CN216234245U

CN216234245U - Semiconductor intelligent storage feeding agencies

Info

Publication number: CN216234245U
Application number: CN202121801863.0U
Authority: CN
Inventors: 沙伟中
Original assignee: Suzhou I Stock Intelligent Technology Co ltd
Current assignee: Suzhou I Stock Intelligent Technology Co ltd
Priority date: 2021-08-04
Filing date: 2021-08-04
Publication date: 2022-04-08
Anticipated expiration: 2031-08-04

Abstract

The utility model relates to the technical field of intelligent storage, in particular to a semiconductor intelligent storage material taking mechanism which comprises a material taking plate and a telescopic mechanism, wherein the telescopic mechanism is used for controlling the material taking plate to move back and forth; the material pressing mechanism is used for fixing the material tray. This semiconductor intelligence storage feeding agencies, after lifting the material dish through getting the flitch, contract, say the material dish and contract below the top board, come the material length of getting of control clamping jaw with this, it gets to the material dish of the memory location of the different degree of depth to make things convenient for to get the material, clamping jaw after the shrink simultaneously, make its carry radius can reduce, it operates in the narrow space to make things convenient for, the condition of interference appears in clamping jaw and the space object around avoiding appearing, simultaneously the material dish is after the shrink, the pushing down of top board, will press the awl to press the middle through-hole position at the material dish, make the circumstances that the material dish of getting avoids appearing dropping in the transportation, improve the material and transport and press the stability of getting the in-process.

Description

Semiconductor intelligent storage feeding agencies

Technical Field

The utility model relates to the technical field of intelligent storage, in particular to a semiconductor intelligent storage material taking mechanism.

Background

The intelligent storage refers to a set of goods storage system which ensures that goods are moved in order in a warehouse in the logistics process so as to improve the logistics efficiency and reduce the overall cost, and mainly comprises a software movement system and a hardware storage facility, wherein the hardware storage facility mainly comprises a warehouse main body and transportation equipment.

And present intelligent storage is pressing from both sides the clamp of getting to the material and is getting the unstability, drops, leads to the material to damage to the action radius is great, leads to getting the material space great in intelligent storage inside, very limitation, the condition of interference appears easily. In view of this, we propose a semiconductor smart storage reclaiming mechanism.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a semiconductor intelligent storage and taking mechanism to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme:

the semiconductor intelligent storage and taking mechanism comprises a material taking plate and a telescopic mechanism, wherein the telescopic mechanism is used for controlling the material taking plate to move back and forth; the material pressing mechanism is used for fixing the material tray.

Preferably, the telescopic mechanism comprises a first motor, an output end of the first motor is connected with a first driving wheel, the surface of the first driving wheel is in transmission connection with the first driving wheel through a first belt, and the material taking plate is connected to the first belt through a first pressing plate.

Preferably, the material taking plate is connected with a sliding seat through a connecting block, the sliding seat is connected with a second sliding rail in a sliding mode, the second sliding rail is fixedly connected with a machine base, the first motor is connected with the machine base, and the first driving wheel is rotatably connected to the machine base.

Preferably, the material pressing mechanism comprises a second motor, an output end of the second motor is connected with a second driving wheel, the surface of the second driving wheel is in transmission connection with a second driving wheel through a second belt, the second belt is connected with a supporting plate, the supporting plate is connected with an upper pressing plate through a connecting block, and the bottom of the upper pressing plate is connected with a pressing cone.

Preferably, the support plate is connected with a second sliding sleeve, the second sliding sleeve is connected with a first sliding rail in a sliding manner, the first sliding rail is connected with a connecting plate, and the connecting plate is fixedly connected to the base.

Preferably, the device further comprises an induction device, the induction device comprises an inductor connected to the connecting plate, an induction sheet is arranged in the inductor, and the induction sheet is connected to the support plate.

Compared with the prior art, the utility model has the beneficial effects that:

this semiconductor intelligence storage feeding agencies lifts the material dish through getting the flitch after, contracts to this gets material length of material of control clamping jaw, makes things convenient for getting the material dish of the storage position of different degree of depth and gets the material, and the clamping jaw after the shrink simultaneously makes its carry the radius and can reduce, is convenient for operate in the narrow space, avoids appearing the clamping jaw and the condition that the interference appears in the space object on every side. Simultaneously the material dish is after the shrink, with the material dish shrink below the top board, the pushing down of top board will press the awl and press the middle through-hole position at the material dish for the circumstances that the charging tray was avoided appearing dropping in the transportation, the stability of the in-process is got with the clamp to the improvement material transportation.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a rear view of the present invention in its entirety;

FIG. 3 is a schematic view of the telescoping mechanism of the present invention;

FIG. 4 is a schematic view of a pressing mechanism in the present invention;

fig. 5 is a schematic structural view of the upper platen of the present invention.

In the figure: 1. a machine base; 2. a telescoping mechanism; 21. a first motor; 22. a first drive wheel; 23. a first platen; 24. a first drive pulley; 25. a slide base; 26. a first belt; 3. a connecting plate; 4. a material pressing mechanism; 41. a second motor; 42. a second drive wheel; 43. a second transmission wheel; 44. a support plate; 45. an inductor; 46. an induction sheet; 47. an upper pressure plate; 48. pressing a cone; 49. a second belt; 5. taking a material plate; 6. a first slide rail; 7. a second slide rail; 8. and the second sliding sleeve.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1-5, a technical solution provided by the present invention is:

the semiconductor intelligent storage taking mechanism comprises a taking plate 5 and a telescopic mechanism 2, wherein the telescopic mechanism 2 is used for controlling the taking plate 5 to move back and forth; the material pressing mechanism 4 is used for fixing the material tray.

In this embodiment, telescopic machanism 2 is including first motor 21, first motor 21's output is connected with first drive wheel 22, first drive wheel 22's surface is connected with the transmission of first drive wheel 24 through a belt 26, it connects on a belt 26 through first clamp plate 23 to get flitch 5, rotate through first motor 21, drive first drive wheel 22's rotation, transmission between the belt, and it fixes on a belt 26 through first clamp plate 23 to get flitch 5, so a belt 26 can drive and get flitch 5 and contract at the moving in-process, thereby directly drive the material dish and take out in the intelligent storage.

Further, get flitch 5 and be connected with slide 25 through the connecting block, sliding connection has second slide rail 7 on slide 25, fixedly connected with frame 1 on the second slide rail 7, and first motor 21 is connected with frame 1, and first drive wheel 24 rotates and connects on frame 1, and slide 25 slides on second slide rail 7 to this is spacing, guarantees that whole flitch 5 of getting can be very stable flexible slip.

Furthermore, the material pressing mechanism 4 comprises a second motor 41, an output end of the second motor 41 is connected with a second driving wheel 42, the surface of the second driving wheel 42 is in transmission connection with a second driving wheel 43 through a second belt 49, the second belt 49 is connected with a support plate 44, the support plate 44 is connected with an upper pressure plate 47 through a connecting block, the bottom of the upper pressure plate 47 is connected with a pressure cone 48, the second driving wheel 42 is driven to rotate through rotation of the second motor 41, the support plate 44 fixed on the second belt 49 is driven to move up and down through operation of the second belt 49, and the upper pressure plate 47 is driven to move up and down, so that the material tray is clamped and fixed, and dropping is prevented.

In addition, the support plate 44 is connected with the second sliding sleeve 8, the second sliding sleeve 8 is connected with the first sliding rail 6 in a sliding manner, the first sliding rail 6 is connected with the connecting plate 3, the connecting plate 3 is fixedly connected to the machine base 1, and the sliding between the first sliding rail 6 and the second sliding sleeve 8 is also used for ensuring the stability of the upper pressure plate 47 in the downward moving process, so that the inclined pressure deviation situation cannot occur.

Besides, still including induction system, induction system is including connecting the inductor 45 on connecting plate 3, be provided with response piece 46 in the inductor 45, response piece 46 is connected on extension board 44, a plurality of inductors 45 have been set up, in-process when extension board 44 gliding from top to bottom, will drive response piece 46 and pass in inductor 45, utilize photoelectric sensor's effect, can directly confirm the position that top board 47 pushed down, confirm whether top board 47 presses on the material dish, avoid appearing top board 47 with this and not compressing tightly the material dish, lead to the condition that the in transit material dropped.

When the semiconductor intelligent storage taking mechanism is used, firstly, the material taking plate 5 is moved to the lower part of a material disc, then the material taking plate 5 moves upwards, the material disc tray is lifted, the material disc stored in the intelligent storage is taken out, then the rotation of the first motor 21 is controlled, the first motor 21 rotates to drive the rotation of the first driving wheel 22, the material taking plate 5 is fixed on the first belt 26 through the transmission between the belts, the first belt 26 drives the material taking plate 5 to contract in the operation process, so that the material disc is directly driven to be taken out from the intelligent storage, the sliding seat 25 is relatively fixed on the material taking plate 5, the sliding seat 25 slides on the second sliding rail 7 to limit, so as to ensure that the whole material taking plate 5 can stably slide in a telescopic way, and after the whole material taking plate 5 contracts, the rotation of the second motor 41 is controlled, the second driving wheel 42 is driven to rotate, the upper pressing plate 47 can be controlled to move downwards by using the same principle, three pressing cones 48 are pressed at the positions of central holes of three material discs to fix the whole material discs in the transferring process, the sliding between the first sliding rail 6 and the second sliding sleeve 8 is also realized to ensure the stability of the upper pressing plate 47 in the moving downwards process, so that the upper pressing plate 47 cannot be inclined and biased, and meanwhile, a plurality of sensors 45 are arranged, when the supporting plate 44 slides upwards and downwards, the sensing sheet 46 is driven to pass through the sensors 45, and the pressing position of the upper pressing plate 47 can be directly determined by using the action of a photoelectric sensor to determine whether the upper pressing plate 47 is pressed on the material discs, so that the situation that the material discs are not pressed by the upper pressing plate 47 and the material drops in the transferring process is avoided.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. Semiconductor intelligent storage feeding agencies, its characterized in that: the device comprises a material taking plate (5) and a telescopic mechanism (2), wherein the telescopic mechanism (2) is used for controlling the material taking plate (5) to move back and forth; the material pressing mechanism (4) is used for fixing the material tray.

2. The semiconductor intelligent warehousing reclaiming mechanism of claim 1, wherein: telescopic machanism (2) are including first motor (21), the output of first motor (21) is connected with first drive wheel (22), the surface of first drive wheel (22) is passed through belt (26) and is connected with first drive wheel (24) transmission, it connects on belt (26) through first clamp plate (23) to get flitch (5).

3. The semiconductor intelligent warehousing reclaiming mechanism of claim 2, wherein: get flitch (5) and be connected with slide (25) through the connecting block, sliding connection has second slide rail (7) on slide (25), fixedly connected with frame (1) is gone up in second slide rail (7), first motor (21) are connected with frame (1), first drive wheel (24) rotate to be connected on frame (1).

4. The semiconductor intelligent warehousing reclaiming mechanism of claim 1, wherein: the material pressing mechanism (4) comprises a second motor (41), the output end of the second motor (41) is connected with a second driving wheel (42), the surface of the second driving wheel (42) is in transmission connection with a second driving wheel (43) through a second belt (49), a support plate (44) is connected onto the second belt (49), an upper pressure plate (47) is connected onto the support plate (44) through a connecting block, and a pressure cone (48) is connected to the bottom of the upper pressure plate (47).

5. The semiconductor intelligent warehousing reclaiming mechanism of claim 4, wherein: the support plate (44) is connected with a second sliding sleeve (8), the second sliding sleeve (8) is connected with a first sliding rail (6) in a sliding mode, the first sliding rail (6) is connected with a connecting plate (3), and the connecting plate (3) is fixedly connected to the machine base (1).

6. The semiconductor intelligent warehousing reclaiming mechanism of claim 5, wherein: the device is characterized by further comprising an induction device, wherein the induction device comprises an inductor (45) connected to the connecting plate (3), an induction sheet (46) is arranged in the inductor (45), and the induction sheet (46) is connected to the support plate (44).