, the inside cooling water of inlet tube 5 gets into a plurality of cooling copper pipe 6 inside afterwards, the cooling water of 6 inside of cooling copper pipe absorbs the heat this moment, thereby cool down circuit board body 16, absorb thermal cooling water and get into 7 insidely of outlet pipe from a plurality of cooling copper pipe 6, it is inside to get into heat dissipation copper pipe 9 through connecting pipe 8 afterwards, utilize heat dissipation copper pipe 9 to cool down the thermal cooling water of absorption, it is inside to get into 2 water tanks through drain pipe 10 afterwards, do work via water pump 4 again, accomplish the continuous cooling to circuit board body 16, this design can effectually cool down circuit board body 16.

In other embodiments, the top of the water tank 2 is fixedly connected with the heat dissipation cover 3, the inside of the heat dissipation cover 3 is fixedly provided with the motor 11, the output end of the motor 11 is fixedly connected with the fan blade 12, and the blowing direction of the fan blade 12 corresponds to the position of the heat dissipation copper pipe 9;

when the cooling water absorbing heat passes through the inside of the heat dissipation copper pipe 9, the motor 11 works to drive the fan blades 12 to rotate, and the fan blades 12 can dissipate the heat of the heat dissipation copper pipe 9, so that the heat can be rapidly dissipated when the heat is absorbed for cooling, the circuit board body 16 can be cooled circularly subsequently, and the heat dissipation capacity of the heat dissipation copper pipe 9 is greatly improved by the design.

In other embodiments, the top and the bottom of the housing 1 are both provided with a plurality of first heat dissipation grooves 13;

the heat inside the shell 1 can be discharged rapidly, so that the circuit board body 16 can dissipate heat conveniently.

In other embodiments, the number of the cooling copper pipes 6 is at least three, and the cooling copper pipes are distributed at equal intervals;

the cooling copper pipes 6 are utilized to increase the speed of cooling water absorbing heat, thereby improving the cooling efficiency.

In other embodiments, the outer surface of each cooling copper pipe 6 is provided with a plurality of cooling fins 14, and the outer surface of the heat dissipation copper pipe 9 is provided with a plurality of heat dissipation fins 15;

the cooling fins 14 on the cooling copper tube 6 can increase the contact area between heat and the cooling copper tube 6 or the heat dissipation copper tube 9, thereby accelerating the cooling efficiency of the cooling copper tube 6 or the heat dissipation efficiency of the heat dissipation copper tube 9.

In other embodiments, the inner diameter of each cooling copper pipe 6 is smaller than that of the water inlet pipe 5, and the inner diameter of the heat dissipation copper pipe 9 is smaller than that of the connecting pipe 8;

all set up a plurality of cooling copper pipes 6 and heat dissipation copper pipe 9 into little pipe diameter, can make cooling copper pipe 6 internal cooling water fully contact with the heat to promote cooling efficiency, the inside cooling water of heat dissipation copper pipe 9 dispels the heat rapidly.

In other embodiments, the top and both sides of the heat dissipation cover 3 are both provided with a plurality of second heat dissipation grooves 17;

the heat emitted from the copper tube 9 can be discharged rapidly.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a high frequency circuit board heat sink for 5G communication, includes shell (1), its characterized in that: a circuit board body (16) is arranged in the shell (1), one side of the bottom of the shell (1) is fixedly connected with a water tank (2), a water pump (4) is arranged in the water tank (2), the output end of the water pump (4) is fixedly connected with a water inlet pipe (5), one end of the water inlet pipe (5) penetrates through the shell (1), the outer surface of the water inlet pipe (5) is fixedly communicated with one ends of the plurality of cooling copper pipes (6), the other ends of the plurality of cooling copper pipes (6) are fixedly communicated with the outer surface of the water outlet pipe (7), one end of the water outlet pipe (7) penetrates through the shell (1) and is communicated with one end of the connecting pipe (8), the bottom of the connecting pipe (8) is fixedly communicated with one end of the heat dissipation copper pipe (9), the other end of the heat dissipation copper pipe (9) is fixedly communicated with one end of the drain pipe (10), the other end of the drain pipe (10) is fixedly communicated with the top end of the water tank (2).

2. The device for cooling a high-frequency circuit board for 5G communication according to claim 1, wherein: the top fixedly connected with heat dissipation cover (3) of water tank (2), the inside fixed mounting of heat dissipation cover (3) has motor (11), the output fixedly connected with flabellum (12) of motor (11), and flabellum (12) are bloied orientation and are corresponding with the position of heat dissipation copper pipe (9).

3. The device for cooling a high-frequency circuit board for 5G communication according to claim 1, wherein: a plurality of first heat dissipation grooves (13) are formed in the top and the bottom of the shell (1).

4. The device for cooling a high-frequency circuit board for 5G communication according to claim 1, wherein: the number of the cooling copper pipes (6) is at least three, and the cooling copper pipes are distributed at equal intervals.

5. The device for cooling a high-frequency circuit board for 5G communication according to claim 1, wherein: every the surface of cooling copper pipe (6) all is provided with a plurality of cooling fin (14), the surface of heat dissipation copper pipe (9) is provided with a plurality of radiating fin (15).

6. The device for cooling a high-frequency circuit board for 5G communication according to claim 1, wherein: the inner diameter of each cooling copper pipe (6) is smaller than that of the water inlet pipe (5), and the inner diameter of each heat dissipation copper pipe (9) is smaller than that of the connecting pipe (8).

7. The device for cooling a high-frequency circuit board for 5G communication according to claim 2, wherein: a plurality of second heat dissipation grooves (17) are formed in the top and the two sides of the heat dissipation cover (3).