CN110120639A - A kind of electronic equipment and electrical cabinet comprising it - Google Patents
A kind of electronic equipment and electrical cabinet comprising it Download PDFInfo
- Publication number
- CN110120639A CN110120639A CN201910555299.XA CN201910555299A CN110120639A CN 110120639 A CN110120639 A CN 110120639A CN 201910555299 A CN201910555299 A CN 201910555299A CN 110120639 A CN110120639 A CN 110120639A
- Authority
- CN
- China
- Prior art keywords
- electronic equipment
- substrate
- heat dissipation
- shell
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000003990 capacitor Substances 0.000 claims description 18
- 230000035939 shock Effects 0.000 claims description 10
- 230000005284 excitation Effects 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 4
- 230000007774 longterm Effects 0.000 abstract description 3
- 238000001914 filtration Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008521 reorganization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
- H02B1/565—Cooling; Ventilation for cabinets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the present disclosure provides a kind of electronic equipment and the electrical cabinet comprising it, the electronic equipment includes shell and is arranged in the intracorporal substrate of shell, the multiple electronic components to form circuit are provided on substrate, shell includes the air outlet set on the air inlet of its first side and set on its second side, at least one heat dissipation channel is formed on substrate, heat dissipation channel is connected to air inlet and air outlet.Air inlet and air outlet is respectively set by the bottom and top of the shell in electronic equipment in the disclosure, and at least one heat dissipation channel is formed between the electronic component in electronic equipment, heat dissipation channel increases the contact area of electronic component and outer gas stream, significantly reduce the heat of electronic component, increase radiating efficiency, air inlet and air outlet make electronic equipment that can reach the demand of high efficiency and heat radiation in the case where fan-free, improve the long-term running reliability of system.
Description
Technical field
This disclosure relates to field of electronic device more particularly to a kind of electronic equipment and the electrical cabinet comprising it.
Background technique
Since electrical cabinet would generally be related to storing the biggish component of volume, such as inductance, so producer is in production electricity
When gas holder, it is difficult its modularization, or miniaturization.Switching Power Supply in electrical cabinet as the Important Components in electrical cabinet it
One, heat dissipation effect has a great impact to its service life itself, and the heat dissipation of Switching Power Supply at present is opened on closed shell
Heat in Switching Power Supply can not effectively be shed, can reduce the service life of Switching Power Supply in this way, influence making for electrical cabinet by hole
With.
Summary of the invention
For the above-mentioned technical problems in the prior art, present disclose provides a kind of electronic equipment and include its electricity
Gas holder realizes the radiating efficiency for effectively increasing electronic equipment.
The embodiment of the present disclosure provides a kind of electronic equipment, including shell and setting are in the intracorporal substrate of the shell, described
The multiple electronic components to form circuit are provided on substrate, the shell includes set on the air inlet of its first side and set on it
The air outlet of second side, forms at least one heat dissipation channel on the substrate, the heat dissipation channel be connected to the air inlet and
The air outlet.
In some embodiments, the substrate be equipped with multiple heat sinks, between the heat sink and the shell and/or
Heat dissipation channel is formed between the heat sink.
In some embodiments, the heat sink is equipped with the heat-conducting layer for being butted on the inner wall of the shell.
In some embodiments, the electronic component setting is on the heat dissipation channel or on the heat sink.
In some embodiments, the circuit is DC-DC transfer circuit, and the electronic component is included in the base
The input terminal and the output terminal of the first end of plate, and on the substrate according to direction pivots clockwise or counter-clockwise successively
Bus capacitor, double tube positive exciting primary circuit, normal shock transformer and the secondary side current rectifying and wave filtering circuit of connection, in the input terminal
Booster circuit is equipped between the bus capacitor.
In some embodiments, the heat sink include the first heat sink and the second heat sink, first heat sink and
The heat dissipation channel is formed between second heat sink, the bus capacitor and the normal shock transformer arrangement are in the heat dissipation
In channel.
It in some embodiments, further include vertical plate, setting on the substrate opposite with the first end second
End, and it is vertical with the substrate connect, form heat dissipation channel between the vertical plate and the heat sink.
In some embodiments, circuit of reversed excitation is set on the vertical plate.
In some embodiments, the side plate of the shell is equipped with radiating ribs.
In some embodiments, the shell further includes the mounting plate being vertical on the substrate, the input terminal
It is arranged with the output terminal close to the mounting plate.
The embodiment of the present disclosure additionally provides a kind of electrical cabinet, including cabinet body and is the air-supply assembly of cabinet body air-supply, institute
Stating electrical cabinet further includes above-mentioned electronic equipment, the air-flow that the air-supply assembly generates followed by the air inlet and it is described go out
Air port.
Compared with prior art, the beneficial effect of the embodiment of the present disclosure is: the disclosure passes through the shell in electronic equipment
Bottom and top air inlet and air outlet is respectively set, and formed between the electronic component in electronic equipment at least one dissipate
The passage of heat, outer gas stream enter in electronic equipment through air inlet, and via heat dissipation channel by the heat of electronic component from outlet air
Mouth discharge, heat dissipation channel increase the contact area of electronic component and outer gas stream, significantly reduce electronic component
Heat, increases radiating efficiency, and air inlet and air outlet make electronic equipment that can reach high efficiency and heat radiation in the case where fan-free
Demand, improve the long-term running reliability of system.Electrical cabinet by above-mentioned electronic equipment can timely cooling and heat dissipation, extend
Service life.
Detailed description of the invention
In the attached drawing being not drawn necessarily to scale, identical appended drawing reference can describe similar in different views
Component.Same reference numerals with letter suffix or different letter suffix can indicate the different instances of similar component.Attached drawing
Generally through citing rather than the mode of limitation shows various embodiments, and reinstates with specification and claims one
It is illustrated in the disclosed embodiments.In due course, make to be referred to identical reference in all the appended drawings same
One or similar part.Such embodiment is illustrative, and is not intended as the exhaustive or exclusive of the present apparatus or method
Embodiment.
Fig. 1 is the structural schematic diagram of the shell of embodiment of the present disclosure electronic equipment；
Fig. 2 is the partial structural diagram of embodiment of the present disclosure electronic equipment；
Fig. 3 is another partial structural diagram of embodiment of the present disclosure electronic equipment；
Fig. 4 is the circuit diagram of embodiment of the present disclosure electronic equipment；
Fig. 5 is the top view of embodiment of the present disclosure electronic equipment；
Fig. 6 is the structural schematic diagram of embodiment of the present disclosure electrical cabinet.
Component represented by appended drawing reference in figure:
1- shell；101- air inlet；102- air outlet；2- substrate；3- radiating ribs；4- heat sink；The first heat sink of 401-；
The second heat sink of 402-；5- input terminal；6- output terminal；7- bus capacitor；8- double tube positive exciting primary circuit；9- normal shock transformation
Device；10- pair side current rectifying and wave filtering circuit；11- booster circuit；12- inputs EMI filter circuit；13- exports EMI filter circuit；14-
Vertical plate；15- electrical cabinet；151- cabinet body；152- air-supply assembly；153- electronic equipment；16- mounting plate；17- circuit of reversed excitation.
Specific embodiment
To make those skilled in the art better understand the technical solution of the disclosure, with reference to the accompanying drawing and specific embodiment party
Formula elaborates to the disclosure.Embodiment of the disclosure work is further retouched in detail in the following with reference to the drawings and specific embodiments
It states, but not as the restriction to the disclosure.
" first ", " second " used in the disclosure and similar word are not offered as any sequence, quantity or again
The property wanted, and be used only to distinguish different parts.The similar word such as " comprising " or "comprising" means the element before the word
Cover the element enumerated after the word, it is not excluded that be also covered by the possibility of other element."upper", "lower", "left", "right" etc. are only used
In indicating relative positional relationship, after the absolute position for being described object changes, then the relative positional relationship may also be correspondingly
Change.
In the disclosure, when being described to certain device between the first device and the second device, in the certain device
There may be devices between two parties between the first device or the second device, and device between two parties can also be not present.When being described to specific device
When part connects other devices, which can be directly connected to without device between two parties with the other devices, can also be with
It is not directly connected to the other devices and there is device between two parties.
All terms (including technical term or scientific term) that the disclosure uses are common with disclosure fields
The meaning that technical staff understands is identical, unless otherwise specifically defined.It is also understood that in term such as defined in the general dictionary
The meaning consistent with their meanings in the context of the relevant technologies should be interpreted as having, without application idealization or
The meaning of extremely formalization explains, unless being clearly defined herein.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
The embodiment of the present disclosure provides a kind of electronic equipment, and as depicted in figs. 1 and 2, which includes shell 1 and set
The substrate 2 in shell 1 is set, the multiple electronic components to form circuit are laid on substrate 2, electronic component is in use process
It is middle to give out certain heat；Shell 1 includes the air outlet 102 set on the air inlet 101 of one side and set on its other side,
Air inlet 101 and air outlet 102 can be arranged according to certain sequence, the quantity and arrangement mode of air inlet 101 and air outlet 102
It can be selected according to the requirement of heat dissipation；At least one heat dissipation channel is formed on a substrate 2, and multiple electronic component devices are arranged in
On the heat dissipation channel, heat dissipation channel is connected to air inlet 101 and air outlet 102.
Specifically, in the present embodiment, DC-DC transfer circuit can be arranged on a substrate 2, and the substrate 2 is for holding
The circuit structure of the present embodiment is carried, as shown in figure 3, input terminal 5 and output terminal 6 is arranged in the first end in the substrate 2,
It is additionally provided on the substrate 2 according to the sequentially connected bus capacitor 7 of direction pivots clockwise or counter-clockwise, double tube positive exciting primary side
Circuit 8, normal shock transformer 9 and secondary side current rectifying and wave filtering circuit 10, are arranged in the same of substrate 2 for input terminal 5 and output terminal 6
One end enables to the connection of DC-DC transfer circuit and external circuit on the substrate 2 more convenient, on substrate successively
Bus capacitor 7, double tube positive exciting primary circuit 8, normal shock transformer 9 and the secondary side current rectifying and wave filtering circuit 10 of connection can be in several fonts
Arrangement；Further, the device between input terminal 5 and output terminal 6 is sequentially connected and for example according to clockwise or inverse
The direction of hour hands is circular layout, and enables to the electronic component on substrate 2 to arrange more reasonable, is not only able to maximum journey
Degree utilizes the space on substrate, moreover it is possible to signal or connection be avoided to intersect to lead to problems such as fault occur.
Further, it is equipped with outer gas stream feeding mechanism in the outside of electronic equipment, the outer gas stream of generation can pass through
The air inlet 101 of electronic equipment enters in shell 1, and flows through heat dissipation channel and be discharged finally by air outlet 102, and outer gas stream exists
Heat caused by multiple electronic components work on substrate 2 can be taken away in the process of circulation, make electronic equipment without passing through wind
Fan heat dissipation is efficiently radiated by improving structure and can be realized.
The disclosure by the way that air inlet 101 and air outlet 102 is respectively set in the bottom and top of the shell 1 of electronic equipment,
And at least one heat dissipation channel is formed in electronic equipment, multiple electronic component devices are arranged on heat dissipation channel, in this way, external gas
Flow through heat that air inlet 101 enters in electronic equipment, and electronic component generated via heat dissipation channel from 102 row of air outlet
Out, the setting of heat dissipation channel increases the contact area of electronic component and outer gas stream, significantly reduces electronic component
Heat, increase radiating efficiency, air inlet 101 and air outlet 102 reach electronic equipment can in the case where fan-free
The demand of high efficiency and heat radiation improves the long-term running reliability of system.Electrical cabinet 15 can timely be dropped by above-mentioned electronic equipment
Temperature heat dissipation, extends service life.
It is as previously mentioned, forms at least one heat dissipation channel on a substrate 2, in order to form the heat dissipation channel, some
In embodiment, as shown in Fig. 2, being equipped with multiple heat sinks 4 on a substrate 2, heat sink 4 is along air inlet 101 to the side of air outlet 102
To arrangement, in this way, can be formed between heat sink 4 and shell 1 and between multiple heat sinks 4 along air inlet 101 to outlet air
At least one heat dissipation channel of mouth 102, multiple electronic components can be arranged in be dissipated by what is formed between heat sink 4 and shell 1
In the passage of heat, electronic component is arranged on heat dissipation channel, enables to the air-flow entered by air inlet 101 logical along heat dissipation
It circulates and radiates to the electronic component on heat dissipation channel in road.
Furthermore it is also possible to electronic component is arranged on heat sink 4, in this way do not stop outer gas stream in shell 1
Flowing while, by directly contacting for heat sink 4 and electronic component, the heat of electronic component is directly conducted to scattered
It is large area low temperature by the small area high temperature transformation of electronic component on hot plate 4, increases the efficiency that outer gas stream takes away heat,
Heat dissipation effect is further enhanced, further, it is also possible to promote the utilization rate of 1 inner space of shell.
In some embodiments, in order to enhance heat dissipation effect, heat sink 4 can be using materials such as copper or graphite, with efficient
Ground conducts heat, and in structure, heat sink 4 can use the structure of heat dissipation scales, and heat dissipation scales are arranged flat by Spaced
Plate is formed, and outer gas stream smooth circulation in the gap between plate is enable, and while saving space, increases heat dissipation effect
Rate, the application are not especially limited the material and structure of heat sink 4 at this, can achieve the purpose that high efficiency and heat radiation.
In some embodiments, heat sink 4 is equipped with the heat-conducting layer (not shown) for being butted on the inner wall of shell 1, will
The heat of heat sink 4 is transferred to shell 1 by way of directly contacting, and is radiated by shell 1 and is capable of increasing dissipating for electronic equipment
Heat area and radiating efficiency.
Further, the material of heat-conducting layer should be able to efficiently conduct the materials such as heat, such as heat-conducting silicone grease, graphene, copper,
Or heat-conducting layer uses G800 chill bar, G800 chill bar can be bonded heat exchange surface, guarantee heat-conducting effect.The application couple
The material of heat-conducting layer is not specifically limited herein, can guarantee heat-conducting effect.
Further, as shown in Figure 3 and Figure 5, input terminal 5 and output terminal 6 are set in the first end of substrate 2, it is defeated
Entering terminal 5 can arrange that output terminal 6 is arranged close to air outlet 102, other electronic components close to air inlet 101, such as female
Line capacitance 7, double tube positive exciting primary circuit 8, normal shock transformer 9 and secondary side current rectifying and wave filtering circuit 10, in input terminal 5 and bus
It is equipped with booster circuit 11 between capacitor 7 to be sequentially connected in zigzag shape on a substrate 2, when the input voltage of DC-DC converter
When value is reduced to scheduled voltage, booster circuit 11 is used to provide the output of the input voltage value higher than DC-DC converter
Voltage is powered for bus capacitor 7, to maintain the voltage value of bus capacitor 7 to be higher than the double tube positive exciting primary circuit 8 of rear class, normal shock
The minimum operating voltage of transformer 9 and secondary side current rectifying and wave filtering circuit 10.
In some embodiments, heat sink 4 includes the first heat sink 401 and the second heat sink 402, the first heat sink 401
Heat dissipation channel is oppositely arranged and formed therebetween with the second heat sink 402, and bus capacitor 7 and normal shock transformer 9 are arranged in this
In heat dissipation channel, and bus capacitor 7 and normal shock transformer 9 are successively vertically arranged along air inlet 101 to the direction of air outlet 102,
First heat sink 401 is vertically arranged along air inlet 101 to 102 direction of air outlet, so that outer gas stream flows through the first heat sink 401
Heat is taken away, the first heat sink includes at least one cooling fin.
In some embodiments, substrate 2 further includes vertical plate 14, setting on a substrate 2 opposite with first end second
End is connect as shown in figure 3, vertical plate 14 is vertical with substrate 2, and it is along the vertical cloth in the direction of air inlet 101 to air outlet 102
It sets, avoids the circulation for stopping outer gas stream, be provided with circuit of reversed excitation 17 (as shown in Figure 5) on the vertical plate 14.In this way, shell 1
Between side and vertical plate 14, between vertical plate 14 and the first heat sink 401, between the first heat sink 401 and the second heat sink 402,
Multiple heat dissipation channels can be formed between second heat sink 402 and shell 1, and vertical plate 14 is installed perpendicular to substrate 2, can not only be saved
The province occupied space of vertical plate 14, additionally it is possible to reduce the length and size of equipment, relatively described second heat dissipation of the first heat sink 401
Plate 402 is arranged close to the vertical plate 14, to reduce the cable run distance on substrate 2, increases the anti-of the component on the first heat sink
Interference.
Corresponding to the DC-DC transfer circuit that the present embodiment is related to, multiple electronic components can be arranged in different
On heat sink 4, so as to further promote the heat dissipation effect in shell 1.
In some embodiments, as shown in Fig. 3, Fig. 4 and Fig. 5, booster circuit 11 for example, third diode (D3),
First inductance (L1), third electronic power switch (T3) and first capacitor (C1), third diode (D3) and third electric power electricity
Sub switch (T3) can be arranged on the side of the first heat sink 401, and third electronic power switch (T3) is attached at the first heat dissipation
Plate 401, to improve the radiating efficiency of third electronic power switch (T3).
In some embodiments, continuing with Fig. 3 to Fig. 5, double tube positive exciting primary circuit 8 include: the 4th diode (D4),
5th diode (D5), the first electronic power switch (T1) and the second electronic power switch (T2), wherein the 4th diode and
Five diodes are arranged on the one side of the first heat sink 401, the first electronic power switch and the setting of the second electronic power switch
On the another side of the first heat sink 401.
In some embodiments, Fig. 3 to Fig. 5 is recombined, secondary side current rectifying and wave filtering circuit 10 includes: the 6th diode
(D6), the 7th diode (D7), the 8th diode (D8), the 9th diode (D9), the second inductance (L2), third inductance (L3),
Third capacitor (C3) and the 4th capacitor (C4), wherein the 6th diode (D6) and the setting of the 7th diode (D7) are radiated in third
On the one side of plate 403, the another side of third heat sink 403 is arranged in the 8th diode (D8) and the 9th diode (D9)
On.
In some embodiments, the DC-DC transfer circuit on substrate 2 further include: input EMI filter circuit 12 and defeated
EMI filter circuit 13 out, input EMI filter circuit 12 is arranged between input terminal 5 and bus capacitor 7, and and booster circuit
11 are connected, and output EMI filter circuit 13 is arranged between secondary side current rectifying and wave filtering circuit 10 and output terminal 6, input EMI filtering
Circuit 12 and output EMI filter circuit 13 are separately positioned on two corners of first end, i.e. input EMI filter circuit 12 is close
Input terminal 5 is arranged, and output EMI filter circuit 13 is arranged close to output terminal 6.
In some embodiments, as shown in Figure 1, the side plate of shell 1 is equipped with radiating ribs 3, increase outside by radiating ribs 3
The contact area of air-flow and shell 1 accelerates the heat dissipation of shell 1, and the structure is simple and at low cost, and the market for being conducive to product pushes away
Extensively.
In some embodiments, as shown in Fig. 2, shell 1 further includes the mounting plate 16 being vertical on substrate 2, electronics is set
It is standby to be arranged by 16 right angle setting of mounting plate, input terminal 5 and output terminal 6 close to mounting plate 16, connection electronic component it
Between fixed cable can be fixed on mounting surface 16, to increase the connection reliability between electronic component.
The embodiment of the present disclosure additionally provides a kind of electrical cabinet 15, as shown in fig. 6, electrical cabinet 15 includes cabinet body 151 and is cabinet
The air-supply assembly 152 that body 151 is blown, air-supply assembly 152 can use compressor, so that the top of electrical cabinet 15 is formed negative pressure, i.e.,
The air-flow from bottom to top generated by the cooling blower that compressor carries, electrical cabinet 15 further includes above-mentioned electronic equipment, such as Fig. 6
Shown, the air-flow that air-supply assembly 152 generates makes electronic equipment 153 followed by air inlet 101, heat dissipation channel and air outlet 102
Pass through the outer gas stream generated by air-supply assembly 152, it will be able to effectively improve radiating efficiency, without by fan or other
Air-supply component radiates.
In addition, range includes any and all based on this public affairs although exemplary embodiment has been described herein
That opens has equivalent element, modification, omission, combination (for example, scheme that various embodiments are intersected), reorganization or the implementation changed
Example.Element in claims will be construed broadly as based on the language used in claim, however it is not limited in this explanation
Described example, example are to be interpreted as nonexcludability in book or during the implementation of the application.Therefore, this specification and
Example is intended to be to be considered only as example, and real scope and spirit are by following following claims and the full scope of its equivalent institute
Instruction.
Above description is intended to illustrative rather than restrictive.For example, above-mentioned example (or one or more side
Case) it can be in combination with one another.Such as other embodiments can be used when reading foregoing description in those of ordinary skill in the art.
In addition, various features can be grouped together to simplify the disclosure in above-mentioned specific embodiment.This should not be construed as
A kind of not claimed disclosed feature is necessary intention for any claim.On the contrary, the theme of the disclosure can be with
Less than whole features of specific disclosed embodiment.To which following claims is incorporated to herein as example or embodiment
In specific embodiment, wherein each claim is independently as individual embodiment, and consider that these embodiments can be with
It is combined with each other with various combinations or arrangement.The scope of the present disclosure should refer to appended claims and these claims are entitled
The full scope of equivalent form determines.
Above embodiments are only the exemplary embodiment of the disclosure, are not used in the limitation disclosure, the protection scope of the disclosure
It is defined by the claims.Those skilled in the art can make respectively the disclosure in the essence and protection scope of the disclosure
Kind modification or equivalent replacement, this modification or equivalent replacement also should be regarded as falling within the scope of the disclosure.
Claims (11)
1. a kind of electronic equipment, including shell and setting are provided with to form circuit on the intracorporal substrate of the shell, the substrate
Multiple electronic components, which is characterized in that the shell include set on its first side air inlet and set on its second side
Air outlet, forms at least one heat dissipation channel on the substrate, and the heat dissipation channel is connected to the air inlet and the outlet air
Mouthful.
2. electronic equipment according to claim 1, which is characterized in that the substrate is equipped with multiple heat sinks, described to dissipate
The heat dissipation channel is formed between hot plate and the shell and/or between the heat sink.
3. electronic equipment according to claim 2, which is characterized in that the heat sink is equipped with and is butted on the interior of the shell
The heat-conducting layer of wall.
4. electronic equipment according to claim 2, which is characterized in that the electronic component is arranged in the heat dissipation channel
On the upper or described heat sink.
5. electronic equipment according to claim 2, which is characterized in that the circuit is DC-DC transfer circuit, described
Electronic component includes the input terminal and the output terminal in the first end of the substrate, and on the substrate according to suitable
Hour hands or counterclockwise sequentially connected bus capacitor, double tube positive exciting primary circuit, normal shock transformer and secondary side rectification
Filter circuit is equipped with booster circuit between the input terminal and the bus capacitor.
6. electronic equipment according to claim 5, which is characterized in that the heat sink includes that the first heat sink and second dissipate
Hot plate, forms the heat dissipation channel between first heat sink and second heat sink, the bus capacitor and it is described just
Violent change depressor is arranged in the heat dissipation channel.
7. electronic equipment according to claim 5, which is characterized in that further include vertical plate, setting on the substrate with
The opposite the second end of the first end, and it is vertical with the substrate connect, formed between the vertical plate and the heat sink
Heat dissipation channel.
8. electronic equipment according to claim 7, which is characterized in that circuit of reversed excitation is arranged on the vertical plate.
9. electronic equipment according to claim 1, which is characterized in that the side plate of the shell is equipped with radiating ribs.
10. electronic equipment according to claim 5, which is characterized in that the shell further includes being vertical at the substrate
On mounting plate, the input terminal and the output terminal are arranged close to the mounting plate.
11. a kind of electrical cabinet including cabinet body and is the air-supply assembly of cabinet body air-supply, which is characterized in that the electrical cabinet is also
Including such as described in any item electronic equipments of claim 1-10, the air-flow that the air-supply assembly generates is followed by the air inlet
Mouth and the air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910555299.XA CN110120639A (en) | 2019-06-25 | 2019-06-25 | A kind of electronic equipment and electrical cabinet comprising it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910555299.XA CN110120639A (en) | 2019-06-25 | 2019-06-25 | A kind of electronic equipment and electrical cabinet comprising it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110120639A true CN110120639A (en) | 2019-08-13 |
Family
ID=67524482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910555299.XA Pending CN110120639A (en) | 2019-06-25 | 2019-06-25 | A kind of electronic equipment and electrical cabinet comprising it |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110120639A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000190163A (en) * | 1998-12-22 | 2000-07-11 | Mitsubishi Electric Corp | Control board |
| CN205029193U (en) * | 2015-08-25 | 2016-02-10 | 深圳市伊力科电源有限公司 | Non intermittented power source machine cabinet |
| CN105939594A (en) * | 2016-06-30 | 2016-09-14 | 海信集团有限公司 | Radiating apparatus for electronic equipment and electronic equipment |
| CN107070256A (en) * | 2017-02-17 | 2017-08-18 | 许继电气股份有限公司 | A kind of power model and the photovoltaic combining inverter using the module |
| CN109390956A (en) * | 2018-12-25 | 2019-02-26 | 北京思源清能电气电子有限公司 | A kind of electric control box and SVG cellular construction |
| CN209805206U (en) * | 2019-06-25 | 2019-12-17 | 阿特拉斯·科普柯(无锡)压缩机有限公司 | Electronic equipment and electrical cabinet comprising same |
-
2019
- 2019-06-25 CN CN201910555299.XA patent/CN110120639A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000190163A (en) * | 1998-12-22 | 2000-07-11 | Mitsubishi Electric Corp | Control board |
| CN205029193U (en) * | 2015-08-25 | 2016-02-10 | 深圳市伊力科电源有限公司 | Non intermittented power source machine cabinet |
| CN105939594A (en) * | 2016-06-30 | 2016-09-14 | 海信集团有限公司 | Radiating apparatus for electronic equipment and electronic equipment |
| CN107070256A (en) * | 2017-02-17 | 2017-08-18 | 许继电气股份有限公司 | A kind of power model and the photovoltaic combining inverter using the module |
| CN109390956A (en) * | 2018-12-25 | 2019-02-26 | 北京思源清能电气电子有限公司 | A kind of electric control box and SVG cellular construction |
| CN209805206U (en) * | 2019-06-25 | 2019-12-17 | 阿特拉斯·科普柯(无锡)压缩机有限公司 | Electronic equipment and electrical cabinet comprising same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI394524B (en) | Modularized heat dissipating apparatus | |
| US5986882A (en) | Electronic apparatus having removable processor/heat pipe cooling device modules therein | |
| JP2002046482A (en) | Heat sink type cooling device | |
| JP6158051B2 (en) | Power converter | |
| CN106357124A (en) | Power conversion device | |
| JP2005124322A (en) | Power source apparatus | |
| CN110120639A (en) | A kind of electronic equipment and electrical cabinet comprising it | |
| CN209805206U (en) | Electronic equipment and electrical cabinet comprising same | |
| CN211127543U (en) | Inverter welding machine with PFC circuit | |
| CN110336452A (en) | A kind of current transformer power modules | |
| JP6179831B1 (en) | Power supply for lighting | |
| CN201533254U (en) | Compact type switch power supply module | |
| CN115176413A (en) | Power converter, heat exchanger, radiator and photovoltaic power generation system | |
| CN111655008A (en) | Electrical apparatus box, air conditioner | |
| CN212935762U (en) | Switch power supply | |
| CN220156392U (en) | Power supply and electronic equipment | |
| TWI677279B (en) | Power supply device | |
| CN212463863U (en) | Electrical apparatus box, air conditioner | |
| CN215322050U (en) | Charger and auxiliary current transformation system | |
| CN216721173U (en) | High density power supply | |
| CN215186479U (en) | Novel PCB board of AC-DC power | |
| CN214315065U (en) | Portable quick radiating converter | |
| CN216121458U (en) | Power supply device and power supply cabinet | |
| CN110932526A (en) | Power supply device | |
| CN212063832U (en) | Phase-shifted full-bridge power supply circuit device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |