CN216311747U - Wafer fixing device and wafer fixing machine with same - Google Patents

Abstract

The application relates to a wafer fixing device and a die bonder with the same, wherein the wafer fixing device comprises: the fixing table is provided with a positioning hole; the fixing component is arranged in the positioning hole and provided with an installation groove for placing a wafer ring, and the fixing component comprises a flange which is positioned outside the positioning hole; the limiting assemblies are arranged on the fixing table along the circumferential direction of the positioning holes and comprise upper pulleys abutted to the upper portion of the flange and lower pulleys abutted to the lower portion of the flange, and the flange can slide between the upper pulleys and the lower pulleys. According to the wafer fixing device, the wafer ring is fixed through the fixing assembly, the fixing assembly is fixed on the fixing table through the upper pulley and the lower pulley, and the fixing piece can rotate between the upper pulley and the lower pulley, so that the circumferential angle of the wafer ring can be adjusted after the wafer ring is installed.

Description

Wafer fixing device and wafer fixing machine with same

Technical Field

The application relates to the technical field of wafer paster, in particular to a wafer fixing device and a die bonder with the same.

Background

In the technical field of semiconductors, the LED wafer forms crystal grains arranged in an array after a scribing process is finished, the crystal grains arranged in the array are attached to a wafer film, the crystal grains on the wafer film are arranged very tightly, and subsequent die bonding operation is not facilitated, so that the wafer film is expanded through a wafer expanding ring in the production process, and the crystal grains attached to the wafer film and arranged in the array are uniformly expanded. The die bonding is to fix a wafer on a Printed Circuit Board (PCB), dispense the wafer at a position on the PCB where the wafer is to be bonded, place the wafer on a wafer fixing device supported by a film, move the wafer fixing device to a designated position, peel the wafer from the film by a mechanism, and bond the wafer on the corresponding position of the PCB. The wafer and the PCB are aligned in a flat mode, the finished product rate of the PCB is high finally, so that high requirements are provided for the levelness of the wafer and the PCB, and the product with high requirements for the mounting planeness is difficult to meet due to the fact that the levelness of a welding head and the whole PCB is difficult to guarantee.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides a wafer fixing device, which can rotate a wafer ring clamped on the wafer fixing device to adjust the circumferential angle of a wafer film.

The wafer fixing device according to the embodiment of the utility model comprises: the fixing table is provided with a positioning hole; the fixing component is arranged in the positioning hole and provided with an installation groove for placing a wafer ring, and the fixing component comprises a flange which is positioned outside the positioning hole; the limiting assemblies are arranged on the fixing table along the circumferential direction of the positioning holes and comprise upper pulleys abutted to the upper portion of the flange and lower pulleys abutted to the lower portion of the flange, and the flange can slide between the upper pulleys and the lower pulleys.

According to the wafer fixing device provided by the embodiment of the utility model, the wafer ring is fixed through the fixing component, the fixing component is fixed on the fixing table through the upper pulley and the lower pulley, and the fixing component can rotate between the upper pulley and the lower pulley, so that the circumferential angle of the wafer ring can be adjusted after the wafer ring is installed.

According to the wafer fixing device of the embodiment of the utility model, the limiting component further comprises: the limiting plate is provided with at least one U-shaped hole extending along the width direction of the limiting plate, the upper pulley and the lower pulley are arranged on the limiting plate at intervals along the length direction of the limiting plate, and the limiting plate is clamped on the fixing table through a fastener penetrating through the U-shaped hole. When loosening the fastener, because the fastener can remove in U type hole, the limiting plate can move towards the direction that is close to the locating hole or keeps away from the locating hole, before putting into the locating hole with fixed subassembly, can move away from the limiting plate towards the direction of keeping away from the locating hole, after putting into the locating hole with fixed subassembly, moves the limiting plate towards the direction that is close to the locating hole to block the flange into in upper pulley and the lower pulley gradually.

Optionally, the central axis of the fixing component is taken as a reference, the lower surface of the flange is inclined upwards from inside to outside, the central axis of the lower pulley is taken as a reference, the upper surface of the lower pulley is inclined downwards from inside to outside, so that the friction force between the flange and the lower pulley can be increased, the flange and the lower pulley are prevented from slipping to prevent the flange from moving and the lower pulley from not rotating to damage the fixing component, meanwhile, the upper surface of the lower pulley is inclined, so that the distance between the upper pulley and the lower pulley is reduced along the direction from inside to outside of the flange, the upper pulley and the lower pulley can limit the flange in the horizontal direction, in addition, the distance between the upper pulley and the lower pulley and the positioning hole can be adjusted by adjusting the distance between the limiting plate and the positioning hole, and the flange is closer to the limiting plate as the distance between the upper pulley and the lower pulley is reduced along the direction from inside to outside of the flange, the height of the flange in the horizontal direction is higher, so that the height of the fixing assembly can be finely adjusted from multiple directions by adjusting the distance between the limiting plates and the fixing assembly, and the wafer film in the wafer ring can be parallel to the fixing table. The method for adjusting the levelness between the fixing ring and the fixing table by adjusting the position of the limiting plate has the advantages of higher adjusting speed and higher adjusted precision and stability.

Optionally, the upper surface of the flange is inclined downwards from inside to outside with the central axis of the fixing assembly as a reference, and the lower surface of the upper pulley is inclined upwards from inside to outside with the central axis of the upper pulley as a reference, so that the friction force between the flange and the upper pulley can be increased, and the flange is prevented from slipping so as to prevent the flange from moving and the upper pulley from not rotating to damage the fixing assembly.

Optionally, be equipped with first pivot and second pivot on the limiting plate, all overlap in first pivot and the second pivot and be equipped with antifriction bearing, go up the pulley cover and locate in first pivot, go up the pulley cover and locate in the second pivot, so can make top sheave and lower pulley rotate more easily, thereby conveniently rotate the circumference angle of fixed subassembly adjustment brilliant ring.

According to the wafer fixing device of the embodiment of the utility model, the fixing component comprises: the flange is arranged on the outer peripheral wall of the fixing ring, the inner wall of the fixing ring is circumferentially provided with a flange extending towards the inside of the fixing ring and a limiting groove spaced from the flange, and the wafer ring is placed on the flange; the clamping ring is placed on the wafer ring, and the clamping ring is provided with a limiting table along the circumferential direction, and the limiting table is embedded in a limiting groove. Through solid fixed ring and clamping ring, with the reliable fixed of wafer ring, wherein, through set up the turn-ups on solid fixed ring, can place the wafer ring on the turn-ups, compress tightly the wafer ring on solid fixed ring through the clamping ring, and through set up the spacing groove on solid fixed ring, set up spacing platform on the clamping ring to realize that clamping ring and solid fixed ring are spacing, prevent to rock the dislocation between clamping ring and the solid fixed ring.

Optionally, still be equipped with the joint groove on solid fixed ring's the outer wall, during the last border embedding joint groove of locating hole to place fixed subassembly steadily in the locating hole, thereby prevent that fixed subassembly from inclining in the locating hole.

Optionally, the one end that the clamping ring is close to the brilliant ring is equipped with the flange, and the flange is located the inboard of brilliant ring to make solid fixed ring and baffle can follow the both sides of brilliant ring and carry on spacingly to the brilliant ring, prevent that the brilliant ring from rocking the removal in the solid fixed ring.

Optionally, the fixing assembly further comprises: the packing ring, the packing ring card is between clamping ring and brilliant ring to make brilliant ring can be compressed tightly in the stationary ring, prevent that brilliant ring from rocking the aversion in fixed subassembly.

Optionally, the wafer ring is provided with a clamping groove along the circumferential direction, and the part of the gasket is embedded in the clamping groove, so that the gasket can be limited, the gasket is ensured to be installed in place, the clamping ring is prevented from shifting in the process of pressing the gasket, the fool-proof effect is achieved, and the installation operation of the fixed assembly is simplified.

The die bonder provided by the embodiment of the utility model comprises: the device comprises a base, a first translation linear module and a second translation linear module, wherein the first translation linear module and the second translation linear module are arranged on the base at intervals in the vertical direction; the carrying platform assembly is connected with the second translation linear module positioned below the carrying platform assembly, the carrying platform assembly comprises a carrying platform, and a plurality of vacuum suction ports are formed in the carrying platform; according to the wafer fixing device, the wafer fixing device is connected with the first translation linear module located above the wafer fixing device, the wafer fixing device comprises a fixing table, the fixing table is parallel to the carrying table, and the distance between the first translation linear module and the second translation linear module in the height direction is adjustable. Can place PCB base plate or other panel on the microscope carrier, the PCB base plate is placed on the microscope carrier after, the vacuum suction inlet is used for adsorbing the PCB base plate and prevents that the PCB base plate from shifting on the microscope carrier, and when the wafer ring with the leveling is along with the translation of first translation straight line module to the position relative with the microscope carrier, can carry out the crystalline grain bonding on the wafer membrane on the wafer ring on the PCB board, and first translation straight line module and second translation straight line module are adjustable at the distance of direction of height, can adjust the distance between microscope carrier and the fixed station, thereby can adjust the fixed station according to the thickness of placing the panel on the microscope carrier, can make solid crystal machine be applicable to the PCB base plate of multiple different specifications.

According to the die bonder disclosed by the embodiment of the utility model, the levelness between the crystal grains and the PCB substrate can be guaranteed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a perspective view of a wafer holding apparatus according to an embodiment of the present invention;

FIG. 2 is an enlarged view taken at A in FIG. 1;

fig. 3 is a perspective view of a holding assembly of the wafer holding apparatus according to the embodiment of the present invention;

FIG. 4 is a perspective view of a retaining ring and a wafer ring of a wafer mounting apparatus according to an embodiment of the present invention;

fig. 5 is a perspective view of a pressure ring of the wafer fixing device according to the embodiment of the present invention;

fig. 6 is a perspective view of another angle of the pressing ring of the wafer fixing device according to the embodiment of the present invention;

fig. 7 is a cross-sectional view of a holding assembly of a wafer holding apparatus according to an embodiment of the present invention.

Reference numerals:

the wafer fixing device 1 is provided with a wafer fixing device,

the fixed table (10) is fixed,

the fixing component 20, the mounting groove 21, the flange 22, the upper surface 222 of the flange 22, the lower surface 224 of the flange 22, the fixing ring 23, the flange 232, the limiting groove 234, the clamping groove 236, the pressing ring 24, the limiting table 242, the rib 244, the gasket 25,

the position limiting assembly 30, the upper pulley 31, the lower surface 312 of the upper pulley 31, the lower pulley 32, the upper surface 322 of the lower pulley 32, the position limiting plate 33, the U-shaped hole 332,

a wafer ring 2.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 to 4, a wafer fixing device 1 according to an embodiment of the present invention includes: a fixed table 10, a fixed component 20 and a limit component 30.

Specifically, the fixing table 10 is provided with a positioning hole; the fixing component 20 is arranged in the positioning hole, the fixing component 20 is provided with an installation groove 21, the installation groove 21 is used for placing the wafer ring 2, the fixing component 20 comprises a flange 22, and the flange 22 is positioned outside the positioning hole; the plurality of limiting assemblies 30 are arranged on the fixing table 10 along the circumferential direction of the positioning hole, each limiting assembly 30 comprises an upper pulley 31 abutting on the upper side of the corresponding flange 22 and a lower pulley 32 abutting on the lower side of the corresponding flange 22, and the corresponding flange 22 can slide between the upper pulley 31 and the corresponding lower pulley 32.

According to the wafer fixing device 1 of the embodiment of the utility model, the wafer ring 2 is fixed by the fixing component 20, the fixing component 20 is fixed on the fixing table 10 by the upper pulley 31 and the lower pulley 32, and the fixing ring 23 can rotate between the upper pulley 31 and the lower pulley 32, so that the circumferential angle of the wafer ring 2 can be adjusted after the wafer ring 2 is installed.

As shown in fig. 1 and fig. 2, according to the wafer fixing device 1 of the embodiment of the utility model, the limiting assembly 30 further includes a limiting plate 33, the limiting plate 33 is provided with at least one U-shaped hole 332 extending along a width direction of the limiting plate 33, the upper pulley 31 and the lower pulley 32 are arranged on the limiting plate 33 at intervals along a length direction of the limiting plate 33, and the limiting plate 33 is clamped on the fixing table 10 by a fastener penetrating through the U-shaped hole 332. When the fastener is loosened, since the fastener can move in the U-shaped hole 332, the stopper plate 33 can move toward a direction close to or away from the positioning hole, before the fixing member 20 is placed in the positioning hole, the stopper plate 33 can be moved away from the positioning hole, and after the fixing member 20 is placed in the positioning hole, the stopper plate 33 is moved toward the direction close to the positioning hole, so that the flange 22 is gradually caught in the upper pulley 31 and the lower pulley 32.

As shown in fig. 7, optionally, based on the central axis of the fixing assembly 20, the lower surface 224 of the flange 22 is inclined upward from inside to outside, and based on the central axis of the lower pulley 32, the upper surface 322 of the lower pulley 32 is inclined downward from inside to outside, and the included angles between the lower surface 224 of the flange 22 and the upper surface 322 of the lower pulley 32 and the vertical direction may be equal or different, and may be set as required. Therefore, the friction force between the flange 22 and the lower pulley 32 can be increased, the flange 22 and the lower pulley 32 can be prevented from slipping, the flange 22 can be prevented from moving, the lower pulley 32 can not rotate, and the fixing component 20 can be prevented from being damaged, meanwhile, the distance between the upper pulley 31 and the lower pulley 32 can be reduced along the direction from inside to outside of the flange 22 due to the inclination of the upper surface 322 of the lower pulley 32, so that the flange 22 can be limited by the upper pulley 31 and the lower pulley 32 in the horizontal direction, in addition, the distance between the upper pulley 31 and the lower pulley 32 and the positioning hole can be adjusted by adjusting the distance between the limiting plate 33 and the positioning hole, because the distance between the upper pulley 31 and the lower pulley 32 is reduced along the direction from inside to outside of the flange 22, the height of the flange 22 is higher as the flange 22 is closer to the limiting plate 33, and the distance between the limiting plates 33 and the fixing component 20 can be adjusted, the height of the fixing component 20 can be finely adjusted from multiple directions, so that the wafer film in the wafer ring 2 can be parallel to the fixing table 10. The levelness between the fixing ring 23 and the fixing table 10 is adjusted by adjusting the position of the limiting plate 33, the adjusting speed is higher, and the adjusted precision and stability are higher.

When the flange 23 is provided on the fixing ring 23, the lower surface 224 of the flange 23 is inclined upward from the inside to the outside, and the "inside" and "outside" are referred to as the center axis of the fixing ring 23, and the end closer to the center axis of the fixing ring 23 is the inside and the end farther from the center axis of the fixing ring 23 is the outside. The upper surface 322 of the lower sheave 32 is inclined downward from inside to outside, where "inside" and "outside" are based on the central axis of the lower sheave 32, with the end near the central axis of the lower sheave 32 being inside and the end away from the central axis of the lower sheave 32 being outside.

As shown in fig. 7, alternatively, the upper surface 222 of the flange 22 may be inclined downward from inside to outside with respect to the central axis of the fixing unit 20, the lower surface 312 of the upper pulley 31 may be inclined upward from inside to outside with respect to the central axis of the upper pulley 31, and the included angles between the upper surface 222 of the flange 22 and the lower surface 224 of the flange 22 and the vertical direction may be equal or different in size, and may be provided as necessary, so that the friction force between the flange 22 and the upper pulley 31 can be increased, and the flange 22 can be prevented from slipping with respect to the upper pulley 31 to move without the upper pulley 31 rotating to damage the fixing unit 20.

When the flange 23 is provided on the fixing ring 23, the upper surface 222 of the flange 22 is inclined downward from inside to outside, and "inside" and "outside" herein refer to the central axis of the fixing ring 23, and one end close to the central axis of the fixing ring 23 is inside and one end far from the central axis of the fixing ring 23 is outside. The lower surface 312 of the upper sheave 31 is inclined upward from inside to outside, and "inside" and "outside" are referred to the central axis of the upper sheave 31, and the end closer to the central axis of the upper sheave 31 is the inside and the end farther from the central axis of the upper sheave 31 is the outside.

Optionally, the limiting plate 33 is provided with a first rotating shaft and a second rotating shaft, the first rotating shaft and the second rotating shaft are both sleeved with rolling bearings, the upper pulley 31 is sleeved on the first rotating shaft, and the lower pulley 32 is sleeved on the second rotating shaft, so that the upper pulley 31 and the lower pulley 32 can rotate more easily, and the fixing component 20 can be rotated conveniently to adjust the circumferential angle of the wafer ring 2.

As shown in fig. 3 to 7, according to the wafer fixing device 1 of the embodiment of the present invention, the fixing member 20 includes: the flange 22 is arranged on the outer peripheral wall of the fixing ring 23, the inner wall of the fixing ring 23 is circumferentially provided with a flange 232 extending towards the inside of the fixing ring 23 and a limiting groove 234 spaced from the flange 232, and the wafer ring 2 is placed on the flange 232; the clamping ring 24, the clamping ring 24 are placed on the wafer ring 2, the clamping ring 24 is provided with a limiting table 242 along the circumferential direction, and the limiting table 242 is embedded in the limiting groove 234. Through solid fixed ring 23 and clamping ring 24, with the reliable fixed of wafer ring 2, wherein, through set up turn-ups 232 on solid fixed ring 23, can place wafer ring 2 on turn-ups 232, compress tightly wafer ring 2 on solid fixed ring 23 through clamping ring 24, and through set up spacing groove 234 on solid fixed ring 23, set up spacing platform 242 on clamping ring 24, thereby realize spacing between clamping ring 24 and the solid fixed ring 23, prevent to rock the dislocation between clamping ring 24 and the solid fixed ring 23. Wherein the flange 232 and the inner wall of the fixing ring 23 define a mounting groove 21.

As shown in fig. 7, optionally, the fixing ring 23 is further provided on an outer wall thereof with a catching groove 236, and an upper edge of the positioning hole is inserted into the catching groove 236, so that the fixing member 20 is smoothly placed in the positioning hole, thereby preventing the fixing member 20 from being inclined in the positioning hole.

As shown in fig. 5 and 6, optionally, one end of the pressing ring 24 close to the wafer ring 2 is provided with a rib 244, and the rib 244 is located inside the wafer ring 2, so that the fixing ring 23 and the baffle plate can limit the wafer ring 2 from two sides of the wafer ring 2, and the wafer ring 2 is prevented from shaking and moving in the fixing ring 23.

As shown in fig. 7, optionally, the fixing assembly 20 further includes: the gasket 25 is clamped between the pressing ring 24 and the wafer ring 2, so that the wafer ring 2 can be pressed in the fixing ring 23, and the wafer ring 2 is prevented from shaking and shifting in the fixing assembly 20.

Optionally, the wafer ring 2 is provided with a clamping groove along the circumferential direction, and the part of the gasket 25 is embedded in the clamping groove, so that the gasket 25 can be limited, the gasket 25 is ensured to be installed in place, the clamping ring 24 is prevented from being displaced in the process of pressing the gasket 25, the fool-proof effect is achieved, and the installation operation of the fixing assembly 20 is simplified.

The die bonder provided by the embodiment of the utility model comprises: the device comprises a base, a first translation linear module and a second translation linear module, wherein the first translation linear module and the second translation linear module are arranged on the base at intervals in the vertical direction; the carrying platform assembly is connected with the second translation linear module positioned below the carrying platform assembly, the carrying platform assembly comprises a carrying platform, and a plurality of vacuum suction ports are formed in the carrying platform; as the wafer fixing device 1, the wafer fixing device 1 is connected to the first translational linear module located above, the wafer fixing device 1 includes the fixing table 10, the fixing table 10 is parallel to the carrier, and the distance between the first translational linear module and the second translational linear module in the height direction is adjustable. Can place PCB base plate or other panel on the microscope carrier, the PCB base plate is placed on the microscope carrier after, the vacuum suction inlet is used for adsorbing the PCB base plate and prevents that the PCB base plate from shifting on the microscope carrier, and when the wafer ring 2 with the leveling shifts to the position relative with the microscope carrier along with first translation straight line module, can carry out the crystalline grain bonding on the wafer membrane on the wafer ring 2 on the PCB board, and first translation straight line module and second translation straight line module are adjustable at the distance of direction of height, can adjust the distance between microscope carrier and the fixed station 10, thereby can adjust the fixed station 10 according to the thickness of placing the panel on the microscope carrier, can make solid crystal machine be applicable to the PCB base plate of multiple different specifications.

According to the die bonder disclosed by the embodiment of the utility model, the levelness between the crystal grains and the PCB substrate can be guaranteed.

In some embodiments, the method of adjusting the levelness between the wafer ring 2 and the PCB substrate is as follows: placing a correction plate with good flatness, including but not limited to a glass plate, on the carrier, firmly adsorbing the correction plate through a vacuum suction port on the carrier, and then moving the carrier assembly to the lower part of the wafer fixing device 1 (the distance between the carrier and the fixing table 10 is set according to the thickness of the correction plate); place brilliant ring 2 in solid fixed ring 23, place packing ring 25 in the top of brilliant ring 2 again, press clamping ring 24 in the top of packing ring 25, place fixed subassembly 20 in the locating hole, at this moment, the wafer membrane is arranged in on the correcting plate, level fixed subassembly 20 through removing a plurality of limiting plates 33, thereby adjust the levelness between wafer membrane and the correcting plate, also can rotate fixed subassembly 20 simultaneously, adjust the circumference angle of wafer membrane, after leveling the wafer membrane, can change the correcting plate into the PCB base plate, thereby carry out the bonding process.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims (10)

1. A wafer holding apparatus, comprising:

the fixing table is provided with a positioning hole;

the fixing component is arranged in the positioning hole, is provided with an installation groove, and is used for placing a wafer ring, and comprises a flange which is positioned outside the positioning hole;

the limiting assemblies are arranged on the fixing table along the circumferential direction of the positioning holes and comprise upper pulleys abutted to the upper portion of the flange and lower pulleys abutted to the lower portion of the flange, and the flange is slidable between the upper pulleys and the lower pulleys.

2. The wafer fixture device of claim 1, wherein the restraint assembly further comprises:

the limiting plate is provided with at least one U-shaped hole extending along the width direction of the limiting plate, the upper pulley and the lower pulley are arranged on the limiting plate at intervals along the length direction of the limiting plate, and the limiting plate is clamped on the fixed table through a fastener penetrating through the U-shaped hole.

3. The wafer fixing device according to claim 2, wherein the lower surface of the flange is inclined upward from inside to outside with respect to the central axis of the fixing member, and the upper surface of the lower pulley is inclined downward from inside to outside with respect to the central axis of the lower pulley.

4. The wafer fixing device according to claim 3, wherein the upper surface of the flange is inclined downward from inside to outside with respect to the central axis of the fixing member, and the lower surface of the upper pulley is inclined upward from inside to outside with respect to the central axis of the upper pulley.

5. The wafer fixing device according to claim 4, wherein the limiting plate is provided with a first rotating shaft and a second rotating shaft, the first rotating shaft and the second rotating shaft are both provided with rolling bearings, the upper pulley is sleeved on the first rotating shaft, and the lower pulley is sleeved on the second rotating shaft.

6. The wafer fixture device of claim 1, wherein the fixture assembly comprises:

the flange is arranged on the outer peripheral wall of the fixing ring, a flange extending towards the inside of the fixing ring and a limiting groove spaced from the flange are circumferentially arranged on the inner wall of the fixing ring, and the wafer ring is placed on the flange;

the compression ring is placed on the wafer ring, a limiting table is arranged on the compression ring along the circumferential direction, and the limiting table is embedded in the limiting groove.

7. The wafer fixing device of claim 6, wherein the outer wall of the fixing ring is further provided with a clamping groove, and the upper edge of the positioning hole is embedded into the clamping groove.

8. The wafer fixing device according to claim 6, wherein a rib is arranged at one end of the pressure ring close to the wafer ring, and the rib is positioned at the inner side of the wafer ring.

9. The wafer fixture device of claim 6, wherein the fixture assembly further comprises: and the gasket is clamped between the pressure ring and the wafer ring.

10. A die bonder, comprising:

the device comprises a base, a first translation linear module and a second translation linear module, wherein the first translation linear module and the second translation linear module are arranged on the base at intervals in the vertical direction;

the carrying platform assembly is connected with the second translation linear module positioned below the carrying platform assembly, the carrying platform assembly comprises a carrying platform, and a plurality of vacuum suction ports are formed in the carrying platform;

the wafer holding apparatus of any of claims 1-9, wherein the wafer holding apparatus is connected to the first translational linear module located above, the wafer holding apparatus comprises a fixed stage parallel to the stage, and the distance between the first translational linear module and the second translational linear module in the height direction is adjustable.

Images