CN216123392U - Power component cooling device - Google Patents

Power component cooling device Download PDF

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Publication number
CN216123392U
CN216123392U CN202122606226.4U CN202122606226U CN216123392U CN 216123392 U CN216123392 U CN 216123392U CN 202122606226 U CN202122606226 U CN 202122606226U CN 216123392 U CN216123392 U CN 216123392U
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China
Prior art keywords
cover plate
power component
fin
cooling
bottom shell
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CN202122606226.4U
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Chinese (zh)
Inventor
刘志强
钟华
文彦东
刘佳男
赵慧超
潘彦全
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FAW Group Corp
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FAW Group Corp
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Abstract

The utility model belongs to the technical field of vehicle engineering, and discloses a power component cooling device which comprises a cover plate assembly and a bottom shell assembly, wherein the cover plate assembly comprises a cover plate body, a plurality of first heat conducting parts are convexly arranged on the cover plate body at intervals, the bottom shell assembly comprises a bottom shell body, the bottom shell body is buckled with the cover plate body to define a cooling cavity, cooling liquid circularly flows in the cooling cavity, and the circularly flowing cooling liquid can be used for cooling a power component in a working state. The bottom shell body is convexly provided with a plurality of second heat conducting parts at intervals on one side facing the cover plate body, a slot is formed between every two adjacent second heat conducting parts, the first heat conducting parts and the second heat conducting parts are alternately arranged and are inserted into the slot, so that a zigzag and circuitous cooling loop is formed in the cooling cavity, a gap channel is prevented from being formed between the first heat conducting parts and the bottom shell body, the cooling cavity is prevented from being blocked and directly flowing out, the contact area with the cooling liquid is increased, and the cooling effect is improved.

Description

Power component cooling device
Technical Field
The utility model relates to the technical field of vehicle engineering, in particular to a power component cooling device.
Background
Under the influence of global energy crisis and environmental pollution, automobile electromotion gradually becomes a trend, and an electric drive system serving as a key power assembly of an electric automobile is responsible for realizing the power of the whole automobile and recovering necessary energy. The high voltage and high power operation mode of the electric drive system causes higher power loss, which causes the temperature of devices in the system to rise. The power components in an electric drive system mainly include semiconductor power devices, such as IGBT power modules, MOSFET power modules, and dc bus capacitors. These semiconductor power devices have limited operating temperatures that can cause device damage or require reduced system output power to ensure that the device does not over-temperature, which can reduce system performance. The operating temperature is a key factor affecting the normal operation and the service life of the power component, and therefore, efficient heat dissipation for the power component becomes particularly important.
The cooling method of the current power component includes indirect cooling and direct cooling. The indirect cooling is that the power component is connected with the cooler through a heat conduction material, and the inside of the cooler cools the power component through a cooling flow channel. The direct cooling is that the power component is provided with a cooling substrate, a flow channel is formed after the cooling substrate is connected with a cooler with a hollow upper part to cool the power component, and the main difference of the direct cooling and the cooling is whether the power component is partially in direct contact with cooling liquid or not.
In order to increase the heat dissipation area and enhance the cooling effect, fin pins are usually disposed in the cooling cavity of the conventional cooling device to increase the contact area with the cooling liquid, or fin pins are directly disposed on the bottom surface of the power component to allow the cooling liquid to directly flow through the bottom surface of the power component for heat dissipation and cooling. However, in this arrangement, a gap exists between the fin pins and the bottom plate of the cooling device, and a channel is formed, so that the cooling liquid directly flows along the gap channel with low resistance, and thus a good cooling effect cannot be achieved, or the cooling effect of the power component is affected due to lack of turbulent flow of the cooling liquid.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a power component cooling device to improve the cooling effect of a power component on the premise of ensuring that the process difficulty is not increased.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a power component cooling apparatus comprising:
the cover plate assembly comprises a cover plate body, wherein a plurality of first heat conducting parts are convexly arranged on the cover plate body at intervals;
the bottom shell assembly comprises a bottom shell body, the bottom shell body is buckled with the cover plate body to limit a cooling cavity, cooling liquid flows in the cooling cavity in a circulating mode, a plurality of second heat conducting parts are arranged on one side, facing the cover plate body, of the bottom shell body in a protruding mode at intervals, a slot is formed between every two adjacent second heat conducting parts, and the first heat conducting parts and the second heat conducting parts are arranged in an alternating mode and inserted into the slot.
In a preferred embodiment of the power component cooling device according to the present invention, the first heat conduction portion is a first fin pin, the first fin pins are distributed in a rectangular array on the cover body, the second heat conduction portion is a second fin pin, and the second fin pins are distributed in a rectangular array on the bottom case body.
In a preferred embodiment of the power component cooling device according to the present invention, the first fin pins have a circular, rhombic, or regular hexagonal cross section, the second fin pins have a circular, rhombic, or regular hexagonal cross section, and the first fin pins have a cross section having a shape that is the same as or different from a cross section of the second fin pins.
In a preferred embodiment of the power component cooling device according to the present invention, the first heat transfer portion is a first fin, a plurality of the first fins are arranged in a row, the second heat transfer portion is a second fin, and a plurality of the second fins are arranged in a row.
As a preferable aspect of the power component cooling device provided by the present invention, the power component cooling device further includes a fastening assembly, and the cover body is connected to the bottom case body through the fastening assembly.
As a preferable aspect of the power component cooling device provided by the present invention, the fastening assembly includes a bolt, a connecting hole is formed in the cover plate body in a penetrating manner, a first threaded hole is formed in the bottom case body, and the bolt passes through the connecting hole and is screwed into the first threaded hole.
As a preferable aspect of the power component cooling device provided in the present invention, the fastening assembly further includes a sealing ring, and the sealing ring is interposed between the cover plate body and the bottom case body.
As a preferable aspect of the power component cooling device provided by the present invention, one of the cover body and the bottom case body is provided with a protrusion, and the other of the cover body and the bottom case body is provided with a groove, and the protrusion is snapped into the groove.
As a preferable scheme of the power component cooling device provided by the present invention, step structures are provided on both the cover plate body and the bottom case body, and the cover plate body and the bottom case body are embedded through the step structures.
As a preferable aspect of the power component cooling device provided by the present invention, the cover plate body and the bottom case body are both provided with a plurality of second threaded holes, the first heat conduction portion and the second heat conduction portion are both provided with external threads, and the first heat conduction portion and the cover plate body, and the second heat conduction portion and the bottom case body are both connected by threads.
The utility model has the beneficial effects that:
the utility model provides a power component cooling device which comprises a cover plate assembly and a bottom shell assembly, wherein the cover plate assembly comprises a cover plate body, a plurality of first heat conducting parts are convexly arranged on the cover plate body at intervals, a power component is arranged on the bottom shell assembly and is in contact with the bottom shell assembly and the cover plate assembly or is in contact with the bottom shell assembly and the cover plate assembly through a heat conducting mounting piece, the bottom shell assembly comprises a bottom shell body, the bottom shell body is buckled with the cover plate body to define a cooling cavity, cooling liquid flows in the cooling cavity in a circulating mode, and the circulating cooling liquid can be used for cooling the power component in a working state. A plurality of second heat conducting parts are convexly arranged on one side, facing the cover plate body, of the bottom shell body at intervals, an inserting groove is formed between every two adjacent second heat conducting parts, and the first heat conducting parts and the second heat conducting parts are alternately arranged and inserted into the inserting grooves. Namely, when the cover plate body is buckled on the bottom shell body, the plurality of first heat conduction parts and the plurality of second heat conduction parts can be staggered, so that a zigzag and circuitous cooling loop is formed in the cooling cavity, the situation that a gap channel is formed between the first heat conduction parts and the bottom shell body to cause the coolant to be blocked and directly flow out of the cooling cavity is avoided, and the cooling effect is improved. The first heat conduction portion and the second heat conduction portion which are staggered up and down can effectively increase the contact area with the cooling liquid, the heat dissipation effect is further improved, the process is simple, the processing difficulty is small, and the quantitative production is suitable.
Drawings
Fig. 1 is a schematic structural view of a power component cooling apparatus in the prior art;
fig. 2 is a schematic structural diagram of a power component cooling apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a cover assembly and a base assembly according to an embodiment of the present invention;
FIG. 4 is a first structural schematic of a first fin pin provided in accordance with an embodiment of the present invention;
FIG. 5 is a second structural schematic of a first fin pin provided in accordance with an embodiment of the present invention;
FIG. 6 is a schematic diagram of a third configuration of a first fin needle provided in accordance with an embodiment of the present invention;
FIG. 7 is a schematic structural view of a first fin provided in accordance with an embodiment of the present invention;
fig. 8 is a side view of fig. 7.
In the figure:
1-a cover plate assembly; 2-a bottom shell assembly; 3-a cooling chamber; 4-a fastening assembly; 5-a thermally conductive mount;
11-a cover plate body; 12-a first fin needle; 13-a first fin;
21-a bottom shell body; 22-second fin needle; 23-a slot;
41-bolt; 42-a sealing ring;
100-power components;
10-cooler cover plate; 20-a cooler floor; 30-heat conducting fin pins; 40-slit passage.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
As shown in fig. 1, a cooling apparatus for a power component 100 in the prior art includes a cooler cover plate 10 and a cooler base plate 20. The cooler cover plate 10 has a plurality of heat-conducting fin pins 30 spaced apart from one side facing the cooler base plate 20, the cooler base plate 20 is a box structure having an opening, and the cooler cover plate 10 blocks the opening of the box structure. As can be seen from fig. 1, there is a gap between the lower ends of the heat-conducting fin pins 30 and the cooler bottom plate 20, so that a slit channel 40 is formed at the bottom of the cavity of the cooler bottom plate 20, and a part of the cooling liquid entering the cavity of the cooler bottom plate 20 directly flows out through the slit channel 40, so that the contact area between the part of the cooling liquid and the heat-conducting fin pins 30 is small, and a good cooling effect cannot be achieved.
In view of the above problems, as shown in fig. 2 and 3, the present embodiment provides a cooling apparatus for a power component 100, including a cover assembly 1 and a bottom case assembly 2.
In this embodiment, the cover plate assembly 1 includes a cover plate body 11, and a plurality of first heat conduction portions are protruded at intervals on the cover plate body 11. The power component 100 is mounted on the bottom case assembly 2 and is in contact with both the bottom case assembly 2 and the cover plate assembly 1, or is in contact with both through the heat conductive mount 5. The bottom shell assembly 2 comprises a bottom shell body 21, the bottom shell body 21 is buckled with the cover plate body 11 to limit the cooling cavity 3, cooling liquid circularly flows in the cooling cavity 3, and the circularly flowing cooling liquid can be used for cooling the power component 100 in a working state. A plurality of second heat conduction portions are convexly arranged on one side of the bottom shell body 21 facing the cover plate body 11 at intervals. An inserting groove 23 is formed between every two adjacent second heat conducting parts. The first heat-conducting portions and the second heat-conducting portions are alternately arranged and inserted into the insertion groove 23. That is, when the cover plate body 11 is fastened to the bottom case body 21, the plurality of first heat conduction portions and the plurality of second heat conduction portions can be staggered, so that a zigzag cooling loop is formed in the cooling cavity 3, the situation that the cooling liquid directly flows out of the cooling cavity 3 due to the fact that the gap channel 40 is formed between the first heat conduction portions and the bottom case body 21 and is blocked is avoided, and the cooling effect is improved. The first heat conduction portion and the second heat conduction portion which are staggered up and down can effectively increase the contact area with the cooling liquid, the heat dissipation effect is further improved, the process is simple, the processing difficulty is small, and the quantitative production is suitable.
In the present embodiment, optionally, referring to fig. 2 and 3, the first heat conducting portion is a first fin pin 12, and the plurality of first fin pins 12 are distributed on the cover plate body 11 in a rectangular array. The second heat conducting portion is a second fin pin 22, and the plurality of second fin pins 22 are distributed on the bottom case body 21 in a rectangular array. The first fin pins 12 and the second fin pins 22 are both strip-shaped, the first fin pins 12 extend towards the bottom case body 21, and the second fin pins 22 extend towards the cover plate body 11 and are arranged in a staggered manner with the first fin pins 12. The plurality of first fin pins 12 and the plurality of second fin pins 22 can effectively increase the contact area with the coolant, and improve the heat dissipation effect on the power component 100.
Referring to fig. 4, the first fin pins 12 may alternatively be circular in cross-section. That is, the first fin pins 12 are cylindrical, so that the manufacturing is simple, and the processing difficulty is reduced. The second fin pins 22 may have a circular cross-section or other cross-sectional shapes.
Referring to FIG. 5, in a new embodiment, the first fin pins 12 may also be diamond shaped in cross-section. The cross section of the second fin needle 22 may be a diamond shape, or may be other shapes.
Referring to fig. 6, in another novel embodiment, the cross-section of the first fin pins 12 may also be a regular hexagon. The cross section of the second fin needle 22 may be a regular hexagon, or may be other shapes.
Referring to fig. 7 and 8, the first heat conduction portion is a first fin 13, and the first fins 13 are distributed in a row. The second heat conduction part is a second fin, and the plurality of second fins are distributed in a row. That is, the first fins 13 and the second fins are both long, and the first fins 13 extend in the width direction of the cover plate body 11, and the second fins extend in the width direction of the bottom case body 21. The first fins 13 and the second fins are arranged in a staggered manner, and the first fins 13 are arranged between every two adjacent second fins.
Optionally, the cover body 11 of the cover assembly 1 and the bottom case body 21 of the bottom case assembly 2 are fixedly connected by the fastening assembly 4. Specifically, referring to fig. 2, the fastening assembly 4 includes a bolt 41, a connecting hole is formed through the cover plate body 11, and a first threaded hole is formed in the bottom case body 21. During installation, the cover plate body 11 is placed over the bottom case assembly 2, the first fins 13 and the second fins are staggered, and then the cover plate body 11 is covered on the bottom case body 21. Finally, the bolt 41 is taken out and penetrates through the connecting hole on the cover plate body 11 and is screwed into the first threaded hole, and the cover plate body 11 can be pressed on the bottom shell body 21 by screwing the bolt 41, so that the detachable connection of the cover plate assembly 1 and the bottom shell assembly 2 is realized.
Referring to fig. 2, further, the fastening assembly 4 further includes a sealing ring 42, and the sealing ring 42 is interposed between the cover body 11 and the bottom case body 21. That is, the packing 42 is filled in the gap between the cover body 11 and the bottom case body 21 to prevent the leakage of the coolant, and to ensure the sealing property after the connection of the cover body 11 and the bottom case body 21. The seal ring 42 is made of an elastic material, which may be rubber.
Of course, the cover body 11 and the bottom case body 21 may be connected by welding. For example, the cover body 11 and the bottom case body 21 are hermetically connected by friction welding, brazing, or the like.
Alternatively, one of the cover body 11 and the bottom case body 21 is provided with a protrusion, and the other of the cover body 11 and the bottom case body 21 is provided with a groove. When installation apron body 11 and drain pan body 21, go into the recess with protruding card, can improve the stability after the two is connected on the one hand, on the other hand can further improve the leakproofness, avoids the weeping.
In other embodiments, the cover plate body 11 and the bottom case body 21 may be provided with step structures, and the cover plate body 11 and the bottom case body 21 are embedded through the step structures, so that the connection stability is improved and the sealing performance between the two is improved.
Optionally, a plurality of second threaded holes are formed in both the cover plate body 11 and the bottom case body 21, external threads are formed in both the first heat conduction portion and the second heat conduction portion, and the first heat conduction portion and the cover plate body 11 and the second heat conduction portion and the bottom case body 21 are connected through threads. Specifically, in this embodiment, the bottoms of the first fin pins 12 and the second fin pins 22 may be respectively provided with an external thread, so as to achieve detachable connection between the first fin pins 12 and the cover plate body 11, and the second fin pins 22 and the bottom case body 21 are detachably connected, so that the mounting is convenient and replaceable, and the number of the first fin pins 12 and the number of the second fin pins 22 can be adaptively adjusted, so as to adjust the distance between the plurality of first fin pins 12 and the distance between the plurality of second fin pins 22, so that the heat dissipation requirements of the power component 100 are met.
In this embodiment, the cover plate assembly 1 and the bottom case assembly 2 are made of metal with high thermal conductivity such as aluminum and copper, and the sides facing each other may be processed by a processing process such as forging to form the first fin pins 12 and the second fin pins 22 for cooling, or by a processing process such as ultrasonic bonding, shoveling, welding to form the first fins 13 and the second fins for cooling.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, adaptations and substitutions will occur to those skilled in the art without departing from the scope of the utility model. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. A power component cooling apparatus, comprising:
the cover plate assembly (1) comprises a cover plate body (11), wherein a plurality of first heat conducting parts are convexly arranged on the cover plate body (11) at intervals;
the bottom shell assembly (2) comprises a bottom shell body (21), the bottom shell body (21) is buckled with the cover plate body (11) to limit a cooling cavity (3), cooling liquid flows in the cooling cavity (3) in a circulating mode, a plurality of second heat conducting parts are convexly arranged on one side, facing the cover plate body (11), of the bottom shell body (21) at intervals, a slot (23) is formed between every two adjacent second heat conducting parts, and the first heat conducting parts and the second heat conducting parts are alternately arranged and inserted into the slot (23).
2. The power component cooling device according to claim 1, wherein the first heat conduction portion is a first fin pin (12), a plurality of the first fin pins (12) are distributed in a rectangular array on the cover plate body (11), the second heat conduction portion is a second fin pin (22), and a plurality of the second fin pins (22) are distributed in a rectangular array on the bottom case body (21).
3. The power component cooling device according to claim 2, wherein the cross section of the first fin pins (12) is circular, rhombic, or regular hexagonal, the cross section of the second fin pins (22) is circular, rhombic, or regular hexagonal, and the cross sectional shape of the first fin pins (12) is the same as or different from the cross sectional shape of the second fin pins (22).
4. The power component cooling device according to claim 1, wherein the first heat transfer portion is a first fin (13), a plurality of the first fins (13) are arranged in a row, and the second heat transfer portion is a second fin, and a plurality of the second fins are arranged in a row.
5. The power component cooling device according to claim 1, further comprising a fastening assembly (4), the cover body (11) being connected with the bottom case body (21) through the fastening assembly (4).
6. The power component cooling device according to claim 5, wherein the fastening assembly (4) includes a bolt (41), a connecting hole is formed through the cover body (11), a first threaded hole is formed in the bottom case body (21), and the bolt (41) passes through the connecting hole and is screwed into the first threaded hole.
7. The power component cooling device according to claim 5, wherein the fastening assembly (4) further includes a seal ring (42), the seal ring (42) being interposed between the cover plate body (11) and the bottom case body (21).
8. Power component cooling arrangement according to any one of claims 1-7, characterized in that one of the cover body (11) and the bottom shell body (21) is provided with a protrusion, and the other of the cover body (11) and the bottom shell body (21) is provided with a recess, into which recess the protrusion snaps.
9. The power component cooling device according to any one of claims 1 to 7, wherein a stepped structure is provided on each of the cover body (11) and the bottom case body (21), and the cover body (11) and the bottom case body (21) are fitted by the stepped structure.
10. The power component cooling device according to any one of claims 1 to 7, wherein a plurality of second threaded holes are formed in each of the cover body (11) and the bottom case body (21), wherein external threads are formed in each of the first heat conduction portion and the second heat conduction portion, and wherein the first heat conduction portion and the cover body (11) and the second heat conduction portion and the bottom case body (21) are screwed together.
CN202122606226.4U 2021-10-28 2021-10-28 Power component cooling device Active CN216123392U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122606226.4U CN216123392U (en) 2021-10-28 2021-10-28 Power component cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122606226.4U CN216123392U (en) 2021-10-28 2021-10-28 Power component cooling device

Publications (1)

Publication Number Publication Date
CN216123392U true CN216123392U (en) 2022-03-22

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Application Number Title Priority Date Filing Date
CN202122606226.4U Active CN216123392U (en) 2021-10-28 2021-10-28 Power component cooling device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115275449A (en) * 2022-07-12 2022-11-01 东风汽车集团股份有限公司 Battery package and vehicle

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115275449A (en) * 2022-07-12 2022-11-01 东风汽车集团股份有限公司 Battery package and vehicle
CN115275449B (en) * 2022-07-12 2024-07-05 东风汽车集团股份有限公司 Battery pack and vehicle

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