CN216286550U - Liquid cooling server heat radiation structure - Google Patents
Liquid cooling server heat radiation structure Download PDFInfo
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- CN216286550U CN216286550U CN202122892424.1U CN202122892424U CN216286550U CN 216286550 U CN216286550 U CN 216286550U CN 202122892424 U CN202122892424 U CN 202122892424U CN 216286550 U CN216286550 U CN 216286550U
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Abstract
The utility model discloses a heat dissipation structure of a liquid cooling server, which comprises a fixed plate and a chip main plate, wherein an upper clamping plate and a lower clamping plate are arranged in the fixed plate; the limiting groove is formed in the upper end face of the upper clamping plate, the threaded bolt is installed in the limiting groove, the threaded bolt is sleeved with the threaded sleeve, the connecting column is sleeved on the threaded sleeve, the clamping block is installed at the upper end of the connecting column, and the clamping groove is formed in the clamping block. The cooling pipe is fixed by the fixing plate, the fixing plate tightly clamps and installs the cooling pipe, the replacement and maintenance of the cooling pipe are convenient, the upper side and the lower side of the cooling pipe are close to the two chip main boards, and the cooling pipe is used for cooling the plurality of chip main boards to the maximum extent. And the chip mainboard is fixed through a clamping mechanism consisting of the threaded bolt, the threaded sleeve, the connecting column and the clamping block, and the installation and the disassembly are very convenient and quick.
Description
Technical Field
The utility model relates to the field of structural design of a server, in particular to a heat dissipation structure of a liquid cooling server.
Background
At present, a large amount of integrated circuits are used in server components, and high temperature is a large enemy of the integrated circuits, so that the system operation is unstable, the service life is shortened, and even some components are possibly burnt, and the conventional integrated chips mainly have two modes of immersion type liquid cooling and cold plate type liquid cooling.
No matter be immersion liquid cooling or cold plate formula liquid cooling can all meet the problem that needs to wherein coolant liquid pipeline maintenance change among the prior art, and its current coolant liquid pipe is generally all fixed at the assigned position through the mount, or direct mount in the box inner wall, dismantles the difficulty when needing the maintenance clearance. Accordingly, one skilled in the art provides a heat dissipation structure for a liquid cooling server to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a heat dissipation structure of a liquid cooling server, so as to solve the problems in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme:
a heat dissipation structure of a liquid cooling server comprises a fixed plate and a chip main plate, wherein an upper clamping plate and a lower clamping plate are arranged in the fixed plate, a placement groove is formed in the upper clamping plate, a hinge is arranged on one side of the upper clamping plate, and the upper clamping plate is rotatably connected with the lower clamping plate through the hinge;
the limiting groove is formed in the upper end face of the upper clamping plate, the threaded bolt is installed in the limiting groove, the threaded bolt is sleeved with the threaded sleeve, the connecting column is sleeved on the threaded sleeve, the clamping block is installed at the upper end of the connecting column, and the clamping groove is formed in the clamping block.
As a further scheme of the utility model: the chip main board is clamped with the clamping block through the clamping groove.
As a still further scheme of the utility model: the connecting column is connected with the threaded bolt through the threaded sleeve, the threaded sleeve is in threaded sleeve connection with the threaded bolt, and the threaded sleeve is in threaded sleeve connection with the connecting column.
As a still further scheme of the utility model: the cooling pipe is arranged in the placing groove, the placing groove is meshed and sleeved with the cooling pipe, a connector is arranged on one side of the cooling pipe, and the connector is in threaded connection with the cooling pipe.
As a still further scheme of the utility model: the upper clamping plate and the lower clamping plate are symmetrical and the same in structure.
As a still further scheme of the utility model: the chip main board is provided with two, is located the upper and lower both sides of fixed plate.
As a still further scheme of the utility model: and a second fixing bolt is installed on one side of the upper clamping plate, a first fixing bolt is installed on one side of the lower clamping plate, a nut is sleeved on the first fixing bolt, and the first fixing bolt is connected with the second fixing bolt through the nut.
Compared with the prior art, the utility model has the beneficial effects that:
1. the cooling pipe is fixed by the fixing plate, the fixing plate tightly clamps and installs the cooling pipe, the replacement and maintenance of the cooling pipe are convenient, the upper side and the lower side of the cooling pipe are close to the two chip main boards, and the cooling pipe is used for cooling the plurality of chip main boards to the maximum extent.
2. And the chip mainboard is fixed through a clamping mechanism consisting of the threaded bolt, the threaded sleeve, the connecting column and the clamping block, and the installation and the disassembly are very convenient and quick.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation structure of a liquid cooling server.
Fig. 2 is a structural diagram showing a heat dissipation structure of a liquid cooling server.
Fig. 3 is an exploded view of a heat dissipation structure of a liquid cooling server.
Fig. 4 is an enlarged view of the heat dissipation structure of the liquid cooling server shown in fig. 1A.
Fig. 5 is an enlarged view of the heat dissipation structure of the liquid cooling server shown in fig. 3B.
In the figure: 1. a chip main board; 2. a fixing plate; 101. a lower splint; 1011. a first fixing bolt; 102. an upper splint; 1021. a second fixing bolt;
3. a cooling tube; 4. a connector; 5. a placing groove; 6. a nut; 7. a limiting groove; 8. a threaded bolt; 9. a threaded sleeve; 10. a clamping block; 11. a card slot; 12. connecting columns; 13. and (4) a hinge.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows: referring to fig. 1 to 5, in the embodiment of the utility model, a heat dissipation structure of a liquid cooling server includes a fixed plate 2 and a chip main plate 1, wherein the chip main plate 1 is clamped with a clamping block 10 through a clamping groove 11, the chip main plate 1 is provided with two blocks which are located at the upper side and the lower side of the fixed plate 2, the fixed plate 2 includes an upper clamping plate 102 and a lower clamping plate 101, the upper clamping plate 102 and the lower clamping plate 101 are symmetrical and the same in structure, a mounting groove 5 is formed in the upper clamping plate 102, a cooling pipe 3 is arranged in the mounting groove 5, the mounting groove 5 is meshed and sleeved with the cooling pipe 3, a connector 4 is arranged at one side of the cooling pipe 3, the connector 4 is in threaded connection with the cooling pipe 3, a hinge 13 is arranged at one side of the upper clamping plate 102, and the upper clamping plate 102 is rotatably connected with the lower clamping plate 101 through the hinge 13;
the upper end surface of the upper clamping plate 102 is provided with a limiting groove 7, a threaded bolt 8 is installed in the limiting groove 7, a threaded sleeve 9 is sleeved on the threaded bolt 8, a connecting column 12 is sleeved on the threaded sleeve 9, a clamping block 10 is installed at the upper end of the connecting column 12, a clamping groove 11 is formed in the clamping block 10, the connecting column 12 is connected with the threaded bolt 8 through the threaded sleeve 9, the threaded sleeve 9 is in threaded sleeve connection with the threaded bolt 8, and the threaded sleeve 9 is in threaded sleeve connection with the connecting column 12;
and cooling tube 3 fixes through fixed plate 2, and fixed plate 2 is the centre gripping installation to cooling tube 3, make things convenient for the change maintenance of cooling tube 3, and cooling tube 3 about both sides all expose outside and press close to with two chip mainboards 1, the maximize use cooling tube 3 cools off polylith chip mainboard 1, and tie 8 through the screw thread, thread bush 9, spliced pole 12, the latch mechanism that fixture block 10 constitutes is fixed chip mainboard 1, and the installation, it is all very convenient quick to dismantle, spliced pole 12 is tied 8 through the screw thread 9, only need to rotate thread bush 9 and can reach the purpose of dismantling fixture block 10, thereby can carry out the dismouting to chip mainboard 1.
Example two: on the basis of the previous embodiment, a second fixing bolt 1021 is installed on one side of the upper clamping plate 102, a first fixing bolt 1011 is installed on one side of the lower clamping plate 101, a nut 6 is sleeved on the first fixing bolt 1011, and the first fixing bolt 1011 is connected with the second fixing bolt 1021 through the nut 6;
in the second embodiment, a second fixing bolt 1021 and a first fixing bolt 1011 are respectively installed at the corresponding ends of the upper clamping plate 102 and the lower clamping plate 101, and the fixing plate 2 can be fastened by the nut 6, so that the upper clamping plate 102 and the lower clamping plate 101 are prevented from being separated.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (7)
1. A heat dissipation structure of a liquid cooling server comprises a fixing plate (2) and a chip main board (1), and is characterized in that the fixing plate (2) comprises an upper clamping plate (102) and a lower clamping plate (101), the upper clamping plate (102) is provided with a placement groove (5), one side of the upper clamping plate (102) is provided with a hinge (13), and the upper clamping plate (102) is rotatably connected with the lower clamping plate (101) through the hinge (13);
the upper end face of the upper clamping plate (102) is provided with a limiting groove (7), a threaded bolt (8) is installed in the limiting groove (7), a threaded sleeve (9) is sleeved on the threaded bolt (8), a connecting column (12) is sleeved on the threaded sleeve (9), a clamping block (10) is installed at the upper end of the connecting column (12), and a clamping groove (11) is formed in the clamping block (10).
2. The heat dissipation structure of a liquid cooling server as claimed in claim 1, wherein the chip motherboard (1) is clamped with the clamping block (10) through the clamping slot (11).
3. The liquid cooling server heat dissipation structure of claim 1, wherein the connection column (12) is connected with the threaded bolt (8) through a threaded sleeve (9), the threaded sleeve (9) is in threaded sleeve connection with the threaded bolt (8), and the threaded sleeve (9) is in threaded sleeve connection with the connection column (12).
4. The liquid cooling server heat dissipation structure of claim 1, wherein a cooling pipe (3) is arranged in the placement groove (5), the placement groove (5) is meshed and sleeved with the cooling pipe (3), a connector (4) is arranged on one side of the cooling pipe (3), and the connector (4) is in threaded connection with the cooling pipe (3).
5. The heat dissipation structure of claim 1, wherein the upper clamping plate (102) and the lower clamping plate (101) have the same symmetrical structure.
6. The heat dissipation structure of a liquid cooling server as claimed in claim 1, wherein the two chip main boards (1) are disposed at the upper and lower sides of the fixing board (2).
7. The heat dissipation structure of the liquid cooling server as claimed in claim 1, wherein a second fixing bolt (1021) is installed on one side of the upper clamping plate (102), a first fixing bolt (1011) is installed on one side of the lower clamping plate (101), a nut (6) is sleeved on the first fixing bolt (1011), and the first fixing bolt (1011) is connected with the second fixing bolt (1021) through the nut (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122892424.1U CN216286550U (en) | 2021-11-24 | 2021-11-24 | Liquid cooling server heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122892424.1U CN216286550U (en) | 2021-11-24 | 2021-11-24 | Liquid cooling server heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216286550U true CN216286550U (en) | 2022-04-12 |
Family
ID=81036476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122892424.1U Active CN216286550U (en) | 2021-11-24 | 2021-11-24 | Liquid cooling server heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216286550U (en) |
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2021
- 2021-11-24 CN CN202122892424.1U patent/CN216286550U/en active Active
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| GR01 | Patent grant | ||
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Address after: 030000 No. 1, floor 2, workshop 3, taikuang Electrical Industrial Park, No. 93, Tanghuai Road, Tanghuai Park, Taiyuan comprehensive reform demonstration zone, Taiyuan, Shanxi Province Patentee after: Shuguang Information Industry (Shanxi) Co.,Ltd. Address before: 030000 No. 1, floor 2, workshop 3, taikuang Electrical Industrial Park, No. 93, Tanghuai Road, Tanghuai Park, Taiyuan comprehensive reform demonstration zone, Taiyuan, Shanxi Province Patentee before: Shanxi guokejinyun Information Industry Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |