CN216087344U - WiFi6 router that contains full coverage fin - Google Patents
WiFi6 router that contains full coverage fin Download PDFInfo
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- CN216087344U CN216087344U CN202120921139.5U CN202120921139U CN216087344U CN 216087344 U CN216087344 U CN 216087344U CN 202120921139 U CN202120921139 U CN 202120921139U CN 216087344 U CN216087344 U CN 216087344U
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Abstract
The embodiment of the utility model provides a WiFi6 router with full-coverage radiating fins, which comprises a shell, a PCB, TOP surface radiating fins and BOTTOM surface radiating fins, wherein the TOP surface radiating fins are arranged at the upper end of the PCB; the embodiment of the utility model is convenient to fully and timely utilize the radiating fins for radiating, can simultaneously improve the reliability of the product and can reduce the cost by using the aluminum plate.
Description
Technical Field
The utility model relates to the technical field of routers, in particular to a WiFi6 router with a full-coverage heat sink.
Background
Because WIFI6 router at present, high power, multichannel, the big characteristics of data throughput lead to generating heat very much, and the heat dissipation is not good, can influence the chip life-span, and a large amount of heats, if the heat dissipation is uneven, lead to bearing too much heat at certain position on the casing of product and lead to structural deformation, influence the use, harm safety even.
Summary of the utility model
In order to overcome the defects of the prior art, the utility model provides a WiFi6 router with a full-coverage heat sink to solve the technical problems of poor heat dissipation effect and high heat dissipation cost of a chip.
The technical scheme adopted by the utility model for solving the technical problems is as follows: the utility model provides a WiFi6 router that contains full coverage fin, includes shell, PCB board, TOP face fin and BOTTOM face fin, TOP face fin is installed the upper end of PCB board, BOTTOM face fin fixed mounting be in the lower extreme of PCB board, constitute sandwich overlapping's PCB board that has the heat dissipation function by PCB board TOP face fin and BOTTOM face fin is installed inside the shell.
On one hand, one side of the TOP surface radiating fin is provided with a first groove and a second groove, the other side of the TOP surface radiating fin is provided with a third groove, the first groove and the second groove are vertically arranged in parallel, the first groove and the second groove are symmetrical with the third groove around a central axis as a whole, and the first groove, the second groove and the third groove are in one-to-one corresponding contact with the chip part on the upper surface of the PCB.
In one aspect, the BOTTOM surface heat sink is mounted on the lower surface of the PCB, and the BOTTOM surface heat sink completely covers the lower surface of the PCB.
On the one hand, the TOP surface radiating fin is provided with a first circular through hole, a second circular through hole, a third circular through hole, a fourth circular through hole, a fifth circular through hole and a rectangular through hole, the first circular through hole, the second circular through hole and the third circular through hole are sequentially arranged, a first electrolytic capacitor of the PCB penetrates through the second circular through hole, a second electrolytic capacitor of the PCB penetrates through the fourth circular through hole, a pin header of the PCB penetrates through the rectangular through hole, and the first circular through hole, the third circular through hole and the fifth circular through hole are all aligned with a small through hole in the PCB.
On one hand, bolts are arranged on the inner side of the shell, and three bolts arranged on the inner side penetrate through the first circular through hole, the third circular through hole and the fifth circular through hole respectively to be connected through the bolts.
On one hand, the TOP surface radiating fin and the BOTTOM surface radiating fin are both made of aluminum plates.
On one hand, the TOP side heat sink and the BOTTOM side heat sink are both made by a stamping process.
On one hand, the lower part of the shell is provided with a mesh bottom shell with ventilation and heat dissipation functions.
The utility model has the beneficial effects that: the sandwich type full-coverage radiating fin ensures that the chip can radiate heat evenly, improves the reliability of the product and can reduce the processing cost.
Drawings
Fig. 1 is a block diagram of a WiFi6 router housing with a full coverage heat sink.
Fig. 2 is a heat sink block diagram of a WiFi6 router that includes a full coverage heat sink.
Detailed Description
The utility model is further illustrated with reference to the following figures and examples.
The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention. In addition, all the connection/connection relations referred to in the patent do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection auxiliary components according to specific implementation conditions. All technical characteristics in the utility model can be interactively combined on the premise of not conflicting with each other.
Refer to FIGS. 1 and 2
Fig. 1 and 2 provide a WiFi6 router that contains full coverage fin, including shell 11, PCB board 14, TOP face fin 12 and BOTTOM face fin 13, TOP face fin 12 installs the upper end of PCB board 14, BOTTOM face fin 13 fixed mounting in the lower extreme of PCB board 14, by PCB board 14, TOP face fin 12 and BOTTOM face fin 13 constitute sandwich overlapping PCB board 14 that has the heat dissipation function and install inside shell 11.
In the embodiment of the application, the TOP surface heat sink 12 and the BOTTOM surface heat sink 13 sandwich the PCB 14 to form a sandwich shape, so that the sandwich type full-coverage heat sink can facilitate the quick heat dissipation of the chip, and avoid the untimely heat dissipation and burning out of the PCB.
On one hand, one side of the TOP surface heat sink 12 is provided with a first groove 122 and a second groove 123, the other side of the TOP surface heat sink 12 is provided with a third groove 121, the first groove 122 and the second groove 123 are vertically juxtaposed, the first groove 122 and the second groove 123 as a whole are symmetrical to the third groove 121 about a central axis, and the first groove 122, the second groove 123 and the third groove 121 are all in one-to-one corresponding contact with the chip parts on the upper surface of the PCB board 14.
In the embodiment of the present application, one side of the TOP surface heat sink 12 is provided with a first groove 122 and a second groove 123, the other side of the TOP surface heat sink 12 is provided with a third groove 121, and the first groove 122, the second groove 123 and the third groove 121 are all in one-to-one corresponding contact with the chip portion on the upper surface of the PCB board 14, so that the grooves are in full contact with the chip, the heat sink can be fully utilized, and the heat dissipation maximization is achieved.
In one aspect, the BOTTOM surface heat sink 13 is mounted on the lower surface of the PCB board 14, and the BOTTOM surface heat sink 13 completely covers the lower surface of the PCB board 14.
On one hand, the TOP surface heat sink 12 is provided with a first circular through hole 124, a second circular through hole 125, a third circular through hole 126, a fourth circular through hole 129, a fifth circular through hole 127 and a rectangular through hole 128, the first circular through hole 124, the second circular through hole 125 and the third circular through hole 126 are sequentially arranged, the first electrolytic capacitor of the PCB 14 penetrates through the second circular through hole 125, the second electrolytic capacitor of the PCB 14 penetrates through the fourth circular through hole 129, the pin of the PCB 14 penetrates through the rectangular through hole 128, and the first circular through hole, the third circular through hole 126 and the fifth circular through hole 127 are all aligned with the small through hole on the PCB 14.
On one hand, bolts are disposed inside the housing 11, and the three bolts disposed inside penetrate through the first circular through hole 124, the third circular through hole 126, and the fifth circular through hole 127 to be connected by bolts.
On one hand, the TOP surface heat sink 12 and the BOTTOM surface heat sink 13 are made of aluminum plate, and the heat dissipation effect of the aluminum plate is the best in the metal array. And the cost of the aluminum plate is low, and the heat dissipation effect of the aluminum plate as the heat dissipation plate is optimal.
In one aspect, the TOP side fins 12 and the BOTTOM side fins 13 are both formed by a stamping process.
On one hand, the lower portion of the shell 11 is provided with a mesh bottom shell with ventilation and heat dissipation functions, and the mesh bottom shell is convenient for a large amount of heat to be dissipated to the outside, so that the router is prevented from being burnt out when the heat is not dissipated in time.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.
Claims (8)
1. The WiFi6 router with the full-coverage radiating fins is characterized by comprising a shell, a PCB, TOP surface radiating fins and BOTTOM surface radiating fins, wherein the TOP surface radiating fins are installed at the upper end of the PCB, the BOTTOM surface radiating fins are fixedly installed at the lower end of the PCB, and the PCB, the TOP surface radiating fins and the BOTTOM surface radiating fins form a sandwich-overlapped PCB with a radiating function and are installed inside the shell.
2. The WiFi6 router with full coverage heat sink as claimed in claim 1, wherein one side of the TOP side heat sink is provided with a first groove and a second groove, the other side of the TOP side heat sink is provided with a third groove, the first groove and the second groove are vertically juxtaposed, the first groove and the second groove as a whole are symmetrical with the third groove about a central axis, and the first groove, the second groove and the third groove are in one-to-one corresponding contact with the chip portion on the upper surface of the PCB board.
3. The WiFi6 router having a full coverage heat sink of claim 1, wherein the BOTTOM surface heat sink is mounted on the PCB BOTTOM surface and the BOTTOM surface heat sink fully covers the PCB BOTTOM surface.
4. The WiFi6 router with full-coverage heat sink as claimed in claim 1, wherein the TOP side heat sink has a first circular through hole, a second circular through hole, a third circular through hole, a fourth circular through hole, a fifth circular through hole and a rectangular through hole, the first circular through hole, the second circular through hole and the third circular through hole are sequentially arranged, the first electrolytic capacitor of the PCB board penetrates through the second circular through hole, the second electrolytic capacitor of the PCB board penetrates through the fourth circular through hole, the pin of the PCB board penetrates through the rectangular through hole, and the first circular through hole, the third circular through hole and the fifth circular through hole are aligned with the small through hole of the PCB board.
5. The WiFi6 router with full-coverage cooling fins according to claim 4, wherein bolts are arranged on the inner side of the housing, and the three bolts arranged on the inner side penetrate through the first circular through hole, the third circular through hole and the fifth circular through hole to be connected through the bolts.
6. The WiFi6 router with full coverage heat sink as claimed in claim 1, wherein the TOP face heat sink and the BOTTOM face heat sink are made of aluminum plate.
7. The WiFi6 router of claim 1, wherein the TOP side heat spreader and the BOTTOM side heat spreader are made by stamping process.
8. The WiFi6 router with full coverage heat sink as claimed in claim 1, wherein the bottom of the housing is a mesh bottom case with ventilation and heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120921139.5U CN216087344U (en) | 2021-04-29 | 2021-04-29 | WiFi6 router that contains full coverage fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120921139.5U CN216087344U (en) | 2021-04-29 | 2021-04-29 | WiFi6 router that contains full coverage fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216087344U true CN216087344U (en) | 2022-03-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120921139.5U Active CN216087344U (en) | 2021-04-29 | 2021-04-29 | WiFi6 router that contains full coverage fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216087344U (en) |
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2021
- 2021-04-29 CN CN202120921139.5U patent/CN216087344U/en active Active
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