CN216174413U

CN216174413U - IC suction head picking and placing mechanism for wafer sorting machine

Info

Publication number: CN216174413U
Application number: CN202122579077.7U
Authority: CN
Inventors: 季林; 卞则军
Original assignee: Suzhou Bokang Intelligent Technology Co ltd
Current assignee: Suzhou Bokang Intelligent Technology Co ltd
Priority date: 2021-10-26
Filing date: 2021-10-26
Publication date: 2022-04-05
Anticipated expiration: 2031-10-26

Abstract

The utility model discloses an IC suction head picking and placing mechanism for a wafer sorting machine, which comprises a moving part and a suction head part, wherein the moving part comprises an X-axis track and a Y-axis track connected on the X-axis track in a sliding manner, the suction head part is connected on the Y-axis track in a sliding manner, the suction head part comprises a mounting seat directly connected on the Y-axis track and an IC suction head group arranged in the mounting seat, and the IC suction head group comprises a plurality of IC suction heads and fine adjustment components configured corresponding to each IC suction head.

Description

IC suction head picking and placing mechanism for wafer sorting machine

Technical Field

The utility model relates to a wafer sorting machine assembly, in particular to an IC sucker picking and placing mechanism for a wafer sorting machine.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. In the wafer processing process, since the types and the qualities of the produced wafers are different due to external factors, the AOI test is usually performed in an automatic optical inspection machine, after the types and the qualities of the wafers are inspected, the wafers are sorted according to the differences of the types and the qualities, and the different wafers are separated.

At present, the sorting process of wafers mainly carries out sorting through manual work, sorting workers need to carefully inspect each wafer and then sort and place the wafer, the sorting efficiency is low, the labor intensity is high, the sorting cost is high, manual sorting cannot sort the substrate numbers, sorting errors are easily caused due to various subjective reasons such as carelessness of personnel operation in the sorting process, the wafers are easily scratched in the sorting process, direct scrapping or degradation treatment of the wafers can be caused, and the production quality and the product percent of pass of the wafers are directly influenced. Therefore, the development of the automatic wafer sorting machine has urgent research value and also has good economic benefit and industrial application potential.

The wafer picking and placing device adopted in the traditional wafer sorting machine is a single-shaft-arranged picking and placing suction head, a transportation rail for arranging wafers below the picking and placing suction head is arranged, the wafers do linear motion on the transportation rail, the suction head picks the wafers to a detection position when the wafers are picked below the suction head, the length of the whole action part is long, and equipment is long.

Disclosure of Invention

The purpose of the utility model is as follows: the utility model aims to provide an IC sucker picking and placing mechanism for a wafer sorting machine, aiming at the defects of the prior art.

The technical scheme is as follows: the IC sucker picking and placing mechanism for the wafer sorting machine comprises a moving part and a sucker part, wherein the moving part comprises an X-axis track and a Y-axis track connected to the X-axis track in a sliding mode, the sucker part is connected to the Y-axis track in a sliding mode, the sucker part comprises a mounting seat directly connected to the Y-axis track and an IC sucker group arranged in the mounting seat, and the IC sucker group comprises a plurality of IC suckers and fine adjustment assemblies configured corresponding to the IC suckers.

Preferably, the fine adjustment assembly comprises a driving block connected to the IC sucker, and a lifting fine adjustment assembly and a horizontal fine adjustment assembly connected to the driving block.

Preferably, the horizontal fine adjustment assembly comprises a horizontal belt driving assembly and a horizontal limiting track, the horizontal belt driving assembly is connected to a driving block, a limiting stop lever is connected to the driving block, and the horizontal limiting track is sleeved on the limiting stop lever.

Preferably, the lifting fine adjustment assembly comprises a lifting belt and a driving motor connected to the lifting belt, and the driving block is fixedly connected to the lifting belt.

Preferably, the IC tip groups are provided with four groups, and each of the four groups is composed of IC tips distributed 2 by 2.

Compared with the prior art, the utility model has the following beneficial effects: the large-span transfer action of the IC sucker picking and placing mechanism on the X axis and the Y axis can be realized, the arrangement of wafers in different trays and the positioning arrangement of wafers at other stations of the equipment can be dealt with, and the working condition adaptability of the IC sucker picking and placing mechanism is improved.

Drawings

FIG. 1 is a schematic view of an assembly structure of an IC sucker picking and placing mechanism for a wafer sorter according to the present invention;

FIG. 2 is a schematic view of a pick-up head of an IC pick-up and placing mechanism for a wafer sorter according to the present invention.

In the figure: 1. an X-axis orbit; 2. a Y-axis track; 3. a mounting seat; 4. an IC suction head group; 41. IC suction head; 42. a fine tuning component; 421. a drive block; 422. a limit stop lever; 423. a horizontal belt drive assembly; 424. a horizontal limit track; 425. a lifting belt; 426. the motor is driven.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used in the indicated orientations and positional relationships based on the drawings for convenience in describing and simplifying the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model.

In the present invention, unless otherwise specifically stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication connection; either directly or indirectly through intervening media, either internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.

The utility model provides a IC suction head pick-up and put mechanism that wafer sorting machine was used, includes motion portion and suction head portion, motion portion includes X axle track 1 and slides the Y axle track 2 of connection on X axle track 1, suction head portion slides and connects on Y axle track 2, suction head portion includes mount pad 3 and the IC suction head group 4 of setting in mount pad 3 of lug connection on Y axle track 2, IC suction head group 4 includes a plurality of IC suction head 41 and corresponds the fine setting subassembly 42 of the configuration of every IC suction head 41. In the operating state, the IC chip group 4 carries out the wafer transfer operation on the X-axis rail 1 and the Y-axis rail 2 using the mounting base 3 as a mounting base, and the fine adjustment assembly 42 finely adjusts the position of the IC chip 41. The technical scheme has the advantages that the IC sucker picking and placing mechanism can realize the long-span transfer action on the X axis and the Y axis, and can be used for dealing with the arrangement of wafers in different trays and the positioning arrangement of the wafers at other stations of the equipment, so that the working condition adaptability of the IC sucker picking and placing mechanism is improved.

Specifically, the fine adjustment assembly 42 comprises a driving block 421 connected to the IC sucker 41, and a lifting fine adjustment assembly and a horizontal fine adjustment assembly connected to the driving block 421; the horizontal fine adjustment component comprises a horizontal belt driving component 423 and a horizontal limiting track 424 which are connected to a driving block 421, the driving block 421 is connected with a limiting stop lever 422, and the horizontal limiting track 424 is sleeved on the limiting stop lever 422; the lifting fine adjustment assembly comprises a lifting belt 425 and a driving motor 426 connected to the lifting belt 425, and the driving block 421 is fixedly connected to the lifting belt 425; four groups of IC sucker groups 4 are arranged, and each IC sucker group 4 consists of 2-2 distributed IC suckers.

In an actual working scene, according to the arrangement mode of the wafers to be sorted on the tray, the driving motor 426 drives the lifting belt 425 to rotate to drive the driving block 421 to perform lifting action, meanwhile, the horizontal belt driving assembly 423 works to drive the driving block 421 to move along the horizontal limiting track 424, position fine adjustment of the IC suction head in the vertical and horizontal directions is realized, then, the IC suction head 41 adsorbs the wafers, and the IC suction head group 4 is driven by the mounting base 3 to move on the X-axis track 1 and the Y-axis track 2 to finish the transportation of the wafers.

In the present invention, unless otherwise explicitly specified or limited, the first feature "on" or "under" the second feature may be directly contacting the first feature and the second feature or indirectly contacting the first feature and the second feature through an intermediate. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lower level than the second feature. In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example.

Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a IC suction head that wafer sorting machine was used picks up a mechanism, includes motion portion and suction head portion, its characterized in that: the motion portion includes X axle track and the Y axle track of connection on X axle track that slides, the suction head slides and connects on Y axle track, the suction head includes the mount pad of lug connection on Y axle track and sets up the IC suction head group in the mount pad, IC suction head group includes a plurality of IC suction head and corresponds the fine setting subassembly of every IC suction head configuration.

2. The IC tip pick-and-place mechanism for a wafer sorter as claimed in claim 1, wherein: the fine adjustment component comprises a driving block connected to the IC sucker, and a lifting fine adjustment component and a horizontal fine adjustment component connected to the driving block.

3. The IC tip pick-and-place mechanism for a wafer sorter as claimed in claim 2, wherein: the horizontal fine adjustment assembly comprises a horizontal belt driving assembly and a horizontal limiting track, the horizontal belt driving assembly is connected to a driving block, a limiting stop lever is connected to the driving block, and the horizontal limiting track is sleeved on the limiting stop lever.

4. The IC tip pick-and-place mechanism for a wafer sorter as claimed in claim 2, wherein: the lifting fine adjustment assembly comprises a lifting belt and a driving motor connected to the lifting belt, and the driving block is fixedly connected to the lifting belt.

5. The IC tip pick-and-place mechanism for a wafer sorter as claimed in claim 1, wherein: the IC suction head group is provided with four groups, and the four groups of IC suction head groups are formed by IC suction heads distributed in 2 x 2.