CN216052925U - High-heat-dissipation combined case power supply - Google Patents
High-heat-dissipation combined case power supply Download PDFInfo
- Publication number
- CN216052925U CN216052925U CN202122811138.8U CN202122811138U CN216052925U CN 216052925 U CN216052925 U CN 216052925U CN 202122811138 U CN202122811138 U CN 202122811138U CN 216052925 U CN216052925 U CN 216052925U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- shell
- heating panel
- heat
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of chassis power supply heat dissipation, in particular to a high-heat-dissipation combined chassis power supply which comprises a shell, wherein a heat dissipation plate is fixedly connected to the bottom surface of the inner wall of the shell, and a plurality of heat dissipation convex parts are fixedly connected to the top surface of the inner wall of the heat dissipation plate. The utility model has the advantages that: the circuit board passes through bolt and heating panel fixed connection, the heat-conducting layer is located between circuit board body and the heating panel, the heat of circuit board bottom surface conducts to the heating panel through the heat-conducting layer, be close to two fans of one side fixedly connected with of inlet port inner wall through the shell, a plurality of heat dissipation bellying of top surface fixedly connected with of heating panel inner wall, and then two equal circular telegrams of fan move, and then make outside air enter into to the inside of ventilation groove through a plurality of inlet ports, a plurality of heat dissipation bellying can increase the area of contact of heating panel and air simultaneously, and then make the air take away the heat of heating panel, thereby reduce the temperature of circuit board body bottom side, prevent that the inside temperature of shell from rising unusually.
Description
Technical Field
The utility model relates to the technical field of chassis power supply heat dissipation, in particular to a high-heat-dissipation combined chassis power supply.
Background
The computer power supply is a closed independent part installed in the host case, it is used to convert the alternating current into 5V, 12V, 3.3V and other different voltage, stable and reliable direct current, and supply to the system mainboard, various adapters and expansion cards, hard disk drive, CD drive and other system parts in the host case and the keyboard and mouse, the existing computer case power supply heat dissipation generally adopts the fan to drive the air circulation, takes away the heat generated by the case power supply, and it also has the following disadvantages when solving the problem of reducing the case power supply temperature:
the existing case power supply overall structure is relatively closed, the fan can only dissipate heat from the top side of the circuit board, the chip capacitors and the chip resistors are widely distributed on the circuit board, heat can be transferred to the circuit board, the fan cannot well blow air to the bottom side of the circuit board, and the heat is accumulated at the bottom of the circuit board, so that the temperature of the case power supply is increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provide a high-heat-dissipation combined type case power supply.
The purpose of the utility model is realized by the following technical scheme: the utility model provides a combined quick-witted case power of high heat dissipation, includes the shell, the bottom surface fixedly connected with heating panel of shell inner wall, a plurality of heat dissipation bellying of top surface fixedly connected with of heating panel inner wall, the synthetic ventilation groove is enclosed with the shell to the heating panel, the top surface of heating panel is provided with the heat-conducting layer, the top surface of heat-conducting layer is provided with the circuit board body, the circuit board body passes through bolt and heating panel fixed connection, a plurality of inlet ports have been seted up to one side of shell, a plurality of ventholes have been seted up to the opposite side of shell, the shell is close to two fans of one side fixedly connected with of inlet port inner wall, the top fixedly connected with upper cover of shell.
Optionally, the two fans are fixedly connected with one side, close to the inner wall of the air inlet hole, of the shell through screws, the air inlet holes are circularly distributed on one side of the shell and correspond to the two fans in position, and the two fans operate to enable outside air to enter the shell through the air inlet holes.
Optionally, the plurality of air outlets are all in a waist-round shape, the positions of the plurality of air outlets correspond to the positions of the ventilation slots respectively, and the plurality of air outlets located at the bottom of one side of the shell, which is far away from the air inlet, are communicated with the ventilation slots.
Optionally, the heating panel is close to the one end fixedly connected with guide plate of fan, the guide plate is placed with the heating panel slope, the top of guide plate is less than the top surface of circuit board body, leave the clearance between one side that the heating panel was kept away from to the guide plate and the side of two fans, the guide plate can make partly air that enters into to the shell inside be led to the inside of draft slot, is convenient for make the volume air that flows take away the heat of heating panel inside.
Optionally, the heat dissipation protruding parts are linearly arranged and distributed on the top surface of the inner wall of the heat dissipation plate, gaps are reserved between the bottom surfaces of the heat dissipation protruding parts and the bottom surface of the inner wall of the shell, the contact area between the heat dissipation plate and the outside air can be correspondingly increased, and therefore the heat exchange rate between the heat dissipation plate and the outside air is convenient to improve.
The utility model has the following advantages:
1. this combined quick-witted case power of high heat dissipation, the circuit board passes through bolt and heating panel fixed connection, the heat-conducting layer is located between circuit board body and the heating panel, and then the heat of circuit board bottom surface passes through the heat-conducting layer and conducts to the heating panel, be close to two fans of one side fixedly connected with of inlet port inner wall through the shell, a plurality of heat dissipation bellying of top surface fixedly connected with of heating panel inner wall, and then two equal circular telegram operation of fan, and then make outside air enter into to the inside of ventilation groove through a plurality of inlet ports, a plurality of heat dissipation bellying can increase the area of contact of heating panel and air simultaneously, and then can make the air take away the heat of heating panel, thereby reduce the temperature of circuit board body bottom side, prevent that the inside temperature of shell from rising unusually.
2. This combined quick-witted case power of high heat dissipation, the one end fixedly connected with guide plate that is close to the fan through the heating panel, and leave the clearance between one side that the heating panel was kept away from to the guide plate and the side of two fans, and then prevent to take place the contact between guide plate and two fans, convenient to use person carries out the installation of earlier stage and the dismantlement clearance in later stage to two fans, guide plate and heating panel slope are placed simultaneously, and then the guide plate can carry out the water conservancy diversion with the air current that two fans drove, thereby be convenient for realize increasing the tolerance that gets into the ventilation groove, be convenient for reduce the temperature of circuit board body bottom.
Drawings
FIG. 1 is a schematic view of the internal cutaway structure of the present invention;
FIG. 2 is a schematic view of a first perspective structure of the present invention;
FIG. 3 is a schematic view of a second viewing angle configuration according to the present invention;
FIG. 4 is a schematic view of a third viewing angle structure according to the present invention;
fig. 5 is a schematic view of the heat dissipation plate structure of the present invention.
In the figure: the heat dissipation structure comprises a shell 1, an air outlet 2, an upper cover 3, a fan 4, a flow guide plate 5, a circuit board body 6, a heat conduction layer 7, a heat dissipation plate 8, an air inlet 9, a ventilation groove 10 and a heat dissipation bulge 11.
Detailed Description
The utility model will be further described with reference to the accompanying drawings, but the scope of the utility model is not limited to the following.
As shown in fig. 1 to 5, a high heat dissipation combined type case power supply comprises a housing 1, a heat dissipation plate 8 is fixedly connected to the bottom surface of the inner wall of the housing 1, a plurality of heat dissipation protrusions 11 are fixedly connected to the top surface of the inner wall of the heat dissipation plate 8, the heat dissipation plate 8 and the housing 1 enclose a synthetic ventilation slot 10, a heat conduction layer 7 is arranged on the top surface of the heat dissipation plate 8, a circuit board body 6 is arranged on the top surface of the heat conduction layer 7, the circuit board body 6 is fixedly connected with the heat dissipation plate 8 through bolts, a plurality of air inlets 9 are formed in one side of the housing 1, a plurality of air outlets 2 are formed in the other side of the housing 1, two fans 4 are fixedly connected to one side of the housing 1 close to the inner wall of the air inlets 9, and an upper cover 3 is fixedly connected to the top end of the housing 1.
As an optional technical scheme of the utility model: two fans 4 all are close to one side fixed connection of inlet port 9 inner wall through screw and shell 1, and a plurality of inlet ports 9 are circular distribution in one side of shell 1, and a plurality of inlet ports divide into two parts in one side of shell 1, and two parts all present circular distribution, and then can be convenient for corresponding with two fans 4's position, and two fans 4 operate, make outside air enter into to shell 1's inside through a plurality of inlet ports 9.
As an optional technical scheme of the utility model: the appearance of a plurality of ventholes 2 is the waist circular, and the position of a plurality of ventholes 2 is corresponding with the position of ventilation groove 10 respectively, and a plurality of ventholes 2 that are located the shell and keep away from inlet port 9 one side bottom all are linked together with ventilation groove 10, and then can be convenient for make the air that is located ventilation groove 10 inside and circuit board body 6 top can be through a plurality of ventholes 2 discharge shell 1 to be convenient for make the air take away the produced heat of circuit board body 6.
As an optional technical scheme of the utility model: one end fixedly connected with guide plate 5 that heating panel 8 is close to fan 4, guide plate 5 and heating panel 8 slope are placed, the top of guide plate 5 is less than the top surface of circuit board body 6, leave the clearance between one side that heating panel 8 was kept away from to guide plate 5 and two fan 4's the side, guide plate 5 can make partly air that gets into to shell 1 inside be drained to the inside of draft slot 10, be convenient for make the volume air that flows take away the inside heat of heating panel 8, and heat-conducting silicone grease can be chooseed for use to heat-conducting layer 7, not only can carry out heat conduction, and self has better electric insulation performance, thereby be convenient for prevent that 6 bottoms of circuit board body and heating panel 7 from producing the discharge phenomenon.
As an optional technical scheme of the utility model: a plurality of heat dissipation bellying 11 are in the top surface linear arrangement distribution of 8 inner walls of heating panel, leave the clearance between the bottom surface of a plurality of heat dissipation bellying 11 all and the bottom surface of 1 inner wall of shell, and a plurality of bellying 11 can be designed for the bandlet, can be corresponding increase heating panel 8 and the area of contact between the outside air like this to be convenient for improve the heat exchange rate between heating panel 8 and the outside air, be convenient for make the air that flows take away the heat of heat dissipation panel 8.
The utility model discloses a need following step during the use:
1) when the temperature is reduced, the two fans 4 are electrified to operate, so that air outside the shell 1 enters the shell 1 through the plurality of air inlet holes;
2) the flow guide plate 5 guides part of air entering the shell 1 to enter the ventilation groove 10, and the rest air flows through the top surface of the circuit board body 6;
3) the plurality of radiating convex parts 11 are linearly distributed on the top surface of the inner wall of the radiating plate 8, so that the contact area of the radiating plate 8 and the air can be increased, the heat exchange rate between the radiating plate 8 and the air is increased, and the heat conducted from the bottom end of the circuit board body 6 is more quickly reduced;
4) meanwhile, the air flowing through the top of the circuit board body 6 can take away the heat generated by the electronic components on the top surface of the circuit board body 6, so that the air can synchronously convey the heat on the top surface and the bottom surface of the circuit board body 6, the temperature inside the shell 1 is reduced, and the case power supply can work normally.
To sum up, when a user uses the heat dissipation device, the circuit board 6 is fixedly connected with the heat dissipation plate 8 through bolts, the heat conduction layer 7 is positioned between the circuit board body 6 and the heat dissipation plate 8, further, the heat on the bottom surface of the circuit board 6 is conducted to the heat dissipation plate 8 through the heat conduction layer 7, two fans 4 are fixedly connected with one side of the shell 1 close to the inner wall of the air inlet hole 9, the top surface of the inner wall of the heat dissipation plate 8 is fixedly connected with a plurality of heat dissipation protrusions 11, further, the two fans 4 are electrified to operate, further, the outside air enters the inside of the ventilation groove 10 through the plurality of air inlet holes 9, meanwhile, the contact area between the heat dissipation plate 8 and the air can be increased through the plurality of heat dissipation protrusions 11, further, the air can carry away the heat of the heat dissipation plate 8, thereby reducing the temperature on the bottom side of the circuit board body 6, preventing the abnormal temperature rise in the shell 1, and then, the end of the heat dissipation plate 8 close to the fan 4 is fixedly connected with the flow guide plate 5, and the guide plate 5 keeps away from and leaves the clearance between one side of heating panel 8 and the side of two fans 4, and then prevent to take place the contact between guide plate 5 and two fans 4, convenient to use person carries out the installation of earlier stage and the dismantlement clearance in later stage to two fans 4, guide plate 5 and heating panel 8 slope are placed simultaneously, and then guide plate 5 can carry out the water conservancy diversion with the air current that two fans 4 drove, thereby be convenient for realize increasing the tolerance that gets into ventilation groove 10, be convenient for reduce the temperature of 6 bottoms of circuit board body.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a combined quick-witted case power of high heat dissipation which characterized in that: including shell (1), the bottom surface fixedly connected with heating panel (8) of shell (1) inner wall, a plurality of heat dissipation bellying (11) of top surface fixedly connected with of heating panel (8) inner wall, synthetic ventilation groove (10) are enclosed with shell (1) in heating panel (8), the top surface of heating panel (8) is provided with heat-conducting layer (7), the top surface of heat-conducting layer (7) is provided with circuit board body (6), circuit board body (6) are through bolt and heating panel (8) fixed connection, a plurality of inlet ports (9) have been seted up to one side of shell (1), a plurality of ventholes (2) have been seted up to the opposite side of shell (1), two fans (4) of one side fixedly connected with of shell (1) inner wall are close to inlet port (9), the top fixedly connected with upper cover (3) of shell (1).
2. The combined high heat dissipation case power supply of claim 1, wherein: the two fans (4) are fixedly connected with one side, close to the inner wall of the air inlet hole (9), of the shell (1) through screws, and the air inlet holes (9) are distributed in a circular shape on one side of the shell (1).
3. The combined high heat dissipation case power supply of claim 1, wherein: the air outlet holes (2) are all in a waist-round shape, and the positions of the air outlet holes (2) correspond to the positions of the ventilation grooves (10).
4. The combined high heat dissipation case power supply of claim 1, wherein: one end fixedly connected with guide plate (5) that heating panel (8) are close to fan (4), guide plate (5) and heating panel (8) slope are placed, the top of guide plate (5) is less than the top surface of circuit board body (6), leave the clearance between one side that heating panel (8) were kept away from in guide plate (5) and the side of two fan (4).
5. The combined high heat dissipation case power supply of claim 1, wherein: the heat dissipation convex parts (11) are linearly arranged and distributed on the top surface of the inner wall of the heat dissipation plate (8), and gaps are reserved between the bottom surfaces of the heat dissipation convex parts (11) and the bottom surface of the inner wall of the shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122811138.8U CN216052925U (en) | 2021-11-17 | 2021-11-17 | High-heat-dissipation combined case power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122811138.8U CN216052925U (en) | 2021-11-17 | 2021-11-17 | High-heat-dissipation combined case power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216052925U true CN216052925U (en) | 2022-03-15 |
Family
ID=80615605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122811138.8U Active CN216052925U (en) | 2021-11-17 | 2021-11-17 | High-heat-dissipation combined case power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216052925U (en) |
-
2021
- 2021-11-17 CN CN202122811138.8U patent/CN216052925U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206097019U (en) | Mainframe box | |
| TWI296187B (en) | Integrated liquid cooling system | |
| CN1913759A (en) | Integral liquid-cooled radiator | |
| CN219574753U (en) | Indirect liquid cooling assembly and PCIE expansion card | |
| WO2017202247A1 (en) | Computer system unit power supply unit | |
| CN216982389U (en) | Heat sink and electrical device | |
| CN209028537U (en) | A kind of reinforcing cabinet based on two-stage phase transformation level-one liquid-cooling heat radiation technology | |
| CN115220545A (en) | Non-phase-change immersion type liquid cooling server | |
| CN100493316C (en) | Integrated liquid cooling heat abstractor | |
| CN216052925U (en) | High-heat-dissipation combined case power supply | |
| CN211375548U (en) | Water-cooling heat dissipation server based on VPX framework | |
| CN211405842U (en) | Frequency converter | |
| CN210579892U (en) | Refrigerant cooling device and variable frequency air conditioner | |
| CN109588014B (en) | Air-cooled flow guide plug-in and air-cooled plug-in type case | |
| CN209805206U (en) | Electronic equipment and electrical cabinet comprising same | |
| CN100444368C (en) | Integrated liquid cooling heat abstractor | |
| CN219145509U (en) | Liquid cooling and air cooling hybrid heat dissipation 1U rack-type high-speed switch structure | |
| CN213073488U (en) | Power heat dissipation dustproof box | |
| CN201533254U (en) | Compact type switch power supply module | |
| CN217685178U (en) | Electromagnetic range | |
| CN219106301U (en) | Power battery water cooling system | |
| CN219625978U (en) | Control computer is used in intelligent processing | |
| CN211405843U (en) | Frequency converter | |
| CN213518180U (en) | Mixed cooling structure of high-density server | |
| CN116249029A (en) | Liquid cooling and air cooling hybrid heat dissipation 1U rack-type high-speed switch structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |