CN216213305U

CN216213305U - Wafer carrier and carrier frame

Info

Publication number: CN216213305U
Application number: CN202122372767.5U
Authority: CN
Inventors: 胡海东; 李伟; 焦锐
Original assignee: Kunshan Hostar Intelligence Technology Co ltd
Current assignee: Kunshan Hongshida Intelligent Technology Co ltd
Priority date: 2021-09-29
Filing date: 2021-09-29
Publication date: 2022-04-05
Anticipated expiration: 2031-09-29

Abstract

The utility model discloses a wafer carrier and a carrier frame, wherein the wafer carrier comprises a bracket and a material tray arranged on the bracket, wherein the material tray comprises a support ring and a glue film used for bearing a wafer, and the glue film is fixedly arranged on the end surface of one shaft side of the support ring; the bracket comprises a supporting plate, a through hole penetrating along the thickness direction of the supporting plate is formed in the supporting plate, the supporting plate is provided with an upper surface and a lower surface which are respectively arranged on two sides of the supporting plate, the thickness direction of the supporting plate is different, the supporting plate further comprises an annular boss protruding downwards from the lower surface of the supporting plate, a hollow cavity of the annular boss is communicated with the through hole, the supporting ring can be sleeved on the annular boss in a matched mode, and the bracket further comprises a pressing assembly used for pressing the supporting ring on the periphery of the outer side of the supporting ring along the radial direction. The wafer carrier can indirectly clamp the wafer, can ensure the position precision of the wafer, thereby realizing the control of the product quality, and simultaneously, the support ring can be axially taken down from the bracket, so the wafer carrier is convenient to replace and has higher working efficiency.

Description

Wafer carrier and carrier frame

Technical Field

The utility model relates to a wafer carrier and a carrier frame.

Background

In the production process of the micro LED, the wafer needs to be fixed on the adhesive film, but due to the structural characteristics of the wafer and the requirement of the processing technology, many problems still exist in the prior art and need to be overcome. On one hand, the size of the wafer is small, and the conventional clamp cannot directly clamp the wafer, namely the wafer cannot be directly processed; on the other hand, the loading and unloading of the wafer are complex, and the working efficiency is low.

Disclosure of Invention

It is an object of the present invention to provide a wafer carrier to solve one or more of the problems of the prior art.

In order to achieve the purpose, the utility model adopts the technical scheme that:

a wafer carrier comprises a bracket and a tray detachably mounted on the bracket, wherein the tray comprises an annular support ring and a glue film for bearing a wafer, and the glue film is fixedly arranged on the end face of one shaft side of the support ring; the bracket comprises a supporting plate, a through hole penetrating along the thickness direction of the supporting plate is formed in the supporting plate, the supporting plate is provided with an upper surface and a lower surface which are respectively arranged on two sides of the supporting plate, the lower surface of the supporting plate protrudes downwards to extend to form an annular boss, a hollow cavity of the annular boss is communicated with the through hole, the supporting ring can be sleeved on the annular boss in a matched mode, and the bracket further comprises a pressing component which is arranged on the supporting plate and is used for pressing the supporting ring along the periphery of the outer side of the supporting ring.

Preferably, the pressure holding assemblies have a plurality of groups distributed at intervals along the circumferential direction on the outer circumference of the annular boss, and each group of the pressure holding assemblies has a pressing piece which radially abuts on the outer circumference of the support ring.

Preferably, the pressing piece is cylindrical, and an outer side peripheral wall of the pressing piece can abut against the outer side peripheral wall of the support ring in a rolling fit mode.

Preferably, the pressing and holding assembly further comprises an elastic member capable of extending and contracting along the length direction of the pressing and holding assembly, and the pressing and holding assembly is sleeved on the elastic member.

Further, the wafer carrier has a first state that the tray is mounted on the bracket and a second state that the tray is detached from the bracket, when the wafer carrier is in the first state, the length direction of the elastic piece extends in an arc line which is arched outwards away from the support ring; when the wafer carrier is in the second state, the length direction of the elastic piece extends along the linear direction.

Further, the elastic member is a spring, and both end portions of the spring in the longitudinal direction are respectively fixedly provided on the support plate.

Further, the pressing and holding assembly is provided with three groups, six groups, nine groups or twelve groups which are arranged at equal intervals along the circumferential direction.

Preferably, the inner diameter of the through hole is the same as that of the annular boss, and the through hole and the annular boss are coaxially arranged therebetween.

Preferably, the supporting plate has a body provided with the annular boss, and two sets of pallets respectively arranged on two sides of the body in different width directions, the pallets extend from the left end portion or the right end portion of the body in a left-right direction away from the annular boss, and the length of the pallets is smaller than that of the body and is arranged at a distance from two end portions of the body in the length direction.

Another object of the present invention is to provide a carrier rack having the above wafer carrier.

a carrier rack comprises a box-shaped rack and a wafer carrier as described above, wherein the rack is provided with supporting grooves which can be inserted by the brackets in a relative motion manner along the length direction of the rack, and the supporting grooves are provided with a plurality of groups distributed at intervals along the height direction.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages: the wafer carrier provided by the utility model has the advantages that the wafer is loaded through the adhesive film, and the clamping of the wafer is indirectly realized; the adhesive film is fixed by the support ring, so that the position precision of the wafer is ensured, and the control on the product quality is realized; the support ring can be sleeved on the annular boss in a matching manner, so that the support ring can be prevented from deforming, and the position precision of the wafer can be further controlled; and the pressing and holding assembly can press the support ring along the radial direction, so that the support ring can be conveniently taken down from the bracket along the axial direction, and the working efficiency is improved.

Drawings

FIG. 1 is a schematic perspective view of a carrier of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is a perspective view of the bracket of FIG. 1 from another perspective;

FIG. 4 is a schematic perspective view of a wafer carrier according to the present invention;

FIG. 5 is a schematic perspective view of the wafer carrier of FIG. 4 from another perspective;

FIG. 6 is a top view of the wafer carrier of FIG. 4;

FIG. 7 is a bottom view of the wafer carrier of FIG. 4;

FIG. 8 is a side view of the wafer carrier of FIG. 4;

FIG. 9 is a schematic perspective view of a tray of the wafer carrier of the present invention;

FIG. 10 is a schematic perspective view of the tray of FIG. 9 from another perspective;

FIG. 11 is a schematic perspective view of a carrier rack according to the present invention;

FIG. 12 is a schematic perspective view of a wafer carrier assembly in a carrier rack according to the present invention;

FIG. 13 is a schematic perspective view of a carrier rack of the present invention when a wafer carrier is fully loaded;

wherein:

100. a wafer carrier; 200. a carrier frame;

1. a bracket; 1a, an upper surface; 1b, lower surface; 11. a support plate; 111. a through hole; 112. a saddle; 12. an annular boss; 13. a pressing component; 131. a pressing member; 132. an elastic member;

2. a material tray; 21. a support ring;

3. a material rack; 3a, a support plate; 31. a support groove.

Detailed Description

The technical solution of the present invention is further explained with reference to the drawings and the specific embodiments.

Referring to fig. 1 to 8, a wafer carrier includes a bracket 1 and a tray 2 detachably mounted on the bracket 1. The tray 2 comprises an annular support ring 21 and a film (not shown) for carrying a wafer (not shown), and the film is fixedly arranged on the end face of one shaft side of the support ring 21; the bracket 1 comprises a supporting plate 11, a through hole 111 penetrating through the supporting plate 11 along the thickness direction of the supporting plate 11 is formed in the supporting plate 11, the supporting plate 11 is provided with an upper surface 1a and a lower surface 1b which are respectively arranged on two sides of the supporting plate 11, the thickness direction of the supporting plate is different, the bracket 1 further comprises an annular boss 12 protruding downwards from the lower surface 1b of the supporting plate 11, a hollow cavity of the annular boss 12 is communicated with the through hole 111, in the embodiment, the inner diameter of the through hole 111 is the same as that of the annular boss 12, and the through hole 111 and the annular boss 12 are coaxially and concentrically arranged, so that a wafer can be conveniently separated from a glue film in the subsequent processing; the support ring 21 can be sleeved on the annular boss 12 in a matching manner, so that the support ring 21 can be prevented from deforming to change the position of the wafer, and the product quality is influenced; the pallet 1 further comprises a pressure holding assembly 13 provided on the pallet 11 for pressing radially against the outer circumference of the support ring 21, so that the support ring 21 can be clamped/removed in the axial direction.

Specifically, referring to fig. 1 and 2, the pressure holding assemblies 13 have a plurality of sets distributed at intervals in the circumferential direction on the outer circumferential portion of the annular boss 12, and each set of pressure holding assemblies 13 has the pressing member 131 radially abutting on the outer circumferential portion of the support ring 21. In this embodiment, the pressing components 13 have three, six, nine, or twelve groups arranged at even intervals along the circumferential direction, and in other embodiments, the number of the pressing components 13 may also be adjusted by the user according to actual needs.

The pressing member 131 is cylindrical, and an outer peripheral wall of the pressing member 131 can be pressed against an outer peripheral wall of the support ring 21 in a rolling fit manner. The pressing and holding assembly 13 further includes an elastic member 132, the elastic member 132 can be extended and contracted along the length direction thereof, and the pressing and holding member is sleeved on the elastic member 132. In this embodiment, the elastic member 132 is a spring 132, and both ends of the spring 132 in the longitudinal direction are fixedly provided on the support plate 11.

The wafer carrier 100 has a first state that the tray 2 is installed on the bracket 1 and a second state that the tray 2 is detached from the bracket 1, when the wafer carrier 100 is in the first state, the length direction of the elastic piece 132 extends in an arc line which is arched outwards away from the support ring 21; when the wafer carrier 100 is in the second state, the length direction of the elastic member 132 extends along a straight line.

The pallet 11 has a body provided with an annular boss 12, and two sets of pallets 112 respectively arranged on two sides of the body in different width directions, the pallets 112 extend from the left end or the right end of the body in the left-right direction away from the annular boss 12, and the length of the pallets 112 is smaller than the length of the body and is arranged at intervals with the two ends of the body in the length direction.

Referring to fig. 11 to 13, a carrier frame 200 includes a box-shaped rack 3 and the wafer carrier 100 as described above, the rack 3 has a supporting groove 31 into which the tray 1 is inserted in a relative motion manner along its length direction, and the supporting grooves 31 have multiple sets distributed at intervals along the height direction, so as to achieve continuous material taking and improve the working efficiency. In this embodiment, the rack 3 has two sets of supporting plates 3a respectively disposed on the left and right sides and vertically extending, the supporting grooves 31 are disposed on the inner side surfaces of the supporting plates 3a, and when the tray table 112 of the wafer carrier 100 is inserted into the supporting grooves 31, gaps are formed between the left and right outer side portions of the body of the tray 1 and the inner side walls of the supporting plates 3a, so that the wafer carrier can be taken out from the rack 3 in the subsequent process.

In this embodiment, the end opening of the support channel 31 is larger than the width of the support slot 31 to facilitate insertion of the platform 112 into the support slot 31.

In this embodiment, a user can arrange different types of wafers according to a certain rule according to processing requirements, where the wafers have three types, for convenience of understanding, the three types of wafers are respectively denoted as a wafer a, a wafer B, and a wafer C, and each group of support plates 3a is provided with nine groups of support grooves 31 arranged at intervals from top to bottom, that is, each group of racks 3 can accommodate nine groups of wafer carriers 100, and the nine groups of wafer carriers 100 are divided into three parts, i.e., each group of carriers has three groups. At this time, three kinds of wafers are respectively placed in the three sets of wafer carriers 100 of the upper part, and the order and kind of the wafers placed in the middle part and the lower part are completely the same as those of the upper part; alternatively, only the same kind of wafer is placed in the upper portion of the wafer carrier 100, and the other two kinds of wafers are placed in the middle and lower portions of the wafer carrier 100, respectively. The arrangement modes of the wafers in the two groups of material racks 3 are the same, so that the clamping assembly 414 can clamp the required wafers according to a set sequence according to the processing requirement, different stations are not required to be arranged according to the difference of the wafers, the working efficiency is higher, the stations are saved, and the production cost is reduced.

It should be noted that the number of the support slots 31 of the rack 3 is set according to the type of the wafer, in other embodiments, when the type of the wafer is changed, the user may set the number of the support slots 31 according to his own needs, and the arrangement of the wafers is not limited to the above two manners.

In summary, the wafer carrier of the present invention indirectly realizes the clamping of the wafer by the adhesive film carrying the wafer; the adhesive film is fixed by the support ring 21, so that the position precision of the wafer is ensured, and the control on the product quality is realized; the support ring 21 can be sleeved on the annular boss 12 in a matching manner, so that the support ring 21 can be prevented from being deformed, and the position precision of the wafer can be further controlled; and the pressing component 13 can press the support ring 21 along the radial direction, so that the support ring 21 can be conveniently taken down from the bracket 1 along the axial direction, and the working efficiency is improved.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A wafer carrier, comprising: the device comprises a bracket and a material tray which is detachably arranged on the bracket, wherein the material tray comprises an annular support ring and a glue film for bearing a wafer, and the glue film is fixedly arranged on the end face of one shaft side of the support ring; the bracket comprises a supporting plate, a through hole penetrating along the thickness direction of the supporting plate is formed in the supporting plate, the supporting plate is provided with an upper surface and a lower surface which are respectively arranged on two sides of the supporting plate, the lower surface of the supporting plate protrudes downwards to extend to form an annular boss, a hollow cavity of the annular boss is communicated with the through hole, the supporting ring can be sleeved on the annular boss in a matched mode, and the bracket further comprises a pressing component which is arranged on the supporting plate and is used for pressing the supporting ring along the periphery of the outer side of the supporting ring.

2. A wafer carrier as claimed in claim 1, wherein: the pressing and holding assemblies are provided with a plurality of groups which are distributed on the outer periphery of the annular boss at intervals along the circumferential direction, and each group of pressing and holding assemblies is provided with pressing pieces which radially abut against the outer periphery of the support ring.

3. A wafer carrier as claimed in claim 2, wherein: the pressing piece is cylindrical, and the outer side peripheral wall of the pressing piece can be pressed against the outer side peripheral wall of the support ring in a rolling fit mode.

4. A wafer carrier as claimed in claim 2, wherein: the pressing and holding assembly further comprises an elastic piece capable of stretching along the length direction of the pressing and holding assembly, and the pressing and holding assembly is sleeved on the elastic piece.

5. A wafer carrier as claimed in claim 4, wherein: the wafer carrier has a first state that the tray is installed on the bracket and a second state that the tray is detached from the bracket, when the wafer carrier is in the first state, the length direction of the elastic piece extends in an arc line which is arched outwards away from the support ring; when the wafer carrier is in the second state, the length direction of the elastic piece extends along the linear direction.

6. A wafer carrier as claimed in claim 4, wherein: the elastic piece is a spring, and two end parts of the spring in the length direction are respectively and fixedly arranged on the supporting plate.

7. A wafer carrier as claimed in any one of claims 2 to 6, wherein: the pressing and holding assembly is provided with three groups, six groups, nine groups or twelve groups which are uniformly arranged at intervals along the circumferential direction.

8. A wafer carrier as claimed in claim 1, wherein: the inner diameter of the through hole is the same as that of the annular boss, and the through hole and the annular boss are coaxially and concentrically arranged.

9. A wafer carrier as claimed in claim 1, wherein: the supporting plate is provided with a body provided with the annular boss and two groups of supporting platforms which are respectively arranged on two sides of the body in different width directions, the supporting platforms extend from the left end part or the right end part of the body away from the annular boss in the left-right direction, and the length of each supporting platform is smaller than that of the body and is arranged at intervals with the two end parts of the body in the length direction.

10. A carrier rack comprising a box-like rack and a wafer carrier as claimed in any one of claims 1 to 9, the rack having receiving slots into which the trays are inserted for relative movement along their length, the receiving slots having groups spaced apart in the height direction.