CN213755476U - Liquid cooling device - Google Patents

Liquid cooling device Download PDF

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Publication number
CN213755476U
CN213755476U CN202022919300.3U CN202022919300U CN213755476U CN 213755476 U CN213755476 U CN 213755476U CN 202022919300 U CN202022919300 U CN 202022919300U CN 213755476 U CN213755476 U CN 213755476U
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CN
China
Prior art keywords
water
radiator
board
cooling
liquid cooling
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Active
Application number
CN202022919300.3U
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Chinese (zh)
Inventor
卢健文
龙军平
杨瑞国
曹太云
莫红苹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Infy Power Co ltd
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Shenzhen Infy Power Co ltd
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Priority to CN202022919300.3U priority Critical patent/CN213755476U/en
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Publication of CN213755476U publication Critical patent/CN213755476U/en
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Abstract

The utility model provides a liquid cooling device, liquid cooling device includes epitheca, inferior valve and water-cooling board, the water-cooling board set up in the cavity that epitheca and inferior valve lid closed, water-cooling board both sides limit is fixed in respectively the connecting portion of epitheca and inferior valve, the radiator is connected respectively to water-cooling board just reverse side. The radiators are arranged on the two sides of the water cooling plate, so that the heat dissipation utilization rate of the water cooling plate is improved. Compared with products with the same power, the length and the width of the power-saving device are greatly reduced, the power-saving device is placed in installation environments with limits on the length and the width, the matching performance is higher, the power density of the products is improved, and the weight of the products is reduced.

Description

Liquid cooling device
Technical Field
The utility model relates to a field of charging especially indicates a liquid cooling device.
Background
In the prior art, the liquid cooling device can generate a large amount of heat in the working process, and the heat needs to be discharged through a heat dissipation structure. The heat dissipation structure of the liquid cooling device mainly comprises a radiator and a cold water plate. At present most liquid cooling device adopts and pastes the radiator and locate cold water board one side, utilizes the unilateral of cold water board to dispel the heat, and the radiating efficiency is relatively poor, leads to the problem that liquid cooling device's power is on the low side. In order to ensure the power of the liquid cooling device, the size of the heat dissipation structure needs to be increased, which is not favorable for the miniaturization design of the liquid cooling device.
Therefore, it is necessary to improve the heat dissipation structure of the liquid cooling device.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the utility model provides a liquid cooling device, aims at solving among the prior art liquid cooling device's radiating efficiency on the low side, the great problem of volume.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a liquid cooling device, liquid cooling device includes epitheca, inferior valve and water-cooling board, the water-cooling board set up in the cavity that epitheca and inferior valve lid closed, water-cooling board both sides limit is fixed in respectively the connecting portion of epitheca and inferior valve, the radiator is connected respectively to water-cooling board just reverse side.
Furthermore, the radiator comprises a first radiator and a second radiator, the first radiator is connected with the front surface of the water cooling plate, and the second radiator is connected with the back surface of the water cooling plate.
Further, still include the PCB board, the PCB board includes first PCB board and second PCB board, first PCB board connect in first radiator, the second PCB board is connected the second radiator.
Further, still include first screw subassembly, the second PCB board is equipped with the trompil, first screw subassembly passes the trompil will the second radiator is fixed on the water-cooling board.
Further, still include second screw assembly, be equipped with the recess on the water-cooling board, second screw assembly passes through recess is with water-cooling board and first radiator fixed connection.
Furthermore, the radiator further comprises a third screw assembly, the upper shell is provided with a mounting hole, and the third screw assembly is connected with the first radiator through the mounting hole.
Further, the upper shell is provided with a groove, the lower shell is provided with a lower shell bulge matched with the upper shell groove or the upper shell is provided with a bulge, and the lower shell is provided with a lower shell groove matched with the upper shell bulge; still include fourth screw assembly, the epitheca is protruding, the inferior valve is protruding and the water-cooling board all is equipped with the mounting hole, through fourth screw assembly will the epitheca is protruding to be connected the water-cooling board or the protruding connection of inferior valve the water-cooling board.
Further, still include the panel, the panel set up in the side of cavity that epitheca and inferior valve lid closed.
The beneficial effects of the utility model reside in that: the radiators are arranged on the two sides of the water cooling plate, so that the heat dissipation utilization rate of the water cooling plate is improved. Compared with products with the same power, the length and the width of the power-saving device are greatly reduced, the power-saving device is placed in installation environments with limits on the length and the width, the matching performance is higher, the power density of the products is improved, and the weight of the products is reduced.
Drawings
The following detailed description of the specific structure of the present invention with reference to the accompanying drawings
Fig. 1 is an exploded view of the liquid cooling device of the present invention.
Fig. 2 is a schematic structural view of the liquid cooling device of the present invention.
The reference numbers are as follows:
100-liquid cooling means; 10-a housing; 1-upper shell; 2-a lower shell; 3-water cooling plate; 4-a first PCB board; 5-a first heat sink; 6-a second heat sink; 7-a second PCB board; 8-a panel; 9-a third screw assembly; 11-upper shell bulge; 12-upper shell groove; 21-inferior shell bulge; 22-lower shell groove; 31-fourth screw assembly.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
Referring to fig. 1 and 2, fig. 1 is an exploded view of a liquid cooling device according to the present invention. Fig. 2 is a schematic structural view of the liquid cooling device of the present invention. The liquid cooling device 100 comprises an upper shell 1, a lower shell 2 and a water cooling plate 3, wherein the water cooling plate 3 is arranged in a cavity covered by the upper shell 1 and the lower shell 2, two side edges of the water cooling plate 3 are respectively fixed on the connecting parts of the upper shell 1 and the lower shell 2, and the front and the back of the water cooling plate 3 are respectively connected with a radiator.
Specifically, the casing 10 includes an upper casing 1 and a lower casing 2, and the radiators are arranged on two sides of the water-cooling plate 3, so that the heat dissipation utilization rate of the water-cooling plate 3 is improved. Compared with products with the same power, the length and the width of the power-saving device are greatly reduced, the power-saving device is placed in installation environments with limits on the length and the width, the matching performance is higher, the power density of the products is improved, and the weight of the products is reduced.
Example 1
The radiator comprises a first radiator 5 and a second radiator 6, the first radiator 5 is connected with the front surface of the water-cooling plate 3, and the second radiator 6 is connected with the back surface of the water-cooling plate 3.
Specifically, the radiator is attached to the water-cooling plate 3, the first radiator 5 is fixed to the front surface of the water-cooling plate 3, the second radiator 6 is fixed to the back surface of the water-cooling plate 3, and the installation is performed in the order of front and back.
Example 2
Still include the PCB board, the PCB board includes first PCB board 4 and second PCB board 7, first PCB board 4 connect in first radiator 5, second PCB board 7 is connected second radiator 6. The water cooling plate is characterized by further comprising a first screw assembly, the second PCB 7 is provided with an opening, and the first screw assembly penetrates through the opening to fix the second radiator 6 on the water cooling plate 3. Still include second screw assembly, be equipped with the recess on the water-cooling plate 3, second screw assembly passes through the recess is with water-cooling plate 3 and first radiator 5 fixed connection. Still include third screw assembly 9, epitheca 1 is equipped with the mounting hole, third screw assembly 9 passes through the mounting hole is connected first radiator 5. Still include panel 8, panel 8 set up in the side of the cavity that epitheca 1 and inferior valve 2 lid closed.
Specifically, the PCB can be easily disassembled through simple threaded connection, and is more convenient when damaged or required to be replaced. The panel 8 is provided with a handle, so that the whole liquid cooling device is convenient to carry.
Example 3
The upper shell 1 is provided with a groove, the lower shell 2 is provided with a lower shell bulge 21 matched with the upper shell groove 12 or the upper shell is provided with a bulge, and the lower shell 2 is provided with a lower shell groove 22 matched with the upper shell bulge 11; still include fourth screw assembly 31, protruding 11 of epitheca, the protruding 21 of inferior valve and water-cooling board 3 all are equipped with the mounting hole, through fourth screw assembly 31 will protruding 11 of epitheca is connected water-cooling board 3 or protruding 21 of inferior valve is connected water-cooling board 3.
Specifically, the connecting portion is connected with the upper shell protrusion 11 through the upper shell groove 12 and the lower shell protrusion 21 or the lower shell groove 22. The upper case 1 and the lower case 2 can be fixed to the water-cooled plate 3 at the same time by making the upper case 1 and the lower case 2 zigzag in the case where the height of the water-cooled plate 3 is narrow (height <10 mm). The upper shell 1 and the lower shell 2 are attached to the side wall of the water cooling plate 3, and the upper shell 1 and the lower shell 2 also improve the heat dissipation efficiency.
To sum up, the utility model provides a liquid cooling device sets up the radiator through water-cooling board two sides, has improved the heat dissipation utilization ratio of water-cooling board. Compared with products with the same power, the length and the width of the power-saving device are greatly reduced, the power-saving device is placed in installation environments with limits on the length and the width, the matching performance is higher, the power density of the products is improved, and the weight of the products is reduced.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims (8)

1. A liquid cooling device, its characterized in that: the liquid cooling device comprises an upper shell, a lower shell and a water cooling plate, wherein the water cooling plate is arranged in a cavity formed by covering the upper shell and the lower shell, two side edges of the water cooling plate are respectively fixed on the connecting part of the upper shell and the lower shell, and the obverse side and the reverse side of the water cooling plate are respectively connected with the radiator.
2. The liquid cooling apparatus of claim 1, wherein: the radiator comprises a first radiator and a second radiator, the first radiator is connected with the front surface of the water cooling plate, and the second radiator is connected with the back surface of the water cooling plate.
3. The liquid cooling apparatus of claim 2, wherein: still include the PCB board, the PCB board includes first PCB board and second PCB board, first PCB board connect in first radiator, the second PCB board is connected the second radiator.
4. The liquid cooling apparatus of claim 3, wherein: still include first screw subassembly, the second PCB board is equipped with the trompil, first screw subassembly passes the trompil will the second radiator is fixed on the water-cooling board.
5. The liquid cooling apparatus of claim 4, wherein: still include second screw assembly, be equipped with the recess on the water-cooling board, second screw assembly passes through recess is with water-cooling board and first radiator fixed connection.
6. The liquid cooling apparatus of claim 5, wherein: still include third screw assembly, the epitheca is equipped with the mounting hole, third screw assembly passes through the mounting hole is connected first radiator.
7. The liquid cooling apparatus of claim 6, wherein: the upper shell is provided with a groove, the lower shell is provided with a lower shell bulge matched with the upper shell groove or the upper shell is provided with a bulge, and the lower shell is provided with a lower shell groove matched with the upper shell bulge; still include fourth screw assembly, the epitheca is protruding, the inferior valve is protruding and the water-cooling board all is equipped with the mounting hole, through fourth screw assembly will the epitheca is protruding to be connected the water-cooling board or the protruding connection of inferior valve the water-cooling board.
8. The liquid cooling apparatus of claim 7, wherein: still include the panel, the panel set up in the side of cavity that epitheca and inferior valve lid closed.
CN202022919300.3U 2020-12-08 2020-12-08 Liquid cooling device Active CN213755476U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022919300.3U CN213755476U (en) 2020-12-08 2020-12-08 Liquid cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022919300.3U CN213755476U (en) 2020-12-08 2020-12-08 Liquid cooling device

Publications (1)

Publication Number Publication Date
CN213755476U true CN213755476U (en) 2021-07-20

Family

ID=76834229

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022919300.3U Active CN213755476U (en) 2020-12-08 2020-12-08 Liquid cooling device

Country Status (1)

Country Link
CN (1) CN213755476U (en)

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