CN216181763U - Multi-mode multilayer silicon wafer clipper - Google Patents

Abstract

The utility model discloses a multi-mode multilayer silicon wafer cutting machine which comprises a mounting frame, a first wire retracting and releasing part, a second wire retracting and releasing part, a first moving part, a second moving part, a third moving part, a first cutting part, a second cutting part, a first servo rotary table and a second servo rotary table. The multi-mode multilayer silicon wafer cutting machine provided by the utility model has the advantages that the silicon rod cutting efficiency is greatly improved, the cutting modes are various, and the disassembly and the replacement are convenient.

Description

Multi-mode multilayer silicon wafer clipper

Technical Field

The utility model relates to the field of multilayer silicon wafer cutting equipment, in particular to a multi-mode multilayer silicon wafer clipper.

Background

Single crystal silicon is typically produced by first producing polycrystalline silicon or amorphous silicon and then growing rod-shaped single crystal silicon from the melt by the Czochralski or suspension float zone method. The silicon rod grows to form a spherical shape with a smooth end and a conical shape with a sharp end. When the molten elemental silicon solidifies, the silicon atoms are arranged in a diamond lattice as many crystal nuclei, and if these crystal nuclei grow into crystal grains having the same crystal plane orientation, these crystal grains are combined in parallel to crystallize into single crystal silicon. Monocrystalline silicon is a relatively active non-metallic element, is an important component of crystal materials, and is in the front of the development of new materials. The solar photovoltaic power generation and heat supply semiconductor material is mainly used as a semiconductor material and utilizes solar photovoltaic power generation, heat supply and the like.

For semiconductor material applications, it is necessary to divide a silicon rod into blocks, cut the silicon blocks into silicon wafers, glue the relatively thin silicon wafers together, and cut the silicon wafers into small pieces for use. The existing wire mesh equipment (the upper vertical line of the lower horizontal line) has the following defects when being used for cutting:

1. the defect rate is high, because the thin silicon wafers are bonded together for cutting, because the transverse lines and the longitudinal lines have intervals, the cutting is carried out by the transverse lines at the bottom, when one or more layers of silicon wafers are cut, the upper longitudinal lines start to cut, but the bonding part of the silicon wafers in the cutting bay and the silicon wafers below is small, the cut side is easy to collapse, the cutting in the other direction cannot be carried out, and the defect rate is high;

2. the cutting variety is single, and only silicon wafers with specified sizes can be cut.

3. Meanwhile, the existing cutting part is coated with the elastic layer on one side, so that the cutting wheel is easily abraded by the diamond cutting line, and the existing cutting wheel is inconvenient to replace.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems, the utility model aims to provide a multi-mode multi-layer silicon wafer cutting machine which greatly improves the silicon rod cutting efficiency, has various cutting modes and is convenient to disassemble and replace.

According to one aspect of the utility model, a multi-mode multilayer silicon wafer cutting machine is provided, which comprises a mounting frame, a first wire retracting part, a second wire retracting part, a first moving part, a second moving part, a third moving part, a first cutting part, a second cutting part, a first servo rotary table and a second servo rotary table, wherein the first wire retracting part is arranged at one end of the mounting frame, the second wire retracting part is arranged at the other end of the mounting frame, the first moving part is horizontally arranged on the mounting frame, the first servo rotary table and the second servo rotary table are both arranged on the first moving part, the second moving part and the third moving part are arranged on the mounting frame and are vertically arranged above the first moving part, the first cutting part is arranged on the second moving part and drives the first cutting part to move towards the first moving part, the second cutting part is arranged on the third moving part and drives the second cutting part to move towards the first moving part, the first moving part drives the first servo rotary table to move to the position below the second cutting part, the first moving part drives the second servo rotary table to move to the position below the first cutting part, the first wire collecting and releasing part is connected with the first cutting part through a cutting wire, and the second wire collecting and releasing part is connected with the second cutting part through the cutting wire.

In some embodiments, the cutting machine comprises a frame, a motor, first cutting wheelset, second cutting wheelset, first transition wheelset, second transition wheelset and synchronous belt drive assembly, motor fixed mounting is in the frame front, first cutting wheelset and second cutting wheelset set up in the positive bottom of frame, first transition wheelset and second transition wheelset are positive, first transition wheelset is located the top of first cutting wheelset, second transition wheelset is located the top of second cutting wheelset, synchronous belt drive assembly sets up the back at the frame, synchronous belt drive assembly connects the output of motor and first cutting wheelset and second cutting wheelset and drives first cutting wheelset and second cutting wheelset syntropy and rotate.

In some embodiments, the first cutting wheel assembly includes a cutting wheel, a first bearing assembly, a second bearing assembly, a mandrel assembly, an elastic sheet assembly and an outer cover, the first bearing assembly and the second bearing assembly are fixed on the frame, the mandrel assembly penetrates through the cutting wheel and is arranged between the first bearing assembly and the second bearing assembly, the mandrel assembly is fixedly connected with the first bearing assembly and the second bearing assembly, the elastic sheet assembly is arranged on one side of the mandrel assembly close to the first bearing assembly, the elastic sheet assembly is arranged between the first bearing assembly and the cutting wheel and limits the position of the cutting wheel, and the outer cover is covered on the outer side of the second bearing assembly to isolate the second bearing assembly from an external space.

In some embodiments, the mandrel assembly comprises an outer shaft and an inner shaft, wherein one end of the outer shaft close to the first bearing assembly is provided with a first bevel edge, the middle of the outer shaft tightly connected with the first bevel edge is provided with a second bevel edge, the center of the outer shaft is provided with a through hole, the first bevel edge is arranged in the first bearing assembly, the second bevel edge is arranged in the cutting wheel, and the inner shaft penetrates through the first bearing assembly through fixed connection and fixes the outer shaft and the first bearing assembly into a whole.

In some embodiments, the first bearing assembly includes a first bearing seat fixedly mounted on the frame, a first bearing mounted in the first bearing seat, a first rotating shaft disposed in the first bearing and having one end extending out of the first bearing seat, and an end seal sleeved outside the first rotating shaft and mounted on the first bearing seat.

In some embodiments, the first rotating shaft has a threaded hole and a first mounting hole at the center, the first inclined edge is attached to the first mounting hole, and one end of the inner shaft is engaged with the threaded hole.

In some embodiments, the second bearing assembly includes a second bearing seat, a second bearing and a driving sleeve, the second bearing seat is fixedly connected with the frame, the second bearing is installed in the second bearing seat, one side of the second bearing seat far away from the first bearing assembly is provided with an internal thread, the outer cover is meshed with the internal thread, one side of the second bearing seat near the first bearing assembly is provided with an external thread, the driving sleeve is meshed with the external thread, and one end of the outer shaft far away from the first bearing assembly is fixed in the second bearing.

In some embodiments, the first bearing is a deep groove ball bearing.

In some embodiments, the second bearing is a cylindrical roller bearing.

In some embodiments, the second bevel edge is provided with an external thread, the elastic sheet assembly is meshed with the external thread, the elastic sheet assembly comprises a threaded sleeve, an elastic sheet and a pressing sheet, the pressing sheet is pressed on the cutting wheel, the threaded sleeve is arranged on the external thread, the elastic sheet is arranged between the threaded sleeve and the pressing sheet, and the threaded sleeve drives the elastic sheet to contract so as to press the pressing sheet to the cutting wheel.

In some embodiments, the first cutting wheel set is structurally identical to the second cutting wheel set.

In some embodiments, the synchronous belt driving assembly comprises a driving wheel, a first driven wheel, a second driven wheel, a first belt passing wheel, a second belt passing wheel, a third belt passing wheel, a fourth belt passing wheel, a fifth belt passing wheel and a synchronous belt, the driving wheel is fixed at the output end of the motor, the first driven wheel is connected with the first cutting wheel set, the second driven wheel is connected with the second cutting wheel set, the first belt passing wheel is arranged below the driving wheel, the third belt passing wheel and the second belt passing wheel are sequentially arranged vertically above the first driven wheel, and the fourth belt passing wheel and the fifth belt passing wheel are sequentially arranged vertically above the second driven wheel;

the synchronous belt sequentially passes through the driving wheel, the second belt passing wheel, the first driven wheel, the third belt passing wheel, the fourth belt passing wheel, the second driven wheel, the fifth belt passing wheel and the first belt passing wheel to form a driving loop with the driving wheel.

In some embodiments, the structure of the first cutting portion is the same as the structure of the second cutting portion.

In some embodiments, the first servo-rotary table comprises a servo-motor and a table, and an output end of the servo-motor is connected with the table and drives the table to rotate at any angle.

In some embodiments, the first servo turret has the same structure as the second servo turret.

The multi-mode multilayer silicon wafer cutting machine disclosed by the utility model can move the first servo rotary table and the second servo rotary table to be below the first cutting part or below the second cutting part for cutting by utilizing the driving of the first moving part; the first servo rotary table and the second servo rotary table can rotate by different angles, so that the silicon wafer with multiple angles and multiple sides can be cut; cutting lines with the same line distance or different line distances can be installed by utilizing the first cutting part and the second cutting part, so that various cutting shapes are realized; the synchronous driving of the motor to the first cutting wheel set and the second cutting wheel set in the same direction is realized by utilizing the motor and the synchronous belt driving assembly; the cutting wheel is driven to rotate by utilizing the first bearing assembly and the second bearing assembly; the mandrel assembly can fix the cutting wheel with the first bearing and the second bearing and can be separated from the cutting wheel quickly, so that the cutting wheel is convenient to replace; the elastic piece assembly is used for facilitating the adjustment of the position of the cutting wheel on the outer shaft; the outer shaft can be quickly disconnected from the cutting wheel by the driving sleeve without knocking.

Drawings

FIG. 1 is a schematic structural diagram of a multi-mode multi-layer silicon wafer clipper of the present invention;

FIG. 2 is a schematic structural diagram of a first cutting part of the multi-mode multi-layer silicon wafer clipper of the present invention;

FIG. 3 is a schematic structural diagram of a first cutting wheel set of the multi-mode multi-layer silicon wafer clipper of the present invention;

FIG. 4 is a schematic structural diagram of a mandrel assembly of the multi-mode multi-layer silicon wafer clipper of the present invention;

FIG. 5 is a schematic structural view of a first bearing assembly of the multi-mode multi-layer silicon wafer clipper of the present invention;

FIG. 6 is a schematic structural view of a second bearing assembly of the multi-mode multi-slice clipper of the present invention;

FIG. 7 is a schematic structural diagram of an elastic sheet assembly of the multimode multi-layer silicon wafer clipper of the present invention;

FIG. 8 is a schematic structural diagram of a synchronous belt driving assembly of the multi-mode multi-layer silicon wafer clipper of the present invention;

FIG. 9 is a schematic structural diagram of a first servo turntable of the multi-mode multi-layer silicon wafer clipper of the present invention;

FIG. 10 is a schematic view of an embodiment of a first servo turret and a second servo turret of the multi-mode multi-layer silicon wafer clipper of the present invention;

FIG. 11 is a top view of a multi-mode multi-layer silicon wafer clipper of the present invention showing a shape capable of cutting a multi-layer silicon wafer;

FIG. 12 is a schematic diagram of a completed structure of the multi-layer silicon wafer cutting in the multi-mode multi-layer silicon wafer clipper of the present invention.

Detailed Description

The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that equivalent changes or substitutions in function, method or structure according to the embodiments are included in the scope of the present invention.

In the description of the present invention, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, mechanically or electrically connected, or interconnected between two elements, directly or indirectly through intervening media, and the specific meaning of the terms may be understood by those skilled in the art according to their specific situation.

As shown in FIG. 1, the multi-mode multi-layer silicon wafer cutting machine comprises a mounting frame 1, a first wire winding and unwinding part 2, a second wire winding and unwinding part 3, a first moving part 4, a second moving part 5, a third moving part 6, a first cutting part 7, a second cutting part 8, a first servo rotary table 9 and a second servo rotary table 10, wherein the first wire winding and unwinding part 2 is arranged at one end of the mounting frame 1, the second wire winding and unwinding part 3 is arranged at the other end of the mounting frame 1, the first moving part 4 is horizontally arranged on the mounting frame 1, the first servo rotary table 9 and the second servo rotary table 10 are both arranged on the first moving part 4, the second moving part 5 and the third moving part 6 are arranged on the mounting frame 1 and are vertically arranged above the first moving part 4, the first cutting part 7 is arranged on the second moving part 5 and drives the first cutting part 7 to move towards the first moving part 4, the second cutting part 8 is arranged on the third moving part 6 and drives the second cutting part 8 to move towards the first moving part 4 The first moving part 4 drives the first servo rotary table 9 to move to the lower part of the second cutting part 8, the first moving part 4 drives the second servo rotary table 10 to move to the lower part of the first cutting part 7, the first wire winding and unwinding part 2 is connected with the first cutting part 7 through a cutting line, and the second wire winding and unwinding part 3 is connected with the second cutting part 8 through the cutting line. The first servo turntable 9 and the second servo turntable 10 can be moved to below the first cutting unit 7 or below the second cutting unit 8 by driving the first moving unit 4 to perform cutting; the first servo rotary table 9 and the second servo rotary table 10 can rotate by different angles, so that the silicon wafer with multiple angles and multiple sides can be cut; by using the first cutting part 7 and the second cutting part 8, cutting lines with the same line pitch or different line pitches can be installed, thereby realizing various cutting shapes.

The first wire housing portion 2 and the second wire housing portion 3 belong to the existing mature technology, and are often used in silicon rod cutting equipment, but it is needless to say that both the first wire housing portion 2 and the second wire housing portion 3 have the same structure.

The first moving part 4, the second moving part 5 and the third moving part 6 can adopt the transmission modes of a motor, a screw rod nut seat, a linear rail and a slide block, the response is rapid, and the moving positions are accurate, so that the silicon wafer cutting device is suitable for cutting processing of small silicon wafers.

As shown in fig. 2, the first cutting portion 7 includes a frame 71, a motor 72, a first cutting wheel set 73, a second cutting wheel set 74, a first transition wheel set 75, a second transition wheel set 76 and a synchronous belt driving assembly 77, the motor 72 is fixedly mounted on the front surface of the frame 71, the first cutting wheel set 73 and the second cutting wheel set 74 are disposed at the bottom of the front surface of the frame 71, the first transition wheel set 75 and the second transition wheel set 76 are disposed at the front surface of the frame 71, the first transition wheel set 75 is disposed above the first cutting wheel set 73, the second transition wheel set 76 is disposed above the second cutting wheel set 74, the synchronous belt 7709 driving assembly is disposed at the back surface of the frame 71, and the synchronous belt driving assembly 77 connects the output end of the motor 72 and the first cutting wheel set 73 and the second cutting wheel set 74 and drives the first cutting wheel set 73 and the second cutting wheel set 74 to rotate in the same direction. The motor 72 is used for driving the first cutting wheel set 73 and the second cutting wheel set 74 in the same direction at the same time by utilizing the motor 72 and a synchronous belt driving component 77; a plurality of cutting line groups in a single direction are formed through the first cutting wheel group 73 and the second cutting wheel group 74, so that the multilayer silicon wafer is cut off; the threading connection of the diamond cutting line is realized by the first transition wheel set 75 and the second transition wheel set 76 to receive and pay-off mechanism.

As shown in fig. 3, the first cutting wheel set 73 includes a cutting wheel 731, a first bearing assembly 732, a second bearing assembly 733, a mandrel assembly 734, a resilient sheet assembly 735, and an outer cover 736, the first bearing assembly 732 and the second bearing assembly 733 are fixed on the frame 71, the mandrel assembly 734 passes through the cutting wheel 731 and places the cutting wheel 731 between the first bearing assembly 732 and the second bearing assembly 733, the mandrel assembly 734 is fixedly connected with the first bearing assembly 732 and the second bearing assembly 733, a resilient sheet assembly is provided on the side of the mandrel assembly 734 close to the first bearing assembly 732, the resilient sheet assembly is provided between the first bearing assembly 732 and the cutting wheel 731 and defines a position of the cutting wheel 731, and the outer cover 736 is covered on the outer side of the second bearing assembly 733 to isolate the second bearing assembly 733 from an external space. The cutting wheel 731 is driven to rotate by using the first bearing assembly 732 and the second bearing assembly 733; the cutting wheel 731 can be both fixed to the first bearing 7322 and the second bearing 7332 by the mandrel assembly 734 and can be quickly detached from the cutting wheel 731, facilitating the replacement of the cutting wheel 731; the use of the resilient sheet assembly 735 facilitates adjustment of the position of the cutting wheel 731 on the outer shaft 7341; the outer shaft 7341 can be quickly disengaged from the cutting wheel 731 by driving the sleeve 7333 without tapping.

As shown in fig. 4, the spindle assembly 734 includes an outer shaft 7341 and an inner shaft 7342, the outer shaft 7341 is provided with a first inclined edge 7343 near one end of the first bearing assembly 732, the outer shaft 7341 is provided with a second inclined edge 7344 in close proximity to the first inclined edge 7343, the outer shaft 7341 is centrally provided with a through hole, the first inclined edge 7343 is disposed in the first bearing assembly 732, the second inclined edge 7344 is disposed in the cutting wheel 731, and the inner shaft passes through the first bearing assembly 732 by being fixedly connected and integrally fixing the outer shaft 7341 with the first bearing assembly 732. The first bearing 7322, the second bearing 7332, and the cutting wheel 731 are connected by the outer shaft 7341, and the outer shaft 7341 and the first rotating shaft 7323 are tightened by the fixed connection of the inner shaft and the first rotating shaft 7323.

Meanwhile, the first inclined edge 7343 is installed in the first rotating shaft 7323, the second inclined edge 7344 is connected with the cutting wheel 731, the specific first inclined edge 7343 has an included angle of 9-11 degrees and optimally 10 degrees with the central axis of the outer shaft 7341, and the specific second inclined edge 7344 has an included angle of 3-5 degrees and optimally 4 degrees with the central axis of the outer shaft 7341, so that the first rotating shaft 7323, the outer shaft 7341 and the cutting wheel 731 are coaxial during installation through the matching of the cone and the taper hole, and the installation is quicker. The end of the outer shaft 7341 is fixed within the second bearing 7332, which enables the first rotating shaft 7323, the outer shaft 7341, the inner shaft, and the cutting wheel 731 to be formed as a unit for rotation within the first bearing 7322 and the second bearing 7332.

The inner shaft is a bolt having an extended length, one end of which is defined in the through hole and the other end of which is coupled to the screw hole 7325 of the first rotating shaft 7323, and the coupling of the inner shaft to the screw hole 7325 facilitates the integration of the outer shaft 7341 with the first rotating shaft 7323.

As shown in fig. 5, the first bearing assembly 732 includes a first bearing seat 7321, a first bearing 7322, a first rotating shaft 7323, and an end seal 7324, the first bearing seat 7321 is fixedly mounted on the frame 71, the first bearing 7322 is mounted in the first bearing seat 7321, the first rotating shaft 7323 is disposed in the first bearing 7322 and has one end extending out of the first bearing seat 7321, and the end seal 7324 is sleeved outside the first rotating shaft 7323 and mounted on the first bearing seat 7321. The first bearing assembly 732 is fixed to the frame 71 by a first bearing seat 7321, and the end of the first rotating shaft 7323 away from the second bearing assembly 733 is connected to a first driven wheel 7702 for rotating the first rotating shaft 7323.

The first rotating shaft 7323 is provided at the center thereof with a screw hole 7325 and a first mounting hole 7326, the first inclined edge 7343 is fitted to the first mounting hole 7326, and one end of the inner shaft 7342 is engaged with the screw hole 7325. The first mounting hole 7326 is coaxial with the first inclined edge 7343 so as to ensure that the first rotating shaft 7323 is coaxial with the outer shaft 7341 and rotates without vibration.

The first bearing 7322 is a deep groove ball bearing. The deep groove ball bearing has small friction resistance and high rotating speed, can be used on a machine member bearing radial load or combined load acted simultaneously in the radial direction and the axial direction, and can also be used on a machine member bearing axial load.

As shown in fig. 6, the second bearing assembly 733 includes a second bearing seat 7331, a second bearing 7332, and a driving sleeve 7333, the second bearing seat 7331 is fixedly connected to the frame 71, the second bearing 7332 is installed in the second bearing seat 7331, a side of the second bearing seat 7331 away from the first bearing assembly 732 is provided with an internal thread, the outer cover 736 is engaged with the internal thread, a side of the second bearing seat 7331 close to the first bearing assembly 732 is provided with an external thread, the driving sleeve 7333 is engaged with the external thread, and an end of the outer shaft 7341 away from the first bearing assembly 732 is fixed in the second bearing 7332. The second bearing assembly 733 is fixed on the frame 71 by the second bearing seat 7331, and the extrusion cutting wheel 731 is rotated by the driving sleeve 7333 to be separated from the outer shaft 7341, so that express replacement is realized.

The second bearing 7332 is a cylindrical roller bearing. The cylindrical roller and the raceway are in line contact bearing. The load capacity is large, and the radial load is mainly born. The friction between the rolling body and the flange of the ferrule is small, and the bearing is suitable for high-speed rotation. The cylindrical roller bearing is a structure with a separable inner ring and an outer ring, so that when the cutting wheel 731 needs to be replaced, the inner ring and the outer shaft 7341 of the bearing can be directly taken out after the driving sleeve 7333 is quickly separated from the cutting wheel 731 and the outer shaft 7341, and the replacement is more rapid and convenient.

As shown in fig. 7, the second inclined edge 7344 is provided with an external thread, the elastic sheet assembly 735 is engaged with the external thread, the elastic sheet assembly 735 includes a threaded sleeve 7351, an elastic sheet 7352 and a pressing sheet 7353, the pressing sheet 7353 is pressed on the cutting wheel 731, the threaded sleeve 7351 is disposed on the external thread, the elastic sheet 7352 is disposed between the threaded sleeve 7351 and the pressing sheet 7353, and the threaded sleeve 7351 drives the elastic sheet 7352 to contract so as to press the pressing sheet 7353 against the cutting wheel 731. The position of the cutting wheel 731 is adjusted and controlled by moving the threaded sleeve 7351 over the external thread.

The cutting wheel 731 is covered with an elastic material, and the elastic material has a plurality of small grooves for placing diamond cutting lines, so that a plurality of cutting lines in the same direction are provided, and the distance between every two cutting lines is the distance of the silicon wafer to be cut. The cutting wheel 731 in the prior art is inconvenient to install and disassemble, so that the cutting wheel 731 is only replaced when the cutting wheel 731 is seriously worn and needs to be replaced, and the cutting wheel 731 with different linear distances is not replaced generally.

When the utility model is replaced, firstly, the screw sleeve 7351 is broken off by a wrench, and finally the screw sleeve 7351 is separated from the outer shaft 7341; then the end of the inner shaft exposed by the outer cover 736 is released, and the end of the inner shaft is rotated to be separated from the first rotating shaft 7323; when the driving sleeve 7333 is broken by a wrench to drive the cutting wheel 731, the cutting wheel 731 is separated from the outer shaft 7341; finally, the inner race of the second bearing 7332 and the outer shaft 7341 are withdrawn, and the cutting wheel 731 is removed. When a new line pitch of the cutting wheel 731 needs to be installed, the above steps are reversed.

The first cutting wheel set 73 has the same structure as the second cutting wheel set 74. So as to facilitate standardized production.

The first and second transition wheel sets 75 and 76 are identical in structure and similar in structure to the first cutting wheel set 73, except that the first shaft 7323 is disposed at the first bearing 7322 but does not extend out of the first bearing seat 7321, and the end seal 7324 seals the first shaft 7323 at the first bearing seat 7321. The transition wheel is convenient to replace through the structure.

As shown in fig. 8, the synchronous belt driving assembly 77 includes a driving wheel 7701, a first driven wheel 7702, a second driven wheel 7703, a first belt passing wheel 7704, a second belt passing wheel 7705, a third belt passing wheel 7706, a fourth belt passing wheel 7707, a fifth belt passing wheel 7708 and a synchronous belt 7709, the driving wheel 7701 is fixed at the output end of the motor 72, the first driven wheel 7702 is connected with the first cutting wheel set 73, the second driven wheel 7703 is connected with the second cutting wheel set 74, the first belt passing wheel 7704 is arranged below the driving wheel 7701, the third belt passing wheel 7706 and the second belt passing wheel 7705 are sequentially arranged vertically above the first driven wheel 7702, and the fourth belt passing wheel 7707 and the fifth belt passing wheel 7708 are sequentially arranged vertically above the second driven wheel 7703;

the synchronous belt 7709 sequentially passes through the driving wheel 7701, the second driven wheel 7705, the first driven wheel 7702, the third driven wheel 7706, the fourth driven wheel 7707, the second driven wheel 7703, the fifth driven wheel 7708, the first driven wheel 7704 and the driving wheel 7701 to form a driving loop. Through the arrangement, the motor 72 is used for driving the driving wheel 7701 to rotate, and the synchronous belt 7709 is further used for driving the first driven wheel 7702 and the second driven wheel 7703 to rotate in the same direction.

The first cutting portion 7 has the same structure as the second cutting portion 8. The first cutting part 7 and the second cutting part 8 which are identical in structure are convenient for standardized production, and the quality is more reliable.

As shown in fig. 9, the first servo turret 9 includes a servo motor 91 and a table 92, and an output end of the servo motor 91 is connected to the table 92 and drives the table 92 to rotate by an arbitrary angle. The servo motor 91 is arranged on the sliding block, the output end of the servo motor 91 is connected with the workbench 92, and the servo motor 91 is used for controlling the rotating angle of the workbench 92 to cut in different modes.

The first servo turret 9 has the same structure as the second servo turret 10. The first servo rotary table 9 and the second servo rotary table 10 which are identical in structure are convenient for standardized production and are more reliable in quality.

As shown in fig. 10, under the driving of the first moving part 4, the first servo-rotary table 9 moves to the lower part of the second cutting part 8 for cutting, and the second servo-rotary table 10 is in the waiting processing position; the same first moving part 4 can drive the second servo turret 10 to move under the first cutting part 7 for cutting, while the first servo turret 9 is in the waiting position for machining. When the pitches of the cutting lines provided in the first cutting unit 7 and the second cutting unit 8 are different from each other, the first servo turret 9 and the second servo turret 10 can be rotated, and thus, a myriad of cutting methods can be derived.

As shown in fig. 11, there are various embodiments of the present invention.

The first implementation mode comprises the following steps:

as shown in a, the line distance of the cutting lines on the first cutting part 7 and the second cutting part 8 is the same, the first servo rotary table 9 is positioned below the first cutting part 7, the second servo rotary table 10 is positioned below the second cutting part 8, and the first cutting part 7 and the second cutting part 8 perform cutting; and after the cutting is finished, the first servo rotary table 9 and the second servo rotary table 10 rotate 90 degrees at the same time, and the first cutting part 7 and the second cutting part 8 cut the square silicon wafer.

The second embodiment:

as shown in the drawing B, the line distances of the cutting lines on the first cutting part 7 and the second cutting part 8 are different, the first servo turntable 9 is positioned below the first cutting part 7, the second servo turntable 10 is positioned below the second cutting part 8, the first cutting part 7 and the second cutting part 8 perform cutting in sequence, then the first moving part 4 drives the first servo turntable 9 to move below the second cutting part 8 to perform cutting, and the second servo turntable 10 is in a waiting processing position; after the machining is finished, the first moving part 4 can drive the second servo rotary table 10 to move to the position below the first cutting part 7 for cutting, and the first servo rotary table 9 is in a waiting machining position for cutting the rectangular silicon wafer.

The third embodiment is as follows:

as shown in the figure C, the line distances of the cutting lines on the first cutting part 7 and the second cutting part 8 are the same, the first servo turntable 9 is positioned below the first cutting part 7, the second servo turntable 10 is positioned below the second cutting part 8, and the first cutting part 7 and the second cutting part 8 perform cutting; and after cutting, the first servo rotary table 9 and the second servo rotary table 10 rotate 45 degrees at the same time, and the first cutting part 7 and the second cutting part 8 cut the diamond-shaped silicon wafer.

The fourth embodiment:

as shown in the diagram D, the line distances of the cutting lines on the first cutting part 7 and the second cutting part 8 are different, the first servo turntable 9 is located below the first cutting part 7, the second servo turntable 10 is located below the second cutting part 8 and rotates 45 °, the first cutting part 7 and the second cutting part 8 perform cutting in sequence, then the first moving part 4 drives the first servo turntable 9 to move below the second cutting part 8, after the first servo turntable 9 rotates 45 °, the second cutting part 8 performs cutting, and the second servo turntable 10 is in the waiting position; after the processing is finished, the first moving part 4 can drive the second servo rotary table 10 to move to the position below the first cutting part 7 and rotate in the reverse direction for 45 degrees, the first cutting part 7 cuts, and the first servo rotary table 9 is in a waiting processing position to cut the parallelogram silicon wafer.

The fifth embodiment:

as shown in the figure E, the line distances of the cutting lines on the first cutting part 7 and the second cutting part 8 are the same, the first servo turntable 9 is positioned below the first cutting part 7, the second servo turntable 10 is positioned below the second cutting part 8, and the first cutting part 7 and the second cutting part 8 perform cutting; after cutting, the first servo rotary table 9 and the second servo rotary table 10 rotate 60 degrees at the same time, and the first cutting part 7 and the second cutting part 8 cut; and after the cutting, the first servo rotary table 9 and the second servo rotary table 10 rotate 60 degrees at the same time for cutting the regular hexagon silicon wafer.

Embodiment six:

the line distances of the cutting lines on the first cutting part 7 and the second cutting part 8 are different, the first servo rotary table 9 is positioned below the first cutting part 7, the second servo rotary table 10 is positioned below the second cutting part 8, and the first cutting part 7 and the second cutting part 8 perform cutting; and after the cutting is finished, the first servo rotary table 9 and the second servo rotary table 10 rotate 90 degrees at the same time, and the first cutting part 7 and the second cutting part 8 cut the square silicon wafers with different sizes.

Embodiment six:

the line distances of the cutting lines on the first cutting part 7 and the second cutting part 8 are different, the line distances of the cutting lines on the first cutting part 7 and the second cutting part 8 are the same, the first servo rotary table 9 is positioned below the first cutting part 7, the second servo rotary table 10 is positioned below the second cutting part 8, and the first cutting part 7 and the second cutting part 8 perform cutting; and after the cutting is finished, the first servo rotary table 9 and the second servo rotary table 10 rotate 45 degrees at the same time, and the first cutting part 7 and the second cutting part 8 cut the diamond-shaped silicon wafers with different sizes.

The eighth embodiment:

the line distances of the cutting lines on the first cutting part 7 and the second cutting part 8 are different, the first servo rotary table 9 is positioned below the first cutting part 7, the second servo rotary table 10 is positioned below the second cutting part 8, and the first cutting part 7 and the second cutting part 8 perform cutting; after cutting, the first servo rotary table 9 and the second servo rotary table 10 rotate 60 degrees at the same time, and the first cutting part 7 and the second cutting part 8 cut; and after the cutting, the first servo rotary table 9 and the second servo rotary table 10 rotate 60 degrees at the same time for cutting the regular hexagon silicon chips with different sizes.

The different rotation angles of the first servo rotary table 9 and the second servo rotary table 10 and the same or different line distances of the cutting lines on the first cutting part 7 and the second cutting part 8 can derive the cutting modes of countless medium silicon wafers in theory, and the processing efficiency is higher.

As shown in fig. 11, in the structural diagram of the cut multilayer silicon wafer, when the silicon wafers are not cut, the silicon wafers are overlapped and bonded by adhesive, and the thin silicon wafers are bonded and cut, since there is a space between the horizontal line and the vertical line, the cutting is performed by the horizontal line at the bottom, so that when the silicon wafer or the silicon wafers are cut, the vertical line at the upper part starts to cut, but the bonded part of the silicon wafer in the cutting bay and the silicon wafer at the lower part is small, the cut side is easily collapsed, the cutting in the other direction cannot be performed, and the defective rate is high.

Therefore, when dicing is performed, the distance between the dicing lines in the first dicing portion 7 and the second dicing portion 8 is the same, and it is necessary to dice square silicon wafers of the same size: firstly, the first cutting part 7 and the second cutting part 8 move downwards to cut 90% of the thickness of the single-layer silicon wafer; the first cutting portion 7 and the second cutting portion 8 move upward; then the first servo turntable 9 and the second servo turntable 10 rotate clockwise by 90 degrees simultaneously; the first cutting part 7 and the second cutting part 8 move downwards to cut the first layer of silicon wafer until the thickness of the second layer of silicon wafer is 90%; the first cutting portion 7 and the second cutting portion 8 move upward; then the first and second servoturrets 9, 10 are simultaneously rotated 90 ° anticlockwise; the first cutting part 7 and the second cutting part 8 move downwards to cut the second layer of silicon wafer until the thickness of the third layer of silicon wafer is 90%; reciprocating like this until all cut, effectively avoid foretell defect like this, owing to adopt servo motor 91 drive workstation 92 moreover, consequently rotation angle is accurate, and is corresponding fast moreover, and machining efficiency is also high when the yield is high.

The foregoing describes only some embodiments of the present invention and modifications and variations thereof will be apparent to those skilled in the art without departing from the spirit and scope of the utility model.

Claims (10)

1. The multi-mode multilayer silicon wafer cutting machine is characterized by comprising a mounting frame, a first wire winding and unwinding part, a second wire winding and unwinding part, a first moving part, a second moving part, a third moving part, a first cutting part, a second cutting part, a first servo rotary table and a second servo rotary table, wherein the first wire winding and unwinding part is arranged at one end of the mounting frame, the second wire winding and unwinding part is arranged at the other end of the mounting frame, the first moving part is horizontally arranged on the mounting frame, the first servo rotary table and the second servo rotary table are both arranged on the first moving part, the second moving part and the third moving part are arranged on the mounting frame and are vertically arranged above the first moving part, the first cutting part is arranged on the second moving part and drives the first cutting part to move towards the first moving part, the second cutting part is arranged on the third moving part and drives the second cutting part to move towards the first moving part, the first moving part drives the first servo rotary table to move to the position below the second cutting part, the first moving part drives the second servo rotary table to move to the position below the first cutting part, the first wire winding and unwinding part is connected with the first cutting part through a cutting wire, and the second wire winding and unwinding part is connected with the second cutting part through the cutting wire.

2. The multi-mode multi-layer silicon wafer cutting machine as claimed in claim 1, wherein the first cutting part comprises a frame, a motor, a first cutting wheel set, a second cutting wheel set, a first transition wheel set, a second transition wheel set and a synchronous belt driving assembly, the motor is fixedly installed on the front side of the frame, the first cutting wheel set and the second cutting wheel set are arranged at the bottom of the front side of the frame, the first transition wheel set and the second transition wheel set are arranged on the front side of the frame, the first transition wheel set is arranged above the first cutting wheel set, the second transition wheel set is arranged above the second cutting wheel set, the synchronous belt driving assembly is arranged on the back side of the frame, and the synchronous belt driving assembly connects the output end of the motor and the first cutting wheel set and the second cutting wheel set and drives the first cutting wheel set and the second cutting wheel set to rotate in the same direction.

3. The multi-mode multi-layer silicon wafer clipper of claim 2, wherein the first cutting wheel set comprises: the cutting machine comprises a cutting wheel, a first bearing assembly, a second bearing assembly, a mandrel assembly, an elastic sheet assembly and an outer cover, wherein the first bearing assembly and the second bearing assembly are fixed on a machine frame, the mandrel assembly penetrates through the cutting wheel and is used for arranging the cutting wheel between the first bearing assembly and the second bearing assembly, the mandrel assembly is fixedly connected with the first bearing assembly and the second bearing assembly, one side of the mandrel assembly, which is close to the first bearing assembly, is provided with an elastic sheet assembly, the elastic sheet assembly is arranged between the first bearing assembly and the cutting wheel and limits the position of the cutting wheel, and the outer cover covers the outer side of the second bearing assembly to isolate the second bearing assembly from an external space;

the mandrel assembly comprises an outer shaft and an inner shaft, wherein a first bevel edge is arranged at one end of the outer shaft close to the first bearing assembly, a second bevel edge is arranged at the middle of the outer shaft in tight connection with the first bevel edge, a through hole is formed in the center of the outer shaft, the first bevel edge is arranged in the first bearing assembly, the second bevel edge is arranged in the cutting wheel, and the inner shaft penetrates through the first bearing assembly and is fixedly connected with the outer shaft and integrally fixed with the first bearing assembly;

the first bearing assembly comprises a first bearing seat, a first bearing, a first rotating shaft and an end sealing element, the first bearing seat is fixedly installed on the rack, the first bearing is installed in the first bearing seat, the first rotating shaft is arranged in the first bearing, one end of the first rotating shaft extends out of the first bearing seat, the end sealing element is sleeved outside the first rotating shaft and installed on the first bearing seat, and the first bearing is a deep groove ball bearing;

the structure of the first cutting wheel set is the same as that of the second cutting wheel set.

4. The multi-mode multi-layer silicon wafer clipper according to claim 3, wherein the first rotating shaft is provided at a center thereof with a threaded hole and a first mounting hole, the first inclined edge is attached to the first mounting hole, and one end of the inner shaft is engaged with the threaded hole.

5. The multi-mode multi-layer silicon wafer guillotine according to claim 3, wherein the second bearing assembly comprises a second bearing seat, a second bearing and a driving sleeve, the second bearing seat is fixedly connected with the frame, the second bearing is installed in the second bearing seat, an inner thread is arranged on one side of the second bearing seat far away from the first bearing assembly, the outer cover is meshed with the inner thread, an outer thread is arranged on one side of the second bearing seat near the first bearing assembly, the driving sleeve is meshed with the outer thread, one end of the outer shaft far away from the first bearing assembly is fixed in the second bearing, and the second bearing is a cylindrical roller bearing.

6. The multi-mode multi-layer silicon wafer guillotine according to claim 3, wherein the second bevel edge is provided with an external thread, the elastic sheet assembly is engaged with the external thread, the elastic sheet assembly comprises a threaded sleeve, a spring plate and a pressing sheet, the pressing sheet presses the cutting wheel, the threaded sleeve is arranged on the external thread, the spring plate is arranged between the threaded sleeve and the pressing sheet, and the threaded sleeve drives the spring plate to contract so as to press the pressing sheet to the cutting wheel.

7. The multi-mode multi-layer silicon wafer cutting machine as claimed in claim 2, wherein the synchronous belt driving assembly comprises a driving wheel, a first driven wheel, a second driven wheel, a first belt passing wheel, a second belt passing wheel, a third belt passing wheel, a fourth belt passing wheel, a fifth belt passing wheel and a synchronous belt, the driving wheel is fixed at the output end of the motor, the first driven wheel is connected with a first cutting wheel set, the second driven wheel is connected with a second cutting wheel set, the first belt passing wheel is arranged below the driving wheel, the third belt passing wheel and the second belt passing wheel are sequentially arranged vertically above the first driven wheel, and the fourth belt passing wheel and the fifth belt passing wheel are sequentially arranged vertically above the second driven wheel;

the synchronous belt sequentially penetrates through the driving wheel, the second belt passing wheel, the first driven wheel, the third belt passing wheel, the fourth belt passing wheel, the second driven wheel, the fifth belt passing wheel and the first belt passing wheel to form a driving loop with the driving wheel.

8. The multi-mode multi-layer silicon wafer clipper as claimed in claim 2, wherein the first cutting part has the same structure as the second cutting part.

9. The multi-mode multi-layer silicon wafer guillotine according to claim 1, wherein the first servo rotary table comprises a servo motor and a worktable, and an output end of the servo motor is connected with the worktable and drives the worktable to rotate at any angle.

10. The multi-mode multi-layer silicon wafer clipper as claimed in claim 1, wherein the first servo turret has the same structure as the second servo turret.

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