CN216250688U - Image sensor packaging reinforcing structure - Google Patents
Image sensor packaging reinforcing structure Download PDFInfo
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- CN216250688U CN216250688U CN202121399212.3U CN202121399212U CN216250688U CN 216250688 U CN216250688 U CN 216250688U CN 202121399212 U CN202121399212 U CN 202121399212U CN 216250688 U CN216250688 U CN 216250688U
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Abstract
The utility model relates to an image sensor packaging and reinforcing structure, which comprises a metalized area, a metal reinforcing frame, a protective film ring and a solder ring, wherein the metalized area is arranged on the protective film ring; the front surface of the packaging ceramic shell corresponding to the outer side of the optical window cover plate is provided with an annular metalized area, the surface of the metalized area is provided with a metalized area coating, the metalized area is provided with a solder ring, the width of the solder ring is smaller than that of the metalized area, an annular metal reinforcing frame is fixed on the solder ring, the surface of the metal reinforcing frame is provided with a metal reinforcing frame coating, the outer ring part of the metal reinforcing frame is fixed with the solder ring, the inner ring part of the metal reinforcing frame is tightly pressed on the optical window cover plate through a protective film ring, and the width of the protective film ring is smaller than or equal to that of the solder ring. The utility model can resist the huge pressure difference of the large-size optical window cover plate in the packaging cavity under the vacuum and low-pressure conditions, effectively avoids the phenomena of layering and falling off of the sealing cemented part, and improves the applicability of the large-size image sensor in the vacuum and low-pressure environment.
Description
Technical Field
The utility model relates to an image sensor packaging reinforcing structure and a preparation method thereof, and belongs to the technical field of integrated circuit manufacturing.
Background
The image sensor package generally comprises an optical window cover plate and a package carrier, wherein the optical window cover plate is used for facilitating light to enter a photosensitive unit on the surface of a chip, and is used for protecting the image sensor chip from being polluted by the external environment.
The optical window cover plate in the image sensor package is generally sealed by using a sealant. Unlike conventional hermetic package of integrated circuits, the sealing strength of the sealant is significantly lower than that of solder, glass, and other sealing materials in hermetic package. In applications such as vacuum, aviation, aerospace, etc., the light window cover will be subjected to an inside-out pressure due to the presence of the negative pressure, the larger the area of the light window cover, the greater the pressure experienced by the cover. The size of the optical window cover plate is usually less than 40mm multiplied by 30mm, the pressure difference born on the cover plate is usually less than 10 kg, for some large-area array image sensor packages, the size of the cover plate even exceeds 80mm multiplied by 70mm, the pressure difference born on the cover plate will exceed 50 kg, such large pressure is loaded on the sealant, the sealant gluing part can be directly layered and fall off, the sealing failure is caused, the optical window cover plate can fall off by serious persons, and therefore the image sensor chip in the package is not protected. Aiming at the image sensor package using the large-size optical window cover plate, the sealing glue sealing interface is reinforced and protected, and the method is a powerful guarantee for realizing the safe use of the large-size image sensor.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide the image sensor packaging reinforcing structure which can obviously improve the sealing strength of the optical window cover plate and ensure that the large-size optical window cover plate cannot be layered and fall off due to the internal and external pressure difference in the application of a vacuum or low-pressure environment.
According to the technical scheme provided by the utility model, the image sensor packaging and reinforcing structure comprises an image sensor packaging body, wherein the image sensor packaging body comprises a packaging ceramic shell, an optical window cover plate, a sealing rubber ring, pins and an image sensor chip; the back surface of the packaging ceramic shell is provided with a pin, the front surface of the packaging ceramic shell is provided with a concave cavity, an image sensor chip is fixedly bonded in the concave cavity, and the front surface of the packaging ceramic shell corresponding to the outer side of the concave cavity is fixedly provided with an optical window cover plate through a sealant ring;
the device also comprises a metalized area, a metal reinforcing frame, a protective film ring and a welding material ring; the front surface of the packaging ceramic shell corresponding to the outer side of the optical window cover plate is provided with an annular metalized area, the surface of the metalized area is provided with a metalized area coating, the metalized area is provided with a solder ring, the width of the solder ring is smaller than that of the metalized area, an annular metal reinforcing frame is fixed on the solder ring, the surface of the metal reinforcing frame is provided with a metal reinforcing frame coating, the outer ring part of the metal reinforcing frame is fixed with the solder ring, the inner ring part of the metal reinforcing frame is tightly pressed on the optical window cover plate through a protective film ring, and the width of the protective film ring is smaller than or equal to that of the solder ring.
Preferably, the metallization region coating adopts a nickel-gold coating structure, and the gold layer is located outside the nickel layer, wherein the thickness of the nickel layer is 1.3-8.9 μm, and the thickness of the gold layer is 0.03-0.3 μm.
Preferably, the metallization region coating adopts a nickel-palladium-gold coating structure, the gold layer is positioned outside the palladium layer, the palladium layer is positioned outside the nickel layer, the thickness of the nickel layer is 1.3-8.9 μm, the thickness of the palladium layer is 0.1-0.5 μm, and the thickness of the gold layer is 0.03-0.3 μm.
Preferably, the metal reinforcing frame is made of kovar alloy or 42 alloy.
Preferably, the metal reinforcing frame coating is of a nickel-gold coating structure, and the gold layer is located outside the nickel layer, wherein the thickness of the nickel layer is 1.3-8.9 μm, and the thickness of the gold layer is 0.03-0.3 μm.
Preferably, the metal reinforcing frame coating is a nickel-palladium-gold coating structure, the gold layer is positioned outside the palladium layer, and the palladium layer is positioned outside the nickel layer, wherein the nickel layer is 1.3-8.9 μm thick, the palladium layer is 0.1-0.5 μm thick, and the gold layer is 0.03-0.3 μm thick.
Preferably, the protective film ring is a polyimide adhesive film, a polytetrafluoroethylene sheet or a polytetrafluoroethylene coating.
Preferably, the solder ring is low-temperature eutectic solder 63Sn37Pb with the melting point of 183 ℃ or lead-free solder Sn96.5Ag3.0Cu0.5 with the melting point of 217-220 ℃.
Compared with the existing image sensor packaging structure, the reinforcing structure with the optical window cover plate has the advantages that the welding flux alloy has higher sealing strength than the sealing adhesive, so that the large pressure difference in a packaging cavity of the large-size optical window cover plate under the vacuum and low-pressure conditions can be resisted, the phenomena of layering and falling of the sealing adhesive part are effectively avoided, and the applicability of the large-size image sensor under the vacuum and low-pressure environment is improved.
Drawings
Fig. 1 is a view showing a clamped state of the present invention at the time of welding.
Fig. 2 is an enlarged view of a portion a in fig. 1.
Fig. 3 is a schematic structural diagram of an image sensor package reinforcing structure according to the present invention.
Fig. 4 is an enlarged view of a portion B in fig. 3.
Detailed Description
The embodiments of the present invention are only part of the embodiments of the present invention, which are used to help understanding the present invention, and not to limit the scope of the present invention.
Example 1
An image sensor package reinforcing structure, as shown in fig. 3 and 4, includes an image sensor package, and the image sensor package includes a package ceramic housing 1, an optical window cover plate 11, a sealing rubber ring 12, a pin 13 and an image sensor chip 7; the back surface of the packaging ceramic shell 1 is provided with a pin 13, the front surface of the packaging ceramic shell 1 is provided with a concave cavity, an image sensor chip 7 is fixedly bonded in the concave cavity, and the front surface of the packaging ceramic shell 1 corresponding to the outer side of the concave cavity is fixedly provided with an optical window cover plate 11 through a sealing rubber ring 12;
the metal reinforcing frame is characterized by also comprising a metalized area 2, a metal reinforcing frame 3, a protective film ring 4 and a solder ring 5; the front surface of a packaging ceramic shell 1 corresponding to the outer side of a light window cover plate 11 is provided with an annular metalized area 2, the surface of the metalized area 2 is provided with a metalized area coating, the metalized area 2 is provided with a solder ring 5, the width of the solder ring 5 is smaller than that of the metalized area 2, an annular metal reinforcing frame 3 is fixed on the solder ring 5, the surface of the metal reinforcing frame 3 is provided with a metal reinforcing frame coating, the outer ring part of the metal reinforcing frame 3 is fixed with the solder ring 5, the inner ring part of the metal reinforcing frame 3 is pressed on the light window cover plate 11 through a protective film ring 4, and the width of the protective film ring 4 is smaller than or equal to that of the solder ring 5.
A preparation method of an image sensor packaging reinforcement structure comprises the following steps:
the method comprises the following steps: taking an image sensor package body of which the image sensor chip 7 is packaged in advance, determining the width of a solder ring 5 according to the size of an optical window cover plate 11 and the type of selected solder, wherein the solder ring 5 is low-temperature eutectic solder 63Sn37Pb with the melting point of 183 ℃, and the width of the solder ring 5 is designed to be 1.2 mm;
step two: determining the width of a housing metallization region 2 according to the width of a solder ring 5, wherein the width of the metallization region 2 is designed to be 1.5mm, the size of an inner ring of the metallization region 2 is slightly smaller than that of the solder ring 5, the distance between the inner ring of the metallization region 2 and the inner ring of the solder ring 5 is 0.15mm, the size of an outer ring of the metallization region 2 is slightly larger than that of the outer ring of the solder ring 5, and the distance between the outer ring of the metallization region 2 and the outer ring of the solder ring 5 is 0.15 mm;
step three: forming a metalized area 2 outside a sealing area of a light window cover plate 11 of a packaging ceramic shell 1 by adopting a packaging ceramic shell manufacturing process, wherein the surface of the metalized area 2 is provided with a metalized area coating, and the metalized area 2 is synchronously completed in the manufacturing process of the packaging ceramic shell 1;
step four: manufacturing a metal reinforcing frame 3, wherein the metal reinforcing frame 3 can be manufactured in a machining mode, the metal reinforcing frame 3 can also be manufactured by adopting an etching process, and a metal reinforcing frame coating is formed on the surface of the metal reinforcing frame 3 by adopting a standard electroplating process or a chemical plating process;
step five: a protective film ring 4 is arranged on the periphery of the light window cover plate 11, and the width of the protective film ring 4 is designed to be 1.2 mm;
step six: placing a solder ring 5 on the metallization region 2;
step seven: installing the metal reinforcing frame 3, and clamping the metal reinforcing frame 3 and the packaging ceramic shell 1 by adopting a clamp 6 to ensure that the protective film ring 4 and the solder ring 5 are in close contact with the metal reinforcing frame 3;
step eight: placing the clamped metal reinforcing frame 3 and the packaged ceramic shell 1 into a welding furnace for solder reflow, wherein the reflow heating amplitude is controlled to be 0.7-2 ℃/s, the peak temperature is controlled to be 210-225 ℃, the solder reflow time is controlled to be 60-120 s, the cooling amplitude is controlled to be 1-2 ℃/s, the total reflow time is controlled to be 10-15 min, and the metal reinforcing frame 3 and the packaged ceramic shell 1 are welded together through a solder ring 5 and a metalized area 2 after the reflow is finished;
step nine: and (5) after welding is finished, removing the clamp 6, and completing packaging and reinforcing of the image sensor.
The metallization region coating adopts the nickel gold coating structure, and the gold layer is located the outside of nickel layer, and wherein the thickness of nickel layer is 1.3 mu m ~8.9 mu m, and the thickness of gold layer is 0.03 mu m ~0.3 mu m.
The metal reinforcing frame 3 is made of Kovar alloy.
The metal reinforcing frame coating is of a nickel-gold coating structure, and the gold layer is located outside the nickel layer, wherein the thickness of the nickel layer is 1.3-8.9 microns, and the thickness of the gold layer is 0.03-0.3 microns.
The protective film ring 4 may be a polyimide adhesive film in a sticking manner.
Example 2
An image sensor package reinforcing structure, as shown in fig. 3 and 4, includes an image sensor package, and the image sensor package includes a package ceramic housing 1, an optical window cover plate 11, a sealing rubber ring 12, a pin 13 and an image sensor chip 7; the back surface of the packaging ceramic shell 1 is provided with a pin 13, the front surface of the packaging ceramic shell 1 is provided with a concave cavity, an image sensor chip 7 is fixedly bonded in the concave cavity, and the front surface of the packaging ceramic shell 1 corresponding to the outer side of the concave cavity is fixedly provided with an optical window cover plate 11 through a sealing rubber ring 12;
the metal reinforcing frame is characterized by also comprising a metalized area 2, a metal reinforcing frame 3, a protective film ring 4 and a solder ring 5; the front surface of a packaging ceramic shell 1 corresponding to the outer side of a light window cover plate 11 is provided with an annular metalized area 2, the surface of the metalized area 2 is provided with a metalized area coating, the metalized area 2 is provided with a solder ring 5, the width of the solder ring 5 is smaller than that of the metalized area 2, an annular metal reinforcing frame 3 is fixed on the solder ring 5, the surface of the metal reinforcing frame 3 is provided with a metal reinforcing frame coating, the outer ring part of the metal reinforcing frame 3 is fixed with the solder ring 5, the inner ring part of the metal reinforcing frame 3 is pressed on the light window cover plate 11 through a protective film ring 4, and the width of the protective film ring 4 is smaller than or equal to that of the solder ring 5.
A preparation method of an image sensor packaging reinforcement structure comprises the following steps:
the method comprises the following steps: taking an image sensor packaging body which is packaged with an image sensor chip 7 in advance, determining the width of a solder ring 5 according to the size of an optical window cover plate 11 and the type of selected solder, wherein the solder ring 5 is lead-free solder Sn96.5Ag3.0Cu0.5 with the melting point of 217-220 ℃, and the width of the solder ring 5 is designed to be 1.2 mm;
step two: determining the width of a housing metallization region 2 according to the width of a solder ring 5, wherein the width of the metallization region 2 is designed to be 1.5mm, the size of an inner ring of the metallization region 2 is slightly smaller than that of the solder ring 5, the distance between the inner ring of the metallization region 2 and the inner ring of the solder ring 5 is 0.15mm, the size of an outer ring of the metallization region 2 is slightly larger than that of the outer ring of the solder ring 5, and the distance between the outer ring of the metallization region 2 and the outer ring of the solder ring 5 is 0.15 mm;
step three: forming a metalized area 2 outside a sealing area of a light window cover plate 11 of a packaging ceramic shell 1 by adopting a packaging ceramic shell manufacturing process, wherein the surface of the metalized area 2 is provided with a metalized area coating, and the metalized area 2 is synchronously completed in the manufacturing process of the packaging ceramic shell 1;
step four: manufacturing a metal reinforcing frame 3, wherein the metal reinforcing frame 3 can be manufactured in a machining mode, the metal reinforcing frame 3 can also be manufactured by adopting an etching process, and a metal reinforcing frame coating is formed on the surface of the metal reinforcing frame 3 by adopting a standard electroplating process or a chemical plating process;
step five: a protective film ring 4 is arranged on the periphery of the light window cover plate 11, and the width of the protective film ring 4 is designed to be 1.2 mm;
step six: placing a solder ring 5 on the metallization region 2;
step seven: installing the metal reinforcing frame 3, and clamping the metal reinforcing frame 3 and the packaging ceramic shell 1 by adopting a clamp 6 to ensure that the protective film ring 4 and the solder ring 5 are in close contact with the metal reinforcing frame 3;
step eight: placing the clamped metal reinforcing frame 3 and the packaged ceramic shell 1 into a welding furnace for solder reflow, wherein the reflow heating amplitude is controlled to be 0.7-2 ℃/s, the peak temperature is controlled to be 235-250 ℃, the solder reflow time is controlled to be 60-120 s, the cooling amplitude is controlled to be 1-2 ℃/s, the total reflow time is controlled to be 10-15 min, and the metal reinforcing frame 3 and the packaged ceramic shell 1 are welded together through a solder ring 5 and a metalized area 2 after the reflow is finished;
step nine: and (5) after welding is finished, removing the clamp 6, and completing packaging and reinforcing of the image sensor.
The metallization region coating adopts a nickel-palladium-gold coating structure, the gold layer is positioned outside the palladium layer, the palladium layer is positioned outside the nickel layer, the thickness of the nickel layer is 1.3-8.9 mu m, the thickness of the palladium layer is 0.1-0.5 mu m, and the thickness of the gold layer is 0.03-0.3 mu m.
The metal reinforcing frame 3 is made of 42 alloy materials.
The metal reinforcing frame coating is of a nickel-palladium-gold coating structure, the gold layer is located outside the palladium layer, the palladium layer is located outside the nickel layer, the thickness of the nickel layer is 1.3-8.9 mu m, the thickness of the palladium layer is 0.1-0.5 mu m, and the thickness of the gold layer is 0.03-0.3 mu m.
The protective film ring 4 is a teflon coating applied on the optical window cover plate 11.
According to the utility model, the metal reinforcing frame 3 is additionally arranged at the edge of the optical window cover plate 11 for welding and reinforcing, and the welding strength of the solder alloy is higher than that of the sealant, so that the pressure resistance of the large-size optical window cover plate 11 under the vacuum and low-pressure conditions is improved, the phenomena of delamination and falling off of the sealant bonding part are avoided, and the applicability of the large-size image sensor under the vacuum and low-pressure environment is further improved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and those skilled in the art can modify and modify the technical solution of the present invention by the above method, or modify the equivalent embodiment of the equivalent variation without departing from the scope of the technical solution of the present invention. Therefore, any modifications and equivalent changes made according to the technical spirit of the present invention are within the technical scope of the present invention, unless the technical spirit of the present invention departs from the content of the technical solution of the present invention.
Claims (8)
1. An image sensor packaging and reinforcing structure comprises an image sensor packaging body, wherein the image sensor packaging body comprises a packaging ceramic shell (1), an optical window cover plate (11), a sealing rubber ring (12), pins (13) and an image sensor chip (7); the back surface of the packaging ceramic shell (1) is provided with a pin (13), the front surface of the packaging ceramic shell (1) is provided with a concave cavity, an image sensor chip (7) is fixedly bonded in the concave cavity, and the front surface of the packaging ceramic shell (1) corresponding to the outer side of the concave cavity is fixedly provided with a light window cover plate (11) through a sealing rubber ring (12);
the method is characterized in that: the metal reinforcing frame is characterized by also comprising a metallization area (2), a metal reinforcing frame (3), a protective film ring (4) and a welding material ring (5); the front surface of a packaging ceramic shell (1) corresponding to the outer side of an optical window cover plate (11) is provided with an annular metalized area (2), the surface of the metalized area (2) is provided with a metalized area plating layer, a solder ring (5) is arranged on the metalized area (2), the width of the solder ring (5) is smaller than that of the metalized area (2), an annular metal reinforcing frame (3) is fixed on the solder ring (5), the surface of the metal reinforcing frame (3) is provided with a metal reinforcing frame plating layer, the outer ring part of the metal reinforcing frame (3) is fixed with the solder ring (5), the inner ring part of the metal reinforcing frame (3) is pressed on the optical window cover plate (11) through a protective film ring (4), and the width of the protective film ring (4) is smaller than or equal to that of the solder ring (5).
2. The image sensor package reinforcement structure of claim 1, wherein: the metallization region coating adopts the nickel gold coating structure, and the gold layer is located the outside of nickel layer, and wherein the thickness of nickel layer is 1.3 mu m ~8.9 mu m, and the thickness of gold layer is 0.03 mu m ~0.3 mu m.
3. The image sensor package reinforcement structure of claim 1, wherein: the metallization region coating adopts a nickel-palladium-gold coating structure, the gold layer is positioned outside the palladium layer, the palladium layer is positioned outside the nickel layer, the thickness of the nickel layer is 1.3-8.9 mu m, the thickness of the palladium layer is 0.1-0.5 mu m, and the thickness of the gold layer is 0.03-0.3 mu m.
4. The image sensor package reinforcement structure of claim 1, wherein: the metal reinforcing frame (3) is made of Kovar alloy or 42 alloy.
5. The image sensor package reinforcement structure of claim 1, wherein: the metal reinforcing frame coating is of a nickel-gold coating structure, and the gold layer is located outside the nickel layer, wherein the thickness of the nickel layer is 1.3-8.9 microns, and the thickness of the gold layer is 0.03-0.3 microns.
6. The image sensor package reinforcement structure of claim 1, wherein: the metal reinforcing frame coating is of a nickel-palladium-gold coating structure, the gold layer is located outside the palladium layer, the palladium layer is located outside the nickel layer, the thickness of the nickel layer is 1.3-8.9 mu m, the thickness of the palladium layer is 0.1-0.5 mu m, and the thickness of the gold layer is 0.03-0.3 mu m.
7. The image sensor package reinforcement structure of claim 1, wherein: the protective film ring (4) is a polyimide adhesive film, a polytetrafluoroethylene sheet or a polytetrafluoroethylene coating.
8. The image sensor package reinforcement structure of claim 1, wherein: the solder ring (5) is low-temperature eutectic solder 63Sn37Pb with the melting point of 183 ℃ or lead-free solder Sn96.5Ag3.0Cu0.5 with the melting point of 217-220 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121399212.3U CN216250688U (en) | 2021-06-22 | 2021-06-22 | Image sensor packaging reinforcing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121399212.3U CN216250688U (en) | 2021-06-22 | 2021-06-22 | Image sensor packaging reinforcing structure |
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| Publication Number | Publication Date |
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| CN216250688U true CN216250688U (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121399212.3U Active CN216250688U (en) | 2021-06-22 | 2021-06-22 | Image sensor packaging reinforcing structure |
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| CN (1) | CN216250688U (en) |
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- 2021-06-22 CN CN202121399212.3U patent/CN216250688U/en active Active
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