CN216217753U - Onboard signal path multi-path data selector - Google Patents

Abstract

The utility model relates to an onboard signal path multi-way data selector. The utility model provides an on-board signal path multichannel data selector, is including setting up the at least three pad on the circuit board, and a plurality of pads are annular align to grid, and a plurality of pads are connected through low impedance mode. The utility model has the beneficial effects that: the multi-channel data selection function is realized, the impedance among signal paths is consistent and convenient to connect, the size is smaller, the cost is lower, no energy consumption is caused, the frequency characteristic is good, and the high temperature resistance is realized.

Description

Onboard signal path multi-path data selector

Technical Field

The utility model relates to a multipath data selector, in particular to an onboard signal path multipath data selector.

Background

At present, modern electronic products are developed rapidly, and have great progress in the aspects of cost, volume, performance and the like. Various types of electronic products such as: electronic products such as smart phones, computers, televisions and the like are developed towards lower cost, smaller size and better performance. The most direct reason why modern electronic products can be developed rapidly is the progress of technology. A complete electronic product is composed of a chip (IC), electronic components, a circuit board and a housing package. With the lapse of time, the integration level of ICs is increasing, and with the development of circuit board manufacturing processes, the size of electronic components is becoming smaller and smaller, and the performance is increasing, the size and performance of electronic products are being optimized. At present, technologies or elements such as jumper caps, multi-way data selectors and the like are commonly used in electronic products to adjust the on-off relationship of different signals on equipment, and thus the working state of the equipment is adjusted. The design idea is that in the design process of electronic products, two or more different working states exist on the same hardware equipment, and a proper control module is added for scheduling. The design concept can greatly improve the flexibility of electronic products, and has certain promotion effect on miniaturization and multi-functionalization of the electronic products.

The jumper cap is a movable part commonly used in a computer mainboard, the outer layer of the jumper cap is made of insulating plastics, the inner layer of the jumper cap is made of conductive materials and can be inserted ON jumper pins, the two jumper pins are connected, when the jumper cap is buckled ON the two jumper pins, the jumper cap is in a switch-ON state, and current passes through the jumper cap and is called to be ON; otherwise, when the jumper cap is not buckled, the jumper cap is disconnected, which is called OFF. However, the jumper cap must be used with a plug-in jumper pin, which means that the jumper cap is not suitable for transmission of high-frequency and high-speed signals. Meanwhile, as a direct-insertion element with a certain height, in the design, it is difficult for engineers to add the jumper cap to small products such as mobile phones, earphones, ultrathin notebooks, and the like.

The data selector is a circuit capable of selecting any one of the paths according to requirements in a multi-path data transmission process, and is also called a multiplexer or a multi-path switch. The data selector with good performance can transmit high-speed and high-frequency signals, has small volume and can be integrated into a small electronic product. However, as an IC, the higher performance means the higher price, and one type of IC simultaneously satisfies the high temperature resistance, the small volume, and the high speed signal transmission. Meanwhile, the data selector needs a power supply, which generates a certain amount of heat and power loss, thereby occupying part of the resources in the design of the electronic product.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem of overcoming the defects in the prior art and provides an onboard signal path multi-path data selector.

The utility model is realized by the following technical scheme:

the utility model provides an on-board signal path multichannel data selector, is including setting up the at least three pad on the circuit board, and a plurality of pads are annular align to grid, and a plurality of pads are connected through low impedance mode.

According to the above technical solution, preferably, the low impedance connection includes a 0 ohm resistance connection, a conductor connection or a magnetic bead connection.

According to the above technical solution, preferably, one structure of the conductor connection is: and a solder mask layer is arranged on the circuit board between the pads, and the pads are connected by cladding solder on the solder mask layer.

According to the technical scheme, preferably, the pads are connected end to end through the solder mask layer to form a ring.

According to the above technical solution, preferably, the number of the pads is four.

According to the technical scheme, the circuit board and the low-impedance connection are preferably made of high-temperature-resistant materials respectively.

The utility model has the beneficial effects that: the multi-channel data selection function is realized, the impedance among signal paths is consistent and convenient to connect, the size is smaller, the cost is lower, no energy consumption is caused, the frequency characteristic is good, and the high temperature resistance is realized.

Drawings

Fig. 1 shows a schematic diagram of a second embodiment of the utility model.

Fig. 2 is a schematic diagram of a package structure according to a second embodiment of the utility model.

Fig. 3 shows a schematic diagram of a two-to-two connection structure of adjacent pads according to a second embodiment of the present invention.

Fig. 4 is a schematic diagram illustrating a connection structure of non-adjacent pads according to a second embodiment of the present invention.

Fig. 5 shows a return loss plot for an embodiment of the present invention.

Fig. 6 shows an insertion loss diagram of an embodiment of the present invention.

In the figure: 5. the packaging structure comprises a bonding pad, 6 a solder mask layer, 7 a packaging appearance silk-screen frame, 8 packaging direction marks and 9 tin.

Detailed Description

In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and preferred embodiments.

Example one

The utility model relates to an onboard signal path multi-path data selector which comprises at least three bonding pads arranged on a circuit board, wherein the bonding pads are annularly arranged and are connected in a low-impedance mode.

The pads are used to connect signal paths. The plurality of pads are respectively connected with different independent signal paths. According to the requirement, any two pads can be connected in a low impedance mode, and the effect of the data selector is achieved.

The low impedance connection may comprise a 0 ohm resistive connection, a conductive connection, or a magnetic bead connection.

One configuration of the conductor connection is: and a solder mask layer is arranged on the circuit board between the pads, and the pads are connected by cladding solder on the solder mask layer. The circuit board is provided with a green oil layer except the bonding pad and the solder resist layer. The solder mask is a part for removing the green oil, so that the solder can be conveniently clad. The green oil layer and the solder mask layer cooperate to limit the shape and size of the solder. When the solder mask is filled with solder, a low impedance connection can be made between the two pads. The solder may be a common solder.

The shape and the size of each pad are the same, and a plurality of pads are the annular and evenly arranged, and a plurality of pads pass through the soldermask end to end and are the annular. The structure ensures that the shapes and the sizes of the solder mask layers are completely the same, and the impedances of the solders cladded in the solder mask layers are consistent.

Example two

As shown in fig. 1-4, the number of pads is four.

The four pads 5 are the same size and are each 0.75mm by 0.75mm square. The four sections of the solder resist layers 6 serve as bridges between the pads and are connected between the adjacent pads. The four pads are externally provided with a package outline silk-screen frame 7, which illustrates the size of the whole package, in this embodiment, the size of the package is a rectangular frame 3.05mm × 3.05 mm. The circuit board is also provided with an encapsulation direction identifier 8 and an encapsulation reference number, the encapsulation direction identifier enables engineers to know paths corresponding to different signals, and the encapsulation reference number provides a component index basis for design.

The working principle of this embodiment is that four pads are connected to four independent signal paths, respectively. When the actual product is applied, the bonding pads are connected by using a low-impedance connection method, such as: any two of the four pads are connected (fig. 4) or adjacent pads are connected in parallel two by two (fig. 3). Therefore, different signal paths are switched on, and the function of multi-path data selection is realized.

There are many methods for low impedance connection, such as using 0 ohm resistor connection, conductor connection, or other connection methods such as magnetic beads. The pad size of this design is 0.75mm x 0.75 mm. The two pads are 0.75mm apart. The small patch type low-impedance element is suitable for being welded on the welding pad. In addition, a solder mask layer is arranged between two adjacent pads in the design. After the circuit board is processed, no green oil exists between the adjacent pads, and the pads can be connected by tin 9. The green oil with the size of 0.75mm multiplied by 0.75mm exists in the middle of the package, so that the width of the tin can be limited in the actual tin connecting process, and the consistency of impedance and the convenience of connection are favorably kept.

In terms of volume, the size of the design is 3.05mm multiplied by 3.05 mm. The area is small, the height is low, and the device is suitable for electronic products with increasingly tense space resources. Compared to jumper caps, the volume is smaller, even smaller than most IC sizes.

In cost investment, the package of the design is only needed to be added and matched with the low-impedance connecting element or the conductor, and almost no cost is caused. Compared with jumper caps and expensive ICs, the novel jumper cap has certain advantages.

In terms of power consumption and heat dissipation, the design can use 0 ohm resistor, tin or other passive devices to realize interconnection, and the package does not consume energy.

In the aspect of frequency characteristics, the jumper cap is not suitable for transmitting high-speed signals due to the fact that impedance matching is not conducted, and in the design, impedance matching can be achieved and high-frequency signals can be transmitted only by selecting a suitable low-impedance connection method. As shown in FIGS. 5 and 6, the return loss of the design is always less than-12 db in the frequency band range of 0-25 GHZ; the insertion loss is always larger than-1 db, and the frequency characteristic is better.

On the temperature characteristic, if the plate and the process selected during processing are high temperature resistant, the design can realize the high temperature resistance only by matching a high temperature resistant low-impedance element or using a high temperature resistant conductor. The outer layer of the jumper cap is made of plastic, and is not suitable for a high-temperature environment, and for a data selector, not only high-temperature-resistant plates and processes are needed, but also the IC itself needs to be high-temperature-resistant, so that the cost is increased.

The utility model has the beneficial effects that: the multi-channel data selection function is realized, the impedance among signal paths is consistent and convenient to connect, the size is smaller, the cost is lower, no energy consumption is caused, the frequency characteristic is good, and the high temperature resistance is realized.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (6)

1. An on-board signal path multiplexer, comprising: including setting up the at least three pad on the circuit board, a plurality of pads are annular align to grid, and a plurality of pads are connected through low impedance mode.

2. An on-board signal path multiplexer as set forth in claim 1, wherein: the low impedance connection may comprise a 0 ohm resistive connection, a conductive connection, or a magnetic bead connection.

3. An on-board signal path multiplexer as set forth in claim 2, wherein: one configuration of the conductor connection is: and a solder mask layer is arranged on the circuit board between the pads, and the pads are connected by cladding solder on the solder mask layer.

4. An on-board signal path multiplexer as set forth in claim 3, wherein: the plurality of welding pads are connected end to end through the solder mask layer to form an annular shape.

5. An on-board signal path multiplexer as defined in any one of claims 1-4, wherein: the number of pads is four.

6. An on-board signal path multiplexer as defined in any one of claims 1-4, wherein: the circuit board and the low-impedance connection respectively adopt high-temperature resistant materials.

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