CN216311746U

CN216311746U - Static electricity eliminating adsorption equipment for semiconductor processing silicon wafer

Info

Publication number: CN216311746U
Application number: CN202121920742.8U
Authority: CN
Inventors: 杨震民
Original assignee: Individual
Current assignee: Huizhou Zhihe Lixing Technology Co ltd
Priority date: 2021-08-17
Filing date: 2021-08-17
Publication date: 2022-04-15
Anticipated expiration: 2031-08-17

Abstract

The utility model discloses a static elimination adsorption device for a semiconductor processing silicon wafer, which comprises a shell, wherein a threaded rod is arranged at the position, close to the left side, of the top of the shell, a top plate is arranged at the top of the shell, first bearings are fixedly connected with the position, close to the left side, of the top of the shell and the position, close to the left side, of the bottom of the top plate, the bottom end of the threaded rod is inserted into an inner cavity of the adjacent first bearing, and the device can be fully contacted with the silicon wafer through the mutual matching of parts such as the threaded rod, a threaded sleeve, the top plate, a motor shell, a connecting rod, a limiting pipe, a limiting rod, a static eliminator, a lead wire, a ground wire and the like, has the characteristics of good static elimination effect and the like, and can automatically carry out loading operation through the mutual matching of parts such as a push plate, a positioning plate, a reciprocating cam, a rotating shaft, a driving motor, a slide block, the limiting sleeve, a fixed rod, a connecting block, a servo motor, a fixed plate and the like, has the characteristics of improving the working efficiency and the like.

Description

Static electricity eliminating adsorption equipment for semiconductor processing silicon wafer

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to static electricity eliminating adsorption equipment for a semiconductor processing silicon wafer.

Background

The semiconductor is a material with electric conductivity between the conductor and the insulator at normal temperature, and has wide application in radio, television and temperature measurement. After the semiconductor processing of silicon wafers, it is necessary to eliminate electrostatic adsorption in order to easily take out the silicon wafers because the silicon wafers must be lifted off the ceramic wafer by an auxiliary mechanism one step before being removed from the ceramic wafer just above, so that a worker can insert the bottom of the silicon wafers to move the silicon wafers to the next process, which requires to eliminate electrostatic adsorption between the silicon wafers and the ceramic wafer, or the silicon wafers are broken.

The prior device can not fully contact with the silicon wafer when carrying out static elimination, has poor static elimination effect, and has lower working efficiency because the prior device carries out feeding operation manually.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide an electrostatic adsorption elimination device for a semiconductor processing silicon wafer.

One of the purposes of the utility model is realized by adopting the following technical scheme:

a semiconductor processing silicon wafer static elimination adsorption device comprises a shell, wherein a threaded rod is arranged at the position, close to the left side, of the top of the shell, a top plate is arranged at the top of the shell, first bearings are fixedly connected with the position, close to the left side, of the top of the shell and the position, close to the left side, of the bottom of the top plate, the bottom of the top plate is fixedly connected with first bearings, the bottom ends of the threaded rods are inserted into inner cavities of the adjacent first bearings, the top ends of the threaded rods penetrate through the inner cavities of the adjacent first bearings and extend to the top, a limiting mechanism is arranged at the position, close to the right side, of the bottom of the top plate, a static eliminator is arranged at the bottom of the top plate, connecting rods are fixedly connected to the left side and the right side of a threaded sleeve, a fixed plate is fixedly connected to the position, a reciprocating cam is arranged on the rear side of the fixed plate, and rotating shafts are fixedly connected to the front end and the rear end of the reciprocating cam, equal fixedly connected with second bearing on the inner chamber rear side of casing and the fixed plate, be located the rear side the rear end of pivot is pegged graft at the inner chamber of adjacent second bearing, is located the front side the front end of pivot runs through the inner chamber of adjacent second bearing, and extends to its front side, the spout has been seted up on the reciprocating cam, the inner chamber of spout is equipped with the slider, the inner chamber of spout is run through at the top of slider, and extends to its top to fixedly connected with stop collar, the top fixedly connected with connecting block of stop collar, the top of casing is close to right side department and has seted up the fluting, the top of connecting block runs through adjacent grooved inner chamber, and extends to its top to fixedly connected with push pedal, the left side fixedly connected with locating plate of push pedal.

Further, stop gear includes the gag lever post, the top of gag lever post and the bottom fixed connection of roof, the bottom of gag lever post and the top fixed connection of casing, the outer wall cover of gag lever post is equipped with spacing pipe, the left side of spacing pipe and the right-hand member fixed connection of adjacent connecting rod.

Further, the top of roof is close to left side department fixedly connected with motor housing, motor housing's inner chamber top fixedly connected with servo motor, servo motor's motor shaft and the top fixed connection of threaded rod.

Furthermore, the right side of the static eliminator is fixedly connected with a lead, and the right end of the lead is fixedly connected with a grounding wire.

Furthermore, a driving motor is arranged on the front side of the fixing plate, the bottom of the driving motor is fixedly connected with the bottom of the inner cavity of the shell, and a motor shaft of the driving motor is fixedly connected with the front end of the adjacent rotating shaft.

Furthermore, the inner cavity of the limiting sleeve is provided with a fixing rod, the front end and the rear end of the fixing rod penetrate through the inner cavity of the limiting sleeve and are fixedly connected with the inner cavity side wall of the shell and the fixing plate respectively.

Furthermore, a base is arranged on the top of the shell close to the front side, the top of the base is fixedly connected with a ceramic wafer, and a silicon wafer is arranged on the top of the ceramic wafer.

Compared with the prior art, the utility model has the beneficial effects that:

1. the device can be fully contacted with the silicon wafer through the mutual matching of the threaded rod, the threaded sleeve, the top plate, the motor shell, the connecting rod, the limiting pipe, the limiting rod, the static eliminator, the lead, the grounding wire and other parts, and has the characteristics of good static eliminating effect and the like;

2. the device automatically carries out feeding operation through the mutual matching of the push plate, the positioning plate, the reciprocating cam, the rotating shaft, the driving motor, the sliding block, the limiting sleeve, the fixed rod, the connecting block, the servo motor, the fixing plate and other parts, and has the characteristics of improving the working efficiency and the like.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a front view of the present invention;

FIG. 3 is a left side view of the present invention;

figure 4 is a top view of a component pusher plate of the present invention.

In the figure: 1. a housing; 2. a threaded rod; 3. a threaded sleeve; 4. a top plate; 5. a motor housing; 6. a connecting rod; 7. a limiting pipe; 8. a limiting rod; 9. a static eliminator; 10. a wire; 11. a ground line; 12. a base; 13. a ceramic plate; 14. a silicon wafer; 15. pushing the plate; 16. positioning a plate; 17. a reciprocating cam; 18. a rotating shaft; 19. a drive motor; 20. a slider; 21. a limiting sleeve; 22. fixing the rod; 23. connecting blocks; 24. a servo motor; 25. a fixing plate; 26. a limiting mechanism.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 4, a semiconductor processing silicon wafer static elimination adsorption apparatus comprises a housing 1, a threaded rod 2 is arranged at the position, close to the left side, of the top of the housing 1, a top plate 4 is arranged at the top of the housing 1, first bearings are fixedly connected to the position, close to the left side, of the top of the housing 1 and the position, close to the left side, of the bottom of the top plate 4, the bottom of the threaded rod 2 is inserted into an inner cavity of an adjacent first bearing, the top end of the threaded rod 2 penetrates through the inner cavity of the adjacent first bearing and extends to the top, a limiting mechanism 26 is arranged at the position, close to the right side, of the bottom of the top plate 4, a static eliminator 9 is arranged at the bottom of the top plate 4, connecting rods 6 are fixedly connected to the left side and the right side of a threaded sleeve 3, a fixing plate 25 is fixedly connected to the inner cavity of the housing 1, a reciprocating cam 17 is arranged at the rear side of the fixing plate 25, the front end and the rear end of the reciprocating cam 17 are fixedly connected with rotating shafts 18, the rear side of the inner cavity of the shell 1 and the fixed plate 25 are fixedly connected with second bearings, the rear end of the rotating shaft 18 positioned at the rear side is inserted into the inner cavity of the adjacent second bearing, the front end of the rotating shaft 18 positioned at the front side penetrates through the inner cavity of the adjacent second bearing and extends to the front side of the adjacent second bearing, a sliding groove is formed in the reciprocating cam 17, a sliding block 20 is arranged in the inner cavity of the sliding groove, the top of the sliding block 20 penetrates through the inner cavity of the sliding groove and extends to the top of the sliding groove, a limiting sleeve 21 is fixedly connected with the top of the limiting sleeve 21, a connecting block 23 is fixedly connected to the top of the limiting sleeve 21, a groove is formed in the position, close to the right side, the top of the connecting block 23 penetrates through the inner cavity of the adjacent groove and extends to the top of the connecting block, a push plate 15 is fixedly connected with a positioning plate 16, a base 12 is arranged close to the front side of the top of the shell 1, the top of the base 12 is fixedly connected with a ceramic plate 13, and the top of the ceramic plate 13 is provided with a silicon wafer 14, so that static electricity can be eliminated conveniently;

the limiting mechanism 26 comprises a limiting rod 8, the top end of the limiting rod 8 is fixedly connected with the bottom of the top plate 4, the bottom end of the limiting rod 8 is fixedly connected with the top of the shell 1, a limiting pipe 7 is sleeved on the outer wall of the limiting rod 8, the left side of the limiting pipe 7 is fixedly connected with the right end of the adjacent connecting rod 6, the static elimination effect is good, a lead 10 is fixedly connected to the right side of the static eliminator 9, a grounding wire 11 is fixedly connected to the right end of the lead 10, and the static elimination effect is good;

a motor shell 5 is fixedly connected to the top of the top plate 4 close to the left side, a servo motor 24 is fixedly connected to the top of an inner cavity of the motor shell 5, and a motor shaft of the servo motor 24 is fixedly connected with the top end of the threaded rod 2, so that automatic feeding is realized, and the working efficiency is improved;

a driving motor 19 is arranged on the front side of the fixing plate 25, the bottom of the driving motor 19 is fixedly connected with the bottom of the inner cavity of the shell 1, and a motor shaft of the driving motor 19 is fixedly connected with the front end of the adjacent rotating shaft 18, so that the material is automatically fed, and the working efficiency is improved; the inner chamber of stop collar 21 is equipped with dead lever 22, and the inner chamber of stop collar 21 is all run through at both ends around dead lever 22 to respectively with the inner chamber lateral wall of casing 1 and fixed plate 25 fixed connection, automatic feeding improves work efficiency.

The working principle is as follows: when the utility model is used, firstly, a driving motor 19 and a servo motor 24 are connected through an external power supply, then a silicon wafer 14 which is just processed and a base 12 are placed on the front side of a push plate 15, the positioning plate 16 positions the silicon wafer and then the driving motor 19 is started, the driving motor 19 drives adjacent rotating shafts 18 to rotate through a motor shaft, the rotating shafts 18 drive reciprocating cams 17 to rotate, the reciprocating cams 17 drive a sliding block 20 to move back and forth through sliding grooves, the sliding block 20 drives a limiting sleeve 21 to move back and forth, a fixing rod 22 limits the sliding block, the limiting sleeve 21 drives a connecting block 23 to move back and forth, the connecting block 23 drives the push plate 15 to move back and forth, the driving motor 19 is controlled to drive the base 12 to move forward, when the silicon wafer moves to the bottom of an electrostatic eliminator 9, the sliding block 20 drives the push plate 15 to move backward, thereby realizing rapid feeding and improving the working efficiency, and then the servo motor 24 is started, the servo motor 24 drives the threaded rod 2 to rotate through a motor shaft, the threaded rod 2 drives the threaded sleeve 3 to move up and down through threads, the threaded sleeve 3 drives the connecting rod 6 to move up and down, the connecting rod 6 drives the static eliminator 9 to move up and down, the limiting mechanism 26 limits the static eliminator, the servo motor 24 is controlled to enable the static eliminator 9 to move down until the static eliminator contacts the silicon wafer 14, the static eliminator 9 eliminates static of the silicon wafer 14, meanwhile, the conducting wire 10 and the grounding wire 11 guide static into the ground, the operation is convenient and rapid, the static eliminating effect is good, the silicon wafer 14 is not adsorbed on the ceramic wafer 13, then the silicon wafer 14 is ejected from the ceramic wafer 13 through the auxiliary mechanism, and the next process is carried out.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims

1. An electrostatic adsorption equipment for eliminating semiconductor processing silicon wafers comprises a shell (1), and is characterized in that: a threaded rod (2) is arranged at the position, close to the left side, of the top of the shell (1), a top plate (4) is arranged at the top of the shell (1), first bearings are fixedly connected to the positions, close to the left side, of the top of the shell (1) and the positions, close to the left side, of the bottom of the top plate (4), the bottom of the threaded rod (2) is inserted into inner cavities of the adjacent first bearings, the top end of the threaded rod (2) penetrates through the inner cavities of the adjacent first bearings and extends to the top, a limiting mechanism (26) is arranged at the position, close to the right side, of the bottom of the top plate (4), an electrostatic eliminator (9) is arranged at the bottom of the top plate (4), connecting rods (6) are fixedly connected to the left side and the left side of the connecting rods (6) are fixedly connected with the right side of the threaded sleeve (3), a fixing plate (25) is fixedly connected to the position, close to the middle of the inner cavity of the shell (1), the rear side of the fixed plate (25) is provided with a reciprocating cam (17), the front end and the rear end of the reciprocating cam (17) are fixedly connected with rotating shafts (18), the rear side of an inner cavity of the shell (1) and the fixed plate (25) are fixedly connected with second bearings, the rear end of the rotating shaft (18) positioned on the rear side is inserted into the inner cavity of the adjacent second bearing, the front end of the rotating shaft (18) positioned on the front side penetrates through the inner cavity of the adjacent second bearing and extends to the front side of the adjacent second bearing, the reciprocating cam (17) is provided with a sliding chute, the inner cavity of the sliding chute is provided with a sliding block (20), the top of the sliding block (20) penetrates through the inner cavity of the sliding chute and extends to the top of the sliding chute and is fixedly connected with a limit sleeve (21), the top of the limit sleeve (21) is fixedly connected with a connecting block (23), the top of the shell (1) is provided with a groove close to the right side, and the top of the connecting block (23) penetrates through the inner cavity of the adjacent groove, and extend to its top to fixedly connected with push pedal (15), the left side fixedly connected with locating plate (16) of push pedal (15).

2. The electrostatic adsorption elimination apparatus for silicon wafers for semiconductor processing as set forth in claim 1, wherein: stop gear (26) include gag lever post (8), the top of gag lever post (8) and the bottom fixed connection of roof (4), the bottom of gag lever post (8) and the top fixed connection of casing (1), the outer wall cover of gag lever post (8) is equipped with spacing pipe (7), the left side of spacing pipe (7) and the right-hand member fixed connection of adjacent connecting rod (6).

3. The electrostatic adsorption elimination apparatus for silicon wafers for semiconductor processing as set forth in claim 1, wherein: the top of roof (4) is close to left side department fixedly connected with motor housing (5), the inner chamber top fixedly connected with servo motor (24) of motor housing (5), the top fixed connection of motor shaft and threaded rod (2) of servo motor (24).

4. The electrostatic adsorption elimination apparatus for silicon wafers for semiconductor processing as set forth in claim 1, wherein: the right side of the static eliminator (9) is fixedly connected with a lead (10), and the right end of the lead (10) is fixedly connected with a grounding wire (11).

5. The electrostatic adsorption elimination apparatus for silicon wafers for semiconductor processing as set forth in claim 1, wherein: the front side of the fixed plate (25) is provided with a driving motor (19), the bottom of the driving motor (19) is fixedly connected with the bottom of the inner cavity of the shell (1), and a motor shaft of the driving motor (19) is fixedly connected with the front end of the adjacent rotating shaft (18).

6. The electrostatic adsorption elimination apparatus for silicon wafers for semiconductor processing as set forth in claim 1, wherein: the inner cavity of the limiting sleeve (21) is provided with a fixing rod (22), the front end and the rear end of the fixing rod (22) penetrate through the inner cavity of the limiting sleeve (21) and are respectively and fixedly connected with the inner cavity side wall of the shell (1) and the fixing plate (25).

7. The electrostatic adsorption elimination apparatus for silicon wafers for semiconductor processing as set forth in claim 1, wherein: the top of the shell (1) is provided with a base (12) close to the front side, the top of the base (12) is fixedly connected with a ceramic plate (13), and the top of the ceramic plate (13) is provided with a silicon wafer (14).