CN209805206U - Electronic equipment and electrical cabinet comprising same - Google Patents

Abstract

The embodiment of the disclosure provides an electronic device and an electrical cabinet comprising the same, wherein the electronic device comprises a shell and a substrate arranged in the shell, a plurality of electronic components forming a circuit are arranged on the substrate, the shell comprises an air inlet arranged on a first side of the shell and an air outlet arranged on a second side of the shell, at least one heat dissipation channel is formed on the substrate, and the heat dissipation channel is communicated with the air inlet and the air outlet. According to the heat dissipation device, the air inlet and the air outlet are respectively formed in the bottom and the top of the shell of the electronic equipment, at least one heat dissipation channel is formed between electronic components in the electronic equipment, the contact area between the electronic components and external air flow is increased through the heat dissipation channel, the heat of the electronic components is effectively reduced, the heat dissipation efficiency is increased, the air inlet and the air outlet enable the electronic equipment to meet the requirement of efficient heat dissipation under the condition of no fan, and the reliability of long-term operation of a system is improved.

Description

Electronic equipment and electrical cabinet comprising same

Technical Field

the present disclosure relates to the field of electronic devices, and in particular, to an electronic device and an electrical cabinet including the same.

Background

Since the electrical cabinet usually involves storing components with large volume, such as inductors, it is difficult for manufacturers to modularize or miniaturize the electrical cabinet when producing the electrical cabinet. The switching power supply in the electrical cabinet is one of important components in the electrical cabinet, the heat dissipation effect of the switching power supply has great influence on the service life of the switching power supply, the existing heat dissipation of the switching power supply is only realized by opening holes in a closed shell, and heat in the switching power supply cannot be effectively dissipated, so that the service life of the switching power supply can be shortened, and the use of the electrical cabinet is influenced.

SUMMERY OF THE UTILITY MODEL

To the above technical problem that exists among the prior art, this disclosure provides an electronic equipment and regulator cubicle that contains it, realizes increasing electronic equipment's radiating efficiency effectively.

The embodiment of the disclosure provides electronic equipment, including casing and setting up base plate in the casing, be provided with a plurality of electronic components who forms the circuit on the base plate, the casing is including locating the air intake of its first side and locating the air outlet of its second side form at least one heat dissipation channel on the base plate, heat dissipation channel intercommunication the air intake with the air outlet.

In some embodiments, a plurality of heat dissipation plates are disposed on the substrate, and heat dissipation channels are formed between the heat dissipation plates and the housing and/or between the heat dissipation plates.

In some embodiments, the heat dissipation plate is provided with a heat conduction layer abutting against the inner wall of the housing.

In some embodiments, the electronic component is disposed on the heat dissipation channel or on the heat dissipation plate.

In some embodiments, the circuit is a dc-dc conversion circuit, the electronic component includes an input terminal and an output terminal at the first end of the substrate, and a bus capacitor, a two-transistor forward primary circuit, a forward transformer, and a secondary rectifier and filter circuit that are sequentially connected on the substrate in a clockwise or counterclockwise direction, and a boost circuit is disposed between the input terminal and the bus capacitor.

In some embodiments, the heat dissipation plate includes a first heat dissipation plate and a second heat dissipation plate, the first heat dissipation plate and the second heat dissipation plate form the heat dissipation channel therebetween, and the bus capacitor and the forward transformer are disposed in the heat dissipation channel.

In some embodiments, the heat sink further includes a vertical plate disposed at a second end portion of the substrate opposite to the first end portion and vertically connected to the substrate, and a heat dissipation channel is formed between the vertical plate and the heat dissipation plate.

In some embodiments, a flyback circuit is disposed on the riser.

in some embodiments, the side plate of the housing is provided with heat dissipating ribs.

In some embodiments, the housing further includes a mounting plate vertically disposed on the substrate, the input terminal and the output terminal being disposed adjacent to the mounting plate.

The embodiment of the disclosure also provides an electrical cabinet, which comprises a cabinet body and an air supply assembly for supplying air to the cabinet body, and the electrical cabinet further comprises the electronic equipment, wherein airflow generated by the air supply assembly flows through the air inlet and the air outlet in sequence.

Compared with the prior art, the beneficial effects of the embodiment of the present disclosure are that: this openly through set up air intake and air outlet respectively at the bottom and the top of electronic equipment's casing, and form at least one heat dissipation channel between the electronic components in the electronic equipment, outside air current gets into in the electronic equipment through the air intake, and discharge electronic components's heat from the air outlet through heat dissipation channel, heat dissipation channel has increased electronic components and outside air current's area of contact, electronic components's heat has been reduced effectively, the radiating efficiency has been increased, air intake and air outlet make electronic equipment can reach high-efficient radiating demand under the condition of no fan, the reliability of the long-term operation of improvement system. The regulator cubicle can be timely cooling heat dissipation through above-mentioned electronic equipment, has prolonged life.

drawings

In the drawings, which are not necessarily drawn to scale, like reference numerals may describe similar components in different views. Like reference numerals having letter suffixes or different letter suffixes may represent different instances of similar components. The drawings illustrate various embodiments generally by way of example and not by way of limitation, and together with the description and claims serve to explain the disclosed embodiments. The same reference numbers will be used throughout the drawings to refer to the same or like parts, where appropriate. Such embodiments are illustrative, and are not intended to be exhaustive or exclusive embodiments of the present apparatus or method.

Fig. 1 is a schematic structural diagram of a housing of an electronic device according to an embodiment of the disclosure;

Fig. 2 is a schematic partial structure diagram of an electronic device according to an embodiment of the disclosure;

Fig. 3 is another partial structural schematic diagram of an electronic device according to an embodiment of the disclosure;

FIG. 4 is a circuit diagram of an electronic device according to an embodiment of the disclosure;

FIG. 5 is a top view of an electronic device of an embodiment of the disclosure;

Fig. 6 is a schematic structural diagram of an electrical cabinet according to an embodiment of the disclosure.

The members denoted by reference numerals in the drawings:

1-a shell; 101-an air inlet; 102-an air outlet; 2-a substrate; 3-radiating ribs; 4-a heat sink; 401 — a first heat sink; 402-a second heat sink; 5-an input terminal; 6-an output terminal; 7-bus capacitance; 8-a double-tube forward primary side circuit; 9-forward transformer; 10-secondary side rectifying and filtering circuit; 11-a boost circuit; 12-input EMI filter circuit; 13-output EMI filter circuit; 14-a vertical plate; 15-electrical cabinets; 151-cabinet body; 152-an air supply assembly; 153-an electronic device; 16-a mounting plate; 17-flyback circuit.

Detailed Description

For a better understanding of the technical aspects of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings. Embodiments of the present disclosure are described in further detail below with reference to the figures and the detailed description, but the present disclosure is not limited thereto.

The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element preceding the word covers the element listed after the word, and does not exclude the possibility that other elements are also covered. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

In the present disclosure, when a specific device is described as being located between a first device and a second device, there may or may not be intervening devices between the specific device and the first device or the second device. When a particular device is described as being coupled to other devices, that particular device may be directly coupled to the other devices without intervening devices or may be directly coupled to the other devices with intervening devices.

All terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

the embodiment of the present disclosure provides an electronic device, as shown in fig. 1 and fig. 2, the electronic device includes a housing 1 and a substrate 2 disposed in the housing 1, a plurality of electronic components forming a circuit are disposed on the substrate 2, and the electronic components can emit certain heat in a using process; the shell 1 comprises an air inlet 101 arranged on one side of the shell and an air outlet 102 arranged on the other side of the shell, the air inlet 101 and the air outlet 102 can be arranged in a certain sequence, and the number and the arrangement mode of the air inlet 101 and the air outlet 102 can be selected according to the heat dissipation requirement; at least one heat dissipation channel is formed on the substrate 2, and a plurality of electronic components are arranged on the heat dissipation channel, and the heat dissipation channel communicates the air inlet 101 and the air outlet 102.

Specifically, in this embodiment, a dc-dc conversion circuit may be disposed on a substrate 2, where the substrate 2 is used to bear the circuit structure of this embodiment, as shown in fig. 3, a first end of the substrate 2 is provided with an input terminal 5 and an output terminal 6, the substrate 2 is further provided with a bus capacitor 7, a two-transistor forward primary circuit 8, a forward transformer 9, and a secondary rectification filter circuit 10, which are sequentially connected in a clockwise or counterclockwise direction, and the input terminal 5 and the output terminal 6 are disposed at the same end of the substrate 2, so that the dc-dc conversion circuit on the substrate 2 can be more conveniently connected to an external circuit, and the bus capacitor 7, the two-transistor forward primary circuit 8, the forward transformer 9, and the secondary rectification filter circuit 10, which are sequentially connected on the substrate, may be arranged in a shape of a few words; further, the devices between the input terminal 5 and the output terminal 6 are sequentially connected and are annularly arranged in a clockwise or counterclockwise direction, so that the arrangement of electronic components on the substrate 2 is more reasonable, the space on the substrate can be utilized to the maximum extent, and the problems of circuit faults and the like caused by signal or line connection crossing can be avoided.

Furthermore, an external airflow supply device is arranged outside the electronic device, generated external airflow can enter the shell 1 through the air inlet 101 of the electronic device and flows through the heat dissipation channel to be discharged through the air outlet 102, and heat generated by the work of a plurality of electronic components on the substrate 2 can be taken away by the external airflow in the flowing process, so that the electronic device does not need to dissipate heat through a fan, and efficient heat dissipation can be realized through an improved structure.

This is disclosed through setting up air intake 101 and air outlet 102 respectively at the bottom and the top of electronic equipment's casing 1, and form at least one heat dissipation channel in electronic equipment, a plurality of electronic component wares are arranged on heat dissipation channel, like this, outside air current gets into in the electronic equipment through air intake 101, and discharge from air outlet 102 the heat that electronic components produced through heat dissipation channel, heat dissipation channel's setting has increased the area of contact of electronic components and outside air current, electronic components's heat has been reduced effectively, the radiating efficiency has been increased, air intake 101 and air outlet 102 make electronic equipment can reach high-efficient radiating demand under the condition of no fan, the reliability of the long-term operation of improvement system. The regulator cubicle 15 can be timely cooling heat dissipation through above-mentioned electronic equipment, has prolonged life.

as mentioned above, at least one heat dissipation channel is formed on the substrate 2, in order to form the heat dissipation channel, in some embodiments, as shown in fig. 2, a plurality of heat dissipation plates 4 are disposed on the substrate 2, the heat dissipation plates 4 are disposed along the direction from the air inlet 101 to the air outlet 102, so that at least one heat dissipation channel along the direction from the air inlet 101 to the air outlet 102 can be formed between the heat dissipation plate 4 and the housing 1 and between the heat dissipation plates 4 and the plurality of heat dissipation plates 4, a plurality of electronic components can be disposed on the heat dissipation channel formed between the heat dissipation plate 4 and the housing 1, and the electronic components are disposed on the heat dissipation channel, so that the air flow entering from the air inlet 101 can circulate along the heat dissipation channel and dissipate.

In addition, can also arrange electronic components on heating panel 4, when not blockking the flow of outside air current in casing 1 like this, through heating panel 4 and electronic components's direct contact, on directly conducting electronic components's heat to heating panel 4, change electronic components's small size high temperature into large tracts of land low temperature, increase outside air current and take away thermal efficiency, further strengthen the radiating effect, in addition, can also promote the utilization ratio of casing 1 inner space.

In some embodiments, in order to strengthen the radiating effect, the heating panel 4 can adopt materials such as copper or graphite to high-efficiently conduct heat, and structurally, the heating panel 4 can adopt the structure of heat dissipation scale, and the heat dissipation scale is formed by the flat board that the multilayer interval set up, makes smooth and easy circulation in the clearance of outside air current between the flat board, when saving space, increases the radiating efficiency, and this application does not do not specifically limit to the material and the structure of heating panel 4 here, can reach high-efficient radiating purpose can.

In some embodiments, the heat dissipation plate 4 is provided with a heat conduction layer (not shown) abutting against the inner wall of the housing 1, so as to transfer the heat of the heat dissipation plate 4 to the housing 1 by direct contact, and the heat dissipation area and the heat dissipation efficiency of the electronic device can be increased by dissipating heat through the housing 1.

Further, the material of the heat conduction layer should be able to conduct heat with high efficiency, for example, materials such as heat conduction silicone grease, graphene, copper, etc., or the heat conduction layer adopts the G800 heat conduction liner, and the G800 heat conduction liner can be laminated on the heat exchange surface, guarantees the heat conduction effect. This application does not do specific limit here to the material of heat-conducting layer, can guarantee that the heat conduction effect can.

Further, as shown in fig. 3 and 5, an input terminal 5 and an output terminal 6 are provided at the first end portion of the substrate 2, the input terminal 5 may be disposed near the intake vent 101, the output terminal 6 may be disposed near the outtake vent 102, other electronic components, such as a bus capacitor 7, a double-tube forward primary circuit 8, a forward transformer 9 and a secondary rectifying and filtering circuit 10, a booster circuit 11 is provided between the input terminal 5 and the bus capacitor 7 and connected in a zigzag manner on the substrate 2, when the input voltage value of the dc-dc converter is reduced to a predetermined voltage value, the boost circuit 11 is used to provide an output voltage higher than the input voltage value of the dc-dc converter, to supply the bus capacitor 7, so as to maintain the voltage value of the bus capacitor 7 higher than the lowest working voltage of the two-transistor forward primary side circuit 8, the forward transformer 9 and the secondary side rectifying and filtering circuit 10 at the rear stage.

In some embodiments, the heat dissipation plate 4 includes a first heat dissipation plate 401 and a second heat dissipation plate 402, the first heat dissipation plate 401 and the second heat dissipation plate 402 are disposed opposite to each other and form a heat dissipation channel therebetween, the bus capacitor 7 and the forward transformer 9 are disposed in the heat dissipation channel, the bus capacitor 7 and the forward transformer 9 are sequentially and vertically arranged along a direction from the air inlet 101 to the air outlet 102, the first heat dissipation plate 401 is vertically arranged along a direction from the air inlet 101 to the air outlet 102, so that an external air flow flows through the first heat dissipation plate 401 to take away heat, and the first heat dissipation plate includes at least one heat dissipation fin.

In some embodiments, the base plate 2 further includes a vertical plate 14 disposed at a second end portion of the base plate 2 opposite to the first end portion, as shown in fig. 3, the vertical plate 14 is vertically connected to the base plate 2 and is vertically arranged along a direction from the air inlet 101 to the air outlet 102 to avoid blocking circulation of the external air flow, and the vertical plate 14 is disposed with a flyback circuit 17 (as shown in fig. 5). Therefore, a plurality of heat dissipation channels can be formed between the side face of the shell 1 and the vertical plate 14, between the vertical plate 14 and the first heat dissipation plate 401, between the first heat dissipation plate 401 and the second heat dissipation plate 402, and between the second heat dissipation plate 402 and the shell 1, and the vertical plate 14 is installed perpendicular to the substrate 2, so that not only can the space occupied by the vertical plate 14 be saved, but also the length and the size of the equipment can be reduced, the first heat dissipation plate 401 is arranged close to the vertical plate 14 relative to the second heat dissipation plate 402, so that the routing distance on the substrate 2 is reduced, and the anti-interference performance of components on the first heat dissipation.

Corresponding to the dc-dc conversion circuit according to the present embodiment, a plurality of electronic components can be arranged on different heat dissipation plates 4, so that the heat dissipation effect in the housing 1 can be further improved.

In some embodiments, as shown in fig. 3, 4 and 5, the boost circuit 11 includes, for example: the third diode (D3), the first inductor (L1), the third power electronic switch (T3), and the first capacitor (C1), the third diode (D3) and the third power electronic switch (T3) can be disposed on the side of the first heat sink 401, and the third power electronic switch (T3) is attached to the first heat sink 401, so as to improve the heat dissipation efficiency of the third power electronic switch (T3).

In some embodiments, with continued reference to fig. 3-5, the two-transistor forward primary circuit 8 includes: a fourth diode (D4), a fifth diode (D5), a first power electronic switch (T1), and a second power electronic switch (T2), wherein the fourth diode and the fifth diode are disposed on one side of the first heat sink 401, and the first power electronic switch and the second power electronic switch are disposed on the other side of the first heat sink 401.

In some embodiments, referring again to fig. 3-5, the secondary side rectifying and filtering circuit 10 includes: a sixth diode (D6), a seventh diode (D7), an eighth diode (D8), a ninth diode (D9), a second inductor (L2), a third inductor (L3), a third capacitor (C3), and a fourth capacitor (C4), wherein the sixth diode (D6) and the seventh diode (D7) are disposed on one side surface of the third heat sink 403, and the eighth diode (D8) and the ninth diode (D9) are disposed on the other side surface of the third heat sink 403.

in some embodiments, the dc-dc conversion circuit on the substrate 2 further includes: the input EMI filter circuit 12 and the output EMI filter circuit 13 are arranged, the input EMI filter circuit 12 is arranged between the input terminal 5 and the bus capacitor 7 and is connected with the booster circuit 11, the output EMI filter circuit 13 is arranged between the secondary rectifying filter circuit 10 and the output terminal 6, the input EMI filter circuit 12 and the output EMI filter circuit 13 are respectively arranged at two corners of the first end portion, namely the input EMI filter circuit 12 is arranged close to the input terminal 5, and the output EMI filter circuit 13 is arranged close to the output terminal 6.

In some embodiments, as shown in fig. 1, the side plate of the housing 1 is provided with the heat dissipation ribs 3, the contact area between the external air flow and the housing 1 is increased through the heat dissipation ribs 3, and the heat dissipation of the housing 1 is accelerated.

In some embodiments, as shown in fig. 2, the housing 1 further includes a mounting plate 16 vertically disposed on the substrate 2, the electronic device is vertically mounted through the mounting plate 16, the input terminal 5 and the output terminal 6 are disposed adjacent to the mounting plate 16, and a fixing cable connecting between the electronic components can be fixed to the mounting surface 16 to increase connection reliability between the electronic components.

The embodiment of the present disclosure further provides an electrical cabinet 15, as shown in fig. 6, the electrical cabinet 15 includes a cabinet 151 and an air supply assembly 152 that supplies air to the cabinet 151, the air supply assembly 152 may adopt a compressor, so that a negative pressure is formed at the top of the electrical cabinet 15, that is, an air flow generated by a cooling fan carried by the compressor from bottom to top, the electrical cabinet 15 further includes the electronic device, as shown in fig. 6, the air flow generated by the air supply assembly 152 sequentially flows through an air inlet 101, a heat dissipation channel and an air outlet 102, so that the electronic device 153 can effectively improve heat dissipation efficiency through an external air flow generated by the air supply assembly 152, and heat dissipation is not required through a fan or other air supply components.

Moreover, although exemplary embodiments have been described herein, the scope thereof includes any and all embodiments based on the disclosure with equivalent elements, modifications, omissions, combinations (e.g., of various embodiments across), adaptations or alterations. The elements of the claims are to be interpreted broadly based on the language employed in the claims and not limited to examples described in the present specification or during the prosecution of the application, which examples are to be construed as non-exclusive. It is intended, therefore, that the specification and examples be considered as exemplary only, with a true scope and spirit being indicated by the following claims and their full scope of equivalents.

The above description is intended to be illustrative and not restrictive. For example, the above-described examples (or one or more versions thereof) may be used in combination with each other. For example, other embodiments may be used by those of ordinary skill in the art upon reading the above description. In addition, in the foregoing detailed description, various features may be grouped together to streamline the disclosure. This should not be interpreted as an intention that a disclosed feature not claimed is essential to any claim. Rather, the subject matter of the present disclosure may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that these embodiments may be combined with each other in various combinations or permutations. The scope of the disclosure should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

The above embodiments are merely exemplary embodiments of the present disclosure, which is not intended to limit the present disclosure, and the scope of the present disclosure is defined by the claims. Various modifications and equivalents of the disclosure may occur to those skilled in the art within the spirit and scope of the disclosure, and such modifications and equivalents are considered to be within the scope of the disclosure.

Claims (11)

1. The utility model provides an electronic equipment, includes the casing and sets up base plate in the casing, be provided with a plurality of electronic components who forms the circuit on the base plate, its characterized in that, the casing is including the air intake of locating its first side and the air outlet of locating its second side form at least one heat dissipation channel on the base plate, heat dissipation channel intercommunication the air intake with the air outlet.

2. The electronic device according to claim 1, wherein a plurality of heat dissipation plates are provided on the substrate, and the heat dissipation passages are formed between the heat dissipation plates and the housing and/or between the heat dissipation plates.

3. The electronic device according to claim 2, wherein the heat dissipation plate is provided with a heat conduction layer abutting against an inner wall of the housing.

4. The electronic device according to claim 2, wherein the electronic component is provided on the heat dissipation passage or the heat dissipation plate.

5. The electronic device according to claim 2, wherein the circuit is a dc-dc converter circuit, the electronic component includes an input terminal and an output terminal at the first end of the substrate, and a bus capacitor, a two-transistor forward primary circuit, a forward transformer, and a secondary rectifier and filter circuit connected in sequence on the substrate in a clockwise or counterclockwise direction, and a boost circuit is provided between the input terminal and the bus capacitor.

6. The electronic device according to claim 5, wherein the heat dissipation plate includes a first heat dissipation plate and a second heat dissipation plate, the first heat dissipation plate and the second heat dissipation plate forming the heat dissipation passage therebetween, the bus capacitor and the forward transformer being arranged in the heat dissipation passage.

7. The electronic device according to claim 5, further comprising a vertical plate disposed at a second end opposite to the first end of the substrate and vertically connected to the substrate, wherein a heat dissipation channel is formed between the vertical plate and the heat dissipation plate.

8. The electronic device of claim 7, wherein a flyback circuit is disposed on the riser.

9. The electronic device of claim 1, wherein the side plate of the housing is provided with heat dissipating ribs.

10. The electronic device of claim 5, wherein the housing further comprises a mounting plate vertically disposed on the substrate, the input terminal and the output terminal being disposed proximate to the mounting plate.

11. An electrical cabinet, comprising a cabinet body and an air supply assembly for supplying air to the cabinet body, wherein the electrical cabinet further comprises the electronic equipment as claimed in any one of claims 1 to 10, and the air flow generated by the air supply assembly sequentially flows through the air inlet and the air outlet.