CN216183632U - Three-dimensional solder paste printing screen - Google Patents
Three-dimensional solder paste printing screen Download PDFInfo
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- CN216183632U CN216183632U CN202122855928.6U CN202122855928U CN216183632U CN 216183632 U CN216183632 U CN 216183632U CN 202122855928 U CN202122855928 U CN 202122855928U CN 216183632 U CN216183632 U CN 216183632U
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Abstract
The utility model provides a three-dimensional solder paste printing screen which comprises a printing screen body, wherein the printing screen body comprises a substrate and at least one boss, the boss is arranged on the substrate, a plurality of first printing through holes are arranged on the substrate at intervals, a plurality of second printing through holes are arranged on the boss at intervals, and the distance between any two adjacent second printing through holes is smaller than the distance between any two adjacent first printing through holes. The three-dimensional solder paste printing screen provided by the utility model has the advantages that the bosses are arranged, the height of the printing holes of the steel screen is increased, so that the solder paste amount of the corresponding element is ensured, meanwhile, the structure of the second printing through hole is designed, the problem of tin connection can be effectively avoided, and the problems of missing printing and less tin are avoided by arranging the structure of the first printing through hole. The three-dimensional solder paste printing screen greatly reduces the problems of short circuit and open circuit during welding, thereby ensuring good hardware connection and welding reliability.
Description
Technical Field
The utility model relates to the technical field of surface mounting, in particular to a three-dimensional solder paste printing screen.
Background
Surface Mount Technology (SMT) mainly includes: solder paste printing, precision taping, and reflow soldering, wherein the quality of solder paste printing has a great influence on the quality of surface mount products.
The application and coating process of the solder paste can be divided into two modes: one is to use a silk screen as a printing plate to print solder paste on a PCB, is suitable for mass production and application, and is the most common coating mode at present; the other is injection coating and solder paste jet printing, which is a screenless technique.
The printing screen is a mold for printing solder paste. In the SMT process, firstly, printing holes are formed in the corresponding positions of a screen according to the positions of pads on a printed circuit board, then solder paste is coated on the whole screen, then the solder paste is filled in the printing holes of the screen by using a scraper of a printing machine, then the screen is detached from the printed circuit board, so that the solder paste with fixed shape and thickness is left on the pads, then the component is attached to the printed circuit board, pins of the component are in contact with the solder paste, and then the printed circuit board is subjected to reflow soldering of the component in a reflow oven.
In the process of surface mounting by using a silk screen, aiming at a fine-pitch integrated circuit with the pad pitch less than or equal to 0.2mm, the phenomenon of tin connection paste is easy to occur on the pad of a circuit board by coating tin paste on the silk screen plate, so that the problem of short circuit is caused, and the yield of device welding is influenced.
Some silk screens have too small printing holes, which easily cause missing printing and less tin, and cause insufficient soldering and bridging, and the silk screens have low yield and poor printing quality.
The process of applying solder paste on a PCB substrate, the amount of solder applied is a key factor affecting the quality of the solder, and the amount of solder is determined by the shape and size of the opening design of the screen. The good silk screen opening design and silk screen structure can guarantee good demoulding effect, can not cause welding short circuit, open a way to guarantee good hardware connection and welding reliability.
Therefore, it is desirable to provide a three-dimensional solder paste printing screen to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a three-dimensional solder paste printing screen, which aims to solve the problems of continuous tin, missing print and less tin caused by unreasonable opening design in the existing solder paste printing screen in the prior art.
In order to solve the technical problems, the technical scheme of the utility model is as follows: the utility model provides a three-dimensional tin cream printing screen, includes the printing screen body, and the printing screen body contains base plate and at least one boss, and the boss setting has the first printing through-hole of a plurality of on the base plate, and interval arrangement has a plurality of second printing through-hole on the boss, and the interval between two arbitrary adjacent second printing through-holes is less than the interval between two arbitrary adjacent first printing through-holes, the horizontal cross-section of second printing through-hole is less than the horizontal cross-section that corresponds the device, the horizontal cross-section more than or equal to of first printing through-hole corresponds the horizontal cross-section of device.
In the three-dimensional solder paste printing screen, the distance between any two adjacent second printing through holes is less than 0.2 mm.
In the three-dimensional solder paste printing screen, the cross section of the boss is rectangular.
In the three-dimensional solder paste printing screen, the right-angle edge of the boss is parallel to or vertical to the back-and-forth movement direction of a scraper for scraping and coating solder paste.
In the three-dimensional solder paste printing screen, the cross section of the first printing through hole is in a T shape with one large end and the other small end, the small end of the first printing through hole is arranged close to the incoming direction of solder paste blade coating, and the large end of the first printing through hole is arranged close to the outgoing direction of solder paste blade coating.
In the three-dimensional solder paste printing screen, the second printing through hole is at least provided with a chamfer.
In the three-dimensional solder paste printing screen, the first printing through hole longitudinally penetrates through the substrate, and the second printing through hole longitudinally penetrates through the boss and the substrate.
In the three-dimensional solder paste printing screen, the inner walls of the first printing through holes and the inner walls of the second printing through holes are both provided with the nano coatings.
In the three-dimensional solder paste printing screen, the longitudinal section of at least one direction of the first printing through holes is trapezoidal, and the caliber of the first printing through holes is gradually increased from top to bottom.
In the three-dimensional solder paste printing screen, the upper part of the longitudinal section of at least one direction of the first printing through holes is trapezoidal, the lower part of the longitudinal section corresponding to the first printing through holes is rectangular, and the caliber of the first printing through holes is gradually increased from top to bottom.
Compared with the prior art, the utility model has the beneficial effects that: the three-dimensional solder paste printing screen provided by the utility model has the advantages that the bosses are arranged, the height of the printing holes of the steel screen is increased, so that the solder paste amount of the corresponding element is ensured, meanwhile, the structure of the second printing through hole is designed, so that the problem of tin connection can be effectively avoided, and the problems of missing printing and less tin are avoided by arranging the structure of the first printing through hole. The three-dimensional solder paste printing screen greatly reduces the problems of short circuit and open circuit during welding, thereby ensuring good hardware connection and welding reliability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments are briefly introduced below, and the drawings in the following description are only corresponding to some embodiments of the present invention.
FIG. 1 is a schematic top view of a three-dimensional solder paste printing screen according to the present invention.
FIG. 2 is a schematic side view of a three-dimensional solder paste printing screen according to the present invention.
Fig. 3 is a schematic structural diagram of a substrate and a first printing through hole of a three-dimensional solder paste printing screen according to a first embodiment of the utility model.
Fig. 4 is a schematic structural diagram of a substrate and a first printing through hole of a three-dimensional solder paste printing screen according to a second embodiment of the utility model.
FIG. 5 is a schematic top view of a boss and a second printing through hole of the three-dimensional solder paste printing screen according to the present invention.
Wherein the content of the first and second substances,
1-printing a screen body, 11-a substrate, 12-a boss, 13-a first printing through hole and 14-a second printing through hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, directional terms such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top" and "bottom" are used only with reference to the orientation of the drawings, and the directional terms are used for illustration and understanding of the present invention, and are not intended to limit the present invention.
The terms "first," "second," and the like in the terms of the utility model are used for descriptive purposes only and not for purposes of indication or implication relative importance, nor as a limitation on the order of precedence.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The tin paste printing screen in the prior art is unreasonable in structure and is easy to cause the problems of continuous tin, missing printing and little tin.
The following is a preferred embodiment of the present invention to provide a three-dimensional solder paste printing screen that can solve the above technical problems.
Referring to fig. 1 to 5, fig. 1 is a schematic top view of a three-dimensional solder paste printing screen of the present invention, fig. 2 is a schematic side view of the three-dimensional solder paste printing screen of the present invention, fig. 3 is a schematic structural view of a substrate and a first printing through hole of the three-dimensional solder paste printing screen according to a first embodiment of the present invention, fig. 4 is a schematic structural view of a substrate and a first printing through hole of the three-dimensional solder paste printing screen according to a second embodiment of the present invention, fig. 5 is a schematic structural view of a boss and a second printing through hole of the three-dimensional solder paste printing screen according to the present invention, and the arrow directions in fig. 3 and fig. 4 are the advancing direction of a squeegee.
In the drawings, elements having similar structures are denoted by the same reference numerals.
The utility model provides a three-dimensional solder paste printing screen, which comprises a printing screen body 1, wherein the printing screen body 1 comprises a substrate 11 and at least one boss 12, the boss 12 is arranged on the substrate 11, a plurality of first printing through holes 13 are arranged on the substrate 11 at intervals, a plurality of second printing through holes 14 are arranged on the boss 12 at intervals, the distance between any two adjacent second printing through holes 14 is smaller than the distance between any two adjacent first printing through holes 13, the horizontal section of each second printing through hole 14 is smaller than that of a corresponding device, and the horizontal section of each first printing through hole 13 is larger than or equal to that of the corresponding device.
In the three-dimensional solder paste printing screen, the distance between any two adjacent second printing through holes 14 is less than 0.2 mm.
It will be understood that other types of printed through holes may be provided in the base plate 11 and the boss 12, as the case may be, and are not limited thereto.
Due to the processing requirement of the circuit board, the distance between any two adjacent second printing through holes 14 is small, and in order to guarantee the safety distance between adjacent devices, the horizontal cross section of each second printing through hole is smaller than that of the corresponding device, so that the amount of solder paste corresponding to the second printing through holes 14 is possibly less, the amount of solder paste in the second printing through holes 14 is increased through the arrangement of the bosses 12, and the stability of a subsequent over-flow soldering process is guaranteed. Since there is no problem of a safety distance between adjacent devices corresponding to the first printed through hole 13, the horizontal cross section of the first printed through hole 13 may be greater than or equal to that of the corresponding device in order to ensure the stability of soldering.
Preferably, the printing screen body 1 is a steel screen, and of course, other materials can be selected to make the printing screen body 1, which is determined according to the actual situation and is not limited to this; the base plate 11 is integrally formed with the boss 12.
Generally, the number of the second printing through holes 14 arranged on the boss 12 is greater than 5, the number of the second printing through holes 14 arranged on the boss 12 is determined according to actual conditions, the second printing through holes 14 arranged on the boss 12 form a dense printing hole set, the number of the bosses 12 is determined according to actual conditions, and the bosses 12 are arranged on the basis that the bosses 12 and the movement tracks of the bosses 12 and the scraper do not interfere with each other; the apertures of the third printing through holes 12 are consistent up and down due to the small distance between the second printing through holes 12; thereby ensuring that the printing screen body 1 is smoothly released.
In the three-dimensional solder paste printing screen of the utility model, the cross section of the boss 12 is rectangular.
In the three-dimensional solder paste printing screen, the right-angle edge of the boss 12 is parallel to or vertical to the back-and-forth movement direction of a scraper for scraping and coating solder paste.
It can be understood that, because the scraper moves back and forth along a straight line, when the cross section of the boss 12 is rectangular, and the right-angle side of the boss 12 is parallel to or perpendicular to the back and forth movement direction of the scraper scraping solder paste, the utilization rate of the printing screen body 1 can be improved, if the boss 12 is placed at will, in order to avoid the interference of the scraper with the boss 12, the first printing through hole 13 is difficult to be arranged at the position of the substrate 11 close to the edge of the boss 12, thereby reducing the utilization rate of the printing screen body 1.
Further, in order to better clean the printing screen body 1 and avoid solder paste from being detained at corners of the printing screen body 1, corners of the bosses 12 are all set to be rounded corners.
In the three-dimensional solder paste printing screen, the cross section of the first printing through hole 13 is in a T shape with one large end and the other small end, the small end of the first printing through hole 13 is arranged close to the incoming direction of solder paste blade coating, and the large end of the first printing through hole 13 is arranged close to the outgoing direction of solder paste blade coating, so that the large end of the first printing through hole 13 can contain more solder paste, and the problem that the solder paste has less tin at the rear end of the first printing through hole 13 is solved.
In the three-dimensional solder paste printing screen, the second printing through holes 14 are at least provided with one chamfer, so that the distance between the adjacent second printing through holes 14 can be ensured, the possibility of forming continuous tin between the adjacent second printing through holes 14 can be reduced, and the yield is improved.
In the three-dimensional solder paste printing screen, the first printing through hole 13 longitudinally penetrates through the substrate 11, and the second printing through hole 14 longitudinally penetrates through the boss 12 and the substrate 11, and it can be understood that solder paste enters the pad through the first printing through hole 13 and the second printing through hole 14 respectively, and when the printing screen body 1 is detached, solder paste with fixed shape and thickness is left on the pad.
In the three-dimensional solder paste printing screen, the inner walls of the first printing through holes 13 and the inner walls of the second printing through holes 14 are both provided with nano coatings; generally, a nano coating is sprayed or plated on the inner walls of the first printing through holes 13 and the second printing through holes 14 by a spraying or plating method, the thickness of the nano coating is generally 100-500 nm, the nano coating not only can improve the hardness of the printing screen body 1, but also has super-hydrophobicity, so that the residues of solder paste on the first printing through holes 13 and the second printing through holes 14 can be reduced, and the demolding effect and poor printing can be greatly improved.
Referring to fig. 3, fig. 3 is a schematic structural view of a substrate and a first printing through hole of a three-dimensional solder paste printing screen according to an embodiment of the utility model.
In the first embodiment of the three-dimensional solder paste printing screen, the longitudinal section of at least one direction of the first printing through holes 13 is trapezoidal, and the caliber of the first printing through holes 13 is gradually increased from top to bottom; therefore, after the scraper finishes coating the solder paste, the printing screen body 1 can be favorably separated; the longitudinal section of the first printing through hole 13 may be a Y-direction longitudinal section, or a Z-direction longitudinal section, and when the Y-direction longitudinal section of the first printing through hole 13 is trapezoidal, the Z-direction longitudinal section of the first printing through hole 13 may be trapezoidal, and the Z-direction longitudinal section of the first printing through hole 13 may also be rectangular, or of course, other shapes may be adopted, based on the fact that the aperture of the first printing through hole 13 is small in top and large in bottom, and the printing screen body 1 is smoothly pulled out; when the Z-direction longitudinal section of the first printing through hole 13 is trapezoidal, the Y-direction longitudinal section of the first printing through hole 13 may be trapezoidal, and the Y-direction longitudinal section of the first printing through hole 13 may also be rectangular, or may be in other shapes, based on the fact that the aperture of the first printing through hole 13 is small at the top and large at the bottom, and the printing screen body 1 is smoothly pulled out.
Referring to fig. 4, fig. 4 is a schematic structural view of a substrate and a first printing through hole of a three-dimensional solder paste printing screen according to a second embodiment of the utility model.
In the second embodiment of the three-dimensional solder paste printing screen of the utility model, the upper part of the longitudinal section of at least one direction of the first printing through holes 13 is trapezoidal, the width of the upper part of the first printing through holes 13 in the corresponding direction is gradually increased from top to bottom, and the lower part of the longitudinal section of the first printing through holes 13 in the corresponding direction is rectangular; therefore, after the scraper finishes coating the solder paste, the separation of the printing screen body 1 can be facilitated, and because the lower part of the longitudinal section of the first printing through hole 13 is rectangular, the phenomenon that the solder paste is not fully filled at the bottom of the first printing through hole 13 due to the fact that the included angle is small can be avoided, the problem of open circuit is avoided, and the yield is improved; the longitudinal section of the first printing through hole 13 may be a Y-direction longitudinal section, or a Z-direction longitudinal section, and when the upper portion of the Y-direction longitudinal section of the first printing through hole 13 is trapezoidal, the Z-direction longitudinal section of the first printing through hole 13 may be trapezoidal, and the Z-direction longitudinal section of the first printing through hole 13 may also be rectangular, or of course, other shapes may be adopted, based on the fact that the aperture of the first printing through hole 13 is small at the top and large at the bottom, and the printing screen body 1 is smoothly pulled out; when the upper portion of the Z-direction longitudinal section of the first printing through hole 13 is trapezoidal, the Y-direction longitudinal section of the first printing through hole 13 may be trapezoidal, and the Y-direction longitudinal section of the first printing through hole 13 may also be rectangular, or may be in other shapes, based on the fact that the aperture of the first printing through hole 13 is small at the top and large at the bottom, and the printing screen body 1 is smoothly pulled out.
The working principle of the utility model is as follows:
coating solder paste on the front end of the substrate 11, and blade-coating the solder paste by a scraper in sequence from front to back to cover the substrate 11 with the solder paste, so that the solder paste enters the bonding pad through the first printing through hole 13;
coating solder paste on the front end of the boss 12, and blade-coating the solder paste by a scraper in sequence from front to back to cover the boss 12 with the solder paste, so that the solder paste enters the bonding pad through the second printing through hole 14;
the sequence of the scraper blade coating of the substrate 11 and the boss 12 is determined according to actual conditions, the substrate 11 may be blade coated first and then the boss 12 may be blade coated, the boss 12 may be blade coated first and then the substrate 11 may be blade coated, or blade coating may be performed simultaneously.
Thus, the working process of the three-dimensional solder paste printing screen of the preferred embodiment is completed.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. A three-dimensional solder paste printing screen is characterized by comprising: the printing screen body, the printing screen body contains base plate and at least one boss, the boss sets up on the base plate, interval arrangement has the first printing through-hole of a plurality of on the base plate, interval arrangement has a plurality of second printing through-hole on the boss, and arbitrary two are adjacent interval between the second printing through-hole is less than arbitrary two adjacent interval between the first printing through-hole, the horizontal cross-section of second printing through-hole is less than the horizontal cross-section that corresponds the device, the horizontal cross-section more than or equal to of first printing through-hole corresponds the horizontal cross-section of device.
2. The three-dimensional solder paste printing screen according to claim 1, wherein the spacing between any two adjacent second printing through holes is less than 0.2 mm.
3. The stencil of claim 1, wherein the bosses are rectangular in cross-section.
4. The stencil of claim 3, wherein the right-angled edges of the projections are parallel or perpendicular to a forward and backward movement direction of a squeegee blade that applies the solder paste.
5. The three-dimensional solder paste printing screen according to claim 1, wherein the cross section of the first printing through hole is in a T shape with one end being large and the other end being small, the small end of the first printing through hole is arranged close to the incoming direction of solder paste blade coating, and the large end of the first printing through hole is arranged close to the outgoing direction of solder paste blade coating.
6. The three-dimensional solder paste printing screen according to claim 1, wherein the second printing through holes are provided with at least one chamfer.
7. The stencil of claim 1, wherein the first printing through-hole extends longitudinally through the substrate and the second printing through-hole extends longitudinally through the projection and the substrate.
8. The three-dimensional solder paste printing screen according to claim 1, wherein the inner walls of the first printing through holes and the inner walls of the second printing through holes are provided with nano-coatings.
9. The three-dimensional solder paste printing screen according to claim 1, wherein the longitudinal section of the first printing through holes in at least one direction is trapezoidal, and the caliber of the first printing through holes is gradually increased from top to bottom.
10. The three-dimensional solder paste printing screen according to claim 1, wherein the upper portion of the longitudinal section of the first printing through holes in at least one direction is trapezoidal, the lower portion of the longitudinal section corresponding to the first printing through holes is rectangular, and the aperture of the first printing through holes is gradually increased from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122855928.6U CN216183632U (en) | 2021-11-19 | 2021-11-19 | Three-dimensional solder paste printing screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122855928.6U CN216183632U (en) | 2021-11-19 | 2021-11-19 | Three-dimensional solder paste printing screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216183632U true CN216183632U (en) | 2022-04-05 |
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ID=80911972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122855928.6U Active CN216183632U (en) | 2021-11-19 | 2021-11-19 | Three-dimensional solder paste printing screen |
Country Status (1)
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|---|---|
| CN (1) | CN216183632U (en) |
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2021
- 2021-11-19 CN CN202122855928.6U patent/CN216183632U/en active Active
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