CN216213540U - Thermoelectric module of slender type granule assembled mode - Google Patents
Thermoelectric module of slender type granule assembled mode Download PDFInfo
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- CN216213540U CN216213540U CN202122177234.1U CN202122177234U CN216213540U CN 216213540 U CN216213540 U CN 216213540U CN 202122177234 U CN202122177234 U CN 202122177234U CN 216213540 U CN216213540 U CN 216213540U
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Abstract
The utility model discloses a thermoelectric module adopting a slender particle assembly mode, which solves the problems of low yield and high cost caused by low cutting efficiency and easiness in breakage of slender particles in the prior art, and comprises a substrate, a lead and a plurality of short particles; every two short particles form a slender particle; the substrate comprises an upper ceramic substrate and a lower ceramic substrate which are distributed in an up-and-down symmetrical mode, and the short particles comprise upper half particles and lower half particles which are distributed in a symmetrical mode; the upper half part of particles are placed on the upper ceramic substrate through a jig to form an assembly, and the lower half part of particles are placed on the lower ceramic substrate through the jig to form another assembly; the assembly formed by the upper half part of particles and the upper ceramic substrate covers the assembly formed by the lower half part of particles and the lower ceramic substrate and is fixed in a heating mode; the wires are soldered to the lower ceramic substrate. The utility model adopts short particles to form slender particles, reduces the particle cutting breakage rate, improves the particle cutting efficiency and has high mass production efficiency.
Description
Technical Field
The utility model relates to the technical field of semiconductor devices, in particular to a thermoelectric module adopting a slender particle assembly mode.
Background
At present, some markets need to use semiconductor modules with lower power consumption, most of the products are low-current products, the height of particles needs to be increased in order to ensure the reliability of the products, and the width of the particles is not greatly increased. If the thermoelectric semiconductor module particle height to width ratio is greater than 2, the particles are elongated by default. Due to the characteristics of the zone-melting material, the slender particles are easy to damage in the cutting process, the cutting efficiency is slow, the yield is poor, and the cost is increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problems of low yield and high cost caused by slow cutting efficiency and easy damage of the slender particles in the prior art, and provides the thermoelectric module with the slender particle assembly mode.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a thermoelectric module with a slender particle assembly mode comprises a substrate, a lead and a plurality of short particles; every two short particles form a slender particle;
the substrate comprises an upper ceramic substrate and a lower ceramic substrate which are distributed in an up-and-down symmetrical mode, and the short particles comprise upper half particles and lower half particles which are distributed in a symmetrical mode;
the upper half part of particles are placed on the upper ceramic substrate through a jig to form an assembly, and the lower half part of particles are placed on the lower ceramic substrate through the jig to form another assembly;
the assembly formed by the upper half part of particles and the upper ceramic substrate covers the assembly formed by the lower half part of particles and the lower ceramic substrate and is fixed in a heating mode;
the wires are soldered to the lower ceramic substrate.
According to the utility model, a layer of soldering tin is coated on an upper ceramic substrate and a lower ceramic substrate which are formed by a sintering process through a jig, then upper half particles and lower half particles are respectively placed on the upper ceramic substrate and the lower ceramic substrate, the types of the particles at the same corresponding positions are the same, then the particles are fixed in a process heating mode, and finally a lead is welded on the lower ceramic substrate to form a current loop.
Preferably, the upper ceramic substrate and the upper half particles are fixed by solder. The soldering tin covers the substrate in advance through the jig, the short particles are also placed on the soldering tin of the substrate through the jig, and the short particles are fixed on the substrate through the soldering tin to form an upper assembly.
Preferably, the lower ceramic substrate and the lower half grains are fixed by solder. The lower assembly is formed in the same mode, the upper assembly covers the lower assembly, the upper assembly and the lower assembly are connected, the upper half particles are in butt joint with the bottom surfaces of the lower half particles, and the two short particles are connected in a heating mode.
Preferably, one of every two short particles belongs to the upper half particles, the other short particles belongs to the lower half particles, and the upper half particles and the lower half particles are connected through soldering tin to form a slender particle.
The short particles are made of wafers with the thickness of 1.5mm, and a layer of soldering tin is coated on the surfaces of the short particles after a series of plating processes; cutting into 1.1mm wide pieces, thus forming 1.5 × 1.1mm short particles;
preferably, the short particles are 1.5 x 1.1mm in size.
Preferably, the elongated particles have a size of 3.0 x 1.1 mm.
The height parts of each pair of short particles are connected to form a slender particle, the short particles are easier to cut in the process, the failure rate of the slender particle cutting is very high, and a complete current loop is formed by combining the substrate and the jig and welding a lead
To ensure the reliability of the product, the size of the particles to be cut is about 3.0 x 1.1mm, and the cutting efficiency is improved and the cost is reduced by combining short particles into long and thin particles.
Preferably, the number of the short particles is 127 pairs, and the maximum current is 2A.
Preferably, the short particles and the elongated particles are aligned in a position orientation, the upper half particles and the lower half particles are uniformly distributed on the upper ceramic substrate and the lower ceramic substrate, respectively, and the size of the thermoelectric module is 40 × 40 mm.
Preferably, the short particles and the long and thin particles are both P/N type semiconductor particles.
Therefore, the utility model has the following beneficial effects:
1. the particle cutting efficiency is improved;
2. the breakage rate of the particles can be reduced;
3, the P type is also a zone-melting material, and the material manufacturing process does not need to be changed or the material cost is not increased;
4. the refrigeration effect and the power consumption of the product are similar to those of a slender assembled product;
5. the material reject ratio of product assembly is reduced, and the increase of material cost is reduced.
Drawings
Fig. 1 is a schematic structural diagram of the present embodiment.
In the figure: 1. the ceramic substrate comprises an upper ceramic substrate 2, upper half particles 3, lower half particles 4, a lower ceramic substrate 5 and a lead.
Detailed Description
The utility model is further described with reference to the following detailed description and accompanying drawings.
Example (b):
the present embodiment provides a thermoelectric module assembled by elongated particles, as shown in fig. 1, including a substrate, a conducting wire 5 and a plurality of short particles; every two short particles form a slender particle; the substrate comprises an upper ceramic substrate 1 and a lower ceramic substrate 4 which are distributed in an up-and-down symmetrical manner, and the short particles comprise upper half particles 2 and lower half particles 3 which are distributed in a symmetrical manner;
the particles 2 of the upper half part are placed on the upper ceramic substrate 1 through a jig to form a combination body, and the particles 3 of the lower half part are placed on the lower ceramic substrate 4 through a jig to form another combination body;
the combination formed by the upper half part of particles 2 and the upper ceramic substrate 1 is covered on the combination formed by the lower half part of particles 3 and the lower ceramic substrate 4 and is fixed in a heating way; the lead 5 is bonded to the lower ceramic substrate 4 in a direction parallel to the longitudinal direction of the lower ceramic substrate 4.
The upper ceramic substrate 1 and the upper half portion particles 2 are fixed by soldering tin, and the lower ceramic substrate 4 and the lower half portion particles 3 are fixed by soldering tin.
One of every two short particles belongs to the upper half part particle 2, the other one belongs to the lower half part particle 3, and the upper half part particle 2 and the lower half part particle 3 are connected through soldering tin to form a slender particle.
Short particle size 1.5 x 1.1mm and elongated particle size 3.0 x 1.1 mm. The short particles of each pair are connected in the height direction to form a slender particle, and the middle of the short particles is fixed in a heating mode. The short particles and the long and thin particles are aligned in the position orientation, the arrangement directions of the short particles and the long and thin particles are consistent, the particles 2 in the upper half part and the particles 3 in the lower half part are respectively and uniformly distributed on the upper ceramic substrate 1 and the lower ceramic substrate 4, and the size of the thermoelectric module is 40 x 40 mm.
The number of short particles per thermoelectric module was 127 pairs with a maximum current of 2A.
The short particles and the long and thin particles are both P/N type semiconductor particles.
The planes of the particles placed on the upper ceramic substrate 1 and the lower ceramic substrate 4 are rectangular planes, the particles are uniformly arranged, 127 pairs of short particles can be prevented in a 40-40 mm area, the substrate area is greatly utilized, and the power of the product is increased.
Firstly, cutting a crystal bar into wafers with the thickness of 1.5mm, and coating a layer of soldering tin on the surface after a series of plating processes; cutting into 1.1mm wide pieces, thus forming 1.5 × 1.1mm sized particles; respectively placing two short particles on the upper and lower ceramic substrates under the same type; and then the cover is closed to heat at high temperature to form a product, so that batch of slender particles can be quickly obtained, the breakage rate of the particles is reduced by colleagues who improve the production efficiency, and the refrigeration effect and the power consumption of the thermoelectric module made into the product are not different from those of the original slender particle product.
The working principle of the utility model is as follows: the utility model firstly coats a layer of soldering tin on an upper ceramic substrate and a lower ceramic substrate formed by a sintering process through a jig, then respectively places upper half particles and lower half particles on the upper ceramic substrate and the lower ceramic substrate, the types of the particles at the same corresponding positions are the same, then fixes the particles in a process heating mode, and finally welds a lead on the lower ceramic substrate to form a complete current loop.
The above embodiments are only for further illustration of the present invention, and should not be construed as limiting the scope of the present invention, and the technical engineers in the art can make many insubstantial modifications and adaptations of the present invention based on the above disclosure and disclosure.
Claims (9)
1. A thermoelectric module of a slender particle assembly mode is characterized by comprising a substrate, a lead (5) and a plurality of short particles; every two short particles form a slender particle;
the substrate comprises an upper ceramic substrate (1) and a lower ceramic substrate (4) which are distributed in an up-and-down symmetrical manner, and the short particles comprise upper half particles (2) and lower half particles (3) which are distributed in a symmetrical manner;
the upper half part of particles (2) are placed on the upper ceramic substrate (1) through a jig to form a combination body, and the lower half part of particles (3) are placed on the lower ceramic substrate (4) through a jig to form another combination body;
the combination formed by the upper half part of particles (2) and the upper ceramic substrate (1) covers the combination formed by the lower half part of particles (3) and the lower ceramic substrate (4) and is fixed in a heating mode;
the lead (5) is welded to the lower ceramic substrate (4).
2. The thermoelectric module of claim 1, wherein the upper ceramic substrate (1) and the upper half grains (2) are fixed by solder.
3. The thermoelectric module of claim 1, wherein the lower ceramic substrate (4) and the lower particles (3) are fixed by solder.
4. The thermoelectric module in an assembly mode of elongated particles as claimed in claim 1, wherein one of every two short particles belongs to the upper half particles (2) and the other one belongs to the lower half particles (3), and one upper half particle (2) and one lower half particle (3) are connected by soldering tin to form one elongated particle.
5. An elongated particle-packed thermoelectric module according to claim 1 or 4, wherein the short particles have a size of 1.5 x 1.1 mm.
6. The thermoelectric module of claim 1 or 4, wherein the elongated particles have a size of 3.0 x 1.1 mm.
7. The thermoelectric module of claim 1, wherein the number of short particles is 127 pairs and the maximum current is 2A.
8. The thermoelectric module of claim 1, wherein the short particles and the elongated particles are aligned in a position orientation, the upper half of the particles (2) and the lower half of the particles (3) are uniformly distributed on the upper ceramic substrate (1) and the lower ceramic substrate (4), respectively, and the size of the thermoelectric module is 40 x 40 mm.
9. The thermoelectric module of claim 1, wherein the short particles and the elongated particles are P/N semiconductor particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122177234.1U CN216213540U (en) | 2021-09-09 | 2021-09-09 | Thermoelectric module of slender type granule assembled mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122177234.1U CN216213540U (en) | 2021-09-09 | 2021-09-09 | Thermoelectric module of slender type granule assembled mode |
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| Publication Number | Publication Date |
|---|---|
| CN216213540U true CN216213540U (en) | 2022-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122177234.1U Active CN216213540U (en) | 2021-09-09 | 2021-09-09 | Thermoelectric module of slender type granule assembled mode |
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| CN (1) | CN216213540U (en) |
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2021
- 2021-09-09 CN CN202122177234.1U patent/CN216213540U/en active Active
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