CN216253324U

CN216253324U - Controller PCB board layout structure

Info

Publication number: CN216253324U
Application number: CN202122061842.6U
Authority: CN
Inventors: 袁廷华; 王磊
Original assignee: HEFEI CHUANGYUAN VEHICLE CONTROL TECHNOLOGY CO LTD
Current assignee: HEFEI CHUANGYUAN VEHICLE CONTROL TECHNOLOGY CO LTD
Priority date: 2021-08-30
Filing date: 2021-08-30
Publication date: 2022-04-08
Anticipated expiration: 2031-08-30

Abstract

A controller PCB layout structure comprises a top surface and a bottom surface, wherein the top surface is provided with a control area and a control unit; the control area comprises a connector connection area, a power electronic switch distribution area and a power input power supply grounding copper foil area, wherein the power electronic switch distribution area is arranged close to the periphery of the connector connection area, the power input power supply grounding copper foil area is provided with a welding surface, and the welding surface covers the power electronic switch distribution area; and a safety protection area is arranged on the bottom surface position corresponding to the top surface power electronic switch distribution area, and a protection device and a current safety channel are arranged in the safety protection area. The utility model solves the problems of circuit board heat dissipation and power device safety.

Description

Controller PCB board layout structure

Technical Field

The utility model belongs to the technical field of controller circuit boards, and particularly relates to a controller PCB layout structure.

Background

The design of the circuit board is also called as the design of a Printed Circuit Board (PCB), and the design of the PCB is based on a circuit schematic diagram to realize the functions required by a circuit designer; the design of the printed circuit board mainly refers to layout design, various factors such as external connection layout, optimized layout of internal electronic elements and the like need to be considered, and the reasonable and excellent layout design can save production cost and achieve good circuit performance and heat dissipation performance.

With the development of automation control technology, the PCB circuit board has been applied to various industries, the circuit safety and heat dissipation problems encountered during circuit board design cannot be avoided, and the good safety performance and heat dissipation performance directly determine the service life of a PCB board, so it is necessary to design a PCB board with good safety performance and heat dissipation performance.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a controller PCB layout structure to solve the technical problems of circuit board heat dissipation and power device safety.

In order to achieve the purpose, the specific technical scheme of the utility model is as follows:

a controller PCB layout structure comprises a top surface and a bottom surface, wherein the top surface is provided with a control area and a control unit; the control area comprises a connector connection area, a power electronic switch distribution area and a power input power supply grounding copper foil area, wherein the power electronic switch distribution area is arranged close to the periphery of the connector connection area, the power input power supply grounding copper foil area is provided with a welding surface, and the welding surface covers the power electronic switch distribution area; and a safety protection area is arranged on the bottom surface position corresponding to the top surface power electronic switch distribution area, and a protection device and a current safety channel are arranged in the safety protection area.

Further, set up connector connection terminal point in the connector linking region, connector connection terminal point includes power input power supply terminal point, output load connection terminal point and ground connection terminal point.

Furthermore, a plurality of power electronic switches are arranged in the power electronic switch distribution area, and the power electronic switches are covered on the welding face and arranged close to the connecting end points of the connector.

Furthermore, the power electronic switches are intelligent MOS transistors, common MOS transistors and IGBT transistors, and the number of the power electronic switches is 12.

Further, the protection device is arranged on the power electronic switch, the bottom surface of the power electronic switch is close to the top surface of the power electronic switch, and the current safety channel covers the protection device.

Further, the protection devices are one-way fast recovery diodes, and the number of the protection devices is 12.

Furthermore, the power electronic switch distribution area is provided with connecting through holes.

The utility model has the following advantages: the power electronic switches are arranged close to the connection end points of the connectors, the MOS tubes and the one-way diodes pass through circuit board through holes, lines needing to be connected between components on the circuit board are shortened, the resistance is reduced, and the heat dissipation is less; and the power supply circuit is formed by a copper foil area with a large area, the area of the connecting circuit is increased, the resistance is reduced, the heat dissipation is reduced, and the heat dissipation area is increased. .

Drawings

FIG. 1 is a schematic top view of the present invention;

FIG. 2 is a schematic bottom view of the present invention;

FIG. 3 is a top view of the present invention;

FIG. 4 is a bottom view of the present invention;

FIG. 5 is a schematic circuit diagram of the present invention;

FIG. 6 is a top connection schematic of the present invention;

FIG. 7 is a bottom connection diagram of the present invention.

Detailed Description

In order to better understand the purpose, structure and function of the present invention, a controller PCB layout structure of the present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1 to 4, the controller PCB of the present invention includes a TOP surface (TOP surface) and a BOTTOM surface (BOTTOM surface), the TOP surface is provided with a control area 10 and a control unit 400, which are disposed adjacent to each other. The control area 10 includes a connector connection area 100, a power electronic switch distribution area 200, and a power input power ground copper foil area 300, wherein the power electronic switch distribution area 200 is disposed around the periphery of the connector connection area 100, a soldering surface 201 is disposed in the power input power ground copper foil area 300, and the soldering surface 201 covers the power electronic switch distribution area 200.

A safety protection area 600 is arranged at the bottom surface position corresponding to the top surface power electronic switch distribution area 200, and a protection device 601 and a current safety channel 602 are arranged in the safety protection area 600.

In the controller PCB board top surface area, disposed within connector connection area 100 are connector connection terminals, which include power input power terminals, output load terminals, and ground terminals.

The power input power terminal is connected to the power input power ground copper foil area 300, and the output load connection terminal is connected to an external load.

The current safety channel 602 is formed by a copper sheet laid on the PCB board, and a connection ground terminal is connected to the ground (ground) to form a current leakage path.

A plurality of power electronic switches are disposed within power electronic switch distribution area 200 and overlie bonding surface 201 and are arranged proximate to connector connection terminals. As an embodiment, the power electronic switches in the power electronic switch distribution area 200 are selected from smart MOS transistors, general MOS transistors, and IGBT transistors, and the number of the power electronic switches is 12.

The power supply line of the power electronic switch is formed by a large-area ground copper foil which is arranged around the power electronic switch distribution area 200, so that a power input power supply ground copper foil area 300 is formed, and the power supply is provided by a storage battery power supply. The power input power supply ground copper foil area 300 is connected with a power input power supply end point in the connector connection end points, and the introduced power supply of the power electronic switch is connected to the power input power supply ground copper foil area 300 from the power supply pin (drain electrode) to the near.

The control unit 400 is a single chip microcomputer control chip.

The single chip microcomputer control chip is connected with the power electronic switch through the DC/DC conditioning circuit.

In the bottom area of the controller PCB board, the protection device 601 is located adjacent to the power electronic switch on the top side at the bottom, and the current safety channel 602 covers the protection device 601. As an embodiment, the protection device 601 is a unidirectional fast recovery diode, and the number is 12.

As shown in fig. 5, the specific circuit diagram is that the drain of the power electronic switch MOS transistor is connected to a power supply, the drain is connected to the power input power ground copper foil area 300 nearby, the gate is connected to the control port of the control unit 400 through the DC/DC conditioning circuit, the source is connected to the external load and then grounded, the source is also connected to the cathode of the unidirectional fast recovery diode, and the anode of the unidirectional fast recovery diode is connected to the current safety channel 602 and grounded. The source electrode of the MOS tube is connected with the negative electrode of the unidirectional fast recovery diode in a circuit board through hole mode.

As shown in fig. 6 and 7, the connection between each MOS transistor, the diode, the output load connection terminal and the single chip microcomputer control chip is schematically illustrated.

The one-way fast recovery diode protects the power electronic switch MOS tube, and the induced voltage is broken down or burnt out.

The heat dissipation of the circuit board is related to the resistance value of the resistor, the larger the resistance value is, the larger the heat dissipation is, and the smaller the resistance value is, the smaller the heat dissipation is. The resistance value of the resistor is in direct proportion to the length of the resistor and in inverse proportion to the sectional area of the resistor.

In the utility model, the power electronic switches are arranged close to the connection end points of the connectors, the MOS tubes and the one-way diodes pass through the through holes of the circuit board, the circuits to be connected between the components on the circuit board are all shortened, the resistance is reduced, and the heat dissipation is less; and the power supply circuit is formed by a copper foil area with a large area, the area of the connecting circuit is increased, the resistance is reduced, the heat dissipation is reduced, and the heat dissipation area is increased.

It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes in the features and embodiments, or equivalent substitutions may be made therein by those skilled in the art without departing from the spirit and scope of the utility model. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the utility model without departing from the essential scope thereof. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. A controller PCB layout structure is characterized by comprising a top surface and a bottom surface, wherein the top surface is provided with a control area (10) and a control unit (400);

the control area (10) comprises a connector connection area (100), a power electronic switch distribution area (200) and a power input power supply ground copper foil area (300), wherein the power electronic switch distribution area (200) is arranged close to the periphery of the connector connection area (100), the power input power supply ground copper foil area (300) is provided with a welding surface (201), and the welding surface (201) covers the power electronic switch distribution area (200);

and a safety protection area (600) is arranged on the bottom surface position corresponding to the top surface power electronic switch distribution area (200), and a protection device (601) and a current safety channel (602) are arranged in the safety protection area (600).

2. The controller PCB board layout structure of claim 1, wherein connector connection terminals are provided within the connector connection area (100), the connector connection terminals including a power input power terminal, an output load connection terminal and a ground terminal.

3. The controller PCB layout structure of claim 2, wherein a plurality of power electronic switches are disposed in the power electronic switch distribution area (200), the power electronic switches overlying the bonding surface (201) and arranged proximate to the connector connection terminals.

4. The controller PCB layout structure of claim 3, wherein the power electronic switches are smart MOS transistors, normal MOS transistors and IGBT transistors, and the number of the power electronic switches is 12.

5. Controller PCB layout structure according to claim 3, characterized in that the protection device (601) is arranged with power electronic switches on the bottom side adjacent to the top side, the current safety channel (602) covering the protection device (601).

6. The controller PCB board layout structure of claim 1, wherein the protection devices (601) are unidirectional fast recovery diodes, 12 in number.

7. Controller PCB board layout structure according to claim 1, characterized in that the power electronic switch distribution area (200) is provided with connection vias.